WO2009002083A3 - Manufacturing method of fpcb - Google Patents
Manufacturing method of fpcb Download PDFInfo
- Publication number
- WO2009002083A3 WO2009002083A3 PCT/KR2008/003622 KR2008003622W WO2009002083A3 WO 2009002083 A3 WO2009002083 A3 WO 2009002083A3 KR 2008003622 W KR2008003622 W KR 2008003622W WO 2009002083 A3 WO2009002083 A3 WO 2009002083A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- foam sheet
- adhesive layer
- fpcb
- high temperature
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800095358A CN101682994B (en) | 2007-06-25 | 2008-06-25 | Manufacturing method of fpcb |
JP2010500847A JP5021806B2 (en) | 2007-06-25 | 2008-06-25 | Method for producing flexible circuit board using high-temperature foam sheet |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070062512A KR100945039B1 (en) | 2007-06-25 | 2007-06-25 | Manufacturing method of FPCB |
KR10-2007-0062512 | 2007-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009002083A2 WO2009002083A2 (en) | 2008-12-31 |
WO2009002083A3 true WO2009002083A3 (en) | 2009-02-26 |
Family
ID=40186166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2008/003622 WO2009002083A2 (en) | 2007-06-25 | 2008-06-25 | Manufacturing method of fpcb |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5021806B2 (en) |
KR (1) | KR100945039B1 (en) |
CN (1) | CN101682994B (en) |
TW (1) | TWI406608B (en) |
WO (1) | WO2009002083A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101055495B1 (en) * | 2009-04-14 | 2011-08-08 | 삼성전기주식회사 | Carrier member for substrate manufacturing and substrate manufacturing method using same |
KR101122146B1 (en) * | 2009-11-25 | 2012-03-16 | 엘지이노텍 주식회사 | Half Buried PCB, Multi-Layer PCB and Fabricating Method of the same |
EP2518122A4 (en) * | 2009-12-25 | 2014-01-08 | Nitto Denko Corp | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
CN104646861A (en) * | 2013-11-25 | 2015-05-27 | 刘现梅 | Soldering flux containing thiadiazole derivative |
CN111993731B (en) * | 2019-05-27 | 2023-11-14 | 宁波长阳科技股份有限公司 | Foaming release film and preparation method thereof |
CN115260877A (en) * | 2022-08-02 | 2022-11-01 | 广东希贵光固化材料有限公司 | UV temporary protective coating for heating film fading and application thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07188502A (en) * | 1993-11-16 | 1995-07-25 | Sumitomo Chem Co Ltd | Aqueous emulsion composition for flame-retardant foamed sheet |
KR20020060659A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of single side typed flexible printed circuit board |
KR20020060660A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of double access typed flexible printed circuit board |
KR20030023416A (en) * | 2001-09-13 | 2003-03-19 | (주)해은켐텍 | Heat-exfoliation type foam sheet comprising emulsion type adhesive |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109294A (en) * | 1983-11-18 | 1985-06-14 | ソニー株式会社 | Method of producing flexible circuit board |
JPH0768499B2 (en) * | 1988-12-02 | 1995-07-26 | 株式会社日本触媒 | Aqueous dispersion type pressure sensitive adhesive composition |
JPH0768501B2 (en) * | 1988-12-08 | 1995-07-26 | 株式会社日本触媒 | Contact adhesive composition for composites |
JP4115711B2 (en) * | 2002-02-14 | 2008-07-09 | 日東電工株式会社 | Adhesive sheet for fixing flexible printed wiring board and method for mounting electronic component on flexible printed wiring board |
KR20020060657A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of thin film flexible printed circuit board |
US7744991B2 (en) * | 2003-05-30 | 2010-06-29 | 3M Innovative Properties Company | Thermally conducting foam interface materials |
JP4475934B2 (en) * | 2003-12-17 | 2010-06-09 | 日本カーバイド工業株式会社 | Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same |
JP2005200505A (en) * | 2004-01-14 | 2005-07-28 | Nitto Denko Corp | Heat-releasable adhesive sheet and method for processing adherend |
JP4906035B2 (en) * | 2005-05-19 | 2012-03-28 | 日本カーバイド工業株式会社 | Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same |
TWI321241B (en) * | 2005-09-14 | 2010-03-01 | Ind Tech Res Inst | Flexible pixel array substrate and method of fabricating the same |
-
2007
- 2007-06-25 KR KR20070062512A patent/KR100945039B1/en active IP Right Grant
-
2008
- 2008-06-25 WO PCT/KR2008/003622 patent/WO2009002083A2/en active Application Filing
- 2008-06-25 CN CN2008800095358A patent/CN101682994B/en not_active Expired - Fee Related
- 2008-06-25 JP JP2010500847A patent/JP5021806B2/en not_active Expired - Fee Related
- 2008-06-25 TW TW97123764A patent/TWI406608B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07188502A (en) * | 1993-11-16 | 1995-07-25 | Sumitomo Chem Co Ltd | Aqueous emulsion composition for flame-retardant foamed sheet |
KR20030023416A (en) * | 2001-09-13 | 2003-03-19 | (주)해은켐텍 | Heat-exfoliation type foam sheet comprising emulsion type adhesive |
KR20020060659A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of single side typed flexible printed circuit board |
KR20020060660A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of double access typed flexible printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
WO2009002083A2 (en) | 2008-12-31 |
TW200922407A (en) | 2009-05-16 |
KR20080113709A (en) | 2008-12-31 |
JP5021806B2 (en) | 2012-09-12 |
CN101682994B (en) | 2011-06-15 |
JP2010522442A (en) | 2010-07-01 |
TWI406608B (en) | 2013-08-21 |
CN101682994A (en) | 2010-03-24 |
KR100945039B1 (en) | 2010-03-05 |
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