WO2009060788A1 - ダイシング・ダイボンドフィルム - Google Patents

ダイシング・ダイボンドフィルム Download PDF

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Publication number
WO2009060788A1
WO2009060788A1 PCT/JP2008/069800 JP2008069800W WO2009060788A1 WO 2009060788 A1 WO2009060788 A1 WO 2009060788A1 JP 2008069800 W JP2008069800 W JP 2008069800W WO 2009060788 A1 WO2009060788 A1 WO 2009060788A1
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WO
WIPO (PCT)
Prior art keywords
dicing
bonding film
die
hydroxyl
work
Prior art date
Application number
PCT/JP2008/069800
Other languages
English (en)
French (fr)
Inventor
Takeshi Matsumura
Katsuhiko Kamiya
Shuuhei Murata
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007314907A external-priority patent/JP4717052B2/ja
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to US12/741,859 priority Critical patent/US20100239866A1/en
Priority to KR1020137027290A priority patent/KR101370771B1/ko
Priority to DE200811003020 priority patent/DE112008003020T5/de
Priority to CN2008801151815A priority patent/CN101855711B/zh
Priority to KR1020107025178A priority patent/KR101370687B1/ko
Publication of WO2009060788A1 publication Critical patent/WO2009060788A1/ja

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

　ワークが薄型の場合にも、ワークをダイシングする際の保持力と、ダイシングにより得られるチップ状ワークをそのダイボンドフィルムと一体に剥離する際の剥離性とのバランス特性に優れるダイシング・ダイボンドフィルムを提供する。基材上に粘着剤層を有するダイシングフィルムと、ダイシングフィルム上に設けられたダイボンドフィルムとを有するダイシング・ダイボンドフィルムであって、粘着剤層は、１０～３０ｍｏｌ％のヒドロキシル基含有モノマーを含むアクリル系ポリマーに、ヒドロキシル基含有モノマーに対し７０～９０ｍｏｌ％の範囲内のラジカル反応性炭素－炭素二重結合を有するイソシアネート化合物を付加反応させたポリマーと、ヒドロキシル基に対し反応性を示す官能基を分子中に２個以上備え、かつ、ポリマー１００重量部に対し含有量が２～２０重量部の架橋剤を含み、ダイボンドフィルムはエポキシ樹脂を含み構成される。    
PCT/JP2008/069800 2007-11-08 2008-10-30 ダイシング・ダイボンドフィルム WO2009060788A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/741,859 US20100239866A1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film
KR1020137027290A KR101370771B1 (ko) 2007-11-08 2008-10-30 다이싱·다이본드 필름
DE200811003020 DE112008003020T5 (de) 2007-11-08 2008-10-30 Klebefolie für das Schneiden von Chips
CN2008801151815A CN101855711B (zh) 2007-11-08 2008-10-30 切割/芯片接合薄膜
KR1020107025178A KR101370687B1 (ko) 2007-11-08 2008-10-30 다이싱·다이본드 필름

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007291052 2007-11-08
JP2007-291052 2007-11-08
JP2007314907A JP4717052B2 (ja) 2007-11-08 2007-12-05 ダイシング・ダイボンドフィルム
JP2007-314907 2007-12-05

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WO2009060788A1 true WO2009060788A1 (ja) 2009-05-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239763A1 (en) * 2008-01-18 2010-10-13 Nitto Denko Corporation Dicing/die bonding film
EP2242089A1 (en) * 2008-01-18 2010-10-20 Nitto Denko Corporation Dicing/die bonding film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096412A (ja) * 2001-09-26 2003-04-03 Nitto Denko Corp 半導体部品ダイシング用粘着シートおよび半導体部品の製造方法
JP2005005355A (ja) * 2003-06-10 2005-01-06 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005116920A (ja) * 2003-10-10 2005-04-28 Nitto Denko Corp 半導体加工用粘着シートおよび半導体加工方法
JP2005239884A (ja) * 2004-02-26 2005-09-08 Nitto Denko Corp 半導体ウエハ加工用粘着シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096412A (ja) * 2001-09-26 2003-04-03 Nitto Denko Corp 半導体部品ダイシング用粘着シートおよび半導体部品の製造方法
JP2005005355A (ja) * 2003-06-10 2005-01-06 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005116920A (ja) * 2003-10-10 2005-04-28 Nitto Denko Corp 半導体加工用粘着シートおよび半導体加工方法
JP2005239884A (ja) * 2004-02-26 2005-09-08 Nitto Denko Corp 半導体ウエハ加工用粘着シート

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239763A1 (en) * 2008-01-18 2010-10-13 Nitto Denko Corporation Dicing/die bonding film
EP2242089A1 (en) * 2008-01-18 2010-10-20 Nitto Denko Corporation Dicing/die bonding film
EP2239763A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp Dicing / CHIP BOND FILM
EP2242089A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp CUTTING FILM IN CHIPS / FIXING OF CHIPS

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