WO2009066396A1 - 導電膜形成用インクおよびプリント配線板の製造方法 - Google Patents

導電膜形成用インクおよびプリント配線板の製造方法 Download PDF

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Publication number
WO2009066396A1
WO2009066396A1 PCT/JP2007/072680 JP2007072680W WO2009066396A1 WO 2009066396 A1 WO2009066396 A1 WO 2009066396A1 JP 2007072680 W JP2007072680 W JP 2007072680W WO 2009066396 A1 WO2009066396 A1 WO 2009066396A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive film
ink
wiring board
printed wiring
film formation
Prior art date
Application number
PCT/JP2007/072680
Other languages
English (en)
French (fr)
Inventor
Kei Nakanishi
Hideyuki Hirakoso
Keisuke Abe
Yasuhiro Sanada
Kazushi Kobayashi
Junko Anzai
Original Assignee
Asahi Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Company, Limited filed Critical Asahi Glass Company, Limited
Priority to PCT/JP2007/072680 priority Critical patent/WO2009066396A1/ja
Publication of WO2009066396A1 publication Critical patent/WO2009066396A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　ポリイミドを含む電気絶縁体層との密着性に優れる導電膜を形成できる導電膜形成用インク、ポリイミドを含む電気絶縁体層との密着性に優れる導電膜を有するプリント配線板を、少ない工程で製造できるプリント配線板の製造方法を提供する。 　気圧０．１ＭＰａの状態での沸点が１５０～３５０°Cである非水溶性有機溶媒と、該有機溶媒中に分散した金属微粒子および／または水素化金属微粒子と、ＪＩＳ　Ｋ７２３７の規定によるアミン価が１０～１９０ｍｇＫＯＨ／ｇであるアミノ化合物とを含む導電膜形成用インク。該インクは、電気絶縁体層１２の表面に塗布して塗膜を形成し、該塗膜を焼成して導電膜１４を形成する。
PCT/JP2007/072680 2007-11-22 2007-11-22 導電膜形成用インクおよびプリント配線板の製造方法 WO2009066396A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/072680 WO2009066396A1 (ja) 2007-11-22 2007-11-22 導電膜形成用インクおよびプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/072680 WO2009066396A1 (ja) 2007-11-22 2007-11-22 導電膜形成用インクおよびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
WO2009066396A1 true WO2009066396A1 (ja) 2009-05-28

Family

ID=40667233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072680 WO2009066396A1 (ja) 2007-11-22 2007-11-22 導電膜形成用インクおよびプリント配線板の製造方法

Country Status (1)

Country Link
WO (1) WO2009066396A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038067A (ja) * 2009-08-17 2011-02-24 Samsung Electro-Mechanics Co Ltd インクジェット用金属インク組成物
WO2012053456A1 (ja) * 2010-10-21 2012-04-26 旭硝子株式会社 水素化銅微粒子分散液の製造方法、導電インクおよび導体付き基材の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367402A (ja) * 1989-08-03 1991-03-22 Toagosei Chem Ind Co Ltd 導電性組成物
JPH0644819A (ja) * 1992-07-24 1994-02-18 Kao Corp 導電性ペーストおよび導電性塗膜
WO2002035554A1 (fr) * 2000-10-25 2002-05-02 Harima Chemicals, Inc. Pate metallique electro-conductrice et procede de production de cette pate
JP2002299833A (ja) * 2001-03-30 2002-10-11 Harima Chem Inc 多層配線板およびその形成方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト
JP2006310022A (ja) * 2005-04-27 2006-11-09 Mitsui Mining & Smelting Co Ltd 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板
JP2008034358A (ja) * 2006-06-30 2008-02-14 Asahi Glass Co Ltd 導電膜形成用インクおよびプリント配線板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367402A (ja) * 1989-08-03 1991-03-22 Toagosei Chem Ind Co Ltd 導電性組成物
JPH0644819A (ja) * 1992-07-24 1994-02-18 Kao Corp 導電性ペーストおよび導電性塗膜
WO2002035554A1 (fr) * 2000-10-25 2002-05-02 Harima Chemicals, Inc. Pate metallique electro-conductrice et procede de production de cette pate
JP2002299833A (ja) * 2001-03-30 2002-10-11 Harima Chem Inc 多層配線板およびその形成方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト
JP2006310022A (ja) * 2005-04-27 2006-11-09 Mitsui Mining & Smelting Co Ltd 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板
JP2008034358A (ja) * 2006-06-30 2008-02-14 Asahi Glass Co Ltd 導電膜形成用インクおよびプリント配線板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038067A (ja) * 2009-08-17 2011-02-24 Samsung Electro-Mechanics Co Ltd インクジェット用金属インク組成物
US8389601B2 (en) 2009-08-17 2013-03-05 Samsung Electro-Mechanics Co., Ltd. Inkjet ink composition
WO2012053456A1 (ja) * 2010-10-21 2012-04-26 旭硝子株式会社 水素化銅微粒子分散液の製造方法、導電インクおよび導体付き基材の製造方法

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