WO2009028376A1 - 天板及びプラズマ処理装置 - Google Patents

天板及びプラズマ処理装置 Download PDF

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Publication number
WO2009028376A1
WO2009028376A1 PCT/JP2008/064854 JP2008064854W WO2009028376A1 WO 2009028376 A1 WO2009028376 A1 WO 2009028376A1 JP 2008064854 W JP2008064854 W JP 2008064854W WO 2009028376 A1 WO2009028376 A1 WO 2009028376A1
Authority
WO
WIPO (PCT)
Prior art keywords
top panel
processing apparatus
processing container
plasma processing
slots
Prior art date
Application number
PCT/JP2008/064854
Other languages
English (en)
French (fr)
Inventor
Caizhong Tian
Tetsuya Nishizuka
Kiyotaka Ishibashi
Toshihisa Nozawa
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US12/441,429 priority Critical patent/US8343308B2/en
Priority to CN2008800007728A priority patent/CN101548364B/zh
Priority to KR1020097004902A priority patent/KR101176061B1/ko
Priority to JP2009512356A priority patent/JP4606508B2/ja
Publication of WO2009028376A1 publication Critical patent/WO2009028376A1/ja
Priority to US13/684,850 priority patent/US20130081763A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

　真空引き可能な処理容器の天井部に設けられて、並設される平面アンテナ部材のスロットから放射されるマイクロ波を処理容器内へ透過可能な天板であって、天板の処理容器内を臨む面側に放射状に設けられた複数の突起部を備える天板を開示する。
PCT/JP2008/064854 2007-08-28 2008-08-20 天板及びプラズマ処理装置 WO2009028376A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/441,429 US8343308B2 (en) 2007-08-28 2008-08-20 Ceiling plate and plasma process apparatus
CN2008800007728A CN101548364B (zh) 2007-08-28 2008-08-20 顶板以及等离子体处理装置
KR1020097004902A KR101176061B1 (ko) 2007-08-28 2008-08-20 천판 및 플라즈마 처리 장치
JP2009512356A JP4606508B2 (ja) 2007-08-28 2008-08-20 天板及びプラズマ処理装置
US13/684,850 US20130081763A1 (en) 2007-08-28 2012-11-26 Ceiling plate and plasma process apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007221524 2007-08-28
JP2007-221524 2007-08-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/684,850 Continuation US20130081763A1 (en) 2007-08-28 2012-11-26 Ceiling plate and plasma process apparatus

Publications (1)

Publication Number Publication Date
WO2009028376A1 true WO2009028376A1 (ja) 2009-03-05

Family

ID=40387099

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064854 WO2009028376A1 (ja) 2007-08-28 2008-08-20 天板及びプラズマ処理装置

Country Status (6)

Country Link
US (2) US8343308B2 (ja)
JP (3) JP4606508B2 (ja)
KR (1) KR101176061B1 (ja)
CN (2) CN103094046A (ja)
TW (1) TW200932069A (ja)
WO (1) WO2009028376A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109080A (ja) * 2010-11-16 2012-06-07 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法
JP2012222063A (ja) * 2011-04-06 2012-11-12 Ulvac Japan Ltd プラズマ処理装置
TWI665713B (zh) * 2015-04-22 2019-07-11 日商東京威力科創股份有限公司 電漿處理裝置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5096047B2 (ja) * 2007-06-14 2012-12-12 東京エレクトロン株式会社 マイクロ波プラズマ処理装置およびマイクロ波透過板
WO2011024446A1 (ja) * 2009-08-25 2011-03-03 キヤノンアネルバ株式会社 プラズマ処理装置およびデバイスの製造方法
US8415884B2 (en) * 2009-09-08 2013-04-09 Tokyo Electron Limited Stable surface wave plasma source
JP5606821B2 (ja) * 2010-08-04 2014-10-15 東京エレクトロン株式会社 プラズマ処理装置
WO2014057836A1 (ja) * 2012-10-11 2014-04-17 東京エレクトロン株式会社 成膜装置
JP2014112644A (ja) * 2012-11-06 2014-06-19 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
US20140165911A1 (en) * 2012-12-14 2014-06-19 Applied Materials, Inc. Apparatus for providing plasma to a process chamber
JP2015018685A (ja) * 2013-07-10 2015-01-29 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
CN103526187A (zh) * 2013-10-12 2014-01-22 武汉工程大学 一种大面积微波等离子体化学气相沉积系统
KR102451370B1 (ko) * 2014-12-15 2022-10-05 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
CN104918401A (zh) * 2015-05-26 2015-09-16 山东专利工程总公司 一种感应耦合型等离子体处理装置
JP2017004665A (ja) * 2015-06-08 2017-01-05 東京エレクトロン株式会社 プラズマ処理装置
JP6883953B2 (ja) * 2016-06-10 2021-06-09 東京エレクトロン株式会社 マイクロ波プラズマ処理装置およびマイクロ波プラズマ処理方法
CN108735567B (zh) * 2017-04-20 2019-11-29 北京北方华创微电子装备有限公司 表面波等离子体加工设备
US20190189398A1 (en) * 2017-12-14 2019-06-20 Tokyo Electron Limited Microwave plasma processing apparatus
KR102184067B1 (ko) * 2017-12-27 2020-11-27 도쿄엘렉트론가부시키가이샤 에칭 방법 및 에칭 장치
JP7138582B2 (ja) * 2018-05-24 2022-09-16 東京エレクトロン株式会社 アンテナ、プラズマ処理装置およびプラズマ処理方法
CN110797248A (zh) * 2018-08-01 2020-02-14 北京北方华创微电子装备有限公司 表面波等离子体装置和半导体处理设备
KR102225685B1 (ko) 2019-08-29 2021-03-10 세메스 주식회사 안테나 유닛 및 이를 포함하는 플라즈마 처리 장치
KR102225657B1 (ko) * 2019-11-14 2021-03-10 피에스케이 주식회사 배플 유닛, 이를 포함하는 기판 처리 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232099A (ja) * 1996-02-20 1997-09-05 Hitachi Ltd プラズマ処理装置
JP2000273646A (ja) * 1999-03-24 2000-10-03 Sumitomo Metal Ind Ltd マイクロ波プラズマ処理装置
JP2003168681A (ja) * 2001-12-03 2003-06-13 Ulvac Japan Ltd マイクロ波プラズマ処理装置および処理方法
JP2004200307A (ja) * 2002-12-17 2004-07-15 Tokyo Electron Ltd プラズマ処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191073A (ja) 1989-12-21 1991-08-21 Canon Inc マイクロ波プラズマ処理装置
JPH05343334A (ja) 1992-06-09 1993-12-24 Hitachi Ltd プラズマ発生装置
US5611864A (en) * 1994-03-24 1997-03-18 Matsushita Electric Industrial Co., Ltd. Microwave plasma processing apparatus and processing method using the same
JP3233575B2 (ja) 1995-05-26 2001-11-26 東京エレクトロン株式会社 プラズマ処理装置
JP4974318B2 (ja) 2001-08-17 2012-07-11 株式会社アルバック マイクロ波プラズマ処理装置および処理方法
JP3723783B2 (ja) * 2002-06-06 2005-12-07 東京エレクトロン株式会社 プラズマ処理装置
CN100492591C (zh) * 2003-09-04 2009-05-27 东京毅力科创株式会社 等离子处理装置
JP4563729B2 (ja) * 2003-09-04 2010-10-13 東京エレクトロン株式会社 プラズマ処理装置
JP4756540B2 (ja) * 2005-09-30 2011-08-24 東京エレクトロン株式会社 プラズマ処理装置と方法
JP5082229B2 (ja) * 2005-11-29 2012-11-28 東京エレクトロン株式会社 プラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232099A (ja) * 1996-02-20 1997-09-05 Hitachi Ltd プラズマ処理装置
JP2000273646A (ja) * 1999-03-24 2000-10-03 Sumitomo Metal Ind Ltd マイクロ波プラズマ処理装置
JP2003168681A (ja) * 2001-12-03 2003-06-13 Ulvac Japan Ltd マイクロ波プラズマ処理装置および処理方法
JP2004200307A (ja) * 2002-12-17 2004-07-15 Tokyo Electron Ltd プラズマ処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109080A (ja) * 2010-11-16 2012-06-07 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法
JP2012222063A (ja) * 2011-04-06 2012-11-12 Ulvac Japan Ltd プラズマ処理装置
TWI665713B (zh) * 2015-04-22 2019-07-11 日商東京威力科創股份有限公司 電漿處理裝置

Also Published As

Publication number Publication date
CN101548364B (zh) 2013-02-06
US8343308B2 (en) 2013-01-01
CN103094046A (zh) 2013-05-08
JP2013140959A (ja) 2013-07-18
TW200932069A (en) 2009-07-16
JPWO2009028376A1 (ja) 2010-12-02
JP4606508B2 (ja) 2011-01-05
JP5438205B2 (ja) 2014-03-12
US20100032094A1 (en) 2010-02-11
CN101548364A (zh) 2009-09-30
KR101176061B1 (ko) 2012-08-24
JP2011066001A (ja) 2011-03-31
KR20090053905A (ko) 2009-05-28
JP5166501B2 (ja) 2013-03-21
US20130081763A1 (en) 2013-04-04

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