WO2009069500A1 - プローブピン - Google Patents

プローブピン Download PDF

Info

Publication number
WO2009069500A1
WO2009069500A1 PCT/JP2008/070898 JP2008070898W WO2009069500A1 WO 2009069500 A1 WO2009069500 A1 WO 2009069500A1 JP 2008070898 W JP2008070898 W JP 2008070898W WO 2009069500 A1 WO2009069500 A1 WO 2009069500A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
plunger
opening
probe pin
enlarging portion
Prior art date
Application number
PCT/JP2008/070898
Other languages
English (en)
French (fr)
Inventor
Kiyokazu Ikeya
Original Assignee
Sensata Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies, Inc. filed Critical Sensata Technologies, Inc.
Publication of WO2009069500A1 publication Critical patent/WO2009069500A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

【課題】　ワイピング機能を有しかつ低コストのプローブピンを提供する。 【解決手段】　プローブピン１００は、金属製の板材から形成された上プランジャー２００および下プランジャー３００と、コイルスプリング４００とを有する。 上プランジャー２００には、一方の端部から長手方向に一定の長さで延在する開口２１０が形成され、それによって弾性変形可能な一対の接点部２２０ａ、２２０ｂが形成される。下プランジャー３００には、一方の端部に接点拡大部３２０が形成され、接点拡大部３２０から長手方向に一定の長さで延在する開口３１０が形成されている。上下のプランジャーは直交するように配置され、開口２１０内に接点拡大部３２０が配置され、開口３１０内に上プランジャー２００の延在部２３０が配置される。上プランジャー２００が下プランジャー３００に接近する方向に移動したとき、接点拡大部３２０が一対の接点部２２０ａ、２２０を広げ、被接触対象へのワイピングを可能にする。
PCT/JP2008/070898 2007-11-26 2008-11-18 プローブピン WO2009069500A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-304153 2007-11-26
JP2007304153A JP2009128211A (ja) 2007-11-26 2007-11-26 プローブピン

Publications (1)

Publication Number Publication Date
WO2009069500A1 true WO2009069500A1 (ja) 2009-06-04

Family

ID=40678403

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070898 WO2009069500A1 (ja) 2007-11-26 2008-11-18 プローブピン

Country Status (2)

Country Link
JP (1) JP2009128211A (ja)
WO (1) WO2009069500A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539153A (ja) * 2010-05-27 2013-10-17 ハイコン カンパニー リミテッド スプリングコンタクト構造
CN106415278A (zh) * 2014-06-16 2017-02-15 欧姆龙株式会社 探针
JP2017059363A (ja) * 2015-09-15 2017-03-23 オムロン株式会社 プローブピン、および、これを備えた検査治具
WO2024032967A1 (de) * 2022-08-08 2024-02-15 Ingun Prüfmittelbau Gmbh Prüfstiftvorrichtung

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455174B1 (ko) * 2013-04-23 2014-10-28 (주)마이크로컨텍솔루션 포고 핀 및 그 제조방법
JP2017015581A (ja) 2015-07-01 2017-01-19 富士通コンポーネント株式会社 コンタクト
KR101749711B1 (ko) * 2015-11-30 2017-06-21 주식회사 대성엔지니어링 테스트 소켓
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006041807A2 (en) * 2004-10-06 2006-04-20 Plastronics Socket Partners, L.P. Contact for electronic devices
WO2006135680A2 (en) * 2005-06-10 2006-12-21 Delaware Capital Formation Inc. Electrical contact probe with compliant internal interconnect

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006041807A2 (en) * 2004-10-06 2006-04-20 Plastronics Socket Partners, L.P. Contact for electronic devices
WO2006135680A2 (en) * 2005-06-10 2006-12-21 Delaware Capital Formation Inc. Electrical contact probe with compliant internal interconnect

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539153A (ja) * 2010-05-27 2013-10-17 ハイコン カンパニー リミテッド スプリングコンタクト構造
CN106415278A (zh) * 2014-06-16 2017-02-15 欧姆龙株式会社 探针
JP2017059363A (ja) * 2015-09-15 2017-03-23 オムロン株式会社 プローブピン、および、これを備えた検査治具
WO2024032967A1 (de) * 2022-08-08 2024-02-15 Ingun Prüfmittelbau Gmbh Prüfstiftvorrichtung

Also Published As

Publication number Publication date
JP2009128211A (ja) 2009-06-11

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