WO2009034008A3 - Bandverfahren für elektronische bauelemente, module und led-anwendungen - Google Patents

Bandverfahren für elektronische bauelemente, module und led-anwendungen Download PDF

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Publication number
WO2009034008A3
WO2009034008A3 PCT/EP2008/061690 EP2008061690W WO2009034008A3 WO 2009034008 A3 WO2009034008 A3 WO 2009034008A3 EP 2008061690 W EP2008061690 W EP 2008061690W WO 2009034008 A3 WO2009034008 A3 WO 2009034008A3
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WIPO (PCT)
Prior art keywords
components
electronic components
modules
electronic
continuous method
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Application number
PCT/EP2008/061690
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English (en)
French (fr)
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WO2009034008A2 (de
Inventor
Karl Weidner
Michael Kaspar
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Siemens Aktiengesellschaft
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Publication of WO2009034008A2 publication Critical patent/WO2009034008A2/de
Publication of WO2009034008A3 publication Critical patent/WO2009034008A3/de

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10643—Disc shaped leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Led Device Packages (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Verfahren zur Serienherstellung einer Vielzahl von ankontaktierten elektronischen Bauelementen (7) insbesondere von Modulen und/oder Leistungsmodulen und/oder Leuchtdioden und/oder allgemein elektronischen Leistungsbauelementen. Es ist Aufgabe ein kostengünstiges und einfaches Verfahren zur Serienherstellung von ankontaktierten elektronischen Bauelementen (7) in großer Stückzahl bereitzustellen. Die vorliegende Erfindung zeichnet sich dadurch aus, dass ein mit Bauelementen (7) bestücktes erstes Band und ein freiliegende Metallleiter (15) aufweisendes zweites Band derart überlagert werden, dass in dem beanspruchten Bandverfahren ein mechanisches und/oder elektrisches Ankontaktieren der jeweiligen Metallleiter (15) an die jeweilige Kontaktfläche (9) des jeweiligen elektronischen Bauelements (7) ausführbar ist. Beide Bänder können in Form von Rollen erzeugt sein. Die elektronischen Bauelemente (7) können nach dem Ankontaktieren vereinzelt oder ebenso als Einzelrolle geschaffen werden. Auf diese Weise ist ein besonders wirksames Herstellungsverfahren bereitstellbar. Das Verfahren eignet sich insbesondere für elektronische Leistungsbauelemente, die zusätzlich auf einfache Weise wärmeableitende Schichten (19) aufweisen können.
PCT/EP2008/061690 2007-09-10 2008-09-04 Bandverfahren für elektronische bauelemente, module und led-anwendungen WO2009034008A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007043001.0 2007-09-10
DE102007043001A DE102007043001A1 (de) 2007-09-10 2007-09-10 Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen

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WO2009034008A3 true WO2009034008A3 (de) 2009-11-26

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DE102009039891A1 (de) * 2009-09-03 2011-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Modul aufweisend zumindest einen ersten Halbleiterkörper mit einer Strahlungsaustrittsseite und einer Isolationsschicht und Verfahren zu dessen Herstellung
KR100999733B1 (ko) 2010-02-18 2010-12-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
US8338317B2 (en) 2011-04-06 2012-12-25 Infineon Technologies Ag Method for processing a semiconductor wafer or die, and particle deposition device
DE102011083627A1 (de) 2011-09-28 2013-03-28 Continental Automotive Gmbh Verfahren zur Kontaktierung eines elektronischen Bauteils und Baugruppe mit einem elektronischen Bauteil auf einem Substrat
DE102012012985A1 (de) 2012-06-29 2014-01-02 Karlsruher Institut für Technologie Verfahren zur Herstellung einer elektrischen Anordnung sowie elektrische Anordnung
WO2016150583A1 (en) * 2015-03-24 2016-09-29 Abb Technology Ag Power semiconductor device and power semiconductor module comprising a power semiconductor device
EP3343600A1 (de) * 2016-12-28 2018-07-04 Siemens Aktiengesellschaft Halbleitermodul mit einem ersten und einem zweiten verbindungselement zum verbinden eines halbleiterchips sowie herstellungsverfahren

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