WO2009021363A1 - Nano silicon dioxide abradant polishing liquid for processing microcrystal glass - Google Patents

Nano silicon dioxide abradant polishing liquid for processing microcrystal glass Download PDF

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Publication number
WO2009021363A1
WO2009021363A1 PCT/CN2007/002753 CN2007002753W WO2009021363A1 WO 2009021363 A1 WO2009021363 A1 WO 2009021363A1 CN 2007002753 W CN2007002753 W CN 2007002753W WO 2009021363 A1 WO2009021363 A1 WO 2009021363A1
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Prior art keywords
ether
abrasive
polishing liquid
polyoxyethylene
fatty alcohol
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PCT/CN2007/002753
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French (fr)
Chinese (zh)
Inventor
Jihe Zhong
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Jiangsu Haixun Industry & Commerce Group Co., Ltd
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Publication of WO2009021363A1 publication Critical patent/WO2009021363A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Definitions

  • the invention relates to a polishing liquid, in particular to a nano silica abrasive polishing liquid for processing glass ceramics. Background technique
  • Glass-ceramic is both a good optical material and a good structural material. It has good mechanical and physical properties and chemical stability at higher temperatures, which has attracted wide attention.
  • the surface of the glass-ceramics needs to be ultra-precision processed to form an ultra-smooth surface to meet the high-precision requirements of computer storage.
  • the special polishing liquid for polishing the surface of glass-ceramics there are problems in the special polishing liquid for polishing the surface of glass-ceramics.
  • the surface quality after polishing is poor, the scratches are many, the polishing efficiency is low, and the surface quality of the glass-ceramic glass cannot be satisfied.
  • the main object of the present invention is to overcome the above disadvantages of the prior art, and to provide a nano silica abrasive polishing liquid for processing glass ceramics, which can be used for surface polishing processing of glass ceramics, and effectively reduces the crystal glass.
  • the polished surface is scratched, the surface roughness of the glass ceramic after polishing is lowered, and the polishing rate is fast, the polishing liquid does not corrode the device, and the safety performance is high.
  • the nano silica abrasive polishing liquid for processing glass ceramics of the invention is characterized in that it comprises: abrasive I, abrasive II, surfactant, pH regulator and deionized water; the weight percentage of each component is: Abrasive I is from 10% to 40%, Abrasive II is from 5% to 20%, surfactant is from 0.01% to 0.6%, and pH regulator is from 1% to 6%. Ionic water is the balance; the pH of each of the above components is from 10 to 11.
  • the abrasive II is a silica powder having a particle diameter of 0.1 to 200 nm.
  • the above-mentioned nano silica abrasive polishing liquid for processing a glass ceramic is characterized in that the abrasive I has a particle diameter of preferably 10 to 80 nm; and the abrasive has a particle diameter of preferably 50 to 150 nra.
  • the nano silica abrasive polishing liquid for processing the glass ceramics characterized in that the surfactant is a nonionic surfactant; the nonionic surfactant is a fatty alcohol polyoxyethylene ether, hydrazine One or a combination of a phenol ethoxylate, a triethanolamine oleate soap, a dodecyl dimethyl amine oxide or a sorbitan oleic acid monoester.
  • the nano silica abrasive polishing liquid for processing the glass ceramics characterized in that the fatty alcohol polyoxyethylene ether is a fatty alcohol polyoxyethylene (3) ether, a fatty alcohol polyoxyethylene (5) ether, and a fat.
  • the nonylphenol polyoxyethylene ether is nonylphenol polyoxyethylene (4) ether, nonylphenol fatty alcohol polyoxyethylene (6) ether, nonylphenol fatty alcohol polyoxyl Ethylene (7) ether, nonylphenol fatty alcohol polyoxyethylene (9) ether, nonylphenol fatty alcohol polyoxyethylene (10) ether, nonylphenol fatty alcohol polyoxyethylene (13) ether, octylphenol fatty alcohol Polyoxyethylene (20) ether, octylphenol fatty alcohol polyoxyethylene (100) ether or dodecyl phenol polyoxyethylene (10) ether, the numbers in parentheses indicate the degree of polymerization of the substance.
  • the nano silica abrasive polishing liquid for processing the glass ceramics characterized in that: the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or ammonia; the organic base is polyhydroxypolyamine And one of the amines or a combination thereof.
  • the nano silica abrasive polishing liquid for processing the glass ceramics characterized in that: the polyhydroxypolyamine is triethanolamine, tetrahydroxyethylenediamine or hexahydroxypropylpropanediamine; the amine is B Diamine or tetramethylammonium hydroxide.
  • the preparation method of the nano silica abrasive polishing liquid for processing the glass ceramics characterized in that the abrasive ⁇ of the required weight is uniformly dispersed in the deionized water placed in the container tank, and then purified in at least one thousand stages.
  • the dissolved abrasive I liquid is input into the container tank through the mass flow meter, mixed with the required weight of the abrasive II in the container tank and fully stirred, and uniformly mixed and polished.
  • the remaining components of the liquid plus The mixture is further stirred into the container and mixed uniformly to prepare a finished polishing liquid.
  • the method for preparing a nano silica abrasive polishing liquid for processing the glass ceramics characterized in that: the ambient temperature of the at least one-stage purification chamber is 20 to 25 degrees Celsius; and the vacuum pressure is 1 ( ⁇ 5 to 0) Mpa.
  • the utility model relates to the beneficial effect of the nano silica abrasive polishing liquid for processing glass ceramics, wherein the polishing liquid is mixed with a water-soluble silica sol of reasonable particle size and a silica powder as an abrasive, which can improve the dispersion of the abrasive. Performance, reduction. Scratch of the surface of the glass ceramic after polishing, and can reduce the roughness and waviness of the surface of the polished glass ceramic; in addition, the polishing rate can be greatly improved; further, the polishing liquid of the present invention is alkaline It has good chemical stability, does not corrode equipment, and is safe to use. detailed description
  • the nano silica abrasive polishing liquid for processing glass ceramics of the invention comprises abrasive I, abrasive II, surfactant, pH regulator and deionized water; the weight percentage of each component is: abrasive I is 10% to 40%, Abrasive II is 5% to 20%, surfactant is 0.01% to 0.6%, PH regulator is 1% to 6%, deionized water is the balance; The pH of the mixture is 10 to 11.
  • the nano silica abrasive polishing liquid for processing the glass ceramics of the present invention is a water-soluble silica sol having a particle diameter of 0.1 to 200 nm, and the silica hydrosol is a silica suspended by colloidal properties.
  • the concentration of the silica sol solution used in the microelectronic polishing liquid is 10% to 40% by weight, and the silica of the present invention may be made of water glass.
  • the method of the exchange is prepared; the abrasive II is a silica powder having a particle diameter of 0.1 to 200 rra; the particle size of the abrasive I is preferably 10 to 80 nra, and the particle size of the abrasive II is preferably 50 to 150 nm.
  • the surfactant is preferably a nonionic surfactant;
  • the nonionic surfactant Preferred is one of fatty alcohol polyoxyethylene ether, alkylphenol ethoxylate, triethanolamine oleate soap, dodecyldimethylamine oxide or sorbitan.
  • the fatty alcohol polyoxyethylene ether is a fatty alcohol polyoxyethylene ether
  • the nonylphenol ethoxylate is octylphenol ethoxylate or phenol ethoxylate, wherein the fat in the above substance
  • the number of carbon atoms of the alcohol and alkylphenol moieties is preferably from 12 to 18.
  • the fatty alcohol polyoxyethylene ether is a fatty polyoxyethylene (3) ether, a fatty alcohol polyoxyethylene (5) ether, a fatty alcohol polyoxyethylene (7) ether, a fatty alcohol polyoxyethylene (9) ether, a fatty alcohol polyoxyethylene (15) ether, a fatty alcohol polyoxyethylene (20) ether, a fatty alcohol polyoxyethylene (25) ether or a fatty alcohol polyoxyethylene (40) ether;
  • the alkylphenol polyoxyethylene ether is preferably hydrazine Phenolic polyoxyethylene (4) Ether, nonylphenol 3 ⁇ 4 oxyethylene (6) ether, nonylphenol polyoxyethylene (7) ether, nonylphenol fatty alcohol polyoxyethylene (9) ether, nonylphenol fatty alcohol polyoxyethylene (10) ether, Nonylphenol polyoxyethylene (13) ether, octylphenol polyoxyethylene (20) ether, octylphenol polyoxyethylene (100) ether or dodecylphenol polyoxy
  • the nano silica abrasive polishing liquid for processing the glass ceramics of the present invention wherein the pH adjusting agent is an inorganic base, an organic base or a combination thereof; the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or Ammonia, the organic base is one or a combination of a polyhydric polyamine and an amine; the polyhydroxypolyamine is triethanolamine, tetrahydroxyethylenediamine or hexahydroxypropylpropanediamine, and the amine is ethylenediamine or Tetramethylammonium hydroxide.
  • the pH adjusting agent is an inorganic base, an organic base or a combination thereof;
  • the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or Ammonia
  • the organic base is one or a combination of a polyhydric polyamine and an amine;
  • the polyhydroxypolyamine is triethanolamine, tetrahydroxyethylenediamine or hexa
  • the preparation method of the nano silica abrasive polishing liquid for processing the glass ceramics of the invention is that the abrasives of the required weight are uniformly dispersed in the deionized water placed in the container tank, and then purified in at least one thousand stages.
  • the dissolved abrasive I liquid is input into the container tank through the mass flow meter, mixed with the required weight of the abrasive II in the container tank and fully stirred, and uniformly mixed and polished.
  • the remaining components of the liquid are added to the vessel and then thoroughly stirred and mixed to prepare a finished polishing liquid.
  • the ambient temperature of at least the first-stage purification chamber is 20 to 25 degrees Celsius;
  • the vacuum pressure is 1 ( ⁇ 5 to 0 M P a, the embodiment of the present invention - - 0. IMPa vacuum pressure.
  • MPa ⁇ 2 ⁇ (2. 2g fatty alcohol polyoxyethylene ether ( 20) and 3 g of potassium hydroxide were added to the vessel and continued to be thoroughly stirred, and the mixture was uniformly mixed to obtain the finished polishing liquid of the present invention.
  • the polishing liquid has a pH of 11 and a specific gravity of 1. ig/cm :i .
  • the surface roughness of the glass-ceramic material required for the preparation of the computer hard disk substrate is generally sub-nanometer. Therefore, the surface roughness of the glass-ceramic disk disk using the polishing process of the present invention is in accordance with the industry standard.
  • the gram of the silica powder is uniformly dispersed in a container of 5, 7 grams of deionized water, and then in an atmosphere of at least a thousand clean room, at 25 ° C, at a vacuum of 0.1 Mpa
  • the sulphide powder is mixed with a mixture of 15 g of silica powder, which is placed in a can.
  • the dodecyl phenol polyoxyethylene (10) ether and 1 gram of tetramethylammonium hydroxide are added to the vessel and continue to be thoroughly stirred, and uniformly mixed to form the finished polishing liquid of the present invention.
  • the polishing liquid has a pH of 10 and a specific gravity of 1. lg / cm a .
  • the abrasive is selected from a water-soluble silica sol solution having a particle diameter of 0.1 to 200 nm (weight percent concentration: 20% to 40%) and a silica powder; and the surfactant is selected from a fatty alcohol polyoxygen Ethylene (3) ether, fatty alcohol polyoxyethylene (5) ether, fatty alcohol polyoxyethylene (7) ether, fatty alcohol polyoxyethylene (9) ether, fatty alcohol polyoxyethylene (15) ether, fatty alcohol polyoxygen Ethylene (25) ether, fatty alcohol polyoxyethylene (40) ether, alkylphenol polyoxyethylene ether is nonylphenol polyoxyethylene (4) ether, nonylphenol polyoxyethylene (6) ether, nonylphenol poly Oxyethylene (7) ether, nonylphenol polyoxyethylene (9) ether, nonylphenol polyoxyethylene (10) ether, nonylphenol polyoxyethylene (13) ether, octylphenol polyoxyethylene (20) ether , octylphenol polyoxyethylene (20
  • the fatty alcohol moiety in the fatty alcohol polyoxyethylene ethers referred to and used in the present invention and examples preferably has a carbon number of 12 to 18.
  • the nano silica abrasive polishing liquid for processing the glass ceramics of the invention has the abrasive material I as the water-soluble dioxide 'silica sol with smaller particle diameter, which has better dispersibility and uniform particle size distribution, and can effectively reduce micro The surface of the crystal glass is scratched, and the surface roughness and waviness of the glass ceramic are reduced.
  • the abrasive II is a silica powder with a larger particle size, which can effectively improve the polishing rate and increase the production efficiency;
  • the agent is a nonionic surfactant, such as a fatty alcohol polyoxyethylene ether or a nonylphenol ethoxylate. The addition of the nonionic surfactant can effectively control the uniformity of polishing during processing and reduce surface defects. And improve the polishing efficiency; the addition of ra value modifier in the polishing solution can ensure the stability of the polishing solution, reduce the corrosion of the device, and can also improve the polishing rate.
  • the present invention has the advantages of: mixing a water-soluble silica sol of a reasonable particle size and a silica powder as an abrasive, thereby improving the dispersion property of the abrasive, reducing the scratch of the surface of the glass ceramic after polishing, and further polishing
  • the surface roughness and waviness of the glass-ceramic glass are reduced; in addition, the polishing rate can be greatly improved; further, the polishing liquid of the invention is alkaline, has good chemical stability, does not corrode the device, and has excellent safety performance.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention provides a nano silicon dioxide abradant polishing liquid for processing microcrystal glass, which contains abradant I, abradant II, surfactant, pH regulator and deionized water; and the weight percentages of the components are following: 10wt%-40wt% of abradant I, 5wt%-20wt% of abradant II, 1wt%-6wt% of pH regulator, 0.01wt%-0.6wt% of surfactant and the balance of deionized water; the pH of the mixed solution of the aforementioned each component is 10-11; in which the abradant I is silicon dioxide colloidal solution having a particle size of 0.1-200nm, the concentration of the above solution is 10% to 40%; the abradant II is silicon dioxide powder having a particle size of 0.1-200nm.

Description

微晶玻璃加工用的纳米二氧化硅磨料抛光液 技术领域  Nano silica abrasive polishing liquid for processing glass ceramics
本发明涉及抛光液， 尤其涉及一种微晶玻璃加工用的纳米二氧化硅磨料抛光液。 背景技术  The invention relates to a polishing liquid, in particular to a nano silica abrasive polishing liquid for processing glass ceramics. Background technique
微晶玻璃既是一种很好的光学材料， 又是一种良好的结构材料， 它具有良好力学物 理性能和在较高温度下的化学稳定性能， 因此引起人们广泛关注。  Glass-ceramic is both a good optical material and a good structural material. It has good mechanical and physical properties and chemical stability at higher temperatures, which has attracted wide attention.
近年来， 随着计算机技术的飞速发展， 对计算机硬盘存储能力的要求也逐渐提高， 原来的铝基板硬盘已经很难适应这种发展的要求， 因此， 该行业开始选用新材料来制备 计算机的硬盘基板。 目前很多从业者选用微晶玻璃作为制备计算机硬盘基板的材料， 实 践中证明微晶玻璃的计算机硬盘基板拥有比铝基板更高的机械强度、 制造几何尺寸精度 和亚纳米级的表面粗糙度， 而且具有不变形、 不易划伤以及抗冲击能力强的特点， 因此 成为硬盘基板制造的重要原材料。  In recent years, with the rapid development of computer technology, the requirements for the storage capacity of computer hard disks have gradually increased. The original aluminum substrate hard disk has been difficult to adapt to this development requirement. Therefore, the industry began to use new materials to prepare computer hard disks. Substrate. At present, many practitioners choose glass-ceramics as the material for preparing computer hard disk substrates. In practice, the computer hard disk substrate of glass-ceramics has higher mechanical strength, manufacturing geometric accuracy and sub-nanometer surface roughness than aluminum substrates. It has the characteristics of no deformation, no scratching and strong impact resistance, so it has become an important raw material for hard disk substrate manufacturing.
同其他制备硬盘基板材料一样， 微晶玻璃在用于制备硬盘基板时， 其表面也需要经 过超精密度的加工， 使其形成超光滑表面， 才能满足计算机存储的高精密要求。 目前， 微晶玻璃表面抛光的专用抛光液存在的问题， 一是种类比较少， 二是抛光后表面质量差， 划伤多， 抛光效率低， 不能满足飞速发展的计算机行业对微晶玻璃表面质量的要求。 发明内容  As with other hard disk substrate materials, when used to prepare hard disk substrates, the surface of the glass-ceramics needs to be ultra-precision processed to form an ultra-smooth surface to meet the high-precision requirements of computer storage. At present, there are problems in the special polishing liquid for polishing the surface of glass-ceramics. First, there are few types. Secondly, the surface quality after polishing is poor, the scratches are many, the polishing efficiency is low, and the surface quality of the glass-ceramic glass cannot be satisfied. Requirements. Summary of the invention
本发明的主要目的在于克服现有产品存在的上述缺点，而提供一种微晶玻璃加工用 的纳米二氧化硅磨料抛光液， 其可用于微晶玻璃的表面抛光加工中， 有效减少微晶玻璃 抛光后的表面划伤， 降低微晶玻璃抛光后的表面粗糙度， 而且抛光速率快， 抛光液不腐 蚀设备， 使用的安全性能高。  The main object of the present invention is to overcome the above disadvantages of the prior art, and to provide a nano silica abrasive polishing liquid for processing glass ceramics, which can be used for surface polishing processing of glass ceramics, and effectively reduces the crystal glass. The polished surface is scratched, the surface roughness of the glass ceramic after polishing is lowered, and the polishing rate is fast, the polishing liquid does not corrode the device, and the safety performance is high.
本发明的目的是由以下技术方案实现的。  The object of the present invention is achieved by the following technical solutions.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于： 包括磨料 I、 磨 料 II、 表面活性剂、 PH调节剂以及去离子水； 各种组分所占的重量百分比为： 磨料 I为 10%至 40%， 磨料 II为 5%至 20%， 表面活性剂为 0. 01%至 0. 6%， PH调节剂为 1%至 6%， 去 离子水为余量； 前述各组分混合液的 PH值为 10至 11。 - 前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于： 所述磨料 I是粒 径为 0. 1至 200nm的水溶性二氧化硅溶胶， 该硅溶胶的重量百分比浓度在 10%至 40% ; 所述磨料 II是粒径为 0. 1至 200nm氧化硅粉末。 The nano silica abrasive polishing liquid for processing glass ceramics of the invention is characterized in that it comprises: abrasive I, abrasive II, surfactant, pH regulator and deionized water; the weight percentage of each component is: Abrasive I is from 10% to 40%, Abrasive II is from 5% to 20%, surfactant is from 0.01% to 0.6%, and pH regulator is from 1% to 6%. Ionic water is the balance; the pH of each of the above components is from 10 to 11. The water-soluble silica sol having a particle size of 0.1 to 200 nm, the weight percent concentration of the silica sol is in the above-mentioned nano-silica abrasive polishing liquid for processing the glass-ceramics. 1至200纳米硅硅粉末。 The abrasive II is a silica powder having a particle diameter of 0.1 to 200 nm.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于：所述磨料 I的粒 径优选 10至 80nm; 所述磨料 Π的粒径优选 50至 150nra。  The above-mentioned nano silica abrasive polishing liquid for processing a glass ceramic is characterized in that the abrasive I has a particle diameter of preferably 10 to 80 nm; and the abrasive has a particle diameter of preferably 50 to 150 nra.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于：所述表面活性剂 为非离子型表面活性剂； 所述非离子型表面活性剂是脂肪醇聚氧乙烯醚、 浣基酚聚氧乙 烯醚、 三乙醇胺油酸皂、 十二焼基二甲基氧化胺或失水山梨醇油酸单脂中的一种或它们 的组合。  The nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that the surfactant is a nonionic surfactant; the nonionic surfactant is a fatty alcohol polyoxyethylene ether, hydrazine One or a combination of a phenol ethoxylate, a triethanolamine oleate soap, a dodecyl dimethyl amine oxide or a sorbitan oleic acid monoester.
前述的微晶玻璃加工用的纳米二氧化硅磨料拋光液， 其特征在于：所述脂肪醇聚氧 乙烯醚是脂肪醇聚氧乙烯（3)醚、 脂肪醇聚氧乙烯 （5)醚、 脂肪醇聚氧乙烯 （7)醚、 脂肪醇聚氧乙烯 （9)醚、 脂肪醇聚氧乙烯（15)醚、 脂肪醇聚氧乙烯（20)醚、 脂肪醇 聚氧乙烯 （25) 醚或脂肪醇聚氧乙烯（40)醚； 所述垸基酚聚氧乙烯醚是壬基酚聚氧乙 烯（4)醚、 壬基酚脂肪醇聚氧乙烯（6)醚、 壬基酚脂肪醇聚氧乙烯（7)醚、 壬基酚脂 肪醇聚氧乙烯（9)醚、 壬基酚脂肪醇聚氧乙烯（10)醚、 壬基酚脂肪醇聚氧乙烯（13) 醚、辛基酚脂肪醇聚氧乙烯（20)醚、辛基酚脂肪醇聚氧乙烯（100)醚或十二烷基酚聚 氧乙烯 （10)醚， 括号内的数字表示所述物质的聚合度。  The nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that the fatty alcohol polyoxyethylene ether is a fatty alcohol polyoxyethylene (3) ether, a fatty alcohol polyoxyethylene (5) ether, and a fat. Alcohol polyoxyethylene (7) ether, fatty alcohol polyoxyethylene (9) ether, fatty alcohol polyoxyethylene (15) ether, fatty alcohol polyoxyethylene (20) ether, fatty alcohol polyoxyethylene (25) ether or fat Alcohol polyoxyethylene (40) ether; the nonylphenol polyoxyethylene ether is nonylphenol polyoxyethylene (4) ether, nonylphenol fatty alcohol polyoxyethylene (6) ether, nonylphenol fatty alcohol polyoxyl Ethylene (7) ether, nonylphenol fatty alcohol polyoxyethylene (9) ether, nonylphenol fatty alcohol polyoxyethylene (10) ether, nonylphenol fatty alcohol polyoxyethylene (13) ether, octylphenol fatty alcohol Polyoxyethylene (20) ether, octylphenol fatty alcohol polyoxyethylene (100) ether or dodecyl phenol polyoxyethylene (10) ether, the numbers in parentheses indicate the degree of polymerization of the substance.
前述的微晶玻璃加工用的纳米二氧化硅磨料拋光液， 其特征在于： 所述 PH值调节 剂为无机碱、 有机碱或它们的组合。  The nano silica abrasive polishing liquid for processing a glass ceramic according to the above, characterized in that the pH adjusting agent is an inorganic base, an organic base or a combination thereof.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于： 所述无机碱为氢 氧化钾、 氢氧化钠、 碳酸钾、 碳酸钠或氨水； 所述有机碱为多羟多胺和胺中的一种或它 们的组合。  The nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that: the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or ammonia; the organic base is polyhydroxypolyamine And one of the amines or a combination thereof.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液，其特征在于： 所述多羟多胺为 三乙醇胺、 四羟基乙二胺或六羟基丙基丙二胺； 所述的胺为乙二胺或四甲基氢氧化铵。  The nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that: the polyhydroxypolyamine is triethanolamine, tetrahydroxyethylenediamine or hexahydroxypropylpropanediamine; the amine is B Diamine or tetramethylammonium hydroxide.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备方法， 其特征在于， 先将 所需重量的磨料 Π均匀分散于放置在容器罐内的去离子水中， 然后在至少千级净化室的 环境内， 在真空负压的动力下， 通过质量流量计将溶解的磨料 I液体输入容器罐中， 与 容器罐内的所需重量的磨料 II进行混合并充分搅拌， 混合均匀后将抛光液的其余组分加 入容器罐内再继续充分搅拌， 混合均匀即制备成成品抛光液。 The preparation method of the nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that the abrasive Π of the required weight is uniformly dispersed in the deionized water placed in the container tank, and then purified in at least one thousand stages. In the environment of the chamber, under the vacuum negative pressure, the dissolved abrasive I liquid is input into the container tank through the mass flow meter, mixed with the required weight of the abrasive II in the container tank and fully stirred, and uniformly mixed and polished. The remaining components of the liquid plus The mixture is further stirred into the container and mixed uniformly to prepare a finished polishing liquid.
前述的微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备方法， 其特征在于： 所述 至少千级净化室的环境温度为 20至 25摄氏度； 所述真空压力为 1(Γ5至 0 Mpa。 The method for preparing a nano silica abrasive polishing liquid for processing the glass ceramics, characterized in that: the ambient temperature of the at least one-stage purification chamber is 20 to 25 degrees Celsius; and the vacuum pressure is 1 (Γ 5 to 0) Mpa.
本发明用于微晶玻璃加工用的纳米二氧化硅磨料抛光液的有益效果，该抛光液使用 合理粒径的水溶性二氧化硅溶胶和二氧化硅粉末混合作为磨料， 既可以提高磨料的分散 性能， 减少.抛光后微晶玻璃表面划伤， 而且可以使拋光后的微晶玻璃表面的粗糙度和波 紋度降低； 另外， 可以大大提高抛光速率； 再者， 本发明的抛光液为碱性， 化学稳定性 好， 不腐蚀设备， 使用的安全性能理想。 具体实施方式  The utility model relates to the beneficial effect of the nano silica abrasive polishing liquid for processing glass ceramics, wherein the polishing liquid is mixed with a water-soluble silica sol of reasonable particle size and a silica powder as an abrasive, which can improve the dispersion of the abrasive. Performance, reduction. Scratch of the surface of the glass ceramic after polishing, and can reduce the roughness and waviness of the surface of the polished glass ceramic; in addition, the polishing rate can be greatly improved; further, the polishing liquid of the present invention is alkaline It has good chemical stability, does not corrode equipment, and is safe to use. detailed description
本发明微晶玻璃加工用的纳米二氧化硅磨料拋光液， 其包括磨料 I、 磨料 II、 表面 活性剂、 PH调节剂以及去离子水； 各种组分所占的重量百分比为： 磨料 I为 10%至 40%， 磨料 II为 5%至 20%, 表面活性剂为 0. 01%至 0. 6%， PH调节剂为 1%至 6%， 去离子水为余 量； 前述各组分混合液的 PH值为 10至 11。  The nano silica abrasive polishing liquid for processing glass ceramics of the invention comprises abrasive I, abrasive II, surfactant, pH regulator and deionized water; the weight percentage of each component is: abrasive I is 10% to 40%, Abrasive II is 5% to 20%, surfactant is 0.01% to 0.6%, PH regulator is 1% to 6%, deionized water is the balance; The pH of the mixture is 10 to 11.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其磨料 I是粒径为 0. 1 至 200nm的水溶性二氧化硅溶胶，二氧化硅水溶胶是二氧化硅以胶体的性质悬浮在溶液中， 但是可以有不同的浓度， 微电子抛光液中所使用的硅溶胶液的重量百分比浓度在 10%至 40%左¾, 本发明的二氧化硅可以是以水玻璃为原料利用离子交换的方法制备； 磨料 II 是粒径为 0. 1至 200rra的二氧化硅粉末； 该磨料 I的粒径优选 10至 80nra， 该磨料 II的 粒径优选 50至 150nm。  The nano silica abrasive polishing liquid for processing the glass ceramics of the present invention, the abrasive I is a water-soluble silica sol having a particle diameter of 0.1 to 200 nm, and the silica hydrosol is a silica suspended by colloidal properties. In the solution, but there may be different concentrations, the concentration of the silica sol solution used in the microelectronic polishing liquid is 10% to 40% by weight, and the silica of the present invention may be made of water glass. The method of the exchange is prepared; the abrasive II is a silica powder having a particle diameter of 0.1 to 200 rra; the particle size of the abrasive I is preferably 10 to 80 nra, and the particle size of the abrasive II is preferably 50 to 150 nm.
为了控制抛光过程中的金属离子粘污，在本发明微晶玻璃加工用的纳米二氧化硅磨 料抛光液中， 其表面活性剂优选为非离子型表面活性剂； 所述非离子型表面活性剂优选 是脂肪醇聚氧乙烯醚、 烷基酚聚氧乙烯醚、 三乙醇胺油酸皂、 十二烷基二甲基氧化胺或 失水山梨醇.油酸单脂中的一种或它们的组合； 优选所述脂肪醇聚氧乙烯醚是脂肪醇聚氧 乙烯醚；所述垸基酚聚氧乙烯醚是辛基酚聚氧乙烯醚或者任基酚聚氧乙烯醚,其中上述物 质中的脂肪醇和烷基酚部分的碳原子数优选为 12至 18。 更优选该脂肪醇聚氧乙烯醚是 的脂肪 聚氧乙烯（3)醚、 脂肪醇聚氧乙烯（5)醚、脂肪醇聚氧乙烯（7)醚、 脂肪醇 聚氧乙烯（9)醚、 脂肪醇聚氧乙烯（15)醚、脂肪醇聚氧乙烯（20)醚、 脂肪醇聚氧乙 烯 （25 ) 醚或脂肪醇聚氧乙烯 （40) 醚； 烷基酚聚氧乙烯醚优选是壬基酚聚氧乙烯 （4) 醚、 壬基酚 ¾氧乙烯（6)醚、壬基酚聚氧乙烯（7)醚、壬基酚脂肪醇聚氧乙烯（9)醚、 壬基酚脂肪醇聚氧乙烯（10)醚、 壬基酚聚氧乙烯（13)醚、 辛基酚聚氧乙烯（20)醚、 辛基酚聚氧乙烯 （100)醚或十二烷基酚聚氧乙烯 （10)醚， 括号内的数字表示聚合度， 上述物 中的脂肪醇部分优选碳原子数为 12至 18。 In order to control the staining of metal ions in the polishing process, in the nano silica abrasive polishing liquid for processing glass ceramics of the present invention, the surfactant is preferably a nonionic surfactant; the nonionic surfactant Preferred is one of fatty alcohol polyoxyethylene ether, alkylphenol ethoxylate, triethanolamine oleate soap, dodecyldimethylamine oxide or sorbitan. oleic acid monoester or a combination thereof Preferably, the fatty alcohol polyoxyethylene ether is a fatty alcohol polyoxyethylene ether; the nonylphenol ethoxylate is octylphenol ethoxylate or phenol ethoxylate, wherein the fat in the above substance The number of carbon atoms of the alcohol and alkylphenol moieties is preferably from 12 to 18. More preferably, the fatty alcohol polyoxyethylene ether is a fatty polyoxyethylene (3) ether, a fatty alcohol polyoxyethylene (5) ether, a fatty alcohol polyoxyethylene (7) ether, a fatty alcohol polyoxyethylene (9) ether, a fatty alcohol polyoxyethylene (15) ether, a fatty alcohol polyoxyethylene (20) ether, a fatty alcohol polyoxyethylene (25) ether or a fatty alcohol polyoxyethylene (40) ether; the alkylphenol polyoxyethylene ether is preferably hydrazine Phenolic polyoxyethylene (4) Ether, nonylphenol 3⁄4 oxyethylene (6) ether, nonylphenol polyoxyethylene (7) ether, nonylphenol fatty alcohol polyoxyethylene (9) ether, nonylphenol fatty alcohol polyoxyethylene (10) ether, Nonylphenol polyoxyethylene (13) ether, octylphenol polyoxyethylene (20) ether, octylphenol polyoxyethylene (100) ether or dodecylphenol polyoxyethylene (10) ether, numbers in brackets The degree of polymerization is expressed, and the fatty alcohol portion in the above is preferably from 12 to 18 carbon atoms.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其 PH值调节剂为无机碱、 有 机碱或它们的组合； 该无机碱为氢氧化钾、 氢氧化钠、 碳酸钾、 碳酸钠或氨水， 该有机 碱为多羟多胺和胺中的一种或它们的组合； 该多羟多胺是三乙醇胺、 四羟基乙二胺或六 羟基丙基丙二胺， 胺为乙二胺或四甲基氢氧化铵。  The nano silica abrasive polishing liquid for processing the glass ceramics of the present invention, wherein the pH adjusting agent is an inorganic base, an organic base or a combination thereof; the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or Ammonia, the organic base is one or a combination of a polyhydric polyamine and an amine; the polyhydroxypolyamine is triethanolamine, tetrahydroxyethylenediamine or hexahydroxypropylpropanediamine, and the amine is ethylenediamine or Tetramethylammonium hydroxide.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备方法，其是先将所需重量 的磨料 II均.匀分散于放置在容器罐内的去离子水中， 然后在至少千级净化室的环境内， 在真空负压的动力下， 通过质量流量计将溶解的磨料 I液体输入容器罐中， 与容器罐内 的所需重量的磨料 II进行混合并充分搅拌， 混合均匀后将抛光液的其余组分加入容器罐 内再继 ί卖充分搅拌， 混合均匀即制备成为成品抛光液。  The preparation method of the nano silica abrasive polishing liquid for processing the glass ceramics of the invention is that the abrasives of the required weight are uniformly dispersed in the deionized water placed in the container tank, and then purified in at least one thousand stages. In the environment of the chamber, under the vacuum negative pressure, the dissolved abrasive I liquid is input into the container tank through the mass flow meter, mixed with the required weight of the abrasive II in the container tank and fully stirred, and uniformly mixed and polished. The remaining components of the liquid are added to the vessel and then thoroughly stirred and mixed to prepare a finished polishing liquid.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备中，至少千级净化室的环 境温度为 20至 25摄氏度； 真空压力为 1(Γ5至 0 MPa， 本发明实施例釆用- 0. IMPa真空 压力。 In the preparation of the nano silica abrasive polishing liquid for processing the glass ceramics of the present invention, the ambient temperature of at least the first-stage purification chamber is 20 to 25 degrees Celsius; the vacuum pressure is 1 (Γ 5 to 0 M P a, the embodiment of the present invention - - 0. IMPa vacuum pressure.
实施例 1 : Example 1
称取 30克 lOnm水溶性二氧化硅溶胶液体， 重量浓度为 20%, 5克 120皿二氧化硅 粉末， 0. 2 ·克聚合度为 20 的脂肪醇聚氧乙烯醚（其商品名为平平加 0— 20, 结构为 R0(CH2C¾0)2„H, R=C12-l8¾,-ar), 3克氢氧化钾和 61. 8克去离子水， 备用。 Weigh 30 g of lOnm water-soluble silica sol liquid, the weight concentration is 20%, 5 g of 120-dish silica powder, 0.2 g · a degree of polymerization of 20 fatty alcohol polyoxyethylene ether (the trade name is flat 0至20, The structure is R0(CH 2 C3⁄40) 2 „H, R=C 12 - l8 3⁄4,-ar), 3 g of potassium hydroxide and 61.8 g of deionized water, ready for use.
先将 5克二氧化硅粉末均匀分散 放置在容器罐内的 61. 8克的去离子水中， 然后 在至少午级净化室的环境内， 20Ό条件下， 在一 O. lMPa真空负压动力下， 通过质量流量 计将水溶性二氧化硅溶胶输入容器罐中， 与预先放置在容器罐中的二氧化硅粉末混合并 充分搅拌， 待混合均匀后将 0. 2克脂肪醇聚氧乙烯醚（20) 和 3克氢氧化钾加入容器罐 中并继续充分搅拌， 混合均匀即成为本发明的抛光液成品。  MPa真空真空压动力下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下下2克的脂醇聚氧乙烯的。 (2. 2g fatty alcohol polyoxyethylene ether ( 20) and 3 g of potassium hydroxide were added to the vessel and continued to be thoroughly stirred, and the mixture was uniformly mixed to obtain the finished polishing liquid of the present invention.
该抛光液的 PH值为 11, 比重为 1. ig/cm:i。 The polishing liquid has a pH of 11 and a specific gravity of 1. ig/cm :i .
实验效果分析： 利用上述抛光液， 与去离子水按 1 : 100稀释， 使用风雷 C6382I/JY 型抛光机， 在压力 100g/cm2、 抛光盘转速为 50rpm、 流量 900ml/min的条件下， 对微晶 玻璃磁盘片抛光 8 分钟， 利用 XRF1020 厚度测试系统 （MICRO PIONEER 公司生产的 XRF-2000H)测量抛光前后残存膜厚差， 求得平均去除速率为 380nra/min, 利用轮廓仪 (Zego公司的 Newview6000系列）在 550nmX410nm的面积内测得该微晶玻璃磁盘片表 面粗糙度为 0. 4ra Experimental effect analysis: Using the above polishing solution, diluted with 1:100 with deionized water, using a wind mine C6382I/JY type polishing machine, under the conditions of pressure 100g/cm 2 , polishing disk rotation speed of 50rpm, flow rate 900ml/min, The glass-ceramic disk is polished for 8 minutes, using the XRF1020 thickness test system (produced by MICRO PIONEER) XRF-2000H) The difference in residual film thickness before and after polishing was measured, and the average removal rate was 380 nra/min. The surface roughness of the glass-ceramic disk was 0 in the area of 550 nm X410 nm using a profiler (Zego's Newview 6000 series). . 4ra
目前制备计算机硬盘基板要求的微晶玻璃材料表面粗糙度通常为亚纳米级，因此使 用本发明抛 ·光液加工的微晶玻璃磁盘片表面粗糙度， 符合本行业规定标准。  At present, the surface roughness of the glass-ceramic material required for the preparation of the computer hard disk substrate is generally sub-nanometer. Therefore, the surface roughness of the glass-ceramic disk disk using the polishing process of the present invention is in accordance with the industry standard.
实施例 2:  Example 2:
取 25克 30nm水溶性二氧化硅溶胶液体， 重量浓度为 30%, 15克 80nm二氧化硅 粉末， 0. 3克十二垸基酚聚氧乙烯 （10)醚， 1克四甲基氢氧化铵和 58. 7克去离子水备 用。  25 g of 30 nm water-soluble silica sol liquid, 30% by weight, 15 g of 80 nm silica powder, 0.3 g of dodecylphenol polyoxyethylene (10) ether, 1 g of tetramethyl hydroxide Ammonium and 58.7 grams of deionized water for use.
先将 15.克二氧化硅粉末均匀分散于放置在容器罐内的 58. 7克的去离子水中，然后 在至少千级净化室的环境内， 25°C条件下， 在一 O. lMpa真空负压动力下， 通过质量流量 计将 25克水溶性二氧化硅溶胶输入容器罐中， 与预先放置在容器罐中的 15克二氧化硅 粉末混合并充分搅拌， 待混合均匀后将 0. 3克十二烷基酚聚氧乙烯（10)醚和 1克四甲 基氢氧化铵.加入容器罐中并继续充分搅拌， 混合均匀即成为本发明的抛光液成品。  The gram of the silica powder is uniformly dispersed in a container of 5, 7 grams of deionized water, and then in an atmosphere of at least a thousand clean room, at 25 ° C, at a vacuum of 0.1 Mpa The sulphide powder is mixed with a mixture of 15 g of silica powder, which is placed in a can. The dodecyl phenol polyoxyethylene (10) ether and 1 gram of tetramethylammonium hydroxide are added to the vessel and continue to be thoroughly stirred, and uniformly mixed to form the finished polishing liquid of the present invention.
该抛光液的 PH值为 10， 比重为 1. lg/cma。 Lg/厘米的。 The polishing liquid has a pH of 10 and a specific gravity of 1. lg / cm a .
实验效果分析： 利用上述抛光液， 与去离子水按 1 : 100稀释， 使用风雷 C6382I/JY 型抛光机， 在压力 100g/cm 抛光盘转速为 50rpffl、 流量 900ml/min的条件下， 对微晶 玻璃磁盘片抛光 8 分钟， 利用 XRF1020 厚度测试系统 （MICRO PIONEER 公司生产的 XRF-2000H)测量抛光前后残存膜厚差， 求得平均去除速率为 410nffl/rain, 利用轮廓仪 (Zego公司的 Newview6000系列）在 550nmX 410nm的面积内测得该微晶玻璃磁盘片表 面粗糙度为 0. 45ran。 Experimental effect analysis: Using the above polishing solution, diluted with 1:100 with deionized water, using a wind mine C6382I/JY type polishing machine, under the condition of pressure 100g/cm polishing disk rotation speed of 50r pffl , flow rate 900ml/min, The crystal glass disk was polished for 8 minutes. The XRF1020 thickness test system (XRF-2000H manufactured by MICRO PIONEER) was used to measure the residual film thickness difference before and after polishing, and the average removal rate was 410nffl/rain. The profiler (Zego's Newview6000 series) was used. The surface roughness of the glass-ceramic disk disk is 0. 45ran.
上述实施例中， 磨料选用粒径为 0. 1至 200nm以下的水溶性二氧化硅溶胶液（重量 百分比浓度.为 20%至 40%) 和二氧化硅粉末； 表面活性剂选用脂肪醇聚氧乙烯 （3) 醚、 脂肪醇聚氧乙烯（5)醚、 脂肪醇聚氧乙烯（7)醚、 脂肪醇聚氧乙烯（9)醚、 脂肪醇聚 氧乙烯 （15) 醚、 脂肪醇聚氧乙烯 （25)醚、 脂肪醇聚氧乙烯（40)醚、 烷基酚聚氧乙 烯醚是壬基酚聚氧乙烯（4 )醚、 壬基酚聚氧乙烯（6)醚、 壬基酚聚氧乙烯（7 )醚、 壬 基酚聚氧乙烯（9)醚、 壬基酚聚氧乙烯（10)醚、 壬基酚聚氧乙烯（13 )醚、 辛基酚聚 氧乙烯（20)醚、辛基酚聚氧乙烯（100)醚、三乙醇胺油酸皂、 十二烷基二甲基氧化胺 或失水山梨醇油酸单脂； PH调节剂选用氢氧化钠、 碳酸钾、碳酸钠、 氨水、 三乙醇胺、 四羟基乙二胺、 六羟基丙基丙二胺或乙二胺时， 采用上述实施例相同的制备方法得到的 抛光液， 用于微晶玻璃磁盘片的抛光， 可以达到与上述实施例相同的效果。 In the above embodiment, the abrasive is selected from a water-soluble silica sol solution having a particle diameter of 0.1 to 200 nm (weight percent concentration: 20% to 40%) and a silica powder; and the surfactant is selected from a fatty alcohol polyoxygen Ethylene (3) ether, fatty alcohol polyoxyethylene (5) ether, fatty alcohol polyoxyethylene (7) ether, fatty alcohol polyoxyethylene (9) ether, fatty alcohol polyoxyethylene (15) ether, fatty alcohol polyoxygen Ethylene (25) ether, fatty alcohol polyoxyethylene (40) ether, alkylphenol polyoxyethylene ether is nonylphenol polyoxyethylene (4) ether, nonylphenol polyoxyethylene (6) ether, nonylphenol poly Oxyethylene (7) ether, nonylphenol polyoxyethylene (9) ether, nonylphenol polyoxyethylene (10) ether, nonylphenol polyoxyethylene (13) ether, octylphenol polyoxyethylene (20) ether , octylphenol polyoxyethylene (100) ether, triethanolamine oleic acid soap, dodecyl dimethyl amine oxide or sorbitan oleic acid monoester; PH regulator used sodium hydroxide, potassium carbonate, sodium carbonate , ammonia, triethanolamine, When tetrahydroxyethylenediamine, hexahydroxypropylpropanediamine or ethylenediamine, the polishing liquid obtained by the same preparation method as in the above embodiment is used for polishing the glass-ceramic disk disk, and can be achieved in the same manner as the above embodiment. effect.
本发明和实施例中涉及和使用的脂肪醇聚氧乙烯醚中的脂肪醇部分优选碳原子数 为 12至 18。  The fatty alcohol moiety in the fatty alcohol polyoxyethylene ethers referred to and used in the present invention and examples preferably has a carbon number of 12 to 18.
本发明微晶玻璃加工用的纳米二氧化硅磨料抛光液，选用的磨料 I为粒径较小的水 溶性二氧化'硅溶胶， 其具有较好的分散性， 粒度分布均匀， 能够有效减少微晶玻璃抛光 后的表面划伤， 同时降低微晶玻璃表面粗糙度和波纹度； 选用磨料 II为粒径较大的二氧 化硅粉末， 其能够有效提高抛光速率， 提高生产效率； 选用的表面活性剂为非离子型表 面活性剂， 如脂肪醇聚氧乙烯醚或垸基酚聚氧乙烯醚， 该非离子型表面活性剂的加入能 够有效控制加工过程中抛光的均勾性， 减少表面缺陷， 并提高抛光效率； 该抛光液中加 入 ra值调节剂能够保证抛光液的稳定性，减少对设备的腐蚀，也能起到提高抛光速率的 作用。  The nano silica abrasive polishing liquid for processing the glass ceramics of the invention has the abrasive material I as the water-soluble dioxide 'silica sol with smaller particle diameter, which has better dispersibility and uniform particle size distribution, and can effectively reduce micro The surface of the crystal glass is scratched, and the surface roughness and waviness of the glass ceramic are reduced. The abrasive II is a silica powder with a larger particle size, which can effectively improve the polishing rate and increase the production efficiency; The agent is a nonionic surfactant, such as a fatty alcohol polyoxyethylene ether or a nonylphenol ethoxylate. The addition of the nonionic surfactant can effectively control the uniformity of polishing during processing and reduce surface defects. And improve the polishing efficiency; the addition of ra value modifier in the polishing solution can ensure the stability of the polishing solution, reduce the corrosion of the device, and can also improve the polishing rate.
因此本发明具有的优点在于： 以合理粒径的水溶性二氧化硅溶胶和二氧化硅粉末混 合作为磨料， 既提高了磨料的分散性能， 减少抛光后微晶玻璃表面划伤， 而且使抛光后 的微晶玻璃'表面的粗糙度和波紋度降低； 另外， 可以大大提高抛光速率； 再者， 本发明 的抛光液为碱性， 化学稳定性好， 不腐蚀设备， 使用的安全性能理想。  Therefore, the present invention has the advantages of: mixing a water-soluble silica sol of a reasonable particle size and a silica powder as an abrasive, thereby improving the dispersion property of the abrasive, reducing the scratch of the surface of the glass ceramic after polishing, and further polishing The surface roughness and waviness of the glass-ceramic glass are reduced; in addition, the polishing rate can be greatly improved; further, the polishing liquid of the invention is alkaline, has good chemical stability, does not corrode the device, and has excellent safety performance.
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式上的限制， 凡 是依据本发明的技术实质对以上实施例所作的任何简单修改、 等同变化与修饰， 均仍属 于本发明技术方案的范围内。  The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modifications, equivalent changes and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still Within the scope of the technical solution of the present invention.

Claims

权利 要求 Rights request
1、 一种微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在于： 包括磨料 I、磨 料 II、 表面活性剂、 PH调节剂以及去离子水； 各种组分所占的重量百分比为： 磨料 I为 10%至 40%, 磨料 II为 5%至 20%, 表面活性剂为 0. 01%至 0. 6%, PH调节剂为 1%至 6%, 去 离子水为余量； 1. A nano-silica abrasive polishing liquid for processing glass-ceramics, comprising: abrasive I, abrasive II, surfactant, pH regulator and deionized water; weight percentage of each component The abrasive I is 10% to 40%, the abrasive II is 5% to 20%, the surfactant is 0.01% to 0.6%, the pH regulator is 1% to 6%, and the deionized water is the balance. ;
所述磨料 I是粒径为 0. 1至 200nm的水溶性二氧化硅溶胶液体， 该硅溶胶的重量百 分比浓度在 10%至 40% ; 所述磨料 II是粒径为 0. 1至 200mn的二氧化硅粉末。  The granules having a particle size of from 0.1 to 200 nm. The abrasive granules having a particle size of from 0.1 to 200 nm. Silica powder.
2、 根据权利要求 1所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述磨料 I的粒径 10至 80nm; 所述磨料 II的粒径 50至 150nm。  The nano-silica abrasive polishing liquid for processing a glass-ceramic according to claim 1, wherein the abrasive I has a particle diameter of 10 to 80 nm; and the abrasive II has a particle diameter of 50 to 150 nm.
3、 根据权利要求 1所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述表面活性剂为非离子型表面活性剂； 所述非离子型表面活性剂是脂肪醇聚氧乙 烯醚、 烷基酚聚氧乙烯醚、 三乙醇胺油酸皂、 十二烷基二甲基氧化胺或失水山梨醇油酸 单脂中的一种或它们的组合。  The nano silica abrasive polishing liquid for processing glass-ceramics according to claim 1, wherein: the surfactant is a nonionic surfactant; and the nonionic surfactant is a fat. One or a combination of an alcohol polyoxyethylene ether, an alkylphenol ethoxylate, a triethanolamine oleate soap, lauryl dimethyl amine oxide or a sorbitan oleic acid monoester.
4、 根据权利要求 3所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述脂肪醇聚氧乙烯醚是脂肪醇聚氧乙烯 （3)醚、 脂肪醇聚氧乙烯 （5)醚、 脂肪 醇聚氧乙烯 （7)醚、 脂肪醇聚氧乙烯 （9)醚、 脂肪醇聚氧乙烯（15)醚、 脂肪醇聚氧 乙烯（20) 醚、 脂肪醇聚氧乙烯（25)醚或脂肪醇聚氧乙烯（40)醚； 所述垸基酚聚氧 乙烯醚是壬基酚聚氧乙烯（4)醚、 壬基酚聚氧乙烯（6)醚、 壬基酚聚氧乙烯 （7)醚、 壬基酚聚氧乙烯（9)醚、 壬基酚聚氧乙烯（10)醚、 壬基酚聚氧乙烯（13)醚、 辛基酚 聚氧乙烯（20)醚、 辛基酚聚氧乙烯（100)醚或十二烷基酚聚氧乙烯（10)醚， 括号内 的数字表示所述物质的聚合度。  The nano silica abrasive polishing liquid for processing glass ceramics according to claim 3, wherein the fatty alcohol polyoxyethylene ether is a fatty alcohol polyoxyethylene (3) ether, a fatty alcohol polyoxygen Ethylene (5) ether, fatty alcohol polyoxyethylene (7) ether, fatty alcohol polyoxyethylene (9) ether, fatty alcohol polyoxyethylene (15) ether, fatty alcohol polyoxyethylene (20) ether, fatty alcohol polyoxygen Ethylene (25) ether or fatty alcohol polyoxyethylene (40) ether; the nonylphenol ethoxylate is nonylphenol polyoxyethylene (4) ether, nonylphenol polyoxyethylene (6) ether, sulfhydryl Phenolic polyoxyethylene (7) ether, nonylphenol polyoxyethylene (9) ether, nonylphenol polyoxyethylene (10) ether, nonylphenol polyoxyethylene (13) ether, octylphenol polyoxyethylene (20) Ether, octylphenol polyoxyethylene (100) ether or dodecyl phenol polyoxyethylene (10) ether, the numbers in parentheses indicate the degree of polymerization of the material.
5、 根据权利要求 1所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述 PH值调节剂为无机碱、 有机碱或它们的组合。  The nano silica abrasive polishing liquid for processing a glass ceramic according to claim 1, wherein the pH adjusting agent is an inorganic base, an organic base or a combination thereof.
6、 根据权利要求 5所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述有机碱为多羟多胺和胺中的一种或它们的组合。  The nano silica abrasive polishing liquid for processing a glass ceramic according to claim 5, wherein the organic base is one of a polyhydric polyamine and an amine or a combination thereof.
7、 根据权利要求 6所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液， 其特征在 于： 所述无机碱为氢氧化钾、 氢氧化钠、 碳酸钾、 碳酸钠或氨水； 所述有机碱为三乙醇 胺、 四羟基乙二胺、 六羟基丙基丙二胺、 乙二胺或四甲基氢氧化铵。  The nano silica abrasive polishing liquid for processing glass-ceramics according to claim 6, wherein the inorganic base is potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate or ammonia; The organic base is triethanolamine, tetrahydroxyethylenediamine, hexahydroxypropylpropanediamine, ethylenediamine or tetramethylammonium hydroxide.
替换页（细则第 26条) Replacement page (Article 26)
8、 权利要求 1所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备方法， 其 特征在于， 先将所需重量的磨料 II均匀分散于放置在容器罐内的去离子水中， 然后在至 少千级净化室的环境内， 在真空负压的动力下， 通过质量流量计将溶解的磨料 I输入容 器罐中， 与容器罐内的所需重量的磨料 II进行混合并充分搅拌， 混合均匀后将抛光液的 其余组分加入容器罐内再继续充分搅拌， 混合均匀即制备成成品抛光液。 8. The method for preparing a nanosilica abrasive polishing liquid for processing a glass ceramic according to claim 1, wherein the abrasive of the desired weight is uniformly dispersed in deionized water placed in a container. Then, in the environment of at least one thousand clean room, under the vacuum negative pressure, the dissolved abrasive I is input into the container tank by the mass flow meter, and mixed with the required weight of the abrasive II in the container tank and fully stirred. After mixing uniformly, the remaining components of the polishing liquid are added into the container tank and further stirred thoroughly, and uniformly mixed to prepare a finished polishing liquid.
9、根据权利要求 8所述的微晶玻璃加工用的纳米二氧化硅磨料抛光液的制备方法， 其特征在于： 所述至少千级净化室的环境温度为 20至 25摄氏度； 所述真空压力为 10一5 至 0 Mpa。 The method for preparing a nano silica abrasive polishing liquid for processing a glass-ceramic according to claim 8, wherein: the ambient temperature of the at least one-stage purification chamber is 20 to 25 degrees Celsius; It is 10 to 5 to 0 Mpa.
8  8
替换页（细则第 26条)  Replacement page (Article 26)
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928524A (en) * 2009-06-23 2010-12-29 安集微电子（上海）有限公司 Chemically mechanical polishing solution
CN105647393A (en) * 2016-02-02 2016-06-08 北京华进创威电子有限公司 Polishing solution for silicon carbide wafers
CN116376450A (en) * 2023-03-13 2023-07-04 咸宁南玻光电玻璃有限公司 Polishing composition, polishing liquid, polishing method, polished glass and glass article
CN117327451A (en) * 2023-09-28 2024-01-02 中建材光芯科技有限公司 Polishing mixture for polishing polymer optical fiber panel and preparation method and application thereof

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Publication number Priority date Publication date Assignee Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1077974A (en) * 1992-04-27 1993-11-03 罗德尔公司 Composition and method that polishing and planarizing surfaces are used
CN1343752A (en) * 1996-12-05 2002-04-10 不二见株式会社 Brightener compsn.
CN1616575A (en) * 2003-09-30 2005-05-18 福吉米株式会社 Polishing composition
CN1660951A (en) * 2004-02-27 2005-08-31 福吉米株式会社 Polishing composition and polishing method
KR20060078761A (en) * 2004-12-31 2006-07-05 제일모직주식회사 Slurry for final polishing of silicon wafer
US20060214133A1 (en) * 2005-03-17 2006-09-28 Fuji Photo Film Co., Ltd. Metal polishing solution and polishing method
CN101050338A (en) * 2007-05-11 2007-10-10 江苏海迅实业有限公司 Polishing fluid of Nano silicon dioxide grinding material in use for processing microcrystalline glass, and preparation method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1077974A (en) * 1992-04-27 1993-11-03 罗德尔公司 Composition and method that polishing and planarizing surfaces are used
CN1343752A (en) * 1996-12-05 2002-04-10 不二见株式会社 Brightener compsn.
CN1616575A (en) * 2003-09-30 2005-05-18 福吉米株式会社 Polishing composition
CN1660951A (en) * 2004-02-27 2005-08-31 福吉米株式会社 Polishing composition and polishing method
KR20060078761A (en) * 2004-12-31 2006-07-05 제일모직주식회사 Slurry for final polishing of silicon wafer
US20060214133A1 (en) * 2005-03-17 2006-09-28 Fuji Photo Film Co., Ltd. Metal polishing solution and polishing method
CN101050338A (en) * 2007-05-11 2007-10-10 江苏海迅实业有限公司 Polishing fluid of Nano silicon dioxide grinding material in use for processing microcrystalline glass, and preparation method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928524A (en) * 2009-06-23 2010-12-29 安集微电子（上海）有限公司 Chemically mechanical polishing solution
CN105647393A (en) * 2016-02-02 2016-06-08 北京华进创威电子有限公司 Polishing solution for silicon carbide wafers
CN116376450A (en) * 2023-03-13 2023-07-04 咸宁南玻光电玻璃有限公司 Polishing composition, polishing liquid, polishing method, polished glass and glass article
CN117327451A (en) * 2023-09-28 2024-01-02 中建材光芯科技有限公司 Polishing mixture for polishing polymer optical fiber panel and preparation method and application thereof
CN117327451B (en) * 2023-09-28 2024-03-22 中建材光芯科技有限公司 Polishing mixture for polishing polymer optical fiber panel and preparation method and application thereof

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