WO2009039184A3 - Traitement de liaison avec déviation de faisceau très rapide - Google Patents
Traitement de liaison avec déviation de faisceau très rapide Download PDFInfo
- Publication number
- WO2009039184A3 WO2009039184A3 PCT/US2008/076694 US2008076694W WO2009039184A3 WO 2009039184 A3 WO2009039184 A3 WO 2009039184A3 US 2008076694 W US2008076694 W US 2008076694W WO 2009039184 A3 WO2009039184 A3 WO 2009039184A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- high speed
- systems
- beam deflection
- link processing
- processing
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0344—Observing the speed of the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Abstract
La présente invention concerne le domaine des procédés et des systèmes de traitement laser et, en particulier, des procédés et des systèmes de traitement laser pour dispositifs multi-matériaux de traitement laser. Les systèmes et les procédés peuvent utiliser des déflecteurs très rapides pour améliorer la fenêtre d'énergie de traitement et/ou la vitesse de traitement. Dans certains modes de réalisation, un déflecteur est utilisé pour le balayage non orthogonal de spots de faisceaux. Dans certains modes de réalisation, un déflecteur est utilisé pour mettre en œuvre un traitement non synchrone de structures cibles.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020107008553A KR101310243B1 (ko) | 2007-09-19 | 2008-09-17 | 고속 빔 편향 링크 가공 |
KR1020147006142A KR101516742B1 (ko) | 2007-09-19 | 2008-09-17 | 고속 빔 편향 링크 가공 |
KR1020137013435A KR101420703B1 (ko) | 2007-09-19 | 2008-09-17 | 고속 빔 편향 링크 가공 |
KR1020147032206A KR20140137465A (ko) | 2007-09-19 | 2008-09-17 | 고속 빔 편향 링크 가공 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99440407P | 2007-09-19 | 2007-09-19 | |
US60/994,404 | 2007-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009039184A2 WO2009039184A2 (fr) | 2009-03-26 |
WO2009039184A3 true WO2009039184A3 (fr) | 2010-05-27 |
Family
ID=40468746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/076694 WO2009039184A2 (fr) | 2007-09-19 | 2008-09-17 | Traitement de liaison avec déviation de faisceau très rapide |
Country Status (4)
Country | Link |
---|---|
US (2) | US8269137B2 (fr) |
KR (4) | KR101516742B1 (fr) |
TW (1) | TW200924891A (fr) |
WO (1) | WO2009039184A2 (fr) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
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GB0809003D0 (en) * | 2008-05-17 | 2008-06-25 | Rumsby Philip T | Method and apparatus for laser process improvement |
US10307862B2 (en) | 2009-03-27 | 2019-06-04 | Electro Scientific Industries, Inc | Laser micromachining with tailored bursts of short laser pulses |
TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
KR20120098623A (ko) * | 2009-09-24 | 2012-09-05 | 이에스아이-파이로포토닉스 레이저스, 인코포레이티드 | 바람직한 펄스 형태를 갖는 레이저 펄스의 버스트를 사용하여 박막 물질에 라인을 스크라이빙하는 방법 및 장치 |
JP5620669B2 (ja) * | 2009-10-26 | 2014-11-05 | 東芝機械株式会社 | レーザダイシング方法およびレーザダイシング装置 |
JP4961468B2 (ja) * | 2009-10-29 | 2012-06-27 | 三星ダイヤモンド工業株式会社 | レーザー加工方法、被加工物の分割方法およびレーザー加工装置 |
KR20120113245A (ko) * | 2009-12-30 | 2012-10-12 | 지에스아이 그룹 코포레이션 | 고속 빔 편향을 이용한 링크 처리 |
JP5452247B2 (ja) * | 2010-01-21 | 2014-03-26 | 東芝機械株式会社 | レーザダイシング装置 |
WO2011156283A2 (fr) * | 2010-06-07 | 2011-12-15 | Gsi Group Corporation | Traitement laser à sous-matrices orientées |
JP5981094B2 (ja) * | 2010-06-24 | 2016-08-31 | 東芝機械株式会社 | ダイシング方法 |
TWI393602B (zh) * | 2010-08-04 | 2013-04-21 | Hortek Crystal Co Ltd | 雷射加工製程裝置 |
KR20220046706A (ko) * | 2010-10-22 | 2022-04-14 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
US8896909B2 (en) | 2010-11-04 | 2014-11-25 | Micronic Ab | Method and device scanning a two-dimensional brush through an acousto-optic deflector (AOD) having an extended field in a scanning direction |
US20120160814A1 (en) * | 2010-12-28 | 2012-06-28 | Electro Scientific Industries, Inc. | Methods and systems for link processing using laser pulses with optimized temporal power profiles and polarizations |
WO2012116226A2 (fr) * | 2011-02-25 | 2012-08-30 | Gsi Group Corporation | Traitement de liaison prédictive |
JP6087916B2 (ja) * | 2011-07-05 | 2017-03-01 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 使用中の音響光学ビーム偏向器および音響光学変調器の温度安定性を実現するためのシステムならびに方法 |
JP5140198B1 (ja) | 2011-07-27 | 2013-02-06 | 東芝機械株式会社 | レーザダイシング方法 |
JP2014011358A (ja) | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | レーザダイシング方法 |
RU2532504C1 (ru) * | 2013-03-11 | 2014-11-10 | Виктор Прович Семенков | Способ формирования лазерного растра |
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EP3045257B1 (fr) * | 2015-01-13 | 2018-05-16 | Berner Fachhochschule Wissens- und Technologietransfer (WTT) | Procédé et appareil de traitement de laser |
JP6983165B2 (ja) * | 2016-02-04 | 2021-12-17 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 超音波イメージングシステム及び方法 |
EP3540378A4 (fr) * | 2016-11-14 | 2020-08-19 | Ningbo Onsight Co., Ltd. | Procédé et appareil de balayage laser |
US11260472B2 (en) | 2016-12-30 | 2022-03-01 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
US10613212B2 (en) | 2017-08-14 | 2020-04-07 | Oculii Corp. | Systems and methods for doppler-enhanced radar tracking |
JP6595558B2 (ja) * | 2017-10-30 | 2019-10-23 | ファナック株式会社 | レーザ加工システム |
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GB201806337D0 (en) * | 2018-04-18 | 2018-05-30 | Datalase Ltd | Improvements in or relating to laser making |
WO2021194577A1 (fr) | 2019-12-13 | 2021-09-30 | Oculii Corp. | Systèmes et procédés d'amélioration de doppler et/ou d'ouverture virtuels |
WO2021127172A1 (fr) | 2019-12-20 | 2021-06-24 | Oculii Corp. | Systèmes et procédés de détection radar à modulation de phase |
CN111505658B (zh) * | 2020-04-16 | 2023-04-07 | 中国科学院上海天文台 | 一种脉冲群式重复频率可调的激光测距方法 |
WO2022026033A1 (fr) | 2020-06-16 | 2022-02-03 | Oculii Corp. | Système et procédé pour limiter les interférences radars |
JPWO2021256434A1 (fr) * | 2020-06-18 | 2021-12-23 | ||
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- 2008-09-17 KR KR1020147032206A patent/KR20140137465A/ko not_active Application Discontinuation
- 2008-09-17 WO PCT/US2008/076694 patent/WO2009039184A2/fr active Application Filing
- 2008-09-17 KR KR1020137013435A patent/KR101420703B1/ko active IP Right Grant
- 2008-09-17 KR KR1020107008553A patent/KR101310243B1/ko active IP Right Grant
- 2008-09-18 US US12/233,476 patent/US8269137B2/en active Active
- 2008-09-19 TW TW097136230A patent/TW200924891A/zh unknown
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2012
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Also Published As
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KR101420703B1 (ko) | 2014-07-23 |
KR20130060377A (ko) | 2013-06-07 |
US8269137B2 (en) | 2012-09-18 |
KR20100065384A (ko) | 2010-06-16 |
TW200924891A (en) | 2009-06-16 |
WO2009039184A2 (fr) | 2009-03-26 |
US20130200050A1 (en) | 2013-08-08 |
US20090095722A1 (en) | 2009-04-16 |
KR20140036334A (ko) | 2014-03-25 |
KR20140137465A (ko) | 2014-12-02 |
KR101310243B1 (ko) | 2013-09-24 |
KR101516742B1 (ko) | 2015-05-04 |
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