WO2009053255A3 - Schaltungsträger mit hoher bauteildichte - Google Patents
Schaltungsträger mit hoher bauteildichte Download PDFInfo
- Publication number
- WO2009053255A3 WO2009053255A3 PCT/EP2008/063602 EP2008063602W WO2009053255A3 WO 2009053255 A3 WO2009053255 A3 WO 2009053255A3 EP 2008063602 W EP2008063602 W EP 2008063602W WO 2009053255 A3 WO2009053255 A3 WO 2009053255A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- recess
- board side
- interconnect device
- component density
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Die Erfindung betrifft einen Schaltungsträger (1) aufweisend eine Leiterplatte (2), vorzugsweise eine Mehrschichtleiterplatte (2), mit einer Leiterplattenoberseite (5) und einer vorzugsweise dazu parallelen Leiterplattenunterseite (6), wobei auf der Leiterplattenoberseite (5) und/oder der Leiterplattenunterseite (6) und/oder vorzugsweise auf Innenlagenober- und/oder -unterseiten (11; 12) der Mehrschichtleiterplatte (2) elektrische Bauelemente (7; 8; 9) und Leiterbahnen (10) angeordnet sind, die die Bauelemente (7; 8; 9) elektrisch leitend miteinander verbinden, und wobei die Leiterplatte (2) zumindest eine durchgehende, innen liegende oder sacklochartige Ausnehmung (13; 15) aufweist, wobei die Ausnehmung (13; 15) zumindest eine Füllung (16) mit zumindest einer elektrisch leitenden Substanz aufweist, wobei die Ausnehmung (13; 15) derart befüllt ist und die Füllung (16) derart mit in die Ausnehmung (13; 15) mündenden Leiterbahnen (10) in elektrisch leitender Verbindung steht, dass ein ohmscher und/oder ein kapazitiver Widerstand in der Ausnehmung (13; 15) gebildet wird.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200710051316 DE102007051316B4 (de) | 2007-10-26 | 2007-10-26 | Schaltungsträger mit hoher Bauteildichte |
DE102007051316.1 | 2007-10-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009053255A2 WO2009053255A2 (de) | 2009-04-30 |
WO2009053255A3 true WO2009053255A3 (de) | 2009-06-11 |
Family
ID=40481726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/063602 WO2009053255A2 (de) | 2007-10-26 | 2008-10-10 | Schaltungsträger mit hoher bauteildichte |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102007051316B4 (de) |
WO (1) | WO2009053255A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020203145B4 (de) | 2020-03-11 | 2023-02-09 | Vitesco Technologies GmbH | Leiterplattenanordnung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0719079A1 (de) * | 1994-12-22 | 1996-06-26 | Kanto Kasei Co., Ltd. | Gedruckte Schaltungsplatte |
DE10015269A1 (de) * | 2000-03-28 | 2001-06-28 | Siemens Ag | Innenliegende Widerstände in Bohrungen von Leiterplatten |
US20020047772A1 (en) * | 2000-10-19 | 2002-04-25 | Huey-Ru Chang | Electrical-resistant via hole and process of fabricating the same |
US20040187297A1 (en) * | 2003-03-27 | 2004-09-30 | E Touch Corporation | Method of fabricating a polymer resistor in an interconnection via |
US20050062587A1 (en) * | 2003-09-24 | 2005-03-24 | Wei-Chun Yang | Method and structure of a substrate with built-in via hole resistors |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3135554A1 (de) * | 1981-09-08 | 1983-04-07 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | "verfahren zur herstellung von gedruckten schaltungen" |
US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
JPH05343855A (ja) * | 1992-06-08 | 1993-12-24 | Cmk Corp | 多層プリント配線板およびその製造方法 |
DE10015270A1 (de) * | 2000-03-28 | 2001-10-11 | Siemens Ag | Vertikale Realisierung von Dickschichtwiderständen in Multilayersubstraten |
-
2007
- 2007-10-26 DE DE200710051316 patent/DE102007051316B4/de active Active
-
2008
- 2008-10-10 WO PCT/EP2008/063602 patent/WO2009053255A2/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0719079A1 (de) * | 1994-12-22 | 1996-06-26 | Kanto Kasei Co., Ltd. | Gedruckte Schaltungsplatte |
DE10015269A1 (de) * | 2000-03-28 | 2001-06-28 | Siemens Ag | Innenliegende Widerstände in Bohrungen von Leiterplatten |
US20020047772A1 (en) * | 2000-10-19 | 2002-04-25 | Huey-Ru Chang | Electrical-resistant via hole and process of fabricating the same |
US20040187297A1 (en) * | 2003-03-27 | 2004-09-30 | E Touch Corporation | Method of fabricating a polymer resistor in an interconnection via |
US20050062587A1 (en) * | 2003-09-24 | 2005-03-24 | Wei-Chun Yang | Method and structure of a substrate with built-in via hole resistors |
Also Published As
Publication number | Publication date |
---|---|
WO2009053255A2 (de) | 2009-04-30 |
DE102007051316B4 (de) | 2010-12-02 |
DE102007051316A1 (de) | 2009-04-30 |
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