WO2009028484A1 - 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 - Google Patents

半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 Download PDF

Info

Publication number
WO2009028484A1
WO2009028484A1 PCT/JP2008/065164 JP2008065164W WO2009028484A1 WO 2009028484 A1 WO2009028484 A1 WO 2009028484A1 JP 2008065164 W JP2008065164 W JP 2008065164W WO 2009028484 A1 WO2009028484 A1 WO 2009028484A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
manufacturing
adhesive sheet
sheet
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065164
Other languages
English (en)
French (fr)
Inventor
Yasuhiro Amano
Sadahito Misumi
Takeshi Matsumura
Naohide Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN200880101005A priority Critical patent/CN101765909A/zh
Priority to US12/675,433 priority patent/US20100236689A1/en
Publication of WO2009028484A1 publication Critical patent/WO2009028484A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

　接着シートが薄層化した場合にも、当該接着シートの有無を容易に識別することを可能にし、これにより製造装置のダウンタイムを短縮して、歩留まりの向上を可能にする半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法を提供する。本発明の半導体装置製造用の接着シートは、半導体素子を被着体に接着させる半導体装置製造用の接着シートであって、波長域が２９０～４５０ｎｍの範囲内にある光を吸収又は反射させる顔料を含有することを特徴とする。
PCT/JP2008/065164 2007-08-31 2008-08-26 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 Ceased WO2009028484A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880101005A CN101765909A (zh) 2007-08-31 2008-08-26 半导体装置制造用的胶粘片及使用其的半导体装置的制造方法
US12/675,433 US20100236689A1 (en) 2007-08-31 2008-08-26 Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007226282A JP4975564B2 (ja) 2007-08-31 2007-08-31 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2007-226282 2007-08-31

Publications (1)

Publication Number Publication Date
WO2009028484A1 true WO2009028484A1 (ja) 2009-03-05

Family

ID=40387204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065164 Ceased WO2009028484A1 (ja) 2007-08-31 2008-08-26 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20100236689A1 (ja)
JP (1) JP4975564B2 (ja)
CN (1) CN101765909A (ja)
TW (1) TW200918632A (ja)
WO (1) WO2009028484A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015013946A (ja) * 2013-07-05 2015-01-22 日東電工株式会社 接着剤組成物及び接着シート
JP2018016705A (ja) * 2016-07-27 2018-02-01 古河電気工業株式会社 電子デバイス用テープ

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8004078B1 (en) * 2009-03-17 2011-08-23 Amkor Technology, Inc. Adhesive composition for semiconductor device
JP5632695B2 (ja) * 2009-11-26 2014-11-26 日東電工株式会社 ダイシングフィルム付き接着フィルム、及び、該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法
JP6045773B2 (ja) * 2009-11-26 2016-12-14 日立化成株式会社 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP4845063B2 (ja) * 2009-12-18 2011-12-28 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP5996836B2 (ja) 2010-02-25 2016-09-21 タレックス光学工業株式会社 眼鏡用合わせガラスレンズ
JP2011253911A (ja) * 2010-06-01 2011-12-15 Shinko Electric Ind Co Ltd 配線基板
JP5408571B2 (ja) * 2010-10-06 2014-02-05 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP5023225B1 (ja) * 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
JP5036887B1 (ja) 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
DE102011077684A1 (de) * 2011-06-17 2012-12-20 Robert Bosch Gmbh Abdeckmaterial für einen Mikrochip, Mikrochip mit Abdeckmaterial sowie Verfahren zur Bereitstellung eines solchen Mikrochips
CN102842512A (zh) * 2011-06-22 2012-12-26 日东电工株式会社 半导体装置的制造方法
RU2476471C1 (ru) * 2011-10-20 2013-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) Способ крепления резин друг к другу
JP6379389B2 (ja) * 2014-12-15 2018-08-29 リンテック株式会社 ダイシングダイボンディングシート
JP6983200B2 (ja) * 2019-07-11 2021-12-17 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
WO2021033715A1 (ja) * 2019-08-22 2021-02-25 昭和電工マテリアルズ株式会社 電子部品加工フィルム及び電子部品加工方法
CN111477621B (zh) * 2020-06-28 2020-09-15 甬矽电子(宁波)股份有限公司 芯片封装结构、其制作方法和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154250A (ja) * 1998-11-20 2000-06-06 Ube Ind Ltd アンダーフィル用ポリイミド樹脂
JP2001168113A (ja) * 1999-12-10 2001-06-22 Hitachi Chem Co Ltd 半導体素子用接着材組成物及びこれを用いた半導体装置
JP2005252114A (ja) * 2004-03-05 2005-09-15 Towa Corp ダイボンド用粘着テープの貼付方法
JP2007220913A (ja) * 2006-02-16 2007-08-30 Nitto Denko Corp 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10228186A1 (de) * 2002-06-24 2004-01-22 Merck Patent Gmbh UV-stabilisierte Partikel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154250A (ja) * 1998-11-20 2000-06-06 Ube Ind Ltd アンダーフィル用ポリイミド樹脂
JP2001168113A (ja) * 1999-12-10 2001-06-22 Hitachi Chem Co Ltd 半導体素子用接着材組成物及びこれを用いた半導体装置
JP2005252114A (ja) * 2004-03-05 2005-09-15 Towa Corp ダイボンド用粘着テープの貼付方法
JP2007220913A (ja) * 2006-02-16 2007-08-30 Nitto Denko Corp 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015013946A (ja) * 2013-07-05 2015-01-22 日東電工株式会社 接着剤組成物及び接着シート
JP2018016705A (ja) * 2016-07-27 2018-02-01 古河電気工業株式会社 電子デバイス用テープ

Also Published As

Publication number Publication date
CN101765909A (zh) 2010-06-30
JP2009059917A (ja) 2009-03-19
TW200918632A (en) 2009-05-01
JP4975564B2 (ja) 2012-07-11
US20100236689A1 (en) 2010-09-23

Similar Documents

Publication Publication Date Title
WO2009028484A1 (ja) 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
EP2819190B8 (en) Semiconductor light emitting module and method for manufacturing the same
BRPI0913324A2 (pt) película anti-reflexo, elemento óptico que compreende a película anti-reflexo, estampador, processo para a produção de estampador e processo para a produção de película anti-reflexo
WO2008033291A3 (en) Photochromic devices and methods for making the same
WO2008149948A1 (ja) 分光モジュール
WO2010065477A3 (en) A method for rotating an object attached to a surface of a substrate
WO2014033324A3 (de) Sicherheitselement sowie sicherheitsdokument
WO2010003671A3 (en) Spectral purity filter, radiation source, lithographic apparatus, and device manufacturing method
WO2008143773A3 (en) Single crystal phosphor light conversion structures for light emitting devices
WO2013039737A3 (en) Methods of making detackified adhesive articles
WO2013006577A3 (en) Optical frame attached with alignment features microfabrictated in die
MX341291B (es) Materiales y articulos opticamente activos y sistemas en los cuales pueden utilizarse.
WO2010022839A3 (en) Spectral purity filter and lithographic apparatus
WO2008112992A3 (en) Sealant material
WO2011051817A3 (en) System and method for increasing the accuracy of optical character recognition (ocr)
WO2011036347A3 (en) A method for attaching labels to items
WO2008114675A1 (ja) 複合センサ
WO2011060155A3 (en) Process for forming an image on a transparent acrylic article
WO2007094875A3 (en) Light absorbers and methods
EP3511611A4 (en) WAVELENGTH CONVERSION FILM, LAMINATE, LIGHT-EMITTING DEVICE AND METHOD FOR PRODUCING A WAVELENGTH CONVERSION FILM
WO2009008419A1 (ja) 基体の反射率低減剤及びそれを用いた低反射性基体の製造方法
WO2013036062A3 (en) Lighting module
WO2008116541A3 (de) Verfahren zur herstellung von transparentem pigment violett 23
WO2012026704A3 (ko) 광결정 패턴이 형성된 반도체 발광 소자 및 그 제조 방법
WO2012015286A3 (ko) 태양광 발전장치 및 이의 제조방법

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880101005.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08828719

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12675433

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08828719

Country of ref document: EP

Kind code of ref document: A1