WO2009028595A1 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
WO2009028595A1
WO2009028595A1 PCT/JP2008/065378 JP2008065378W WO2009028595A1 WO 2009028595 A1 WO2009028595 A1 WO 2009028595A1 JP 2008065378 W JP2008065378 W JP 2008065378W WO 2009028595 A1 WO2009028595 A1 WO 2009028595A1
Authority
WO
WIPO (PCT)
Prior art keywords
ports
substrate
unload
processing apparatus
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065378
Other languages
English (en)
French (fr)
Inventor
Mitsugu Sato
Shigeo Kaneko
Masayuki Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2009530173A priority Critical patent/JPWO2009028595A1/ja
Priority to CN200880104374A priority patent/CN101785094A/zh
Publication of WO2009028595A1 publication Critical patent/WO2009028595A1/ja
Priority to US12/706,991 priority patent/US20100168909A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

スループットが低下しない基板処理装置を提供する。ロードポート（Ａ６Ａ、Ｂ６Ｂ）及びアンロードポート（Ａ７Ａ、Ｂ７Ｂ）を備える、ロードポート（Ａ６Ａ、Ｂ６Ｂ）及びアンロードポート（Ａ７Ａ、Ｂ７Ｂ）と基板搬送チャンバ（３）との間で基板搬送ロボット（Ｔｒ）によって基板（５）の受け渡しが行われる。制御部（１２）は、基板（５）の受け渡しの際、ロードポート（Ａ６Ａ、Ｂ６Ｂ）及びアンロードポート（Ａ７Ａ、Ｂ７Ｂ）のうち、隣接するロードポート及びアンロードポートを１対のポートと認識する。制御部（１２）は、１対のポートに対して基板の受け渡しを行うように基板搬送ロボット（Ｔｒ）を制御する。
PCT/JP2008/065378 2007-08-31 2008-08-28 基板処理装置 Ceased WO2009028595A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009530173A JPWO2009028595A1 (ja) 2007-08-31 2008-08-28 基板処理装置
CN200880104374A CN101785094A (zh) 2007-08-31 2008-08-28 基板处理设备
US12/706,991 US20100168909A1 (en) 2007-08-31 2010-02-17 Substrate Processing Apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007226146 2007-08-31
JP2007-226146 2007-08-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/706,991 Continuation US20100168909A1 (en) 2007-08-31 2010-02-17 Substrate Processing Apparatus

Publications (1)

Publication Number Publication Date
WO2009028595A1 true WO2009028595A1 (ja) 2009-03-05

Family

ID=40387309

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065378 Ceased WO2009028595A1 (ja) 2007-08-31 2008-08-28 基板処理装置

Country Status (4)

Country Link
US (1) US20100168909A1 (ja)
JP (1) JPWO2009028595A1 (ja)
CN (1) CN101785094A (ja)
WO (1) WO2009028595A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019183209A (ja) * 2018-04-05 2019-10-24 株式会社アルバック スパッタ装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11823932B2 (en) * 2020-08-26 2023-11-21 Samsung Electronics Co., Ltd. Substrate processing system and substrate processing apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737907A (ja) * 1993-07-22 1995-02-07 Toshiba Corp 半導体処理装置およびその処理方法
JPH0846013A (ja) * 1994-05-23 1996-02-16 Tokyo Electron Ltd マルチチャンバ処理システム用搬送装置
JP2003179120A (ja) * 1994-08-19 2003-06-27 Tokyo Electron Ltd 処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
KR960002534A (ko) * 1994-06-07 1996-01-26 이노우에 아키라 감압·상압 처리장치
TW295677B (ja) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
US5993081A (en) * 1995-10-24 1999-11-30 Canon Kabushiki Kaisha In-line processing system
US5944857A (en) * 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
JP3862438B2 (ja) * 1998-12-28 2006-12-27 キヤノン株式会社 走査露光装置、走査露光方法およびデバイス製造方法
US20020023715A1 (en) * 2000-05-26 2002-02-28 Norio Kimura Substrate polishing apparatus and substrate polishing mehod
JP3880343B2 (ja) * 2001-08-01 2007-02-14 株式会社ルネサステクノロジ ロードポート、基板処理装置および雰囲気置換方法
JP4319434B2 (ja) * 2003-03-11 2009-08-26 東京エレクトロン株式会社 ゲートバルブ及び真空容器
JP4860167B2 (ja) * 2005-03-30 2012-01-25 東京エレクトロン株式会社 ロードロック装置，処理システム及び処理方法
WO2006137287A1 (ja) * 2005-06-22 2006-12-28 Hitachi Kokusai Electric Inc. 半導体装置の製造方法および基板処理装置
US20100136773A1 (en) * 2005-08-10 2010-06-03 Naonori Akae Semiconductor Device Manufacturing Method and Substrate Processing Apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737907A (ja) * 1993-07-22 1995-02-07 Toshiba Corp 半導体処理装置およびその処理方法
JPH0846013A (ja) * 1994-05-23 1996-02-16 Tokyo Electron Ltd マルチチャンバ処理システム用搬送装置
JP2003179120A (ja) * 1994-08-19 2003-06-27 Tokyo Electron Ltd 処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019183209A (ja) * 2018-04-05 2019-10-24 株式会社アルバック スパッタ装置

Also Published As

Publication number Publication date
JPWO2009028595A1 (ja) 2010-12-02
CN101785094A (zh) 2010-07-21
US20100168909A1 (en) 2010-07-01

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