WO2009066351A1 - Tête de polissage et appareil de polissage - Google Patents

Tête de polissage et appareil de polissage Download PDF

Info

Publication number
WO2009066351A1
WO2009066351A1 PCT/JP2007/001271 JP2007001271W WO2009066351A1 WO 2009066351 A1 WO2009066351 A1 WO 2009066351A1 JP 2007001271 W JP2007001271 W JP 2007001271W WO 2009066351 A1 WO2009066351 A1 WO 2009066351A1
Authority
WO
WIPO (PCT)
Prior art keywords
middle plate
polishing
polishing head
work
rubber film
Prior art date
Application number
PCT/JP2007/001271
Other languages
English (en)
Japanese (ja)
Inventor
Hisashi Masumura
Koji Kitagawa
Kouji Morita
Hiromi Kishida
Satoru Arakawa
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Fujikoshi Machinery Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to PCT/JP2007/001271 priority Critical patent/WO2009066351A1/fr
Priority to KR1020107010751A priority patent/KR20100094466A/ko
Priority to US12/682,458 priority patent/US20100210192A1/en
Priority to CN200780101162.2A priority patent/CN101827685A/zh
Priority to DE112007003710T priority patent/DE112007003710T5/de
Publication of WO2009066351A1 publication Critical patent/WO2009066351A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

La présente invention se rapporte à une tête de polissage (11) composée d'au moins une plaque intermédiaire sensiblement en forme de disque (12), et d'un film caoutchouc (13) qui recouvre au moins une section surface inférieure et une section surface latérale de la plaque intermédiaire. La tête de polissage comporte une section espace (14) entourée par la plaque intermédiaire et le film caoutchouc, et est conçue pour que la pression dans la section espace soit modifiée par un mécanisme de réglage de pression (15). La tête de polissage maintient la surface arrière d'un ouvrage (W) dans une section surface inférieure du film caoutchouc, et polit la surface de l'ouvrage en faisant glisser la surface de l'ouvrage sur un tissu de polissage (22) adhérant sur une plaque de surface. Dans la tête de polissage, la plaque intermédiaire et le film caoutchouc ne sont pas en contact l'un avec l'autre au moins entièrement sur une section surface inférieure de la plaque intermédiaire, et un espace (14a) est créé. Ainsi, la tête de polissage du système à mandrin de caoutchouc applique une charge de polissage sur tout l'ouvrage sans être affectée par la rigidité et la planarité de la plaque intermédiaire.
PCT/JP2007/001271 2007-11-20 2007-11-20 Tête de polissage et appareil de polissage WO2009066351A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2007/001271 WO2009066351A1 (fr) 2007-11-20 2007-11-20 Tête de polissage et appareil de polissage
KR1020107010751A KR20100094466A (ko) 2007-11-20 2007-11-20 연마 헤드 및 연마 장치
US12/682,458 US20100210192A1 (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus
CN200780101162.2A CN101827685A (zh) 2007-11-20 2007-11-20 研磨头及研磨装置
DE112007003710T DE112007003710T5 (de) 2007-11-20 2007-11-20 Polierkopf und Poliervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/001271 WO2009066351A1 (fr) 2007-11-20 2007-11-20 Tête de polissage et appareil de polissage

Publications (1)

Publication Number Publication Date
WO2009066351A1 true WO2009066351A1 (fr) 2009-05-28

Family

ID=40667190

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001271 WO2009066351A1 (fr) 2007-11-20 2007-11-20 Tête de polissage et appareil de polissage

Country Status (5)

Country Link
US (1) US20100210192A1 (fr)
KR (1) KR20100094466A (fr)
CN (1) CN101827685A (fr)
DE (1) DE112007003710T5 (fr)
WO (1) WO2009066351A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012192470A (ja) * 2011-03-15 2012-10-11 Asahi Glass Co Ltd 板状体の研磨装置
DE112012002493T8 (de) * 2011-06-29 2014-06-12 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
US9566687B2 (en) 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN110815071A (zh) * 2019-12-09 2020-02-21 深圳市汇友环境科技有限公司 防脱转换片及其制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574749A (ja) * 1991-09-13 1993-03-26 Toshiro Doi デバイス付きウエーハのプラナリゼーシヨンポリツシング方法及びその装置
JP2001260004A (ja) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp ウェーハ研磨ヘッド
JP2002524281A (ja) * 1998-09-08 2002-08-06 アプライド マテリアルズ インコーポレイテッド 基板を化学機械的に研磨するためのキャリアヘッド
JP2003019661A (ja) * 2001-07-09 2003-01-21 Okamoto Machine Tool Works Ltd 研磨装置における基板キャリア
JP2004154933A (ja) * 2002-11-07 2004-06-03 Ebara Technologies Inc ピボット機構を有する垂直方向に調整可能な化学機械研磨ヘッドおよびその利用のための方法
JP2004327547A (ja) * 2003-04-22 2004-11-18 Shin Etsu Handotai Co Ltd ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
JP2006159392A (ja) * 2004-12-10 2006-06-22 Ebara Corp 基板保持装置および研磨装置

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Publication number Priority date Publication date Assignee Title
JPH0569310A (ja) 1991-04-23 1993-03-23 Mitsubishi Materials Corp ウエーハの鏡面研磨装置
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
FR2778129B1 (fr) * 1998-05-04 2000-07-21 St Microelectronics Sa Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
JP2001345297A (ja) * 2000-05-30 2001-12-14 Hitachi Ltd 半導体集積回路装置の製造方法及び研磨装置
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
KR100621629B1 (ko) * 2004-06-04 2006-09-19 삼성전자주식회사 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법
JP2007307623A (ja) * 2006-05-16 2007-11-29 Elpida Memory Inc 研磨装置
JP2009539626A (ja) * 2006-06-02 2009-11-19 アプライド マテリアルズ インコーポレイテッド メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574749A (ja) * 1991-09-13 1993-03-26 Toshiro Doi デバイス付きウエーハのプラナリゼーシヨンポリツシング方法及びその装置
JP2002524281A (ja) * 1998-09-08 2002-08-06 アプライド マテリアルズ インコーポレイテッド 基板を化学機械的に研磨するためのキャリアヘッド
JP2001260004A (ja) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp ウェーハ研磨ヘッド
JP2003019661A (ja) * 2001-07-09 2003-01-21 Okamoto Machine Tool Works Ltd 研磨装置における基板キャリア
JP2004154933A (ja) * 2002-11-07 2004-06-03 Ebara Technologies Inc ピボット機構を有する垂直方向に調整可能な化学機械研磨ヘッドおよびその利用のための方法
JP2004327547A (ja) * 2003-04-22 2004-11-18 Shin Etsu Handotai Co Ltd ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
JP2006159392A (ja) * 2004-12-10 2006-06-22 Ebara Corp 基板保持装置および研磨装置

Also Published As

Publication number Publication date
US20100210192A1 (en) 2010-08-19
CN101827685A (zh) 2010-09-08
KR20100094466A (ko) 2010-08-26
DE112007003710T5 (de) 2010-12-02

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