WO2009017032A1 - バリア層つき基板、表示素子および表示素子の製造方法 - Google Patents

バリア層つき基板、表示素子および表示素子の製造方法 Download PDF

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Publication number
WO2009017032A1
WO2009017032A1 PCT/JP2008/063298 JP2008063298W WO2009017032A1 WO 2009017032 A1 WO2009017032 A1 WO 2009017032A1 JP 2008063298 W JP2008063298 W JP 2008063298W WO 2009017032 A1 WO2009017032 A1 WO 2009017032A1
Authority
WO
WIPO (PCT)
Prior art keywords
display element
substrate
barrier layer
manufacturing
element manufacturing
Prior art date
Application number
PCT/JP2008/063298
Other languages
English (en)
French (fr)
Inventor
Shinichi Morishima
Original Assignee
Sumitomo Chemical Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited filed Critical Sumitomo Chemical Company, Limited
Priority to EP08791550A priority Critical patent/EP2184727A4/en
Priority to CN200880101003A priority patent/CN101765870A/zh
Priority to KR1020107002110A priority patent/KR101462704B1/ko
Priority to US12/671,102 priority patent/US9012017B2/en
Publication of WO2009017032A1 publication Critical patent/WO2009017032A1/ja

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

　本発明に係るバリア層つき基板（１０）は、基板（１１）上にバリア層（１２）が形成されてなるバリア層つき基板（１０）と、該バリア層つき基板（１０）のバリア層（１２）上に形成されてなる複数の表示エレメント（１３）と、該表示エレメント（１３）上に該表示エレメント（１３）を覆うように形成されている上部多層封止膜（１５）とを有してなる表示素子に用いられるバリア層つき基板（１０）であって、前記バリア層（１２）が複数に分割パターニングされて前記基板（１１）上に形成されていることを特徴とする。本発明のバリア層つき基板（１０）を用いて本発明の長寿命な表示素子が製造される。
PCT/JP2008/063298 2007-07-31 2008-07-24 バリア層つき基板、表示素子および表示素子の製造方法 WO2009017032A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08791550A EP2184727A4 (en) 2007-07-31 2008-07-24 SUBSTRATE WITH A BARRIER LAYER, DISPLAY ELEMENT AND DISPLAY ELEMENT MANUFACTURING METHOD
CN200880101003A CN101765870A (zh) 2007-07-31 2008-07-24 附阻障层基板、显示元件以及显示元件的制造方法
KR1020107002110A KR101462704B1 (ko) 2007-07-31 2008-07-24 배리어층 부착 기판, 표시 소자 및 표시 소자의 제조 방법
US12/671,102 US9012017B2 (en) 2007-07-31 2008-07-24 Barrier layer-attached substrate, display component, and method for manufacturing display component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007199906A JP5296343B2 (ja) 2007-07-31 2007-07-31 バリア層つき基板、表示素子および表示素子の製造方法
JP2007-199906 2007-07-31

Publications (1)

Publication Number Publication Date
WO2009017032A1 true WO2009017032A1 (ja) 2009-02-05

Family

ID=40304262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063298 WO2009017032A1 (ja) 2007-07-31 2008-07-24 バリア層つき基板、表示素子および表示素子の製造方法

Country Status (7)

Country Link
US (1) US9012017B2 (ja)
EP (1) EP2184727A4 (ja)
JP (1) JP5296343B2 (ja)
KR (1) KR101462704B1 (ja)
CN (1) CN101765870A (ja)
TW (1) TWI462633B (ja)
WO (1) WO2009017032A1 (ja)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101097344B1 (ko) * 2010-03-09 2011-12-23 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
KR101239575B1 (ko) * 2010-08-16 2013-03-05 고려대학교 산학협력단 기체 차단막 형성 장치 및 그 방법
JP5836974B2 (ja) * 2010-12-07 2015-12-24 東京エレクトロン株式会社 表示デバイス製造装置、表示デバイスの製造方法
FR2973939A1 (fr) * 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
JP2013073880A (ja) * 2011-09-29 2013-04-22 Ulvac Japan Ltd 発光素子の製造方法
JP2013186984A (ja) * 2012-03-07 2013-09-19 Panasonic Corp 複合基板構造及びその作製方法、並びに、有機エレクトロルミネッセンス素子
WO2013118508A1 (ja) * 2012-02-07 2013-08-15 パナソニック株式会社 複合基板及びその製造方法、並びに、有機エレクトロルミネッセンス素子
KR101971202B1 (ko) * 2012-11-22 2019-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR20140094916A (ko) * 2013-01-23 2014-07-31 삼성디스플레이 주식회사 표시 장치
WO2014115825A1 (ja) * 2013-01-25 2014-07-31 富士フイルム株式会社 有機電子デバイス
US9368749B2 (en) 2013-03-12 2016-06-14 Samsung Sdi Co., Ltd. Patterned multilayered stack, and system and method for making the same
CN103247233B (zh) * 2013-04-28 2015-09-23 京东方科技集团股份有限公司 柔性基板、显示装置及在柔性基板上贴附电子器件的方法
KR102133433B1 (ko) * 2013-05-24 2020-07-14 삼성디스플레이 주식회사 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법
US9909022B2 (en) 2014-07-25 2018-03-06 Kateeva, Inc. Organic thin film ink compositions and methods
US9991326B2 (en) * 2015-01-14 2018-06-05 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device comprising flexible substrate and light-emitting element
US10056574B2 (en) * 2015-02-19 2018-08-21 Sharp Kabushiki Kaisha Organic EL display device
JP2016186911A (ja) * 2015-03-27 2016-10-27 パイオニア株式会社 発光装置
JP6474337B2 (ja) 2015-08-27 2019-02-27 株式会社ジャパンディスプレイ 表示装置及びその製造方法
WO2017039857A1 (en) 2015-08-31 2017-03-09 Kateeva, Inc. Di- and mono(meth)acrylate based organic thin film ink compositions
JP6396879B2 (ja) * 2015-11-20 2018-09-26 株式会社ジャパンディスプレイ 表示装置
KR102513210B1 (ko) * 2015-12-31 2023-03-22 엘지디스플레이 주식회사 플렉서블 표시장치 및 그의 제조방법
CN106158740A (zh) * 2016-09-26 2016-11-23 昆山工研院新型平板显示技术中心有限公司 柔性衬底基板和柔性oled显示器的制备方法
KR101989086B1 (ko) * 2017-01-25 2019-06-14 한국생산기술연구원 Ｏｌｅｄ 조명 소자 및 그 제조 방법
JP6330112B1 (ja) 2017-03-08 2018-05-23 堺ディスプレイプロダクト株式会社 有機ｅｌデバイスの製造方法および成膜装置
WO2018195066A2 (en) 2017-04-21 2018-10-25 Kateeva, Inc. Compositions and techniques for forming organic thin films
US20190165328A1 (en) * 2017-11-30 2019-05-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
CN111972044B (zh) * 2018-03-28 2024-02-13 夏普株式会社 显示装置及显示装置的制造方法
KR102547989B1 (ko) * 2018-07-25 2023-06-23 엘지디스플레이 주식회사 유기 발광 소자를 이용한 조명 장치 및 이의 제조 방법
US20210341787A1 (en) * 2018-09-28 2021-11-04 Sharp Kabushiki Kaisha Circularly polarizing plate, method for producing circularly polarizing plate, display device and method for producing display device
WO2020145296A1 (ja) 2019-01-09 2020-07-16 株式会社Ｊｏｌｅｄ 表示パネルおよび表示装置
CN109962180B (zh) * 2019-03-01 2020-11-10 昆山国显光电有限公司 一种显示面板的制备方法
EP3785897B1 (en) 2019-08-29 2021-12-29 SHPP Global Technologies B.V. Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003531745A (ja) 2000-04-20 2003-10-28 バッテル・メモリアル・インスティチュート Ｔｇ基体上の平滑層及びバリア層
WO2005101542A1 (en) 2004-03-23 2005-10-27 Eastman Kodak Company Encapsulating oled devices
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器
US20070164376A1 (en) 1999-10-25 2007-07-19 Burrows Paul E Method for edge sealing barrier films

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164376A1 (en) 1999-10-25 2007-07-19 Burrows Paul E Method for edge sealing barrier films
JP2003531745A (ja) 2000-04-20 2003-10-28 バッテル・メモリアル・インスティチュート Ｔｇ基体上の平滑層及びバリア層
WO2005101542A1 (en) 2004-03-23 2005-10-27 Eastman Kodak Company Encapsulating oled devices
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2184727A4

Also Published As

Publication number Publication date
TW200915909A (en) 2009-04-01
KR101462704B1 (ko) 2014-11-17
US9012017B2 (en) 2015-04-21
EP2184727A1 (en) 2010-05-12
CN101765870A (zh) 2010-06-30
US20100196679A1 (en) 2010-08-05
JP2009037798A (ja) 2009-02-19
JP5296343B2 (ja) 2013-09-25
TWI462633B (zh) 2014-11-21
EP2184727A4 (en) 2011-11-23
KR20100055395A (ko) 2010-05-26

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