WO2009023787A3 - Stoker with purge condition sensing - Google Patents

Stoker with purge condition sensing Download PDF

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Publication number
WO2009023787A3
WO2009023787A3 PCT/US2008/073198 US2008073198W WO2009023787A3 WO 2009023787 A3 WO2009023787 A3 WO 2009023787A3 US 2008073198 W US2008073198 W US 2008073198W WO 2009023787 A3 WO2009023787 A3 WO 2009023787A3
Authority
WO
WIPO (PCT)
Prior art keywords
purge
reticle
pod
pods
streams
Prior art date
Application number
PCT/US2008/073198
Other languages
French (fr)
Other versions
WO2009023787A2 (en
Inventor
William W Goodwin
Mark C Phelps
Original Assignee
Entegris Inc
William W Goodwin
Mark C Phelps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, William W Goodwin, Mark C Phelps filed Critical Entegris Inc
Publication of WO2009023787A2 publication Critical patent/WO2009023787A2/en
Publication of WO2009023787A3 publication Critical patent/WO2009023787A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

The present invention provides a method, system, and components for protecting substrates and particularly reticles (9) by providing purging and sensing and confirmation of said purging streams. A storage housing (54, 54.1, 70, 78) with a purge system (50, 52) for reticle (2, 66, 84) pods has an automated robotic mechanism (74, 85) for transferring reticle pods which includes a gripper (70.3, 90) with an air flow sensor (71.2, 102) associated therewith. The storage housing includes receptacles (58, 71.7, 87) for receiving the reticle pods, the receptacles having purge outlets (64) as part of the purge system that discharge purge streams, into the enclosed envoironment (54.2) of the storage housing, when a reticle pod is not in place and discharge purge streams into the reticle pod when the recticle pod is in place. The air flow sensor on the gripper can confirm a measure, a purge stream at a receptacle before placing a reticle pod thereon.
PCT/US2008/073198 2007-08-14 2008-08-14 Stoker with purge condition sensing WO2009023787A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96476807P 2007-08-14 2007-08-14
US60/964,768 2007-08-14

Publications (2)

Publication Number Publication Date
WO2009023787A2 WO2009023787A2 (en) 2009-02-19
WO2009023787A3 true WO2009023787A3 (en) 2009-06-04

Family

ID=39874953

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/073198 WO2009023787A2 (en) 2007-08-14 2008-08-14 Stoker with purge condition sensing

Country Status (2)

Country Link
TW (1) TW200933779A (en)
WO (1) WO2009023787A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376606B (en) * 2010-08-09 2014-03-19 家登精密工业股份有限公司 Mask box provided with sensor
JP6942634B2 (en) * 2015-03-03 2021-09-29 レブストック，ルッツ Inspection system
TWI673565B (en) * 2018-04-03 2019-10-01 特銓股份有限公司 Side cover type box cover device and side cover type box cover method
US10871722B2 (en) * 2018-07-16 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask purging system and method
US20220301909A1 (en) * 2021-03-19 2022-09-22 Taiwan Semiconductor Manufacturing Company Limited Airflow detection device and methods of use

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5351415A (en) * 1992-05-18 1994-10-04 Convey, Inc. Method and apparatus for maintaining clean articles
US7084466B1 (en) * 2002-12-09 2006-08-01 Novellus Systems, Inc. Liquid detection end effector sensor and method of using the same
WO2007149513A2 (en) * 2006-06-19 2007-12-27 Entegris, Inc. System for purging reticle storage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5351415A (en) * 1992-05-18 1994-10-04 Convey, Inc. Method and apparatus for maintaining clean articles
US7084466B1 (en) * 2002-12-09 2006-08-01 Novellus Systems, Inc. Liquid detection end effector sensor and method of using the same
WO2007149513A2 (en) * 2006-06-19 2007-12-27 Entegris, Inc. System for purging reticle storage

Also Published As

Publication number Publication date
WO2009023787A2 (en) 2009-02-19
TW200933779A (en) 2009-08-01

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