WO2009053215A1 - Procédé pour réaliser des contacts périphériques sur des composants céramiques - Google Patents

Procédé pour réaliser des contacts périphériques sur des composants céramiques Download PDF

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Publication number
WO2009053215A1
WO2009053215A1 PCT/EP2008/062945 EP2008062945W WO2009053215A1 WO 2009053215 A1 WO2009053215 A1 WO 2009053215A1 EP 2008062945 W EP2008062945 W EP 2008062945W WO 2009053215 A1 WO2009053215 A1 WO 2009053215A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
layer
region
contacting
ceramic
Prior art date
Application number
PCT/EP2008/062945
Other languages
German (de)
English (en)
Inventor
Hans-Joerg Renz
Jens Schneider
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN200880112738.XA priority Critical patent/CN101836109B/zh
Publication of WO2009053215A1 publication Critical patent/WO2009053215A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/4067—Means for heating or controlling the temperature of the solid electrolyte
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/4062—Electrical connectors associated therewith
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
    • G01N27/4071—Cells and probes with solid electrolytes for investigating or analysing gases using sensor elements of laminated structure

Definitions

  • the invention is based on known methods for producing electrical components, which have a layer structure with at least one substrate and at least one structure for an electrical circuit.
  • a particular focus of the present invention is the production of electrical components see in the form of ceramic sensor elements, such as those used for the determination of at least one physical property of a gas in a sample gas space.
  • Ceramic sensor elements are sensor elements which are based on electrolytic properties of certain solids, ie the ability of these solids to conduct certain ions.
  • Such sensor elements are used in particular in motor vehicles to measure air-fuel gas mixture compositions and are referred to there as lambda probes.
  • Robert Bosch GmbH "Sensors in the Motor Vehicle", June 2001, pages 112 to 117 or T. Baunach et al .: “Outer exhaust gas by ceramic sensors", Physikjournal 5 (2006) No. 5, pages 33 to 38, referenced. It should be noted, however, that the present invention is applicable to other types of electronic components.
  • the layer structure in particular a ceramic layer structure
  • various methods are known from the prior art.
  • a ceramic layer structure it is usual for a plurality of functional layers to be added together, wherein, for example, one or more printing and / or laminating methods can be used.
  • Other methods are known.
  • a layer structure produced in this way is closing one or more thermal treatment steps, such as sintering steps subjected.
  • DE 196 33 675 A1 discloses a method in which layers or layer systems are transferred to a sinterable layer carrier by means of a transfer process.
  • at least one metallic, ceramic or metallic / ceramic layer or a layer system is applied to a flexible carrier film and subsequently transferred by means of this carrier film to the sinterable layer carrier.
  • other types of production of layer systems are known and can be used in the context of the present invention .
  • a particular difficulty in the production of the layer structure is that it usually has one or more electrical circuits in one or more layer planes, which must be contacted electrically, for example, to provide these circuits with electrical energy and / or signals of these electrical circuits tap off. Furthermore, contacts of these electrical circuits are also required to connect, for example, in under different layer layers of the layer structure arranged electrical circuits together.
  • the problem of contacting the electrical circuit from another layer level is usually achieved by electrically connecting internal, electrically conductive circuits or circuit parts by means of plated-through holes.
  • electrical feedthroughs which are also referred to as vias
  • Such electrical feedthroughs are usually produced in the ceramic layer technology by producing one or more holes in one or more substrates to which the electrical circuit is applied by a drilling and / or punching method , The edges of these holes must then be insulated, so that these holes can then be provided with an electrically conductive via (for example in the form of an electrically conductive paste).
  • an electrically conductive via for example in the form of an electrically conductive paste
  • DE 10 2004 012 672 A1 describes a method for contacting electrical contact points of a measuring sensor by means of a flexible connection cable, on which electrical conductors are arranged.
  • the electrical connection cable has at least one high-temperature-resistant flexible Foeke, on which the conductor tracks are arranged.
  • DE 10 2004 025 549 A1 discloses a method for the production of electrical components in which at least one structure for an electrical circuit in a form still to be sintered is applied to a substrate.
  • the at least one structure is deposited in such a way that it projects beyond an outer boundary of the later component in the plane of the substrate.
  • the method and the ceramic sensor element at least largely avoid the disadvantages of known methods and sensor elements, in particular - A - dere can be the process cost-effective and easy to implement and implement on a large scale, since a UmWallet ists vide is proposed, in which compared to known plated-through numerous critical work steps can be omitted.
  • the above-described, required for the production of plated-through holes in the rule working steps of drilling or punching of substrates, a through insulation and a contacting of the holes can be omitted.
  • sensor elements produced by the method according to the invention have a high temperature stability, since recontacting can be arranged, for example, outside strongly temperature-stressed areas of the sensor elements, for example, as far as possible away from the actual, tempered measuring range of the sensor elements.
  • Another advantage of the present method is that in many cases all layers used, in particular the re-contacting, can be visually inspected.
  • all layers used, in particular the re-contacting can be visually inspected.
  • the electrical component has a layer structure with at least one substrate, in particular a ceramic substrate (which may also be understood as a preform of a ceramic substrate, for example a ceramic FoKe and / or a Braunling) and at least one structure for an electrical circuit to this structure
  • a ceramic substrate which may also be understood as a preform of a ceramic substrate, for example a ceramic FoKe and / or a Braunling
  • the structure may contain additional elements, for example insulation elements, which separate the individual components of the electrical circuit from each other, which the individual elements of the electrical circuit separate from the at least one substrate or which can take over other functions, such as dielectric functions.
  • the layer structure may comprise a plurality of such structures of the same or different types and several such substrates.
  • the structure is arranged substantially on a first side of the substrate, for example on a plane or even uneven (for example, stepped) surface of the substrate.
  • substantially arranged on a first side is thus to be understood a structure in which essential elements of the structure are arranged on the first side, even if further elements of the structure, such as leads, on another side, for example one second side and / or outside of the substrate may be arranged.
  • the structure in particular the electrical circuit of this structure, has to be contacted from a different plane of the layer structure, for example around the electrical circuit with electrical circuits arranged in other planes
  • a problem frequently encountered during production is that in many cases the structure, in particular the electrical circuit of this structure, has to be contacted from a different plane of the layer structure, for example around the electrical circuit with electrical circuits arranged in other planes
  • it is therefore proposed that, for contacting the structure, at least one connection region of the structure is guided in at least one recontacting step in at least one re-contacting region around an edge region of the substrate to at least one second side of the substrate, different from the first side this second side is formed at least one contact area for contacting the electrical circuit.
  • the structure may be applied to the substrate in various forms to create the re-contact.
  • one possibility is to apply the structure already in preformed state to the substrate, so that the structure already substantially their Endform, which it occupies after Umking ist has.
  • a preferred possibility is to apply the structure in a substantially planar manner to the substrate, wherein the connection region forms a region projecting in the edge region of the substrate. This can be done, for example, similar to the protruding ends of the structures described in DE 10 2004 025 549 A1. Subsequently, in a further step, the connection region is bent around the edge region, for example towards the second side of the substrate.
  • substantially plane state is meant a state in which the structure substantially already corresponds to the surface contour of the substrate, which may include a flat shape, even if the surface of the substrate is stepped or otherwise profiled However, a planar shape is preferred since it can usually be processed most easily.
  • a transfer method is used for applying the structure to the substrate, for example the transfer method known from DE 196 33 675 A1 in one or more of the variants of the method shown there.
  • a layer to be transferred is applied to a carrier foil, which may be, for example, a rigid or flexible carrier foil.
  • the layer to be transferred (which may also be a multilayer structure) is transferred to the substrate by means of this carrier film.
  • the layer to be transferred may, for example, comprise one or more metallic layers, one or more ceramic layers, a plurality of metallic / ceramic layers, a layer system and / or a combination of the elements mentioned. It is particularly preferred if the layer to be transferred further on the side facing away from the Sufölie, ie on the side which assigns when applied to the substrate (for example, when laminating) to the substrate, to improve the adhesion to the substrate at least one film binder having.
  • an inorganic and / or organic film binder for example an adhesive
  • the structure has at least one insulation structure, which is preferably arranged on the side of the structure facing the substrate.
  • insulation structures can also be arranged at other locations in the structure, in particular insulation layers which, for example, insulate individual electrically conductive components of the structure from one another and / or from other components of the electrical component.
  • the substrate comprises, for example, one or more solid electrolytes, such as, for example, yttrium-stabilized zirconium dioxide (YSZ), it can be prevented by means of these insulation structures that metallic components of the electrical circuit contact said solid electrolyte at undesired points and form electrodes.
  • the substrate is milled before the UmARM ists in the edge region and / or phased. In this way, it can be prevented, for example, that stresses, mechanical damage and even fractures in the connection area arise as a result of recontacting in the edge region.
  • the outer shape of the electrical component can be adapted by a suitable milling.
  • the connecting region of the structure can be passed through the at least one cutout during the re-contacting step, for example.
  • connection region in the re-contacting region is essentially free and can therefore be exposed to mechanical and / or electrical influences. It is therefore proposed to provide the connection region with an additional covering layer at least on the side facing away from the substrate, at least in the re-contacting region.
  • This covering layer can already be applied to the structure before the re-contacting, that is to say, for example, before the terminal region is bent over or, alternatively or additionally, can also be applied to the connection region after the re-contacting step.
  • the Umutton ists Symposium example, be electrically isolated and / or protected against mechanical stress.
  • the structure can be configured such that in the terminal region it has a composition with an increased adhesion to the substructure relative to the rest of the structure. strat.
  • a ceramic component of the structure can be increased in this connection region during the production of ceramic sensor element, so that this connection region bonds better to a ceramic substrate.
  • a conductivity of the structure in particular of a component of the electrical circuit (for example of connection contacts) can be increased, for example by increasing the proportion of conductive elements in the structure (for example by increasing the concentration and / or the thickness of these conductive portions), for example by reinforcing conductive pastes in this area.
  • it can be ensured that a sufficient electrical connection is produced between the contact regions arranged on the second side of the substrate and the components of the electrical circuit arranged on the first side of the substrate.
  • a ceramic sensor element is furthermore proposed, which, in particular, can be manufactured according to the method in one of the method variants presented above.
  • this may be a ceramic sensor element for determining at least one physical property of a gas in a measurement gas space, in particular for determining a concentration of a gas component (partial pressure) in a measurement gas, for example an exhaust gas of a motor vehicle.
  • a gas component for example an exhaust gas of a motor vehicle.
  • the configuration of the ceramic sensor element is a lambda probe.
  • Figure 1 shows an embodiment of a layer structure for explaining the proposed UmWallet michs method using the example of a heating element
  • FIG. 2 shows the construction according to FIG. 1 after carrying out the method steps illustrated in FIG. 1 from a first side (front side);
  • FIG. 3 shows the structure according to FIG. 2 from a second side (rear side); and
  • FIG. 4 shows the construction according to FIG. 2 in a sectional view from the side.
  • the proposed method is explained below by way of example with reference to FIGS. 1 to 4 using the example of a ceramic sensor element 110, wherein only the method steps for re-contacting a heating element 112 are shown. Steps can thus follow the method steps shown, in particular the construction of one or more sensor cells, which usually one or more solid electrolytes and two or more electrodes which contact the solid electrolyte, connect.
  • the product illustrated in FIGS. 2 to 4 thus generally represents only an intermediate product in the production of the ceramic sensor element 110.
  • the illustrated re-contacting method may repeat itself and / or conventional sealing techniques, in particular plated-through holes, be used.
  • FIG. 1 shows a layer sequence of the ceramic sensor element, by means of which the method steps are to be explained.
  • a variant of the transfer method described above is used in the present embodiment.
  • a heater function layer sequence 114 is printed onto a carrier film 116 in a mirror-inverted printing sequence.
  • This carrier film 116 is a flexible, transferable pad.
  • films of the "Pacothane thin" or Kapton films can be used as carrier film 116.
  • the heater functional layer sequence 114 is composed of the electrical heater circuit 118, which in this exemplary embodiment is applied to a heater base film 120, and two subsequent ones Heater insulation films 122, 124.
  • the heater functional layer sequence 114 of the type described forms a structure 128 to be transferred to a substrate 126 (eg, a ceramic substrate).
  • the substrate 126 may be designed, for example, as a ceramic base film and has a first side 130 (front side) and a second side 132 (rear side in FIG. 1).
  • the substrate 126 is formed in the edge region 134, in which the re-contacting of supply lines 136 of the electrical heater circuit 118 is to be made, preferably milled out, wherein the edge region 134 in this case also represents the rear cutting edge of the sensor element 110.
  • This rear cutting edge of the edge region 134 can be phased or rounded on both sides.
  • the print layers of the heater function sequence on the carrier film 116 are then transferred to the substrate 126 in a lamination process.
  • This can be done, for example, in a known manner in the range of known parameters.
  • Particularly preferred is a lamination with a surface pressure of 20 to 60 KN in a temperature range of about 40 to 100 0 C, wherein the thickness of the ceramic support film used as the substrate 126 may for example be in the range between 0.1 and 2 mm.
  • the structure 128 to be transferred has a connection region 138 which, after application to the substrate 126, forms a region 140 projecting or projecting over the edge region 134 of the substrate 126.
  • This projecting region 140 of the structure 128 is drawn by the milling in the region of the edge region 134 and folded over or folded onto the rear side 132 of the substrate 126 and preferably on the rear side 132 and on the front side by lamination to the substrate 126. Bending may be accomplished with or without the backing sheet 116, that is, before or after peeling this backing sheet 116 from the structure 128 to be transferred.
  • the surface of the structure 128 may be bent which points away from the carrier film 116, in addition to the said layer sequence, a laminatable film binder may be further printed.
  • the laminatability can be achieved, for example, by adding a suitable solvent to the heater functional sequence 114, such as, for example, DEH (2-diethyl-1-hexanol).
  • This type of laminatable film binder can, for example, be set in such a way that the heater functional layer sequence 114 has a surface which is similar to a dry paint layer.
  • FIGS. 2 and 3 the intermediate product which results after carrying out the method sequence shown in FIG. 1 is shown once in perspective from the front side 130 (FIG. 2) and once in a perspective view as viewed from the rear side 132 (FIG ).
  • the protruding region 140 in the UmWallet ists Geneva which is designated in Figure 1 by the reference numeral 142, already bent over, and there is a two-sided lamination process. It can be seen that this contacting on the second side 132 has formed a contact region 144, which is electrically insulated from the substrate 126 by the heater insulation foils 122, 124.
  • the electric heater circuit 118 of the heating element 112 can be electrically contacted from the rear side 132, even if further, not shown in the figures layers are applied to the front side 130 of the sensor element 110 and thus the front 130 is not more accessible for a contact.
  • FIG. 4 shows a sectional illustration of the intermediate product of the sensor element 110 according to FIGS. 2 and 3.
  • optional preferred further developments of the described method are to be represented, which relate to a particular embodiment of the re-contacting region 142.
  • a particularly good adhesion of the structure 128 on the substrate 126 is required to defects here, for example, by the deflection can occur with a small radius to avoid.
  • a verse tärkungs layer 146 is inserted, which can be configured as a platinum layer with a higher ceramic content.
  • the reinforcing layer 146 preferably has electrical conductivity of its own (for example, by incorporating a platinum) as shown. Paste with Keramikanteil is used) and thus can contribute to increasing the conductivity of the leads 136 and even form a part of these leads 136 in the edge region 134.
  • an additional covering layer 148 can be applied in this Umutton ists Hoch 142, which covers the leads 136 in the edge region 134 in this case.
  • This cover layer 148 may provide better mechanical protection of the leads 136 and / or electrical insulation thereof.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Molecular Biology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un composant électrique, en particulier d'un élément céramique de détecteur (110). Le composant électrique présente une structure stratifiée avec au moins un substrat (126) et au moins une structure (128) pour un circuit électrique, en particulier un circuit de chauffage. La structure (128) est disposée essentiellement sur un premier côté (130) du substrat (126). Pour assurer le contact de la structure (128), une zone de raccordement (138) de la structure (128) est guidée, dans une étape de création de contacts périphériques, dans une zone (142) de réalisation de contacts périphériques autour de la zone de bord (134) du substrat (126) sur le deuxième côté (132) du substrat (126). La zone de contact (144) qui assure le contact avec le circuit électrique (118) est formée sur le deuxième côté (132).
PCT/EP2008/062945 2007-10-24 2008-09-26 Procédé pour réaliser des contacts périphériques sur des composants céramiques WO2009053215A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880112738.XA CN101836109B (zh) 2007-10-24 2008-09-26 用于在陶瓷结构元件中进行包封式电接触的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007050806A DE102007050806A1 (de) 2007-10-24 2007-10-24 Verfahren zur Umkontaktierung in keramischen Bauelementen
DE102007050806.0 2007-10-24

Publications (1)

Publication Number Publication Date
WO2009053215A1 true WO2009053215A1 (fr) 2009-04-30

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Application Number Title Priority Date Filing Date
PCT/EP2008/062945 WO2009053215A1 (fr) 2007-10-24 2008-09-26 Procédé pour réaliser des contacts périphériques sur des composants céramiques

Country Status (3)

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CN (1) CN101836109B (fr)
DE (1) DE102007050806A1 (fr)
WO (1) WO2009053215A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3327991A1 (de) * 1983-08-03 1985-02-14 Robert Bosch Gmbh, 7000 Stuttgart Gasmessfuehler
US5556526A (en) * 1994-03-24 1996-09-17 Nippondenso Co., Ltd. Gas sensor having enhanced external connectivity characteristics
US6723217B1 (en) * 1999-10-20 2004-04-20 Delphi Technologies, Inc. Method and device for pumping oxygen into a gas sensor
DE102004025549A1 (de) * 2004-05-25 2005-12-22 Robert Bosch Gmbh Verfahren zur Herstellung von elektrischen Bauelementen sowie elektrisches Bauelement, insbesondere Sensorelement
US20060010960A1 (en) * 2004-07-13 2006-01-19 Wu Hsiao C Staged electrode carrier of an O2 sensor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19633675B4 (de) 1996-08-21 2007-07-19 Robert Bosch Gmbh Verfahren zum Übertragen von Schichten oder Schichtsystemen auf einen sinterfähigen Schichtträger
DE102004012672A1 (de) 2004-03-16 2005-10-06 Robert Bosch Gmbh Messfühler
CN100487444C (zh) * 2007-04-24 2009-05-13 谢光远 平板式氧传感器芯片的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3327991A1 (de) * 1983-08-03 1985-02-14 Robert Bosch Gmbh, 7000 Stuttgart Gasmessfuehler
US5556526A (en) * 1994-03-24 1996-09-17 Nippondenso Co., Ltd. Gas sensor having enhanced external connectivity characteristics
US6723217B1 (en) * 1999-10-20 2004-04-20 Delphi Technologies, Inc. Method and device for pumping oxygen into a gas sensor
DE102004025549A1 (de) * 2004-05-25 2005-12-22 Robert Bosch Gmbh Verfahren zur Herstellung von elektrischen Bauelementen sowie elektrisches Bauelement, insbesondere Sensorelement
US20060010960A1 (en) * 2004-07-13 2006-01-19 Wu Hsiao C Staged electrode carrier of an O2 sensor

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Publication number Publication date
DE102007050806A1 (de) 2009-04-30
CN101836109B (zh) 2014-03-05
CN101836109A (zh) 2010-09-15

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