WO2009011329A1 - Curable composition - Google Patents

Curable composition Download PDF

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Publication number
WO2009011329A1
WO2009011329A1 PCT/JP2008/062679 JP2008062679W WO2009011329A1 WO 2009011329 A1 WO2009011329 A1 WO 2009011329A1 JP 2008062679 W JP2008062679 W JP 2008062679W WO 2009011329 A1 WO2009011329 A1 WO 2009011329A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
group
silicon
crosslinkable
general formula
Prior art date
Application number
PCT/JP2008/062679
Other languages
French (fr)
Japanese (ja)
Inventor
Ayako Yano
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009523642A priority Critical patent/JPWO2009011329A1/en
Priority to EP08778150.6A priority patent/EP2177571A4/en
Publication of WO2009011329A1 publication Critical patent/WO2009011329A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
    • C08G65/2645—Metals or compounds thereof, e.g. salts
    • C08G65/2663—Metal cyanide catalysts, i.e. DMC's
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/337—Polymers modified by chemical after-treatment with organic compounds containing other elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C08K5/57—Organo-tin compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is a curable composition having good curability and good tensile property (high elongation), wherein the amount of toxic dibutyltin compound content is reduced. Specifically disclosed is a curable composition characterized by containing a reactive silicon group-containing organic polymer (A) having a group represented by the following general formula (1): -SiX3 as a silicon-containing group which is crosslinkable by forming a siloxane bond, and a reactive silicon group-containing organic polymer (B) having a partial structure represented by the following general formula (2): -O-R1-CH(CH3)-CH2-Si(R23-a)Xa (wherein a represents 1 or 2) as a silicon-containing group which is crosslinkable by forming a siloxane bond. This curable composition is also characterized in that the weight ratio between the component (A) and the component (B) is from 25/75 to 75/25.
PCT/JP2008/062679 2007-07-19 2008-07-14 Curable composition WO2009011329A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009523642A JPWO2009011329A1 (en) 2007-07-19 2008-07-14 Curable composition
EP08778150.6A EP2177571A4 (en) 2007-07-19 2008-07-14 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-187805 2007-07-19
JP2007187805 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011329A1 true WO2009011329A1 (en) 2009-01-22

Family

ID=40259662

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062679 WO2009011329A1 (en) 2007-07-19 2008-07-14 Curable composition

Country Status (4)

Country Link
US (1) US20100216925A1 (en)
EP (1) EP2177571A4 (en)
JP (1) JPWO2009011329A1 (en)
WO (1) WO2009011329A1 (en)

Cited By (20)

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JP2010222485A (en) * 2009-03-24 2010-10-07 Sharp Kagaku Kogyo Kk Adhesion method
JP2010242008A (en) * 2009-04-08 2010-10-28 Yokohama Rubber Co Ltd:The Adhesive composition
WO2011046235A1 (en) 2009-10-16 2011-04-21 Kaneka Corporation Curable composition
JP2011127003A (en) * 2009-12-18 2011-06-30 Cemedine Co Ltd Adhesive for assembling speaker
JP2011127004A (en) * 2009-12-18 2011-06-30 Cemedine Co Ltd Adhesive for assembling speaker, using plurality of polyoxyalkylene-based polymers
WO2011108415A1 (en) * 2010-03-02 2011-09-09 サンスター技研株式会社 Curable composition
CN102304970A (en) * 2011-05-20 2012-01-04 晋江艾佳地板有限公司 Stone plastic floor and processing method thereof
WO2012117902A1 (en) * 2011-03-02 2012-09-07 株式会社カネカ Curable composition
US20120245279A1 (en) * 2009-12-09 2012-09-27 Bayer Intellectual Property Gmbh Sealants
JP2012241080A (en) * 2011-05-18 2012-12-10 Sharp Kagaku Kogyo Kk Adhesive
WO2013016654A1 (en) 2011-07-27 2013-01-31 Vonage Network Llc Systems and methods of providing communications services
JP2014132100A (en) * 2014-04-16 2014-07-17 Cemedine Co Ltd Method for producing flame-retardant heat-conductive curable composition excellent in storage stability
JP2014528496A (en) * 2011-09-30 2014-10-27 ダウ グローバル テクノロジーズ エルエルシー Improving compressive strain properties in silylated polymers.
KR20140144274A (en) * 2012-04-06 2014-12-18 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. Negative photosensitive siloxane composition
JP2015038192A (en) * 2013-07-16 2015-02-26 セメダイン株式会社 Curable composition
EP2625226B1 (en) 2010-10-05 2016-02-24 Henkel AG & Co. KGaA Curable composition having a special catalyst / softener system
JP2017513982A (en) * 2014-04-16 2017-06-01 シーカ・テクノロジー・アーゲー Fast-curing migration-free composition based on silane group-containing organic polymer
JP2017519057A (en) * 2014-04-17 2017-07-13 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ Crosslinkable materials based on organyloxysilane-terminated polymers
JPWO2016060112A1 (en) * 2014-10-16 2017-07-27 シャープ化学工業株式会社 Antifouling moisture-curing resin composition for sanitary equipment and method for preventing dirt around sanitary equipment using the same
WO2020066551A1 (en) * 2018-09-26 2020-04-02 Ａｇｃ株式会社 Curable composition, cured product and sealing material

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US8901255B2 (en) * 2010-08-10 2014-12-02 Kaneka Corporation Curable composition
EP2634222B1 (en) * 2010-10-27 2020-02-12 Kaneka Corporation Curable composition
CN104066796B (en) * 2011-11-23 2017-02-22 莫门蒂夫性能材料股份有限公司 Process for making organic-inorganic hybrid materials
JP6062942B2 (en) * 2011-12-20 2017-01-18 株式会社カネカ The roof of the building on which the waterproof coating material and this coating film are formed
US9704724B2 (en) * 2011-12-26 2017-07-11 Toray Industries, Inc. Photosensitive resin composition and method for producing semiconductor device
JP6196114B2 (en) * 2013-10-04 2017-09-13 アイカ工業株式会社 Flame retardant adhesive composition
JP6349073B2 (en) * 2013-11-12 2018-06-27 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ SEALING MATERIAL COMPOSITION, SOLAR CELL MODULE SEALING MATERIAL CURED BY THE SAME, AND SOLAR CELL MODULE MANUFACTURING METHOD USING SAME
JP6714515B2 (en) * 2015-01-16 2020-06-24 株式会社カネカ Curable composition and cured product thereof
WO2016166336A1 (en) * 2015-04-16 2016-10-20 Sika Technology Ag Amidine-group containing catalyst
CA3068864A1 (en) 2017-06-26 2019-01-03 Dow Silicones Corporation Silicone-polyether copolymer, sealants comprising same, and related methods
KR20210106501A (en) 2018-12-21 2021-08-30 다우 글로벌 테크놀로지스 엘엘씨 Silicone-organic copolymers, sealants comprising same, and related methods
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