WO2009011217A1 - 表面実装部品 - Google Patents

表面実装部品 Download PDF

Info

Publication number
WO2009011217A1
WO2009011217A1 PCT/JP2008/061840 JP2008061840W WO2009011217A1 WO 2009011217 A1 WO2009011217 A1 WO 2009011217A1 JP 2008061840 W JP2008061840 W JP 2008061840W WO 2009011217 A1 WO2009011217 A1 WO 2009011217A1
Authority
WO
WIPO (PCT)
Prior art keywords
surface mounting
mounting component
external terminals
manufacturing process
end surfaces
Prior art date
Application number
PCT/JP2008/061840
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi Sato
Yasunori Morimoto
Original Assignee
Sumida Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corporation filed Critical Sumida Corporation
Priority to US12/669,220 priority Critical patent/US20100172114A1/en
Priority to CN200880020101A priority patent/CN101681715A/zh
Priority to JP2009523590A priority patent/JPWO2009011217A1/ja
Priority to EP08790753A priority patent/EP2172951A4/en
Publication of WO2009011217A1 publication Critical patent/WO2009011217A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H01F2005/046—Details of formers and pin terminals related to mounting on printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

　製造工程での構成部材に対する衝撃を緩和することが可能であり、また、表面実装後のはんだの接合強度を十分にすることが可能な表面実装部品を提供すること。 　実装基板に接合される表面実装部品の外部端子５Ａ，５Ｂの端面５Ａ２，５Ｂ２の少なくとも一部は、表面実装部品の製造工程で外部端子５Ａ，５Ｂに接続される被接続部材７Ａが切り離されて形成される切断面であり、外部端子５Ａ，５Ｂには、端面５Ａ２，５Ｂ２から窪む凹部６が形成されている。
PCT/JP2008/061840 2007-07-19 2008-06-30 表面実装部品 WO2009011217A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/669,220 US20100172114A1 (en) 2007-07-19 2008-06-30 Surface mounting component
CN200880020101A CN101681715A (zh) 2007-07-19 2008-06-30 表面安装部件
JP2009523590A JPWO2009011217A1 (ja) 2007-07-19 2008-06-30 表面実装部品
EP08790753A EP2172951A4 (en) 2007-07-19 2008-06-30 SURFACE MOUNT COMPONENT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-187865 2007-07-19
JP2007187865 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011217A1 true WO2009011217A1 (ja) 2009-01-22

Family

ID=40259555

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061840 WO2009011217A1 (ja) 2007-07-19 2008-06-30 表面実装部品

Country Status (5)

Country Link
US (1) US20100172114A1 (ja)
EP (1) EP2172951A4 (ja)
JP (1) JPWO2009011217A1 (ja)
CN (1) CN101681715A (ja)
WO (1) WO2009011217A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5935309B2 (ja) * 2011-12-15 2016-06-15 スミダコーポレーション株式会社 コイル部品
CN102637512A (zh) * 2012-04-09 2012-08-15 卡尔马斯特电子有限公司 多电感器用端子
JP2014110370A (ja) * 2012-12-04 2014-06-12 Seiko Epson Corp ベース基板、実装構造体、モジュール、電子機器、および移動体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06290975A (ja) * 1993-03-30 1994-10-18 Tokin Corp コイル部品並びにその製造方法
JPH0922824A (ja) * 1995-07-07 1997-01-21 Toko Inc 高周波コイル及びその製造方法
JP2001085259A (ja) * 1999-09-09 2001-03-30 Citizen Electronics Co Ltd コイルとその製造方法
JP2005228827A (ja) * 2004-02-10 2005-08-25 Tdk Corp 面実装型コイル部品およびその製造方法
JP2006186075A (ja) 2004-12-27 2006-07-13 Fdk Corp 表面実装部品およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960006710B1 (ko) * 1987-02-25 1996-05-22 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체집적회로장치 및 그 제조방법과 그 실장방법
JPH1092998A (ja) * 1996-09-18 1998-04-10 Fuji Elelctrochem Co Ltd 電子デバイス製造用リードフレーム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06290975A (ja) * 1993-03-30 1994-10-18 Tokin Corp コイル部品並びにその製造方法
JPH0922824A (ja) * 1995-07-07 1997-01-21 Toko Inc 高周波コイル及びその製造方法
JP2001085259A (ja) * 1999-09-09 2001-03-30 Citizen Electronics Co Ltd コイルとその製造方法
JP2005228827A (ja) * 2004-02-10 2005-08-25 Tdk Corp 面実装型コイル部品およびその製造方法
JP2006186075A (ja) 2004-12-27 2006-07-13 Fdk Corp 表面実装部品およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2172951A4

Also Published As

Publication number Publication date
US20100172114A1 (en) 2010-07-08
CN101681715A (zh) 2010-03-24
EP2172951A1 (en) 2010-04-07
EP2172951A4 (en) 2010-10-27
JPWO2009011217A1 (ja) 2010-09-24

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