WO2008149656A1 - 電子部品焼成用治具の製造方法 - Google Patents
電子部品焼成用治具の製造方法 Download PDFInfo
- Publication number
- WO2008149656A1 WO2008149656A1 PCT/JP2008/059114 JP2008059114W WO2008149656A1 WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1 JP 2008059114 W JP2008059114 W JP 2008059114W WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- manufacturing electronic
- baking jig
- component baking
- baking
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Furnace Charging Or Discharging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Powder Metallurgy (AREA)
Abstract
基材と保護層とが剥離しにくくなる電子部品焼成用治具の製造方法を提供する。 本発明の電子部品焼成用治具の製造方法は、基材上に保護層を形成した電子部品焼成用治具の製造方法であって、予備焼成した基材上に保護層を形成した後に、本焼成を行なう工程を備えたことを特徴とする。 前記予備焼成の温度は、600°C以上1400°C未満とし、前記本焼成温度は、1400°C以上2000°C以下とするのが好ましい。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009517770A JP5474538B2 (ja) | 2007-06-04 | 2008-05-19 | 電子部品焼成用治具の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148465 | 2007-06-04 | ||
JP2007-148465 | 2007-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008149656A1 true WO2008149656A1 (ja) | 2008-12-11 |
Family
ID=40093481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059114 WO2008149656A1 (ja) | 2007-06-04 | 2008-05-19 | 電子部品焼成用治具の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5474538B2 (ja) |
WO (1) | WO2008149656A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011214915A (ja) * | 2010-03-31 | 2011-10-27 | Central Res Inst Of Electric Power Ind | ジルコニアコーティング剤 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002114578A (ja) * | 2000-09-29 | 2002-04-16 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
JP2004137114A (ja) * | 2002-10-18 | 2004-05-13 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
JP2005289715A (ja) * | 2004-03-31 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4002634B2 (ja) * | 1997-03-28 | 2007-11-07 | 日立エーアイシー株式会社 | 固体電解コンデンサの製造方法 |
JP2000103689A (ja) * | 1998-09-28 | 2000-04-11 | Kyocera Corp | アルミナ質焼結体およびその製造方法、並びに耐プラズマ部材 |
JP2002362986A (ja) * | 2001-06-04 | 2002-12-18 | Yotai Refractories Co Ltd | 電子セラミックス焼成用道具材の製造方法 |
-
2008
- 2008-05-19 WO PCT/JP2008/059114 patent/WO2008149656A1/ja active Application Filing
- 2008-05-19 JP JP2009517770A patent/JP5474538B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002114578A (ja) * | 2000-09-29 | 2002-04-16 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
JP2004137114A (ja) * | 2002-10-18 | 2004-05-13 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
JP2005289715A (ja) * | 2004-03-31 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | 電子部品焼成用治具 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011214915A (ja) * | 2010-03-31 | 2011-10-27 | Central Res Inst Of Electric Power Ind | ジルコニアコーティング剤 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008149656A1 (ja) | 2010-08-26 |
JP5474538B2 (ja) | 2014-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006094313A3 (en) | Forming method for polymeric laminated wafers comprising different film materials | |
WO2006036297A3 (en) | Organic electroluminescence device and method of production of same | |
WO2008091742A3 (en) | Pre-molded clip structure | |
WO2009063850A1 (ja) | 有機エレクトロニクス素子の製造方法 | |
GB2439001B (en) | Method of forming organic compound layer, method of manufacturing organic el element and organic el element | |
TW200731850A (en) | Organic light-emitting transistor element and method for manufacturing the same | |
WO2007140391A3 (en) | Methods of making decomposable thin films of polyelectrolytes and uses thereof | |
WO2008136504A1 (ja) | Iii族窒化物半導体発光素子の製造方法 | |
WO2012004699A3 (en) | Panel and method for manufacturing panels | |
WO2011099831A3 (ko) | 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법 | |
WO2010143895A3 (en) | Semiconductor substrate, semiconductor device, and manufacturing methods thereof | |
TW200735433A (en) | Manufacturing method of semiconductor device | |
EP2009135A4 (en) | BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, METHOD FOR MANUFACTURING BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, EPITAXIC DIAMOND FILM MANUFACTURED BY THE BASE SUBSTRATE FOR EPITAXIC DIAMOND FILM, AND METHOD FOR FABRICATION | |
WO2007124209A3 (en) | Stressor integration and method thereof | |
WO2008105360A1 (ja) | 半導体装置の製造方法及び半導体装置の製造装置 | |
TWI372586B (en) | Capacitor-embedded substrate and method of manufacturing the same | |
WO2008053008A3 (en) | Method for manufacturing a micromachined device | |
WO2009005041A1 (ja) | 耐フレッティング性コネクタおよびその製造方法 | |
WO2007084811A3 (en) | Embedded assembly including moveable element and antenna element | |
WO2012047069A3 (ko) | 발광소자 및 그 제조방법 | |
TW200737244A (en) | Dielectric element and method for manufacturing the same | |
EP4044268A4 (en) | ORGANIC LIGHT EMITTING DEVICE, METHOD FOR THE PRODUCTION THEREOF AND COMPOSITION FOR ORGANIC MATERIAL LAYER OF AN ORGANIC LIGHT EMITTING DEVICE | |
WO2009014345A3 (en) | Light emitting device and method of manufacturing the same | |
EP4006966A4 (en) | CERAMIC SUBSTRATE AND METHOD FOR MAKING IT, COMPOSITE SUBSTRATE AND METHOD FOR MAKING IT, AND CIRCUIT SUBSTRATE AND METHOD FOR MAKING IT | |
EP3859971A4 (en) | COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08752934 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009517770 Country of ref document: JP |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08752934 Country of ref document: EP Kind code of ref document: A1 |