WO2009069375A1 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
WO2009069375A1
WO2009069375A1 PCT/JP2008/067612 JP2008067612W WO2009069375A1 WO 2009069375 A1 WO2009069375 A1 WO 2009069375A1 JP 2008067612 W JP2008067612 W JP 2008067612W WO 2009069375 A1 WO2009069375 A1 WO 2009069375A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
laser
laser beam
machining device
porous member
Prior art date
Application number
PCT/JP2008/067612
Other languages
English (en)
French (fr)
Inventor
Hideki Morita
Norifumi Arima
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to CN2008801180911A priority Critical patent/CN101878088B/zh
Priority to JP2009543701A priority patent/JP5221560B2/ja
Publication of WO2009069375A1 publication Critical patent/WO2009069375A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Abstract

　設置スペースを小さくすることができ、固定テーブルを用いて、テーブル回転機構を用いることなく基板を回転することができるレーザ加工装置を提供する。 　基板載置面が多孔質部材で形成され、多孔質部材を介して基板を吸着する吸着機構と多孔質部材を介して基板に気体を吹き付けて浮上させる浮上機構とが設けられた位置固定のテーブル４０と、レーザ光源１０と、レーザ光源から出射されるレーザビームを断面が楕円のレーザビームに整形し基板の加工面に導いて加工面上を走査するレーザビーム走査光学系２０と、テーブル上に載置された基板の位置決め、または、移動を行う際に、浮上させた基板の基板側面に当接し基板側面をテーブル面に水平な方向に押して移動させる可動当接部により基板を誘導する基板誘導機構５０とを備え、基板を浮上させて基板誘導機構で基板側面を押しながら所望の位置に移動、回転する。
PCT/JP2008/067612 2007-11-27 2008-09-29 レーザ加工装置 WO2009069375A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801180911A CN101878088B (zh) 2007-11-27 2008-09-29 激光加工装置
JP2009543701A JP5221560B2 (ja) 2007-11-27 2008-09-29 レーザ加工装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007305466 2007-11-27
JP2007-305466 2007-11-27
JP2007308579 2007-11-29
JP2007-308579 2007-11-29
JP2007309597 2007-11-30
JP2007-309597 2007-11-30

Publications (1)

Publication Number Publication Date
WO2009069375A1 true WO2009069375A1 (ja) 2009-06-04

Family

ID=40678280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067612 WO2009069375A1 (ja) 2007-11-27 2008-09-29 レーザ加工装置

Country Status (5)

Country Link
JP (1) JP5221560B2 (ja)
KR (1) KR101210979B1 (ja)
CN (1) CN101878088B (ja)
TW (1) TWI409123B (ja)
WO (1) WO2009069375A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012000675A (ja) * 2010-06-15 2012-01-05 Lg Chem Ltd レーザーを用いたロールフィルム切断装置
JP2012016735A (ja) * 2010-07-09 2012-01-26 Mitsubishi Materials Corp レーザ加工装置およびレーザ加工方法
CN108723609A (zh) * 2018-07-24 2018-11-02 廊坊西波尔钻石技术有限公司 激光刻蚀机及超硬材料加工方法
CN111533439A (zh) * 2020-03-31 2020-08-14 东莞泰升玻璃有限公司 一种激光切割制作圆形玻璃的方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101494564B1 (ko) * 2011-03-08 2015-02-17 카와사키 주코교 카부시키 카이샤 광 주사 장치 및 레이저 가공 장치
JP5906115B2 (ja) * 2012-03-29 2016-04-20 川崎重工業株式会社 光走査装置及びレーザ加工装置
KR101653524B1 (ko) * 2016-07-01 2016-09-01 이석준 레이저 3차원 가공 시스템
CN106191384B (zh) * 2016-07-13 2018-02-13 广东工业大学 基于导轨运动的金属板料激光喷丸成形动态自适应装备及方法
CN106392345A (zh) * 2016-11-14 2017-02-15 苏州领创激光科技有限公司 双工位激光切割工作台
US10661313B2 (en) * 2017-01-05 2020-05-26 Fives Cinetic Corp. Multi-tool part cleaning machine
KR102042659B1 (ko) * 2017-03-21 2019-11-08 (주)컨셉션 다중 레이저의 중첩을 이용한 레이저 고출력 변환장치
JP6997566B2 (ja) * 2017-09-14 2022-01-17 株式会社ディスコ レーザー加工装置
CN108356998A (zh) * 2018-02-05 2018-08-03 上海升研智能科技有限公司 陶瓷管坯的同步切割装置及方法
DE102018220336A1 (de) * 2018-11-27 2020-01-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Strahlformung und Strahlmodulation bei einer Lasermaterialbearbeitung
JP7278868B2 (ja) * 2019-05-27 2023-05-22 株式会社オーク製作所 レーザ加工装置
TWI826848B (zh) * 2020-12-21 2023-12-21 日商斯庫林集團股份有限公司 光照射裝置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724589A (ja) * 1993-07-12 1995-01-27 Sanyo Mach Works Ltd レーザロボットの自動アライメント調整方法及び装置
JPH07116882A (ja) * 1993-10-22 1995-05-09 Sumitomo Electric Ind Ltd 放物面集光光学系の調整方法及び装置
JP2004050247A (ja) * 2002-07-22 2004-02-19 Rezakku:Kk レーザ加工装置
WO2005078738A1 (ja) * 2004-02-12 2005-08-25 Japan Science And Technology Agency 軟ｘ線加工装置及び軟ｘ線加工方法
JP2007021528A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工装置およびその調整方法
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0315274Y2 (ja) * 1985-03-29 1991-04-03
JPH0753826Y2 (ja) * 1991-06-27 1995-12-13 鬼頭工業株式会社 シーム溶接機の被溶接物保持装置
JP3727441B2 (ja) * 1997-06-11 2005-12-14 松下電器産業株式会社 レーザー加工機の被加工物位置決め装置
WO2007020835A1 (ja) * 2005-08-12 2007-02-22 Shibaura Mechatronics Corporation 脆性材料の割断加工システム及びその方法
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
WO2008078738A1 (ja) * 2006-12-26 2008-07-03 Daikin Industries, Ltd. 含フッ素エラストマーの製造方法および該製造方法により得られる含フッ素エラストマー

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724589A (ja) * 1993-07-12 1995-01-27 Sanyo Mach Works Ltd レーザロボットの自動アライメント調整方法及び装置
JPH07116882A (ja) * 1993-10-22 1995-05-09 Sumitomo Electric Ind Ltd 放物面集光光学系の調整方法及び装置
JP2004050247A (ja) * 2002-07-22 2004-02-19 Rezakku:Kk レーザ加工装置
WO2005078738A1 (ja) * 2004-02-12 2005-08-25 Japan Science And Technology Agency 軟ｘ線加工装置及び軟ｘ線加工方法
JP2007021528A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工装置およびその調整方法
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012000675A (ja) * 2010-06-15 2012-01-05 Lg Chem Ltd レーザーを用いたロールフィルム切断装置
JP2012016735A (ja) * 2010-07-09 2012-01-26 Mitsubishi Materials Corp レーザ加工装置およびレーザ加工方法
CN108723609A (zh) * 2018-07-24 2018-11-02 廊坊西波尔钻石技术有限公司 激光刻蚀机及超硬材料加工方法
CN111533439A (zh) * 2020-03-31 2020-08-14 东莞泰升玻璃有限公司 一种激光切割制作圆形玻璃的方法

Also Published As

Publication number Publication date
CN101878088B (zh) 2013-08-14
TWI409123B (zh) 2013-09-21
CN101878088A (zh) 2010-11-03
KR101210979B1 (ko) 2012-12-11
KR20100035173A (ko) 2010-04-02
JP5221560B2 (ja) 2013-06-26
TW200936286A (en) 2009-09-01
JPWO2009069375A1 (ja) 2011-04-07

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