WO2009066355A1 - 研磨ヘッド及び研磨装置並びにワークの剥離方法 - Google Patents

研磨ヘッド及び研磨装置並びにワークの剥離方法 Download PDF

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Publication number
WO2009066355A1
WO2009066355A1 PCT/JP2007/001282 JP2007001282W WO2009066355A1 WO 2009066355 A1 WO2009066355 A1 WO 2009066355A1 JP 2007001282 W JP2007001282 W JP 2007001282W WO 2009066355 A1 WO2009066355 A1 WO 2009066355A1
Authority
WO
WIPO (PCT)
Prior art keywords
main body
locking section
polishing
carrier
head main
Prior art date
Application number
PCT/JP2007/001282
Other languages
English (en)
French (fr)
Inventor
Hisashi Masumura
Koji Kitagawa
Kouji Morita
Hiromi Kishida
Satoru Arakawa
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Fujikoshi Machinery Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to CN200780101147.8A priority Critical patent/CN101827684A/zh
Priority to PCT/JP2007/001282 priority patent/WO2009066355A1/ja
Priority to US12/734,119 priority patent/US8323075B2/en
Priority to DE112007003705T priority patent/DE112007003705T5/de
Priority to KR1020107011134A priority patent/KR101411293B1/ko
Publication of WO2009066355A1 publication Critical patent/WO2009066355A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

　本発明は、周縁部に環状の突出部１３ａとキャリア掛止部１３ｂが形成されている円盤状のキャリア１３と、外側に環状のヘッド本体掛止部１２ａが形成されている円盤状のヘッド本体１２と、前記ヘッド本体と前記キャリアを連結するダイヤフラム１４と、前記キャリア掛止部及び／またはヘッド本体掛止部の一部に、該キャリア掛止部と前記ヘッド本体掛止部との間に位置するスペーサー１５とを有し、前記ヘッド本体を上昇させた時、前記キャリア掛止部及び／またはヘッド本体掛止部と前記スペーサーとが当接することで、前記キャリアを傾斜させて持ち上げてワークＷを研磨布から剥離するものである研磨ヘッド１１である。これにより、研磨布に溝を形成したり、定盤から研磨ヘッドをオーバーハングさせたりすることなく、ワークを保持した研磨ヘッドを上昇させてワークを研磨布から容易かつ安全、確実に剥離することができる研磨ヘッド等が提供される。
PCT/JP2007/001282 2007-11-21 2007-11-21 研磨ヘッド及び研磨装置並びにワークの剥離方法 WO2009066355A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200780101147.8A CN101827684A (zh) 2007-11-21 2007-11-21 研磨头、研磨装置以及工件的剥离方法
PCT/JP2007/001282 WO2009066355A1 (ja) 2007-11-21 2007-11-21 研磨ヘッド及び研磨装置並びにワークの剥離方法
US12/734,119 US8323075B2 (en) 2007-11-21 2007-11-21 Polishing head, polishing apparatus and method for demounting workpiece
DE112007003705T DE112007003705T5 (de) 2007-11-21 2007-11-21 Polierkopf, Poliervorrichtung und Verfahren zum Ablösen eines Werkstücks
KR1020107011134A KR101411293B1 (ko) 2007-11-21 2007-11-21 연마 헤드, 연마 장치 및 워크의 박리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/001282 WO2009066355A1 (ja) 2007-11-21 2007-11-21 研磨ヘッド及び研磨装置並びにワークの剥離方法

Publications (1)

Publication Number Publication Date
WO2009066355A1 true WO2009066355A1 (ja) 2009-05-28

Family

ID=40667194

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001282 WO2009066355A1 (ja) 2007-11-21 2007-11-21 研磨ヘッド及び研磨装置並びにワークの剥離方法

Country Status (5)

Country Link
US (1) US8323075B2 (ja)
KR (1) KR101411293B1 (ja)
CN (1) CN101827684A (ja)
DE (1) DE112007003705T5 (ja)
WO (1) WO2009066355A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012086129A1 (ja) * 2010-12-22 2012-06-28 信越半導体株式会社 研磨方法、研磨装置及び研磨布

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009051007B4 (de) * 2009-10-28 2011-12-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
JP4869423B2 (ja) * 2010-05-28 2012-02-08 株式会社東芝 ヘッドジンバルアッセンブリおよびこれを備えたディスク装置
US9011207B2 (en) * 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
CN104117989B (zh) * 2013-04-26 2015-12-09 林锡聪 玻璃面板撷取装置及其撷取玻璃面板的方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN110450047B (zh) * 2019-08-27 2021-06-08 淮北摩兰科技有限公司 一种显示屏异形加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199388A (ja) * 1986-02-21 1987-09-03 株式会社東芝 ハンドリング装置
US5527209A (en) * 1993-09-09 1996-06-18 Cybeq Systems, Inc. Wafer polisher head adapted for easy removal of wafers
JPH08290358A (ja) * 1995-04-17 1996-11-05 Fujikoshi Mach Corp 研磨装置のワーク押圧機構
JPH11320388A (ja) * 1998-05-12 1999-11-24 Speedfam-Ipec Co Ltd 平面研磨装置及びワークの取出方法
JP2000323445A (ja) * 1999-04-22 2000-11-24 Applied Materials Inc 基板センサを有するキャリアヘッド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341070A (ja) 2000-05-31 2001-12-11 Fujikoshi Mach Corp ウェーハの剥離方法
KR100472959B1 (ko) * 2002-07-16 2005-03-10 삼성전자주식회사 언로딩구조가 개선된 반도체 웨이퍼의 표면평탄화설비

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199388A (ja) * 1986-02-21 1987-09-03 株式会社東芝 ハンドリング装置
US5527209A (en) * 1993-09-09 1996-06-18 Cybeq Systems, Inc. Wafer polisher head adapted for easy removal of wafers
JPH08290358A (ja) * 1995-04-17 1996-11-05 Fujikoshi Mach Corp 研磨装置のワーク押圧機構
JPH11320388A (ja) * 1998-05-12 1999-11-24 Speedfam-Ipec Co Ltd 平面研磨装置及びワークの取出方法
JP2000323445A (ja) * 1999-04-22 2000-11-24 Applied Materials Inc 基板センサを有するキャリアヘッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012086129A1 (ja) * 2010-12-22 2012-06-28 信越半導体株式会社 研磨方法、研磨装置及び研磨布

Also Published As

Publication number Publication date
US20100233945A1 (en) 2010-09-16
CN101827684A (zh) 2010-09-08
US8323075B2 (en) 2012-12-04
DE112007003705T5 (de) 2010-12-23
KR101411293B1 (ko) 2014-07-02
KR20100088143A (ko) 2010-08-06

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