WO2009048095A1 - 伝送線路を有する回路装置及びプリント回路基板 - Google Patents
伝送線路を有する回路装置及びプリント回路基板 Download PDFInfo
- Publication number
- WO2009048095A1 WO2009048095A1 PCT/JP2008/068346 JP2008068346W WO2009048095A1 WO 2009048095 A1 WO2009048095 A1 WO 2009048095A1 JP 2008068346 W JP2008068346 W JP 2008068346W WO 2009048095 A1 WO2009048095 A1 WO 2009048095A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- convex
- transmission line
- concave
- parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguides (AREA)
Abstract
伝送線路を有する回路装置において、簡便な構造で不要なモードの影響を抑制し、伝播特性の劣化を抑制する回路装置を提供する。回路装置は、伝送線路を構成する導電性ストリップと、導電性ストリップに平行に対向配置された導電性プレーンとを有する。導電性プレーンの周囲外形の少なくとも一部が、凹部及び凸部から成る連続的な凸凹形状で構成される。好適には、導電性プレーンに発生させたくない伝播モードの波長をλとしたとき、導電性プレーンの凹凸形状の隣り合う凹部の間隔がλのn/4倍(nは奇数)である。導電性プレーンの凹部の長さについて、λの成分が凹部の長さ方向に伝播する場合のモード波長のn/4倍(nは奇数)、あるいは導電性プレーンの凸部の長さについて、λの成分が凸部の長さ方向に伝播する場合のモード波長のn/4倍(nは奇数)である。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009537020A JPWO2009048095A1 (ja) | 2007-10-09 | 2008-10-09 | 伝送線路を有する回路装置及びプリント回路基板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007263484 | 2007-10-09 | ||
JP2007-263484 | 2007-10-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009048095A1 true WO2009048095A1 (ja) | 2009-04-16 |
Family
ID=40549238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068346 WO2009048095A1 (ja) | 2007-10-09 | 2008-10-09 | 伝送線路を有する回路装置及びプリント回路基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2009048095A1 (ja) |
WO (1) | WO2009048095A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015080018A (ja) * | 2013-10-15 | 2015-04-23 | 富士通株式会社 | 半導体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3297093B1 (de) * | 2016-09-16 | 2019-01-02 | Rosenberger Hochfrequenztechnik GmbH & Co. KG | Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09219607A (ja) * | 1996-02-13 | 1997-08-19 | Murata Mfg Co Ltd | 伝送線路 |
WO2001067540A1 (fr) * | 2000-03-06 | 2001-09-13 | Fujitsu Limited | Plaque metallique de blindage et ensemble circuit comprenant cette plaque |
JP2001352204A (ja) * | 2000-06-08 | 2001-12-21 | Murata Mfg Co Ltd | 伝送線路およびそれを用いた回路素子およびそれらを用いた電子回路およびそれを用いた電子装置 |
US20020084876A1 (en) * | 2000-12-29 | 2002-07-04 | Wright Mitchel E. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
-
2008
- 2008-10-09 WO PCT/JP2008/068346 patent/WO2009048095A1/ja active Application Filing
- 2008-10-09 JP JP2009537020A patent/JPWO2009048095A1/ja not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09219607A (ja) * | 1996-02-13 | 1997-08-19 | Murata Mfg Co Ltd | 伝送線路 |
WO2001067540A1 (fr) * | 2000-03-06 | 2001-09-13 | Fujitsu Limited | Plaque metallique de blindage et ensemble circuit comprenant cette plaque |
JP2001352204A (ja) * | 2000-06-08 | 2001-12-21 | Murata Mfg Co Ltd | 伝送線路およびそれを用いた回路素子およびそれらを用いた電子回路およびそれを用いた電子装置 |
US20020084876A1 (en) * | 2000-12-29 | 2002-07-04 | Wright Mitchel E. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
Non-Patent Citations (1)
Title |
---|
T.H.LOH ET AL.: "Photonic bandgap surfaces with interdigitated corrugations", ELECTRONICS LETTERS, vol. 40, no. 18, 22 September 2004 (2004-09-22), pages 1123 - 1125 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015080018A (ja) * | 2013-10-15 | 2015-04-23 | 富士通株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009048095A1 (ja) | 2011-02-24 |
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