JPH0642189B2 - Touch panel - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to a touch panel used for inputting by a computer or the like.

Technical background of the invention and its problems Many input devices for computers have been developed. Typical examples are keyboards, trackballs, mice, pressure sensitive pads, digitizers, and touch panels.
However, a touch panel that allows direct input of predetermined information on the display screen while looking at the display screen is often easier and more convenient to use than other input devices.

There are a matrix type and an analog type as typical touch panels. In a matrix type touch panel, two transparent electrodes on a transparent insulating base material are etched and processed into strips, a spacer is interposed between them, and the transparent electrodes are crossed vertically and horizontally to face each other. There is. In an analog type touch panel, the transparent electrodes are not processed into strips, but electrodes are provided on both ends of the transparent electrodes with silver paste or the like. The position coordinates are detected by a digital (A / D) converter. Since the position detection resolution of the matrix type depends on the width of the strip, it is not suitable for inputting characters and figures, and is used exclusively as a touch switch. On the other hand, the analog type is A /
Due to the ability of the D converter, high resolution can be expected, and it has become the mainstream for character / graphic input.

However, in such an analog type touch panel, in order to prevent erroneous input, it is necessary to interpose a spacer, which is an insulator, between the transparent electrodes by means of printing or the like. Cannot be entered. Also, since the width of the spacer is wide, the resolution is limited,
It was impossible to input high-definition characters or figures.
Further, since the spacer is wide, the transparency of the transparent electrode is likely to be deteriorated, and in order to prevent this, the distance between the spacers must be increased. However, as a result, the transparent insulating base material may bend, or when the touch panel is touched by mistake (hereinafter referred to as erroneous input), the space held by the spacer disappears, causing the transparent electrodes to come into contact with each other and cause malfunctions. There were things.

Further, such an analog type touch panel is not suitable as an electrode because the transparent electrode is damaged or the surface resistance of the transparent electrode is deteriorated by the pressure applied at the time of input or the arc generated when the transparent electrode comes into contact. Sometimes the function could not be maintained.

OBJECT OF THE INVENTION The present invention mainly solves the problems associated with the prior art in the above analog type touch panel. That is, it is an object of the present invention to provide a touch panel that is highly durable and has few erroneous inputs even though high-definition characters and figures can be input.

SUMMARY OF THE INVENTION A touch panel according to the present invention comprises a combination of two base materials (A) and (B) in which a conductive layer is formed on one surface of an insulating base material. In the touch panel arranged in parallel at a predetermined interval and pressing a part of one of the base materials to bring a part of the conductive layers into electrical contact with each other, the base material (A) Is a kind of base material selected from the following base materials III, V, VI, VII, VIII and IX, and a base material (B) is a kind of base material selected from the following base materials I to IX. , The following base material II
In I, V, VI, VII, VIII, and IX, some of the insulating particles are exposed from the conductive layer, and the other parts of the insulating particles are embedded in the conductive layer, and the insulating is exposed from the conductive layer. The tip of the particle is located at the top of the conductive layer.

Substrate I: Substrate having a conductive layer made of a resistive film formed on the surface Substrate II: Substrate having a conductive layer made of a resistive film dispersed on the surface Substrate III: Conductive particles dispersed A resistance film and a conductive film in which a coating in which insulating particles are dispersed are laminated in this order on the surface of a base material, a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is formed. Is embedded in the coating, and the coating may be insulative or conductive. When the coating is insulative, a group in which a part of the conductive particles is exposed on the surface of the conductive layer is formed. Material Base material IV: A base material having a conductive layer in which a resistance film and a coating film in which conductive particles are dispersed are laminated on the base material surface in this order. Base material V: a resistance film and a coating film in which conductive particles are dispersed, A coating film in which insulating particles are dispersed has a conductive layer laminated on the surface of the base material in this order, and the insulating particles A part is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the insulating particle-dispersed coating, and the insulating particle-dispersed coating may be insulative or conductive. When the particle-dispersed coating is insulative, the base material in which the conductive particles are exposed on the surface of the conductive layer Base material VI: A conductive layer composed of a resistance film in which insulating particles are dispersed is formed on the surface, Part is exposed on the surface of the conductive layer, and the other part of the insulating particles is a base material embedded in the conductive layer. Base material VII: a resistive film and a conductive coating in which insulating particles are dispersed are the base materials in this order. It has a conductive layer laminated on the surface,
A base material in which a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the conductive coating material. Base material VIII: Conductivity consisting of conductive particles and a resistance film in which insulating particles are dispersed A layer is formed on the surface, a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the conductive layer. Base material IX: resistive film and conductive particles A coating film in which insulating particles are dispersed has a conductive layer formed on the surface of a base material in this order, a part of the insulating particles is exposed on the conductive layer surface, and the other part of the insulating particles is the coating film. Embedded in the coating, the coating may be insulative or conductive, and when the coating is insulative, a base material in which a part of the conductive particles is exposed on the conductive layer surface. Of the materials I to IX, the base materials III, V, VI, VII, VIII,
In IV, a part of the insulating particles is exposed from the conductive layer, the other part of the insulating particles is embedded in the conductive layer, and the exposed tips of the insulating particles are located at the uppermost part of the conductive layer. When both the insulating particles and the conductive particles are contained in the conductive layer, the tips of the insulating particles are projected above the tips of the conductive particles from the conductive layer, and the insulating particles move between the base materials of the touch panel. It plays a role in maintaining a constant interval.

The first touch panel according to the present invention (hereinafter referred to as the first touch panel) uses a base material III as a base material (A) and combines one kind selected from base materials I to IX as a base material (B). Composed of structure.

A second touch panel according to the present invention (hereinafter referred to as the second touch panel) uses a base material V as a base material (A) and selects one of base materials I, II, IV, and V to IX as a base material (B). It consists of a combination of selected types.

A third touch panel according to the present invention (hereinafter referred to as the third touch panel) uses a base material VI as a base material (A) and selects one of base materials I, II, IV, and VI to IX as a base material (B). It consists of a combination of selected types.

A fourth touch panel according to the present invention (hereinafter referred to as the fourth touch panel) uses a base material VII as a base material (A) and selects one of base materials I, II, IV, and VII to IX as a base material (B). It consists of a combination of selected types.

A fifth touch panel according to the present invention (hereinafter referred to as the fifth touch panel) uses a substrate VIII as a substrate (A) and a substrate I, II, IV, VIII, IX as a substrate (B). It consists of a combination of selected types.

The sixth touch panel according to the present invention (hereinafter referred to as the sixth touch panel) uses the base material IX as the base material (A) and is selected from the base materials I, II, IV and IX as the base material (B). It consists of a combination of types.

In the first to sixth touch panels, since the insulating particles act as a spacer in the conventional touch panel, erroneous input can be effectively prevented. Moreover, since the insulating particles and the conductive particles have a small particle diameter, the resolution is improved as compared with the conventional touch panel, and high-definition characters and figures can be input. In order to manufacture the touch panel of the present invention, a conductive film and / or insulating particles are dispersed in advance to form a resistance film, and a conductive film and / or insulating particles are uniformly dispersed to form a coating film. It may be applied on the insulating base material according to the structure of the materials I to IX. Therefore, unlike the conventional touch panel, it is not necessary to print only the spacers in a dot shape in the subsequent process. Further, in the touch panel of the present invention, since the resistance films do not come into direct contact with each other, the touch panel of the present invention has a structure capable of surely preventing an erroneous operation due to erroneous input. Furthermore, the touch panel of the present invention is set so that the surface resistance value of one of the conductive layers facing each other is set to be equal to or higher than the surface resistance value of the other conductive layer, and the positive side of the power source is connected to the conductive layer side having a high resistance value. With this configuration, it is possible to effectively prevent the arc that occurs when the conductive layers are brought into contact with each other in the conventional touch panel. Therefore, the resistance film or the like is not scratched or peeled off, or the surface resistance thereof is not deteriorated, so that the resistance film can be used for a long period of time, and the durability is significantly improved as compared with the conventional touch panel.

DETAILED DESCRIPTION OF THE INVENTION The touch panel of the present invention will be described below with reference to the embodiments shown in the drawings.

First, the substrates I to IX used in the touch panel of the present invention will be described. 1 to 9 are cross-sectional views of main parts of the base materials I to IX.

FIG. 1 shows the substrate I. In this base material I, a resistance film 6 (7) is formed as a conductive layer on the surface of the insulating base material 4 (5). That is, the resistance film 6 is formed on the surface of the insulating base material 4.
And the resistance film 7 is formed on the surface of the insulating base material 5.

FIG. 2 shows the substrate II. In this base material II, a resistance film 6 (7) in which conductive particles 15 are dispersed is formed as a conductive layer on the surface of the insulating base material 4 (5).

FIG. 3 shows the substrate III. In this substrate III, a conductive layer in which a resistance film 6 (7) in which conductive particles 15 are dispersed and a coating film 9 in which insulating particles 14 are dispersed are laminated in this order on the surface of the insulating substrate 4 (5) Has been formed. this house,
Part of the insulating particles 14 is exposed on the surface of the coating 9 (that is, the surface of the conductive layer), and the other part of the insulating particles 14 is embedded in the coating 9. Further, part of the conductive particles 15 is also exposed on the surface of the coating film 9 (that is, the surface of the conductive layer).

The coating 9 may be insulating or conductive, but when the coating 9 is insulating, the conductive particles 15 are exposed on the surface of the conductive layer. If the coating 9 is conductive, the conductive particles 1
5 may not be exposed on the surface of the conductive layer.

FIG. 4 shows the substrate IV. In this substrate IV, the resistive film 6 (7) and the conductive particles 1 are formed on the surface of the insulating substrate 4 (5).
A coating layer 8 in which 5 is dispersed is laminated in this order to form a conductive layer.

FIG. 5 shows the substrate V. In this base material V, the resistive film 6 (7) and the conductive particles 1 are formed on the surface of the insulating base material 4 (5).
Coating 8 in which 5 is dispersed and coating 9 in which insulating particles 14 are dispersed
To form a conductive layer. Of these, some of the insulating particles 14 are exposed on the surface of the coating 9 (that is, the surface of the conductive layer), and the other portions of the insulating particles 14 are embedded in the coating 9. Further, part of the conductive particles 15 is also exposed on the surface of the coating film 9 (that is, the surface of the conductive layer).

The coating 9 may be insulating or conductive, but when the coating 9 is insulating, the conductive particles 15 are exposed on the surface of the conductive layer. If the coating 9 is conductive, the conductive particles 1
5 may not be exposed on the surface of the conductive layer.

FIG. 6 shows substrate VI. In this base material VI, a resistance film 6 (7) having insulating particles 14 dispersed therein is formed as a conductive layer on the surface of the insulating base material 4 (5). Of these, part of the insulating particles 14 is exposed on the surface of the resistive film 6 (7) (that is, the surface of the conductive layer), and the other part of the insulating particles 14 is embedded in the resistive film 6 (7).

FIG. 7 shows the substrate VII. In this base material VII, a conductive layer in which a resistive film 6 (7) and a conductive coating film 9 in which insulating particles 14 are dispersed are laminated in this order is formed on the surface of the insulating base material 4 (5). . Of these, some of the insulating particles 14 are exposed on the surface of the conductive coating 9 (that is, the surface of the conductive layer), and the other portions of the insulating particles 14 are embedded in the conductive coating 9.

FIG. 8 shows the substrate VIII. In this substrate VIII,
Conductive particles 1 as a conductive layer on the surface of the insulating base material 4 (5)
5 and the insulating particles 14 are dispersed in the resistance film 6 (7), of which part of the insulating particles 14 is the resistance film 6
It is exposed on the surface of (7) (that is, the surface of the conductive layer),
The other part of the insulating particles 14 is embedded in the resistance film 6 (7).

FIG. 9 shows the substrate IX. In this substrate IX, the resistive film 6 (7) and the conductive particles 1 are formed on the surface of the insulating substrate 4 (5).
5 and the coating film 10 in which the insulating particles 14 are dispersed are laminated in this order to form a conductive layer. Of these, part of the insulating particles 14 is the surface of the coating film 10 (that is, the surface of the conductive layer).
The other part of the insulating particles 14 is embedded in the coating film 10. Further, part of the conductive particles 15 is also exposed on the surface of the coating film 10 (that is, the surface of the conductive layer).

The coating 10 may be insulating or conductive,
When the coating film 10 is insulative, the conductive particles 15 are exposed on the surface of the conductive layer. When the coating film 10 is conductive, the conductive particles 15 may not be exposed on the surface of the conductive layer.

Both the insulating particles and the conductive particles are contained in the conductive layers of the base materials III, V, VIII, and IX. Thus, in the base material in which the insulating particles and the conductive particles are both contained in the conductive layer, the tips of the insulating particles exposed on the surface of the conductive layer are located at the uppermost part of the conductive layer. That is, the height of the tip of the insulating particle protruding and exposed from the surface of the conductive layer is higher than the height of the tip of the conductive particle protruding and exposed from the surface of the conductive layer in the same manner. Therefore, one of the base materials III, V, VIII, and IX is combined with any one of the base materials I to IX so that the conductive layers face each other. When a touch panel is manufactured by using the touch panel, insulating layers contained in the conductive layers of the substrates III, V, VIII, and IX keep the conductive layers of the pair of substrates at a constant interval.

Hereinafter, the insulating base material, the conductive particles, the insulating particles, the resistance film, and the coating film used for the base materials I to IX will be described.

The insulating base material is plate-shaped, and as its material, glass or plastic can be used. The insulating base material may be transparent or opaque, but when the touch panel of the present invention is arranged and used on a display device or the like, a transparent one is used. In that case, transparent resistance films and coatings are used. The touch panel of the present invention configured by appropriately combining the base materials I to IX has one insulating base material pressed to bend the insulating base material, and through the conductive layer formed on the insulating base material. In this structure, the conductive layers facing each other are partially brought into contact with each other to be electrically conducted. Therefore, when combining the substrates I to IX, one of the insulating substrates having flexibility is used. For example, a plastic film or a plastic sheet is suitable.

Conductive particles are anything good if the volume resistivity of the small, preferably 10 ⁰ Omega · cm or less, particularly preferably 10
^-1 Ω · cm or less is preferable. Specifically, Au, Ag,
Metal particles such as Pt, Pd, Sn, Cu, Ni, Zn, Fe and Pb or alloy particles of the above metals can be used. In addition, inorganic particles or resin particles in which a metal is plated can also be used.

The distance d ₂ between the conductive particles contained in the resistance film or the coating is
It is preferable that d ₂ ≦ 300 μm. If it exceeds 300 μm,
There may be a part that cannot be entered. In addition, for applications requiring transparency, 5 μm ≦ d ₂ is preferable. 5 μm
If it is less than the above, the total light transmittance of the substrate and the transparency such as haze cannot be maintained.

The insulating particles keep the gap between the two conductive layers so that the conductive layers facing each other of the touch panel of the present invention are not always in contact with each other. The volume resistance is preferably 10 ⁸ Ω · cm or more, and more preferably 10 ¹² Ω · cm or more. As a material for the insulating particles, a resin or an inorganic material can be used. As the resin, any of a thermoplastic resin, a thermosetting resin and an ultraviolet curable resin can be used. Further, oxides, carbides, and nitrides can be used as the inorganic substance.

These resins or inorganic substances can be used alone or in combination of two kinds, or both may be mixed. The particle size of the insulating particles is selected to be larger than the film thickness of the resistance film and the film. Furthermore, if the respective particle diameters are larger than the film thickness of the resistance film and the film, several kinds of insulating particles having different particle diameters can be used in combination. In this case, there are advantages that the transparency and insulation of the touch panel can be improved, and that the load at the time of input becomes constant at any coordinates on the input surface. This is because the insulating particles having a relatively small particle size (insulating particles having a small particle size) are conveniently arranged between the insulating particles having a relatively large particle size (insulating particles having a large particle size). Insulation particles of large diameter conveniently assist the insulation effect of large-diameter insulating particles, reduce the large-sized insulating particles that cause deterioration of transparency, and widen the intervals of large-sized insulating particles. This is because it is possible.

The distance d ₁ between the insulating particles contained in the resistance film or the film is
It is preferable that d ₁ ≦ 1000 μm. More preferably, 5
It is not more than 00 μm. If it exceeds 1000 μm, the resistance films may always contact with each other via the conductive layer.
For applications requiring transparency, 30 μm ≦ d ₁ ≦ 1
000 μm is preferable. If it is less than 30 μm, the total light transmittance of the substrate and the transparency such as haze cannot be maintained.

As a means for uniformly dispersing conductive particles or insulating particles in each film, conductive particles or insulating particles are uniformly blended in a resistance film forming coating or a film forming coating, and this coating is applied to an insulating substrate. It may be applied on the surface to a predetermined thickness.

The resistance film is a conductive indium oxide film (ITO film) or a conductive tin oxide film (NESA film) on an insulating substrate by a vapor phase method such as a vapor deposition method, a sputtering method or a CVD method.
Etc. can be obtained by applying. For forming a resistance film, apply an opaque electrode paste such as silver paste or carbon paste, or (a) a conductive oxide powder dispersed in (b) a binder resin (hereinafter referred to as a binder resin for a resistance film). It is also possible to apply a paint to form it on the insulating substrate. (c) conductive particles and / or (d)
In the case of a resistance film in which insulating particles are dispersed, (c) conductive particles and / or (d) insulating particles may be mixed in the resistance film forming coating material.

The (b) binder resin for the resistance film used in this resistance film forming coating is a thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or a carrier moving speed of 10 ^-8 cm ²
A conductive resin of / V · sec or more can be used. Specifically, acrylic resin such as methacrylic resin, urea resin, amino resin such as melamine resin, polyamide resin, polyimide resin, polyamideimide resin, polyurethane resin, polyether resin, alkyd resin, etc. Chlorinated resin such as polyester resin, epoxy resin and chlorinated polyether resin, polyolefin resin such as polyethylene resin and polypropylene resin,
Polycarbonate resin, silicone resin, polystyrene resin, ABS resin, polyamine sulfone resin,
Polysulfone resin such as polyethersulfone resin, vinyl chloride resin, vinylidene chloride resin, vinyl acetate resin, polyvinyl carbazole resin, vinyl resin such as butyral resin, fluorine resin, polyphenylene oxide resin, polyprol resin, polyphalar A phenylene resin, an ultraviolet curable resin, a cellulose derivative or the like is used. Further, the above-mentioned resin copolymers and the like can be used alone or in combination of two or more.
As the binder resin having a carrier moving speed of 10 ⁻⁸ cm ² / V · sec or more, a conductive resin such as polypyrrole, polyacetal or polypyridine, or a photoconductive resin such as polyvinylcarbazole or diphenylaminostyrene can be used. Further, by mixing one or more of the thermoplastic resin, the thermosetting resin, and the ultraviolet curable resin with the above-mentioned conductive resin, the coatability of the resistance film-forming coating material is improved, and the resistance film is obtained. The adhesion with the insulating base material can be improved.

The above conductive resin, a thermoplastic resin, a thermosetting resin,
The mixing ratio with the ultraviolet curable resin is such that the carrier moving speed in the mixed binder resin is 10 ^-8 cm ² / V · sec.
The range is held above.

(a) The conductive oxide powder is a conductive indium oxide powder obtained by doping indium oxide with one or more elements such as tin, fluorine and chlorine, or tin oxide with antimony, fluorine, phosphorus and chlorine. A conductive tin oxide powder doped with one or more of the above elements is used.

Further, the conductive indium oxide powder and the conductive tin oxide powder can be mixed and used. Further, a powder composed of a flaky substance or a fibrous substance coated with such a conductive oxide can also be used.

Furthermore, in applications requiring transparency, the average particle size of the conductive oxide powder in the paint is 0.01 to 0.6 μm.
It is preferably in the range of 0.01 to 0.5 μm. Further, it is preferable that coarse particles of 0.8 μm or more are contained only in a small amount. These powders are disclosed in Japanese Patent Application Laid-Open Nos. 60-50813 and 60-253112 filed by the present applicant.
Those obtained by JP-A No. 63-11519 and JP-A No. 63-11519 are preferable.

The mixing ratio of (a) the conductive oxide powder and (b) the binder resin for the resistance film is 60 ≦ (a) in each weight.
It is preferable that / ((a) + (b)) ≦ 95% by weight. (a) is ((a) +
If it is less than 40% by weight with respect to (b), the conductivity of the resulting resistance film becomes poor. On the other hand, if it exceeds 95% by weight, the adhesiveness between the resistance film and the insulating base material and the transparency of the resistance film obtained are deteriorated, which is not preferable.

(c) The conductive particles and (b) the binder resin for the resistance film have respective volumes of 0.1 ≦ (c) / ((c) + (b)) ≦ 50 v
ol%, preferably 0.5 ≦ (c) / ((c) + (b)) ≦ 30 vol
%. If it is less than 0.1 vol%, the resistance film resolution is deteriorated. Further, if it exceeds 50 vol%, the transparency becomes poor.

(d) Insulating particles and (b) Binder resin for resistive film are 0.1 ≦ (d) / ((d) + (b)) ≦ 50 in each volume.
vol%, preferably 0.5 ≦ (d) / ((d) + (b)) ≦ 20 v
ol%. If it is less than 0.1 vol%, the resistance films will always contact each other through the coating. Further, if it exceeds 50 vol%, the transparency becomes poor.

The same applies to the mixing ratio of the (c) conductive particles and / or (d) insulating particles to the opaque electrode paste.

Carrier moving speed is when the electric field is applied to the resin,
It means the speed at which electrons or holes move in the resin, and is also called mobility. This carrier moving speed is measured as follows.

A resin having a thickness of 1 is inserted between electrodes having a distance of 1. Next, the resin is irradiated with light to excite the electrons in the resin and move the electrons to the positive electrode. In this case, the time t ₀ when irradiated with light, is measured by the measuring device the difference between the time t ₁ that electrons reaches the positive electrode. Here, the carrier moving speed function ν (E) is expressed by the following equation.

Therefore (In the formula, μ is a carrier moving speed, E is an electric field, and V is a voltage.) The resistance film preferably has 50Ω / □ ≦ surface resistance ≦ 3000Ω / □. In applications requiring transparency, it is preferable that the insulating substrate having the above-mentioned surface resistance and having a resistance film has a total light transmittance of 70% or more and a haze of less than 20%.

The coating film is sequentially formed on the resistance film by using a coating film-forming coating material in which insulating particles and / or conductive particles are dispersed. The coating itself may or may not have conductivity, except for the substrate VII. In a non-conductive film, the film thickness of the film or the particle size of the conductive particles must be adjusted so that a part of the conductive particles is exposed so that the upper and lower resistance films can be electrically conducted through the conductive particles. . In addition, when the coating film itself has conductivity, the resolution of the touch panel can be further improved.

In order to impart conductivity to the coating film itself, (d) insulating particles and / or (c) are added to a binder resin having a carrier moving speed of 10 ^-8 cm ² / V · sec or more (hereinafter referred to as binder resin for conductive coating film). ) A conductive film-forming coating material in which conductive particles are dispersed may be used to form a coating on a resistance film or the like. The conductive resin binder resin has a carrier moving speed of 10 used in the resistance film binder resin.
^-It is the same as the binder resin of ⁸ cm ² / V · sec or more. Further, as in the case of the binder resin for the resistance film, mixing one or more of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin improves the coatability of the conductive film-forming coating material or obtains the resistance film. It is possible to improve the adhesion between the coating and the coating.

Further, when the coating itself does not have conductivity, in place of the binder resin for the above-mentioned conductive coating, a non-conductive coating forming paint using a binder resin for the non-conductive coating,
It may be formed by coating. The non-conductive coating binder resin is the same as the thermoplastic resin, thermosetting resin, or ultraviolet curable resin similar to the binder resin for the resistance film.

(c) The conductive particles and (e) the conductive or non-conductive binder resin for the coating film have a volume of 0.1 ≦ (c) /
((c) + (e)) ≦ 50 vol%, preferably 0.5 ≦ (c) /
((c) + (e)) ≦ 30 vol%. If it is less than 0.1 vol%, the resistance film resolution is deteriorated. Further, if it exceeds 50 vol%, the transparency becomes poor.

(d) the insulating particles and (e) the conductive or non-conductive coating binder resin have a volume of 0.1 ≦ (d)
/ ((D) + (e)) ≦ 50 vol%, preferably 0.5 ≦ (d) /
((d) + (e)) ≦ 20 vol%. If it is less than 0.1 vol%, the resistance films will always contact each other through the coating.
Further, if it exceeds 50 vol%, the transparency becomes poor.

The conductive layer on which the coating is laminated preferably has 100Ω / □ ≦ surface resistance ≦ 5000Ω / □ on the coating surface in the laminated state. In applications where transparency is required, it is preferable that the insulating substrate having the above-mentioned surface resistance and having a coating layer have a total light transmittance of 70% or more and a haze of less than 20%. The film thickness of the coating is preferably 0.5 to 50 μm. If it exceeds 50 μm, the resolution becomes poor, and if it is 0.
If the thickness is less than 5 μm, the coating may be peeled off or an arc may be generated at the time of input, and the chich panel cannot be used for a long period of time.

When conductive particles are dispersed in the resistive film (Base materials II, VII
I), the conductive particles do not necessarily have to be exposed on the surface. Further, in the base materials III, IV, V and IX,
When the coatings 8, 9 and 10 have conductivity, the conductive particles do not necessarily have to be exposed on the surface.

However, when the coating film itself has conductivity and the conductive particles are exposed, the resolution of the touch panel can be improved, the input resistance can be reduced, and the input load can be reduced.

In the coating for forming a resistance film and the coating for forming a film used in the present invention, the above components are dissolved or dispersed in a solvent. As this solvent, one that can dissolve or dilute each resin is used. For example, alcohols such as methanol, ethanol, propanol, butanol, diacetone alcohol, cyclohexanol, acetone,
Cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, ketones such as phorone and isophorone, ethylene glycol monomethyl ether, ethylene glymonoethyl ether, carbitol, ethers such as methyl carbitol and dioxane, esters such as n-butyl acetate, hexane , Petroleum naphthas such as cyclohexane, aromatics such as toluene, xylene and mesitylene, N-methyl-2
-Pyrrolidone and its derivatives are used alone or in combination of two or more. Such a solvent is used in an amount such that a desired film thickness and a viscosity capable of applying a coating material are obtained. When a water-soluble binder resin is used, water can be used as the solvent.

When manufacturing paint for resistance film formation, paint for film formation,
In order to improve the dispersibility of the insulating particles, the conductive particles or the conductive oxide powder and prevent the particles from re-agglomerating, a surfactant or a coupling material may be added to the coating material.

As the surfactant, those of anionic type, nonionic type and cationic type can be widely used. As the coupling agent, silane-based, titanium-based, aluminum-based, zirconium-based, and magnesium-based ones can be used.

Using the coating material thus obtained, conventionally known coating methods, for example, spinner method, bar coating method, dipping method, Mayer bar method, air knife method or gravure,
Substrates I to IX are obtained by applying by a printing method such as a screen or a roll coater and then curing. In the present invention, the substrate I obtained by these methods is
~ IX are stacked so that the conductive layers face each other to form a touch panel.

FIG. 10 is a cross-sectional view of an essential part of the first touch panel.
FIG. 11 is an example of a principle of coordinate reading of the touch panel of the present invention. Further, FIG. 12 is a schematic perspective view of the touch panel. Here, an example of the principle of coordinate reading of the first touch panel is shown with reference to FIGS. 10 and 12 (combination of the base material I and the base material III). In this example, the movable panel (upper side) 2 reads the Y coordinate of the pressed position A and the fixed panel (lower side) 3 reads the X coordinate. When the resistance film 7 contacts the resistance film 6 via the film 10 at the pressing position A, the current I supplied by the constant current power supply device 21
Is distributed to I ₁ and I ₂ , flows through the movable panel (upper side) 2, and moves to the lower A'point at the point A. Further, at the point A ′, the current I is distributed to I ₃ and I ₄ , and then fixed panel (lower side).
3 to form a circuit. If I ₁ and I ₂ are detected here, the Y coordinate of point A is calculated, and if I ₃ and I ₄ are detected, the X coordinate of point A is calculated and the coordinate of point A is determined. .

Further, one of the movable panel (upper side) 2 and the fixed panel (lower side) 3 in which the resistance value of the resistance film is higher than the resistance value of the other resistance film is combined, and the panel having the higher resistance value is set to the constant current. When connected to the + side of the power supply,
It is possible to effectively prevent an arc that occurs when a figure is input.

The present invention is not limited to the illustrated embodiment, but can be variously modified within the scope of the present invention. For example, this touch panel has the X, Y shown in FIG. 12 as described above.
It is possible to connect not only to the coordinate reading electric circuit but also to other known electric circuits. At this time, the touch panel may be used by stacking two or more layers.

EFFECTS OF THE INVENTION As described above, the present touch panel uses two base materials in which a conductive layer mainly made of a resistance film is formed on one surface of an insulating base material, and the respective conductive layers are opposed to each other.
High-definition characters / figures are arranged substantially parallel and at a predetermined interval, and by pressing a part of one of the base materials, a part of the conductive layers are brought into contact with each other to be electrically conductive. For inputting one of the base materials III, V, V
It has a structure in which one kind of base material selected from I, VII, VIII and IX is used and one kind of base material selected from the base materials I to IX is combined as the other base material. Therefore, high-definition characters
It is possible to input a figure and the like, and there are few erroneous inputs, which has an excellent effect of improving the durability of the touch panel.

The touch panel can be used not only as an input device of a computer but also in a copying machine when designating a copy position. It can also be used in applications where transparency is not required, in which case the insulating base material, the resistance film, and the coating need not be transparent.

The present touch panel will be described below with reference to more specific examples, but the present touch panel is not limited to these examples.

Examples In order to form a touch panel, the following substrates I to IX
It was created.

"Substrate I-1" Tin-doped indium oxide powder (trade name ELCOM TL-
120, average particle size 2μm, Catalyst Chemical Co., Ltd.) 130g
And polyester resin (trade name: Byron Toyobo Co., Ltd.)
70 g) and 200 g of cyclohexanone were mixed and pulverized with a sand mill for 30 minutes to obtain a resistance film-forming coating material.
This paint was applied to a polycarbonate plate (CR-39) with a bar coater and dried to obtain a base material.

"Substrate I-2" A substrate was obtained in the same manner as the substrate I-1 except that a PET film (thickness 125 µm) was used.

"Substrate I-3" Tin-doped indium oxide powder (trade name ELCOM TL-
130, average particle size 0.2 μm, manufactured by Catalyst Kasei Kogyo Co., Ltd.) 15
0 g and polyvinyl carbazole resin (trade name, manufactured by Chibicol Anan Fragrance, carrier moving speed is 10 ⁻⁶ cm ² / V · s
ec) 25.0g and UV curable resin (trade name DH-705
12.5 g (manufactured by Daihachi Chemical Industry Co., Ltd.) and 200 g of cyclohexanone were mixed and pulverized with a sand mill for 2 hours to obtain a resistance film-forming coating material. Use this paint on a polycarbonate plate
(CR-39) was coated with a bar coater, dried and then cured with ultraviolet rays to obtain a substrate.

"Substrate I-4" A substrate was obtained in the same manner as the substrate I-3 except that a PET film (thickness 125 µm) was used.

The indium oxide powder containing a "substrate I-5" 5 wt% of tin oxide, was molded into a doublet shape, an electron gun 2 kw, the plate temperature 400 ° C. on a glass plate, oxide partial pressure 3 × 10 ^{- The} substrate was obtained by vapor deposition at ⁴ torr and a vapor deposition rate of 3Å / sec. "Substrate I-6" Using a PET film (thickness 125 μm), the plate temperature is 1
A base material was obtained in the same manner as the base material I-5 except that the temperature was set to 00 ° C.

"Substrate I-7" Carbon paste (product name JEF024-R132 Nippon Acheson
Screen-printed on a polycarbonate plate (CR-39) using a 150 mesh screen.
A substrate was obtained by drying at 0 ° C. for 30 minutes.

"Substrate I-8" A substrate was obtained in the same manner as the substrate I-7 except that a PET film (thickness 125 µm) was used.

"Substrate I-9" Fluorine-doped indium oxide powder (trade name ELCOM T
L-130, average particle size 0.2 μm, manufactured by Catalyst Kasei Kogyo Co., Ltd.) 1
50 g and polyester resin (trade name: Byron) 37.
5 g and 200 g of cyclohexanone were mixed and pulverized with a sand mill for 2 hours to obtain a resistance film-forming coating material. This coating material was applied to a PET film (thickness 100 μm) with a bar coater and dried to obtain a base material.

"Substrate II-1" Tin-doped indium oxide powder (trade name ELCOM TL-
120), 130 g of polyester resin (trade name: Byron) and 200 g of cyclohexanone are mixed, crushed in a sand mill for 30 minutes, and further, silicon oxide particles (trade name: true sphere, particle size: 8 μm, specific gravity: 2.2 Catalysis Chemical Industry)
(Manufactured by Co., Ltd.) was mixed with 4.2 g (specific gravity 2.5) of silver-plated particles having a thickness of 0.05 μm to obtain a resistance film-forming coating material. This paint was applied to a polycarbonate plate (CR-39) with a bar coater and dried to obtain a base material. (The particles obtained by plating silver particles on the conductive spheres are 2.0 vol%.) “Substrate II-2” The same as the substrate II-1 except that a PET film (thickness 125 μm) is used. A substrate was obtained.

"Substrate II-3" Tin-doped indium oxide powder (trade name ELCOM TL-1
30) 150 g and polyvinylcarbazole resin (trade name: Tubicor) 25.0 g and ultraviolet curing resin (trade name)
12.5 g of DH-705) and 200 g of cyclohexanone were mixed, pulverized with a sand mill for 2 hours, and further, a nickel plating of 0.05 μm in thickness was formed on the surface of silicon oxide particles (trade name: true sphere, particle size: 5 μm, specific gravity: 2.2). 0.05 on it
0.4 μg (specific gravity 3.5) of particles plated with μm of gold were mixed to obtain a resistance film-forming coating material. This coating material was applied to a polycarbonate plate (CR-39) with a bar coater, dried and then cured with ultraviolet rays to obtain a base material. (The particle size of nickel-gold plated nickel-gold plated conductive particles is 0.25 v
Contains ol%. ) "Substrate II-4" A substrate was obtained in the same manner as the substrate II-3 except that a PET film (thickness 125 µm) was used.

"Substrate III-1" Polyvinylcarbazole resin (trade name: Tubicor) 1
5 g, isophorone 85 g, and silicon oxide particles (trade name: hair particles, particle size 16 μm, specific gravity 2.2, manufactured by Catalysts & Chemicals Industry Co., Ltd.)
5 g was mixed and sufficiently dispersed to obtain a film-forming coating material.
This coating material was applied to a base material II-2 with a bar coater and dried to form a base material. (The hair particles that are insulating particles are 5.1
Contains vol%. ) "Base material III-2" A base material was formed in the same manner as the base material III-1 except that the amount of silicon oxide particles (trade name: hair particles) was 0.75 g. (Hair particles which are insulating particles contain 2.6 vol%.) "Base material III-3" Same as the base material III-1 except that the silicon oxide particles (trade name hair particles) are 0.15 g. To form a substrate. (The hair particles that are insulating particles contain 0.5 vol%.) "Base material III-4" Polyvinylcarbazole resin (trade name: Tubicor) 1
0 g, UV curable resin (trade name: DH-705) 5 g, cyclohexanone 85 g, and divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm, specific gravity 1.2) 0.1
5 g was mixed and sufficiently dispersed to obtain a film-forming coating material.
This coating material was applied to a base material II-4 with a bar coater, dried and then cured with ultraviolet rays to form a base material. (Microvol SP, which is an insulating particle, contains 1.0 vol%.) “Base material IV-1” Indium oxide powder doped with tin (trade name ELCOM TL-
130) 150 g and acrylic resin (manufactured by Dainippon Ink and Chemicals, Inc.)
Product name Acridic A-405) 60g and melamine resin (Dainippon Ink Co., Ltd. product name Super Beckamine J-8
20-60) 33.3 g and butyl carbitol acetate 2
00g was mixed and pulverized with a sand mill for 2 hours, and further, silicon oxide particles (trade name: true sphere, particle size: 5 μm, specific gravity: 2.
Particles having a thickness of 0.05 μm plated on the surface of 2) of 0.
7 g (specific gravity 2.7) was mixed to obtain a coating material for forming a film. This coating material is applied to a base material I-5 with a bar coater,
A substrate was obtained by drying. (Particles obtained by silver-plating true-spheres, which are conductive particles, contain 0.4 vol%.) "Substrate IV-2" Except that Substrate I-6 was used, it was the same as Substrate IV-1. A base material was obtained.

"Substrate IV-3" Tin-doped indium oxide powder (trade name ELCOM TL-
120), 120 g of polyester resin (trade name: Byron) and 200 g of cyclohexanone are mixed, crushed in a sand mill for 30 minutes, and further, a silicon oxide particle (trade name: true sphere, particle size: 8 μm, specific gravity: 2.2) is formed on the surface of a thickness of 0.2. 18.2 g of particles plated with silver having a thickness of 05 μm (specific gravity: 2.
5) and were mixed to obtain a coating for forming a film. This paint
The base material I-8 was coated with a bar coater and dried to obtain a base material. (The particles that are silver-plated on the diamond balls that are conductive particles are
Contains 8.2 vol%. ) “Substrate V-1” 27 g of polyester resin (trade name: Byron), 130 g of cyclohexanone, and divinylbenzene resin particles (trade name: Micropearl SP, particle size: 12 μm, specific gravity: 1.2)
5 g was mixed and sufficiently dispersed to obtain a film-forming coating material.
This coating material was applied to the substrate IV-1 with a bar coater and dried to form a substrate. (Micropearl SP which is an insulating particle
Contains 5.5 vol%. ) "Substrate V-2" A substrate was obtained in the same manner as the substrate V-1 except that the substrate IV-2 was used.

"Substrate V-3" 20 g of polyester resin (trade name Byron), 100 g of cyclohexanone and silicon oxide particles (trade name of hair particles)
A particle size of 16 μm and a specific gravity of 2.2) (1.9 g) were mixed and sufficiently dispersed to obtain a film-forming coating material. Use this paint as the base material IV-3
Was coated with a bar coater and dried to form a substrate.
(The hair particles that are insulating particles contain 5.1 vol%.) "Base material VI-1" Indium oxide powder doped with tin (trade name ELCOM TL-
130) 150 g, polyester resin (trade name: Byron) 37.5 g and cyclohexanone 200 g were mixed and pulverized with a sand mill for 2 hours. Then divinylbenzene resin particles (trade name: Micropearl SP particle size 12 μm
A specific gravity of 1.2) and 10 g were mixed and sufficiently dispersed to obtain a resistance film-forming coating material. Apply this paint to a polycarbonate plate (C
R-39) was coated with a bar coater and dried to obtain a substrate.
(Micropearl SP, which is an insulating particle, contains 1.6 vol%.) “Substrate VI-2” A substrate was obtained in the same manner as the substrate VI-1 except that a PET film (thickness 125 μm) was used. It was

"Substrate VII-1" Polyvinylcarbazole resin (trade name: Tubicor) 1
5 g, 85 g of isophorone and 1.5 g of silicon oxide particles (trade name: hair particles, particle size 16 μm, specific gravity 2.2) are mixed,
It was sufficiently dispersed to obtain a film-forming coating material. This paint is used as a substrate I
-2 was coated with a bar coater and dried to form a substrate. (The hair particles which are insulating particles contain 5.1 vol%.) "Base material VII-2" Same as the base material VII-1 except that the silicon oxide particles (trade name hair particles) are 0.75 g. To form a substrate. (Hair particles which are insulating particles contain 2.6 vol%.) "Base material VII-3" Same as the base material VII-1, except that the silicon oxide particles (trade name hair particles) are 0.15 g. To form a substrate. (The hair particles which are insulating particles contain 0.5 vol%.) "Base material VII-4" Polyvinylcarbazole resin (trade name: Tubicor) 1
0 g, UV curable resin (trade name: DH-705) 5 g, cyclohexanone 85 g, and divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm, specific gravity 1.2) 0.1
5 g was mixed and sufficiently dispersed to obtain a film-forming coating material.
This coating material was applied to the substrate I-3 with a bar coater, dried and then cured with ultraviolet rays to form a substrate. (Micropearl SP, which is an insulating particle, contains 1.0 vol%.) "Substrate VII-5" A substrate was formed in the same manner as the substrate VII-4 except that the substrate I-4 was used. .

"Substrate VII-6" Polyvinylcarbazole resin (trade name: Tubicor) 1
0 g, polyester resin (trade name: Byron) 1 g, cyclohexanone 89 g, and divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm, specific gravity 1.2)
0.5 g was mixed and sufficiently dispersed to obtain a film-forming coating material. This coating material was applied to a substrate I-5 with a bar coater and dried to form a substrate. (Micro pearls that are insulating particles
SP contains 4.3 vol%. ) "Substrate VII-7" A substrate was formed in the same manner as the substrate VII-6 except that the substrate I-6 was used.

"Substrate VII-8" Polyvinylcarbazole resin (trade name: Tubicor) 1
500 g, isophorone 8500 g, silicon oxide particles (trade name: hair particles, particle size: 16 μm, specific gravity 2.2) 150 g, silicon oxide particles (trade name: true sphere, particle size: 1 μm, specific gravity: 2.
2) 0.04 g was mixed and sufficiently dispersed to obtain a film-forming coating material. This coating material was applied to the substrate I-2 with a bar coater and dried to form a substrate. (Hair particles and true spheres, which are insulating particles, contain 5.1 vol% in total of both.) "Base material VII-9" Same as base material VII-8 except that base material I-8 was used. To form a substrate.

"Substrate VIII-1" Tin-doped indium oxide powder (trade name ELCOM TL-
130) 150 g and polyvinyl carbazole resin (trade name Tubicor) 25.0 g and ultraviolet curing resin (trade name)
DH-705) 12.5 g and cyclohexanone 200 g were mixed, pulverized with a sand mill for 2 hours, and further divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm
Specific gravity of 1.2) 0.3 g and silicon oxide particles (trade name: Masagozu, particle size 5 μm, specific gravity 2.2) with a thickness of 0.05 μ
m of nickel plating and 0.46 g of particles having a gold plating of 0.05 thereon (specific gravity 3.5) were mixed to obtain a coating film for forming a resistance film. Apply this paint to a polycarbonate plate (CR-39)
Was coated with a bar coater, dried and then cured with ultraviolet rays to obtain a substrate. (Micropearl SP, which is an insulating particle,
Contains 0.5 vol%. Nickel-
The gold-plated particles contain 0.3 vol%. ) "Substrate VIII-2" A substrate was obtained in the same manner as the substrate VIII-1 except that a PET film (thickness 125 µm) was used.

"Substrate VIII-3" Tin-doped indium oxide powder (trade name ELCOM TL-
130) 9600 g and polyvinyl carbazole resin (trade name Tubicor) 1600 g and ultraviolet curing resin (trade name)
DH-705) 800 g, isophorone 13600 g, and silicon oxide particles (trade name: hair particles, particle diameter 16 μm, specific gravity 2.2)
240 g and silicon oxide particles (trade name: Masago ball, particle size: 3.5
μm specific gravity 2.2) 0.7 g and the thickness of silicon oxide particles (trade name: Masaki sphere particle size 2.4 μm specific gravity 2.2) of 0.7 g.
10 μg of silver-plated particles (specific gravity: 3.2) having a thickness of 05 μm were mixed and sufficiently dispersed to obtain a resistance film-forming coating material. This coating material was applied to a polycarbonate plate (CR-39) with a bar coater, dried and then cured with ultraviolet rays to obtain a base material.
(Hair particles and true spheres, which are insulating particles, contain 5.4 vol% in total. Particles obtained by plating the true spheres, which are conductive particles, with silver include 0.2 vol%.) "Substrate VIII-" 4 ”A base material was obtained in the same manner as the base material VIII-3, except that a PET film (thickness 125 μm) was used.

"Substrate IX-1" Polyvinylcarbazole resin (trade name: Tubicor) 1
0.05 g of silver on the surface of 5 g, 85 g of isophorone, silicon oxide particles (trade name: hair particles, particle size: 16 μm, specific gravity 2.2), 1.5 g and silicon oxide particles (trade name: true sphere, particle size: 2 μm, specific gravity: 2.2) 0.45 g of the plated particles (specific gravity 3.3) were mixed and sufficiently dispersed to obtain a film-forming coating material. This coating material is applied to the substrate I-2 with a bar coater,
It was dried to form a substrate. (Hair particles, which are insulating particles,
Contains 5.1 vol%. Particles of silver plated electro-conductive particles, containing 1.0 vol%. ) "Base material IX-2" A base material was formed in the same manner as the base material IX-1 except that the amount of silicon oxide particles (trade name: hair particles) was 0.75 g. (Containing 2.6 vol% of hair particles which are insulating particles, 1.0 vol% of particles which are silver-plated spherical particles which are conductive particles.) "Substrate IX-3" Silicon oxide particles (commodity) A base material was formed in the same manner as the base material IX-1 except that the amount of (namely hair particles) was 0.15 g. (The hair particles, which are insulating particles, contain 0.5 vol%. The particles, which are silver particles plated on the core, which are conductive particles, contain 1.0 vol%.) "Substrate IX-4" Polyvinylcarbazole resin (commodity) Name Tsubikoru) 1
0 g, UV curable resin (trade name: DH-705) 5 g, cyclohexanone 85 g, and divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm, specific gravity 1.2) 0.1
5g and silicon oxide particles (trade name: Shin-yakyu, particle size: 3μm, specific gravity: 2.2) on the surface of nickel-gold plated particles with a thickness of 0.05μm 0.43g (specific gravity: 4.3) are mixed and sufficiently dispersed. A coating film-forming coating material was obtained. This paint is used as a base material I
-3 was applied with a bar coater, dried and then cured with ultraviolet rays to form a substrate. (Microvol SP, which is an insulating particle, contains 1.0 vol%. Nickel-gold plated particles, which are conductive particles, contain 0.8 vol%.) Substrate IX-5 Substrate IX-4 except that I-4 was used, 1 g of polyester resin (trade name: Byron) was used instead of the ultraviolet curable resin, 89 g of cyclohexanone, and 0.15 g of nickel-gold-plated particles were used. A substrate was formed in the same manner as in. (Micropearl SP, which is an insulating particle,
Contains 1.3 vol%. Nickel-
Particles plated with gold contain 0.4 vol%. ) “Substrate IX-6” 24 g of polyester resin (trade name: Byron), 89 g of cyclohexanone and divinylbenzene resin particles (trade name: Micropearl SP, particle size 12 μm, specific gravity 1.2) 1.5
g and silicon oxide particles (trade name: Masago ball, particle size: 2.2 μm
0.35 g (specific gravity 3.2) of silver-plated particles having a thickness of 0.05 μm on the surface of specific gravity 2.2) were mixed and sufficiently dispersed to obtain a coating material for forming a film. Apply this paint to Substrate I-6
Screen printed using an 80 mesh screen and dried to form the substrate. (The insulating particles, Micropearl SP, contains 6.1 vol%. The particles, which are conductive particles and plated with silver, contain 0.5 vol%.) "Substrate IX-7" Polyester resin (Product Name Byron) 2400 g, isophorone 13600 g, silicon oxide particles (trade name: hair particles, particle size 16 μm, specific gravity 2.2) 240 g, silicon oxide particles (trade name: true sphere particle size 3.5 μm, specific gravity 2.2) 0.2
7g and silicon oxide particles (trade name: Masago ball, particle size 2.4μm
10 g of silver-plated particles (specific gravity 3.2) having a thickness of 0.05 μm on the surface of specific gravity 2.2) were mixed and sufficiently dispersed to obtain a film-forming coating material. This paint is applied to the substrate I-7 38
Screen print using a 0 mesh screen,
It was dried to form a substrate. (The total of the insulating particles, hair particles and the true spheres, is 5.4 vol%. The conductive particles, the true spheres, are silver-plated. The content is 0.2 vol%.) The transparency (total light transmittance: Tt, haze: H) of the obtained substrate was measured by a haze computer (manufactured by Suga Test Instruments Co., Ltd.), and the surface resistance (R _s ) was measured by an electrode cell (YHP).
Manufactured by TAYLOR HOBSON) and the film thickness was measured with a surface roughness meter (TAYLOR HOBSON), and the results are shown in Table 1.

Next, these base materials were combined as shown in Tables 2 to 7 to prepare a touch panel. The following evaluation was performed about the obtained touch panel.

Input state: Characters / graphics were written on the touch panel and the input state of the display was evaluated.

Sliding test: A ballpoint pen loaded with 300g load is 5cm
The number of times of reciprocation until the input became impossible such as a broken wire was evaluated by sliding the slides in the width.

Transparency: Tt and H were measured.

Input load: DC from the constant current power supply 21 to the touch pen
When 12 V and 1 mA were supplied and the load applied to the ball ben was increased, the load was measured by the voltmeter 23 when the voltage became 3 V or less.

Distance between particles: Measured by electron micrograph.

[Brief description of drawings]

1 to 9 are cross-sectional views of a main part of a base material I to a base material IX, FIG.
FIG. 11 is a cross-sectional view of the main part of the touch panel, and FIG.
FIG. 12 is a schematic diagram showing an example of the coordinate reading principle of the sixth touch panel, and FIG. 12 is a schematic perspective view showing an example of the present touch panel. 1 ... Touch panel, 2 ... Movable panel (upper side), 3 ... Fixed panel (lower side), 4, 5 ... Insulating base material, 6, 7 ... Resistive film, 8 ... Conductive particle dispersion film, 9 ... Insulation Particle-dispersed film 10 ... Conductive particles Insulating particle-dispersed film 14 ... Insulating particles, 15 ... Conductive particles 17, 18, 19, 20 ... Terminal 21 ... Constant current device, 22 ... Ammeter 23 ... Voltmeter , 24 …… Input pen

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiro Komatsu 3-36-9 Nakakasai, Edogawa-ku, Tokyo No. 901, Amenities Kasai, 2nd Hikomoto Building (72) Inventor Akira Nakajima Hibiki Wakamatsu-ku, Kitakyushu, Fukuoka 2-1-206 Minamimachi (72) Inventor Michiyasu Hagio 2-1-406 Hibikiminamicho, Wakamatsu-ku, Kitakyushu City, Fukuoka Prefecture (56) References JP-A-61-206116 (JP, A) JP-A-61-282909 ( JP, A) JP 62-92301 (JP, A)

Claims (2)

[Claims] 1. A combination of two base materials (A) and (B) in which a conductive layer is formed on one surface of an insulating base material, and the conductive layers are opposed to each other and are substantially parallel to each other at a predetermined interval. In the touch panel which brings the conductive layers into contact with each other and electrically conducts them by pressing a part of one of the base materials, the base material (A) is a base material described below.
A base material selected from III, V, VI, VII, VIII and IX, wherein the base material (B) is a base material selected from the following base materials I to IX, and the base material described below. III, V, VI, VII, VII
In I and IX, some of the insulating particles are exposed from the conductive layer,
A touch panel, wherein the other part of the insulating particles is embedded in a conductive layer, and the tip of the insulating particles exposed from the conductive layer is located at the uppermost part of the conductive layer. Substrate I: Substrate having a conductive layer made of a resistive film formed on the surface Substrate II: Substrate having a conductive layer made of a resistive film dispersed on the surface Substrate III: Conductive particles dispersed A resistance film and a conductive film in which a coating in which insulating particles are dispersed are laminated in this order on the surface of a base material, a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is formed. Is embedded in the coating, and the coating may be insulative or conductive. When the coating is insulative, a group in which a part of the conductive particles is exposed on the surface of the conductive layer is formed. Material Base material IV: A base material having a conductive layer in which a resistance film and a coating film in which conductive particles are dispersed are laminated on the base material surface in this order. Base material V: a resistance film and a coating film in which conductive particles are dispersed, A coating film in which insulating particles are dispersed has a conductive layer laminated on the surface of the base material in this order, and the insulating particles A part is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the insulating particle-dispersed coating, and the insulating particle-dispersed coating may be insulative or conductive. When the particle-dispersed coating is insulative, the base material in which the conductive particles are exposed on the surface of the conductive layer Base material VI: A conductive layer composed of a resistance film in which insulating particles are dispersed is formed on the surface, Part is exposed on the surface of the conductive layer, and the other part of the insulating particles is a base material embedded in the conductive layer. Base material VII: a resistive film and a conductive coating in which insulating particles are dispersed are the base materials in this order. It has a conductive layer laminated on the surface,
A base material in which a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the conductive coating material. Base material VIII: Conductivity consisting of conductive particles and a resistance film in which insulating particles are dispersed A layer is formed on the surface, a part of the insulating particles is exposed on the surface of the conductive layer, and the other part of the insulating particles is embedded in the conductive layer. Base material IX: resistive film and conductive particles A coating film in which insulating particles are dispersed has a conductive layer formed on the surface of a base material in this order, a part of the insulating particles is exposed on the conductive layer surface, and the other part of the insulating particles is the coating film. Embedded in the coating, the coating may be insulative or conductive, and when the coating is insulative, a base material in which a part of the conductive particles is exposed on the conductive layer surface. 2. The surface resistance value of one conductive layer is set to be equal to or higher than the surface resistance value of the other conductive layer, and the positive side of the power source is connected to the conductive layer having a high surface resistance value. The touch panel according to claim 1.