WO2008149656A1 - 電子部品焼成用治具の製造方法 - Google Patents

電子部品焼成用治具の製造方法 Download PDF

Info

Publication number
WO2008149656A1
WO2008149656A1 PCT/JP2008/059114 JP2008059114W WO2008149656A1 WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1 JP 2008059114 W JP2008059114 W JP 2008059114W WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
manufacturing electronic
baking jig
component baking
baking
Prior art date
Application number
PCT/JP2008/059114
Other languages
English (en)
French (fr)
Inventor
Yasuhisa Izutsu
Tomoo Nagatome
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2009517770A priority Critical patent/JP5474538B2/ja
Publication of WO2008149656A1 publication Critical patent/WO2008149656A1/ja

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/85Coating or impregnation with inorganic materials
    • C04B41/87Ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661Multi-step sintering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Powder Metallurgy (AREA)

Abstract

 基材と保護層とが剥離しにくくなる電子部品焼成用治具の製造方法を提供する。  本発明の電子部品焼成用治具の製造方法は、基材上に保護層を形成した電子部品焼成用治具の製造方法であって、予備焼成した基材上に保護層を形成した後に、本焼成を行なう工程を備えたことを特徴とする。  前記予備焼成の温度は、600°C以上1400°C未満とし、前記本焼成温度は、1400°C以上2000°C以下とするのが好ましい。
PCT/JP2008/059114 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法 WO2008149656A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009517770A JP5474538B2 (ja) 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007148465 2007-06-04
JP2007-148465 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008149656A1 true WO2008149656A1 (ja) 2008-12-11

Family

ID=40093481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059114 WO2008149656A1 (ja) 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法

Country Status (2)

Country Link
JP (1) JP5474538B2 (ja)
WO (1) WO2008149656A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011214915A (ja) * 2010-03-31 2011-10-27 Central Res Inst Of Electric Power Ind ジルコニアコーティング剤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114578A (ja) * 2000-09-29 2002-04-16 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2004137114A (ja) * 2002-10-18 2004-05-13 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2005289715A (ja) * 2004-03-31 2005-10-20 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4002634B2 (ja) * 1997-03-28 2007-11-07 日立エーアイシー株式会社 固体電解コンデンサの製造方法
JP2000103689A (ja) * 1998-09-28 2000-04-11 Kyocera Corp アルミナ質焼結体およびその製造方法、並びに耐プラズマ部材
JP2002362986A (ja) * 2001-06-04 2002-12-18 Yotai Refractories Co Ltd 電子セラミックス焼成用道具材の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114578A (ja) * 2000-09-29 2002-04-16 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2004137114A (ja) * 2002-10-18 2004-05-13 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2005289715A (ja) * 2004-03-31 2005-10-20 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011214915A (ja) * 2010-03-31 2011-10-27 Central Res Inst Of Electric Power Ind ジルコニアコーティング剤

Also Published As

Publication number Publication date
JPWO2008149656A1 (ja) 2010-08-26
JP5474538B2 (ja) 2014-04-16

Similar Documents

Publication Publication Date Title
WO2006094313A3 (en) Forming method for polymeric laminated wafers comprising different film materials
WO2006036297A3 (en) Organic electroluminescence device and method of production of same
WO2008091742A3 (en) Pre-molded clip structure
WO2009063850A1 (ja) 有機エレクトロニクス素子の製造方法
GB2439001B (en) Method of forming organic compound layer, method of manufacturing organic el element and organic el element
TW200731850A (en) Organic light-emitting transistor element and method for manufacturing the same
WO2007140391A3 (en) Methods of making decomposable thin films of polyelectrolytes and uses thereof
WO2008136504A1 (ja) Iii族窒化物半導体発光素子の製造方法
WO2012004699A3 (en) Panel and method for manufacturing panels
WO2011099831A3 (ko) 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법
WO2010143895A3 (en) Semiconductor substrate, semiconductor device, and manufacturing methods thereof
TW200735433A (en) Manufacturing method of semiconductor device
EP2009135A4 (en) BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, METHOD FOR MANUFACTURING BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, EPITAXIC DIAMOND FILM MANUFACTURED BY THE BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, AND METHOD FOR FABRICATION
WO2007124209A3 (en) Stressor integration and method thereof
WO2008105360A1 (ja) 半導体装置の製造方法及び半導体装置の製造装置
TWI372586B (en) Capacitor-embedded substrate and method of manufacturing the same
WO2008053008A3 (en) Method for manufacturing a micromachined device
WO2009005041A1 (ja) 耐フレッティング性コネクタおよびその製造方法
WO2007084811A3 (en) Embedded assembly including moveable element and antenna element
WO2012047069A3 (ko) 발광소자 및 그 제조방법
TW200737244A (en) Dielectric element and method for manufacturing the same
EP4044268A4 (en) ORGANIC LIGHT EMITTING DEVICE, METHOD FOR THE PRODUCTION THEREOF AND COMPOSITION FOR ORGANIC MATERIAL LAYER OF AN ORGANIC LIGHT EMITTING DEVICE
WO2009014345A3 (en) Light emitting device and method of manufacturing the same
EP4006966A4 (en) CERAMIC SUBSTRATE AND METHOD FOR MAKING IT, COMPOSITE SUBSTRATE AND METHOD FOR MAKING IT, AND CIRCUIT SUBSTRATE AND METHOD FOR MAKING IT
EP3859971A4 (en) COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752934

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009517770

Country of ref document: JP

122 Ep: pct application non-entry in european phase

Ref document number: 08752934

Country of ref document: EP

Kind code of ref document: A1