KR20020060660A - Manufacturing method of double access typed flexible printed circuit board - Google Patents

Abstract

PURPOSE: A method for manufacturing a double access type flexible printed circuit board is provided to reduce the number of processes and maintain a support force responding to an external force which is applied to a raw material. CONSTITUTION: A circuit formation is performed(100). A raw material is provided, cut out into a sheet status of a necessary size, and drilled(102). A sparkling carrier is adhered or hot-pressed to both surfaces of the cut raw material(104). A dry film and a liquid ink is stuck to the raw material to which a carrier is adhered(106). A pattern is formed and a substrate is developed(108) to expose and develop the raw material(108). The raw material is corroded, peeled, and dried(110). A post process is performed. A mold is manufactured. The mold is punched. A hot press/automatic forming is performed. A second press is performed. A protective process is performed. A mounting and a testing delivery is performed.

Description

MANUFACTURING METHOD OF DOUBLE ACCESS TYPED FLEXIBLE PRINTED CIRCUIT BOARD}

The present invention relates to a method for manufacturing a double-sided exposure flexible printed circuit board, and more specifically, to manufacturing and manufacturing a flexible printed circuit board, process change, improvement, and cost by using a carrier or a back board. To drive savings.

Recently, as the manufacturing method of circuit boards is diversified and the quality is increased, attempts to reduce the number of processes possible for the product and to automate as possible are in progress everywhere.

Flexible PCBs, as the name suggests, are more flexible, so the more defects the more processes and the more people reach them, the more likely this problem will occur, especially in the double-access exposure model. to be. This is because the cover layer is manufactured by bonding the cover layer to the base of copper foil.

In general, the manufacturing process of the flexible printed circuit board (FPCB) (FPCB; FLEXIBLE CIRCUIT BOARD), in particular, the double-sided exposure (DOUBLE ACCESS) type is set by the CNC hole processing of the raw material of the copper foil, and set the position of the copper foil with a coverlay (COVERLAY) Dry film, exposure, and pattern formation are used by bonding the surface through thermocompression bonding.

However, in this manufacturing method, the exposure film must be set at the exact position of the guide hole. Therefore, a separate operator is required because the exposure film must be set at the correct position of the guide hole and the film is fixed at the product position when the coverlay is bonded during the manufacturing process. It becomes a long time, and the manufacturing process has a problem that becomes complicated.

Accordingly, an object of the present invention is to reduce the number of manufacturing steps in the manufacturing method of the double-sided exposure model, and to maintain a bearing force against wrinkles or external forces applied to raw materials during manufacturing. It is to provide a manufacturing method that allows.

Another object of the present invention is to provide a manufacturing method that simplifies the manufacturing process and shortens the manufacturing process time.

1 is a raw material configuration of the double-sided exposure model according to the present invention.

2 is a schematic view illustrating the initial production of a conventional double-sided exposure type.

3 is a flowchart of a manufacturing process of a conventional double-sided exposure model.

4A is a process flow diagram of a two-sided exposure model in accordance with the present invention.

4B is a diagram illustrating a circuit formation process.

4C is a diagram illustrating a post-treatment process.

4D is a diagram illustrating a protection treatment process.

4E is a diagram illustrating the mounting and inspection shipment process.

*** Explanation of symbols for main parts of drawing ***

10: copper foil

12: Coverlay

100: circuit formation process

200: post-treatment process

300: protective treatment process

400: mounting and inspection

The present invention relates to a double-sided exposure type flexible printed circuit board manufacturing method,

In the circuit formation process of the double exposure type (DOUBLE ACCESS TYPE) in which a raw material of copper foil is introduced to form a circuit,

Cutting the raw material into a sheet state of a required size; Adhering or thermocompressing a foam carrier to both sides of the cut raw material; Adhering a dry film or a liquid ink of a raw material having an expandable carrier attached to both surfaces thereof; An exposure / development step of forming a pattern after attaching the dry film and developing the substrate; Corrosion / peeling / drying the substrate that has undergone the exposure / development step; Adhering the substrate which has undergone the corrosion / peel / drying step and performing automatic compression after hot pressing; And performing a second hot pressing process after the auto-foamed substrate is temporarily welded.

The carrier is characterized in that any one of PET, PI and EPOXY.

With reference to the accompanying drawings, a method for manufacturing a flexible printed circuit board according to the present invention will be understood by the embodiments described in detail below.

Figure 1 is a raw material configuration of the double-sided exposure model according to the present invention, Figure 2 is an initial product manufacturing configuration of a conventional double-sided exposure type, Figure 3 is a manufacturing process flow chart of a conventional double-sided exposure model, Figure 4a is a present invention 4B is a diagram illustrating a circuit forming process, FIG. 4C is a diagram illustrating a post-treatment process, FIG. 4D is a diagram showing a protection treatment process, and FIG. 4E is It is a figure which shows mounting and inspection shipment process.

The conventional double-sided exposure type flexible printed circuit board manufacturing method according to FIG. 3 may be roughly divided into a circuit forming process 100, a post-processing process 200, a protective processing process 300, and a mounting and inspection shipment step 400. .

In the following, the processing process will be described.

First, the circuit forming process 100 is performed;

(101) inserting the raw material, cutting and drilling into a sheet state of the required size;

(103) temporarily attaching or thermocompressing the coverlay to one surface of the drilled raw material;

(105) printing and drying after temporarily attaching or thermocompressing the coverlay;

(107) contacting the dry film or the liquid ink in close contact with the carrier-attached raw material;

(108) an exposure / development step of adhering a dry film or liquid ink to form a pattern and developing the substrate; And

(110) corroding, peeling, and drying the raw material that has undergone the exposure / development step.

Second, the post-treatment process 200 is a process before the protection treatment process 300 after the circuit forming step 100;

202, manufacturing a mold;

204 punching;

206 removing the release paper;

208 temporarily attaching; And

(209) hot pressing (HOT PRESS); consists of.

Third, the protective treatment process 300 is a process after the circuit forming step 100;

(302) plating the raw material which has undergone corrosion / peel / drying;

304, cutting the plated raw material;

(306) adhering a reinforcing plate to the cut raw material;

308 adhering the reinforcing plate and then compressing it; And

(310) temporarily attaching from step 306;

312 and the step of thermal bonding after the temporary adhesion.

Fourth, the mounting and inspection shipment step 400 is a process after the protection treatment process 300;

(402) mounting a device such as IC on the surface;

404, processing the appearance after surface mounting; And

406 finally inspecting and shipping step.

Referring to FIG. 4, the method for manufacturing a double-sided exposed flexible printed circuit board according to the present invention is divided into a circuit forming process 100, a post-processing process 200, a protection processing process 300, and a mounting and inspection shipment step 400. The load is the same as the existing method, and in more detail, there is a difference between the circuit forming process 100 and the post-processing process 200. Hereinafter, the circuit forming process 100 and the post-processing process 200 will be described.

First, the circuit formation process 100 is performed;

(102) inputting the raw materials and cutting them into sheets of a required size;

(104) contacting or thermocompressing the foam carrier (CARIER) on both sides of the cut raw material;

(106) contacting the dry film or the liquid ink in close contact with the raw material attached to the foam carrier on both sides;

(108) an exposure / development step of adhering a dry film or liquid ink to form a pattern and developing the substrate; And

(110) corroding, peeling, and drying the raw material that has undergone the exposure / development step.

Second, the post-treatment process 200 is a process before the protection treatment process 300 after the circuit forming step 100;

202, manufacturing a mold;

204 punching;

206) hot press / hot press / auto foaming;

208 contiguous; And

(210) a second hot press (HOT PRESS); consists of.

As shown in Figure 1, the product used as the raw material of the double-sided exposure type flexible printed circuit board is different from the other types of materials used as raw materials are separated through the use of separate bonding, according to Figure 1 base (BASE A circuit is formed on a copper foil (COPPER) 10 called "), and pattern lands or connector portions 14 are formed on both surfaces 10a and 10b of the copper foil 10 and exposed after circuit formation on the copper foil 10. The coverlay 12 is processed and manufactured by the method which exposes both surfaces to one layer of copper foil 10.

Therefore, as shown in FIG. 2, when the force supported by the copper foil 10 is weak and an external force is applied, shape recovery is not performed well. Therefore, a coverlay 12 is first applied to one surface of the copper foil 10 ( 10c), and after forming a pattern PATTERN, the method of temporarily bonding the other surface of the copper foil 10 is employ | adopted.

In addition, before forming the circuit, in order to match the position of the coverlay 12 and the copper foil 10, the copper foil 10 is subjected to a CNC drill process, the coverlay 12 uses a mold or other machining mechanism. To combine the two materials in the same location,

According to Figure 4, such a manufacturing method adopts a method capable of working even without effort to adjust the copper foil 10 and the coverlay 12 in the same position, the CNC drill machining disappears in the process, and In comparison with FIG. 3 and FIG. 4, it can be seen that the film does not need to be set by adjusting the position of the coverlay 12 to correspond to the processing portion of the front and rear covers during the exposure process.

Therefore, the manufacturing process called CNC drill processing and the film fixing setting in the exposure process can be omitted from the process, leading to a reduction in the number of processes, reducing the production cost of the process, and reducing the manufacturing time by reducing the number of processes. Can be reduced.

First, the manufacturing method through the present invention can be summarized in two ways.

The first method is to use a carrier (PET or other polymer material) in close contact with the raw material.

In the second method, there is a method of completely removing bubbles by thermocompression or room temperature compression in a press process in order to secure reliability.

The manufacturing process of these two methods is described in more detail below.

First, the carrier was removed by compressing the carrier under the conditions of a process temperature according to a setting criterion among the temperatures between 10 ° C. and 180 ° C., a pressure of 0.1 to 20 Kgf / cm 2, and a speed of 0.1 to 4 M / MIN. Then proceed to the next step.

In case of going through press process later, it is carried out under the condition of 10 ℃ ~ 180 ℃, pressure 0.1 ~ 40Kgf / ㎠, and time 1 ~ 60 minutes (MIN).)

After pressing, the next process is similar to the existing process, but there are some differences in the exposure and hot pressing process. The exposure process matches the openings of the coverlays 12 on the front and back when working with the existing method. Terminals (connectors, lands, and other circuits) must be exposed at the correct area. Therefore, the conventional method is advantageous for automation because exposure can be performed by setting a film to form a pattern.

In addition, this method is similarly applied even if the circuit formation method using a printing type or other dry film.

Even if it is not a dry film, it is preferable to apply not only to a liquid ink type and a solid state (SOLID type) coverlay but also to a liquid photosensitive coverlay or liquid coverlay ink (INK).

Although the embodiments of the present invention have been described in detail as above, the scope of the present invention is not limited thereto, and the scope of the present invention extends to the range substantially equivalent to the embodiment of the present invention.

As can be seen from the above description, according to the present invention, the carrier is closely adhered in the state of the raw material, and then the press rate is reduced through the process of completely compressing the air by pressing or pressing at room temperature to reduce the defect rate of the product The manufacturing time can be reduced.

In addition, the process as described above eliminates the CNC drill processing process for the correct position temporary adhesion when the coverlay is bonded, and fixed the film anywhere in the product position without the need to set the exposure film in the exact position of the guide hole 2 workers However, by eliminating the process time and easy and simple operation can improve the work efficiency.

Claims (2)

In the circuit formation process of the double exposure type (DOUBLE ACCESS TYPE) in which a raw material of copper foil is introduced to form a circuit, Cutting the raw material into a sheet state of a required size; Adhering or thermocompressing a foam carrier to both sides of the cut raw material; Adhering a dry film or a liquid ink of a raw material having an expandable carrier attached to both surfaces thereof; An exposure / development step of forming a pattern after attaching the dry film and developing the substrate; Corrosion / peeling / drying the substrate that has undergone the exposure / development step; Adhering the substrate which has undergone the corrosion / peel / drying step and performing automatic foaming after first hot pressing; And Performing second hot pressing after adhering the auto-foamed substrate; Method for manufacturing a double-sided exposed flexible printed circuit board, characterized in that consisting of. The method of claim 1, Said carrier is formed of any one of PET, PI, and EPOXY.