WO2008149768A1 - 有機エレクトロルミネッセンス発光素子および製造方法 - Google Patents

有機エレクトロルミネッセンス発光素子および製造方法 Download PDF

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Publication number
WO2008149768A1
WO2008149768A1 PCT/JP2008/059890 JP2008059890W WO2008149768A1 WO 2008149768 A1 WO2008149768 A1 WO 2008149768A1 JP 2008059890 W JP2008059890 W JP 2008059890W WO 2008149768 A1 WO2008149768 A1 WO 2008149768A1
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WO
WIPO (PCT)
Prior art keywords
substrate
substrates
electrode layer
bendable
manufacturing
Prior art date
Application number
PCT/JP2008/059890
Other languages
English (en)
French (fr)
Inventor
Hiroshi Otani
Atsuo Nozaki
Kiyoshi Endo
Original Assignee
Konica Minolta Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Holdings, Inc. filed Critical Konica Minolta Holdings, Inc.
Priority to JP2009517821A priority Critical patent/JPWO2008149768A1/ja
Publication of WO2008149768A1 publication Critical patent/WO2008149768A1/ja

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

　本発明は、曲面形状を利用して、可撓性を有する屈曲性の基板に張力をかけながら固定することで曲面形状の上で２枚の基板同士を密着させ、貼合力を得て、貼合する基板同士の均一な密着性をうる有機ＥＬ素子の製造方法を提供する。本発明の製造方法は、曲率をもつ剛性基板、第１電極層を有する屈曲性の第１基板、光透過性のある第２電極層を有する屈曲性の第２基板があり、第１、第２の少なくとも一方の基板の電極層上に、少なくとも１層の有機層を有し、前記曲率をもつ剛性基板上の凸面側に前記第１基板を設置し、さらに前記第２基板を、それぞれ第１電極層と第２電極層が有機層を挟むように設置し、第２基板に張力が生じるように、第２基板の対向する両端部を第１基板または剛性基板上に固定させ、前記曲率をもつ剛性基板上に、前記第１基板、前記第２基板を貼合させた状態で保持することを特徴とする。
PCT/JP2008/059890 2007-06-05 2008-05-29 有機エレクトロルミネッセンス発光素子および製造方法 WO2008149768A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009517821A JPWO2008149768A1 (ja) 2007-06-05 2008-05-29 有機エレクトロルミネッセンス発光素子および製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007149062 2007-06-05
JP2007-149062 2007-06-05

Publications (1)

Publication Number Publication Date
WO2008149768A1 true WO2008149768A1 (ja) 2008-12-11

Family

ID=40093584

Family Applications (1)

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PCT/JP2008/059890 WO2008149768A1 (ja) 2007-06-05 2008-05-29 有機エレクトロルミネッセンス発光素子および製造方法

Country Status (2)

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JP (1) JPWO2008149768A1 (ja)
WO (1) WO2008149768A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010084815A1 (ja) * 2009-01-22 2012-07-19 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子及びその製造方法
JP2013222750A (ja) * 2012-04-13 2013-10-28 Kuraray Co Ltd 光電変換素子とその製造方法、及び太陽電池
CN104576965A (zh) * 2014-12-29 2015-04-29 北京维信诺科技有限公司 一种可首尾电连接的柔性显示装置及其制备方法
JP2015144183A (ja) * 2014-01-31 2015-08-06 パイオニアＯｌｅｄライティングデバイス株式会社 発光装置
WO2017188116A1 (ja) * 2016-04-27 2017-11-02 シャープ株式会社 表示装置及びその製造方法
DE102014111997B4 (de) * 2014-08-21 2018-01-04 Osram Oled Gmbh Verfahren zur Herstellung eines dreidimensionalen organischen Leuchtkörpers und dreidimensionaler organischer Leuchtkörper
WO2018179261A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 貼り付け方法及び貼り付け装置
WO2018179215A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置、実装装置、コントローラ
CN111816798A (zh) * 2020-07-24 2020-10-23 武汉华美晨曦光电有限责任公司 一种三维自卷曲oled面板的制备方法及oled面板
US11557745B2 (en) 2012-08-10 2023-01-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
TWI841256B (zh) 2012-08-10 2024-05-01 日商半導體能源研究所股份有限公司 顯示裝置及可折疊的資訊終端機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3614584B1 (ja) * 1959-03-30 1961-08-28
JP2000182770A (ja) * 1998-12-15 2000-06-30 Sony Corp 発光具
JP2002184580A (ja) * 2000-08-17 2002-06-28 General Electric Co <Ge> Ｏｌｅｄ繊維光源
JP2005108516A (ja) * 2003-09-29 2005-04-21 Seiko Epson Corp 有機ｅｌ装置および給電装置
JP2005111705A (ja) * 2003-10-03 2005-04-28 Hitachi Ltd 光書き込み装置及び画像形成装置
JP2007199427A (ja) * 2006-01-26 2007-08-09 Nec Network & Sensor Systems Ltd 立体表示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3614584B1 (ja) * 1959-03-30 1961-08-28
JP2000182770A (ja) * 1998-12-15 2000-06-30 Sony Corp 発光具
JP2002184580A (ja) * 2000-08-17 2002-06-28 General Electric Co <Ge> Ｏｌｅｄ繊維光源
JP2005108516A (ja) * 2003-09-29 2005-04-21 Seiko Epson Corp 有機ｅｌ装置および給電装置
JP2005111705A (ja) * 2003-10-03 2005-04-28 Hitachi Ltd 光書き込み装置及び画像形成装置
JP2007199427A (ja) * 2006-01-26 2007-08-09 Nec Network & Sensor Systems Ltd 立体表示装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5589852B2 (ja) * 2009-01-22 2014-09-17 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子及びその製造方法
JPWO2010084815A1 (ja) * 2009-01-22 2012-07-19 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子及びその製造方法
JP2013222750A (ja) * 2012-04-13 2013-10-28 Kuraray Co Ltd 光電変換素子とその製造方法、及び太陽電池
US11557745B2 (en) 2012-08-10 2023-01-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
TWI841256B (zh) 2012-08-10 2024-05-01 日商半導體能源研究所股份有限公司 顯示裝置及可折疊的資訊終端機器
TWI795914B (zh) * 2012-08-10 2023-03-11 日商半導體能源研究所股份有限公司 發光裝置及可折疊的資訊終端機器
JP2015144183A (ja) * 2014-01-31 2015-08-06 パイオニアＯｌｅｄライティングデバイス株式会社 発光装置
DE102014111997B4 (de) * 2014-08-21 2018-01-04 Osram Oled Gmbh Verfahren zur Herstellung eines dreidimensionalen organischen Leuchtkörpers und dreidimensionaler organischer Leuchtkörper
CN104576965A (zh) * 2014-12-29 2015-04-29 北京维信诺科技有限公司 一种可首尾电连接的柔性显示装置及其制备方法
WO2017188116A1 (ja) * 2016-04-27 2017-11-02 シャープ株式会社 表示装置及びその製造方法
US10621893B2 (en) 2017-03-30 2020-04-14 Sharp Kabushiki Kaisha Display device, manufacturing method for display device, manufacturing apparatus of display device, mounting device, and controller
WO2018179215A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置、実装装置、コントローラ
WO2018179261A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 貼り付け方法及び貼り付け装置
CN111816798A (zh) * 2020-07-24 2020-10-23 武汉华美晨曦光电有限责任公司 一种三维自卷曲oled面板的制备方法及oled面板

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