WO2009054371A1 - Method for formation of metal coating film, and electrically conductive particle - Google Patents

Method for formation of metal coating film, and electrically conductive particle Download PDF

Info

Publication number
WO2009054371A1
WO2009054371A1 PCT/JP2008/069024 JP2008069024W WO2009054371A1 WO 2009054371 A1 WO2009054371 A1 WO 2009054371A1 JP 2008069024 W JP2008069024 W JP 2008069024W WO 2009054371 A1 WO2009054371 A1 WO 2009054371A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating film
metal coating
conductive particle
electrically non
formation
Prior art date
Application number
PCT/JP2008/069024
Other languages
French (fr)
Japanese (ja)
Inventor
Hidekatsu Kuroda
Original Assignee
Ube-Nitto Kasei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube-Nitto Kasei Co., Ltd. filed Critical Ube-Nitto Kasei Co., Ltd.
Priority to JP2009538214A priority Critical patent/JP5620678B2/en
Priority to KR1020107008712A priority patent/KR101502995B1/en
Priority to CN200880111331A priority patent/CN101842515A/en
Publication of WO2009054371A1 publication Critical patent/WO2009054371A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

Disclosed is a method for forming a metal coating film, which is characterized by forming a metal coating film on an electrically non-conductive particle having a particle diameter of 0.5 to 100 μm by electroless plating. The electroless plating is carried out after a pre-treatment for attaching a metal core to the electrically non-conductive particle is carried out, and can form a metal coating film made of silver in the presence of a silane compound having a thiol group. The metal coating film formed over the entire surface of the electrically non-conductive particle can impart electrical conductivity to the electrically non-conductive particle. The electrically non-conductive particle has a particle diameter ranging from 0.5 to 100 μm. The metal coating film is composed of a single silver layer.
PCT/JP2008/069024 2007-10-23 2008-10-21 Method for formation of metal coating film, and electrically conductive particle WO2009054371A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009538214A JP5620678B2 (en) 2007-10-23 2008-10-21 Metal film forming method and conductive particles
KR1020107008712A KR101502995B1 (en) 2007-10-23 2008-10-21 Method for formation of metal coating film, and electrically conductive particle
CN200880111331A CN101842515A (en) 2007-10-23 2008-10-21 Method for formation of metal coating film, and electrically conductive particle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007275794 2007-10-23
JP2007-275794 2007-10-23

Publications (1)

Publication Number Publication Date
WO2009054371A1 true WO2009054371A1 (en) 2009-04-30

Family

ID=40579476

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069024 WO2009054371A1 (en) 2007-10-23 2008-10-21 Method for formation of metal coating film, and electrically conductive particle

Country Status (5)

Country Link
JP (1) JP5620678B2 (en)
KR (1) KR101502995B1 (en)
CN (1) CN101842515A (en)
TW (1) TWI467049B (en)
WO (1) WO2009054371A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011058050A (en) * 2009-09-10 2011-03-24 Ricoh Co Ltd Composite metal nanoparticle and method for producing the same, and multiphoton absorption material or multiphoton absorption reaction auxiliary containing composite metal nanoparticle
JP2011168631A (en) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd Method for producing metal-coated particle
JP2013510953A (en) * 2009-11-16 2013-03-28 ビーエーエスエフ ソシエタス・ヨーロピア Island metal coating and synthesis method
WO2012072658A3 (en) * 2010-11-30 2013-12-12 Technische Universität Dresden Process for coating nanoparticles with metal by means of electroless deposition techniques
JP5497183B2 (en) * 2010-08-20 2014-05-21 三菱マテリアル株式会社 Silver-coated spherical resin, production method thereof, anisotropic conductive adhesive containing silver-coated spherical resin, anisotropic conductive film, and conductive spacer
WO2016121558A1 (en) * 2015-01-28 2016-08-04 三菱マテリアル株式会社 Silver-coated particles and method for producing same
JP2016146319A (en) * 2015-01-28 2016-08-12 三菱マテリアル株式会社 Silver coated particle and manufacturing method thereof
EP3096330A4 (en) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Composite conductive particles, conductive resin composition containing same and conductive coated article
CN114695896A (en) * 2022-03-14 2022-07-01 电子科技大学 Self-assembly high-barrier film packaging method of electronic device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102681262B (en) * 2012-02-23 2016-02-24 京东方科技集团股份有限公司 A kind of conductivity type chock insulator matter be entrained in sealed plastic box and its preparation method and application
WO2014203649A1 (en) * 2013-06-18 2014-12-24 株式会社Ｊｃｕ Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same
EP3729468B1 (en) * 2017-12-22 2023-05-10 ECKART GmbH Electrically conductive particles, composition, article and method of manufacturing electrically conductive particles

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051151A (en) * 2003-07-31 2005-02-24 Seiko Epson Corp Manufacturing method for conductive layer, substrate with conductive layer and electronic device
JP2006169566A (en) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd Colored particle manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642189B2 (en) * 1987-09-07 1994-06-01 触媒化成工業株式会社 Touch panel
JPH0696771B2 (en) * 1988-03-24 1994-11-30 日本化学工業株式会社 Electroless plating powder, conductive filler and method for producing the same
JP3940638B2 (en) * 2002-06-10 2007-07-04 積水化学工業株式会社 Conductive fine particles and method for producing conductive fine particles
JP2004224942A (en) * 2003-01-24 2004-08-12 Kinugawa Rubber Ind Co Ltd Anisotropic conductive elastic body composition and its preparing process
JP2006040546A (en) * 2004-07-22 2006-02-09 Sanyo Chem Ind Ltd Conductive particulate
JP2007242307A (en) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd Conductive particulate and anisotropic conductive material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051151A (en) * 2003-07-31 2005-02-24 Seiko Epson Corp Manufacturing method for conductive layer, substrate with conductive layer and electronic device
JP2006169566A (en) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd Colored particle manufacturing method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011058050A (en) * 2009-09-10 2011-03-24 Ricoh Co Ltd Composite metal nanoparticle and method for producing the same, and multiphoton absorption material or multiphoton absorption reaction auxiliary containing composite metal nanoparticle
JP2013510953A (en) * 2009-11-16 2013-03-28 ビーエーエスエフ ソシエタス・ヨーロピア Island metal coating and synthesis method
JP2011168631A (en) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd Method for producing metal-coated particle
JP5497183B2 (en) * 2010-08-20 2014-05-21 三菱マテリアル株式会社 Silver-coated spherical resin, production method thereof, anisotropic conductive adhesive containing silver-coated spherical resin, anisotropic conductive film, and conductive spacer
US9093192B2 (en) 2010-08-20 2015-07-28 Mitsubishi Materials Corporation Silver-coated spherical resin, method for producing same, anisotropically conductive adhesive containing silver-coated spherical resin, anisotropically conductive film containing silver-coated spherical resin, and conductive spacer containing silver-coated spherical resin
WO2012072658A3 (en) * 2010-11-30 2013-12-12 Technische Universität Dresden Process for coating nanoparticles with metal by means of electroless deposition techniques
EP3096330A4 (en) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Composite conductive particles, conductive resin composition containing same and conductive coated article
US10227496B2 (en) 2014-01-14 2019-03-12 Toyo Aluminium Kabushiki Kaisha Composite conductive particle, conductive resin composition containing same and conductive coated article
WO2016121558A1 (en) * 2015-01-28 2016-08-04 三菱マテリアル株式会社 Silver-coated particles and method for producing same
JP2016146319A (en) * 2015-01-28 2016-08-12 三菱マテリアル株式会社 Silver coated particle and manufacturing method thereof
US10590540B2 (en) 2015-01-28 2020-03-17 Mitsubishi Materials Corporation Silver-coated particle and method of producing same
CN114695896A (en) * 2022-03-14 2022-07-01 电子科技大学 Self-assembly high-barrier film packaging method of electronic device

Also Published As

Publication number Publication date
KR20100093518A (en) 2010-08-25
CN101842515A (en) 2010-09-22
JP5620678B2 (en) 2014-11-05
TW200936807A (en) 2009-09-01
JPWO2009054371A1 (en) 2011-03-03
KR101502995B1 (en) 2015-03-16
TWI467049B (en) 2015-01-01

Similar Documents

Publication Publication Date Title
WO2009054371A1 (en) Method for formation of metal coating film, and electrically conductive particle
TWI350780B (en) Electrode wire for spark erosion
TW200635461A (en) Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment
TW200746199A (en) Laminated electronic component and method for manufacturing the same
JP2010045353A5 (en)
TW200616789A (en) Article with a coating of electrically conductive polymer and process for production thereof
TW200942644A (en) Anti-tarnish coating
WO2009005042A1 (en) Metal material, method for producing the same, and electrical electronic component using the same
HK1160232A1 (en) Process for fabricating multi-level metal parts by the uv-liga technique uv-liga
TW200802649A (en) Manufacturing method of package substrate
TW200641918A (en) Method for manufacturing base material provided with conductor layer pattern, base material provided with conductor layer pattern and electromagnetic wave blocking member using such base material
WO2008029376A3 (en) Deposition of conductive polymer and metallization of non-conductive substrates
WO2009016980A1 (en) Plated material having metal thin film formed by electroless plating, and method for production thereof
CN102438412B (en) Back drilling method of PCB (Printed Circuit Board)
WO2009016979A1 (en) Plated material having metal thin film formed by electroless plating, and method for production thereof
WO2008027856A3 (en) Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
WO2011028004A3 (en) Copper foil for an embedded pattern for forming a microcircuit
WO2004077633A3 (en) Thin coaxial cable and method for its manufacture
TW200730659A (en) Formation method of metal film
EP2442367A3 (en) Improved method for forming metal contacts
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
WO2006074902A3 (en) Method for depositing palladium layers and palladium bath therefor
MY148752A (en) Process of fabricating a circuit board
GB201110808D0 (en) Building materials
CN203589206U (en) Low cost type electroplating structure of LDS antenna

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880111331.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08843227

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009538214

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20107008712

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08843227

Country of ref document: EP

Kind code of ref document: A1