WO2009066390A1 - スパッタ装置およびスパッタ方法 - Google Patents
スパッタ装置およびスパッタ方法 Download PDFInfo
- Publication number
- WO2009066390A1 WO2009066390A1 PCT/JP2007/072625 JP2007072625W WO2009066390A1 WO 2009066390 A1 WO2009066390 A1 WO 2009066390A1 JP 2007072625 W JP2007072625 W JP 2007072625W WO 2009066390 A1 WO2009066390 A1 WO 2009066390A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas introduction
- gas
- spattering
- jetting
- connection hole
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本発明に従ったスパッタ装置は、基板を保持する基板保持手段、及び基板の周囲を囲む複数の位置に配置された、ガス噴出口を有するガス導入経路を有し、ガス導入接続口が少なくとも1つのガス導入経路上に設けられており、ガス導入接続口が設けられた少なくとも1つのガス導入経路に設けたガス噴出口数は、ガス導入接続口が設けられていないガス導入経路に設けたガス噴出口数より少であること、又は、ガス導入接続口が設けられた少なくとも1つのガス導入経路に設けたガス噴出口の口径は、ガス導入接続口が設けられていないガス導入経路に設けたガス噴出口の口径より小さいことを特徴とする。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008545488A JPWO2009066390A1 (ja) | 2007-11-22 | 2007-11-22 | スパッタ装置およびスパッタ方法 |
PCT/JP2007/072625 WO2009066390A1 (ja) | 2007-11-22 | 2007-11-22 | スパッタ装置およびスパッタ方法 |
US12/274,022 US20090134010A1 (en) | 2007-11-22 | 2008-11-19 | Sputtering apparatus and sputtering method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/072625 WO2009066390A1 (ja) | 2007-11-22 | 2007-11-22 | スパッタ装置およびスパッタ方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/274,022 Continuation US20090134010A1 (en) | 2007-11-22 | 2008-11-19 | Sputtering apparatus and sputtering method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009066390A1 true WO2009066390A1 (ja) | 2009-05-28 |
Family
ID=40667227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/072625 WO2009066390A1 (ja) | 2007-11-22 | 2007-11-22 | スパッタ装置およびスパッタ方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090134010A1 (ja) |
JP (1) | JPWO2009066390A1 (ja) |
WO (1) | WO2009066390A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009060541A1 (ja) * | 2007-11-09 | 2009-05-14 | Canon Anelva Corporation | インライン型ウェハ搬送装置 |
WO2009060540A1 (ja) * | 2007-11-09 | 2009-05-14 | Canon Anelva Corporation | インライン型ウェハ搬送装置 |
WO2009060539A1 (ja) * | 2007-11-09 | 2009-05-14 | Canon Anelva Corporation | インライン型ウェハ搬送装置 |
WO2011028597A1 (en) * | 2009-08-26 | 2011-03-10 | Veeco Instruments, Inc. | System for fabricating a pattern on magnetic recording media |
TW201137143A (en) * | 2010-04-28 | 2011-11-01 | Hon Hai Prec Ind Co Ltd | Sputtering system |
WO2014105872A2 (en) * | 2012-12-27 | 2014-07-03 | Flir Systems, Inc. | Deposition systems and methods |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311425A (ja) * | 1992-05-12 | 1993-11-22 | Sumitomo Electric Ind Ltd | 半導体装置の製造装置 |
JPH0897288A (ja) * | 1994-09-22 | 1996-04-12 | Sony Corp | リフロー方法及びリフロー装置 |
JPH10212575A (ja) * | 1997-01-29 | 1998-08-11 | Sony Corp | スパッタリング装置 |
JPH11343568A (ja) * | 1998-05-29 | 1999-12-14 | Toyota Motor Corp | 光輝化製品の製造方法及びスパッタリング装置 |
JP2004346406A (ja) * | 2003-05-26 | 2004-12-09 | Anelva Corp | スパッタリング装置 |
-
2007
- 2007-11-22 JP JP2008545488A patent/JPWO2009066390A1/ja active Pending
- 2007-11-22 WO PCT/JP2007/072625 patent/WO2009066390A1/ja active Application Filing
-
2008
- 2008-11-19 US US12/274,022 patent/US20090134010A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311425A (ja) * | 1992-05-12 | 1993-11-22 | Sumitomo Electric Ind Ltd | 半導体装置の製造装置 |
JPH0897288A (ja) * | 1994-09-22 | 1996-04-12 | Sony Corp | リフロー方法及びリフロー装置 |
JPH10212575A (ja) * | 1997-01-29 | 1998-08-11 | Sony Corp | スパッタリング装置 |
JPH11343568A (ja) * | 1998-05-29 | 1999-12-14 | Toyota Motor Corp | 光輝化製品の製造方法及びスパッタリング装置 |
JP2004346406A (ja) * | 2003-05-26 | 2004-12-09 | Anelva Corp | スパッタリング装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009066390A1 (ja) | 2011-03-31 |
US20090134010A1 (en) | 2009-05-28 |
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