WO2008149656A1 - 電子部品焼成用治具の製造方法 - Google Patents

電子部品焼成用治具の製造方法 Download PDF

Info

Publication number
WO2008149656A1
WO2008149656A1 PCT/JP2008/059114 JP2008059114W WO2008149656A1 WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1 JP 2008059114 W JP2008059114 W JP 2008059114W WO 2008149656 A1 WO2008149656 A1 WO 2008149656A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
manufacturing electronic
baking jig
component baking
baking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059114
Other languages
English (en)
French (fr)
Inventor
Yasuhisa Izutsu
Tomoo Nagatome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2009517770A priority Critical patent/JP5474538B2/ja
Publication of WO2008149656A1 publication Critical patent/WO2008149656A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/87—Ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　基材と保護層とが剥離しにくくなる電子部品焼成用治具の製造方法を提供する。 　本発明の電子部品焼成用治具の製造方法は、基材上に保護層を形成した電子部品焼成用治具の製造方法であって、予備焼成した基材上に保護層を形成した後に、本焼成を行なう工程を備えたことを特徴とする。 　前記予備焼成の温度は、６００°C以上１４００°C未満とし、前記本焼成温度は、１４００°C以上２０００°C以下とするのが好ましい。
PCT/JP2008/059114 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法 Ceased WO2008149656A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009517770A JP5474538B2 (ja) 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007148465 2007-06-04
JP2007-148465 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008149656A1 true WO2008149656A1 (ja) 2008-12-11

Family

ID=40093481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059114 Ceased WO2008149656A1 (ja) 2007-06-04 2008-05-19 電子部品焼成用治具の製造方法

Country Status (2)

Country Link
JP (1) JP5474538B2 (ja)
WO (1) WO2008149656A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011214915A (ja) * 2010-03-31 2011-10-27 Central Res Inst Of Electric Power Ind ジルコニアコーティング剤
WO2026083711A1 (ja) * 2024-10-18 2026-04-23 三井金属株式会社 セラミックスシート焼結体およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114578A (ja) * 2000-09-29 2002-04-16 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2004137114A (ja) * 2002-10-18 2004-05-13 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2005289715A (ja) * 2004-03-31 2005-10-20 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4002634B2 (ja) * 1997-03-28 2007-11-07 日立エーアイシー株式会社 固体電解コンデンサの製造方法
JP2000103689A (ja) * 1998-09-28 2000-04-11 Kyocera Corp アルミナ質焼結体およびその製造方法、並びに耐プラズマ部材
JP2002362986A (ja) * 2001-06-04 2002-12-18 Yotai Refractories Co Ltd 電子セラミックス焼成用道具材の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114578A (ja) * 2000-09-29 2002-04-16 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2004137114A (ja) * 2002-10-18 2004-05-13 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具
JP2005289715A (ja) * 2004-03-31 2005-10-20 Mitsui Mining & Smelting Co Ltd 電子部品焼成用治具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011214915A (ja) * 2010-03-31 2011-10-27 Central Res Inst Of Electric Power Ind ジルコニアコーティング剤
WO2026083711A1 (ja) * 2024-10-18 2026-04-23 三井金属株式会社 セラミックスシート焼結体およびその製造方法

Also Published As

Publication number Publication date
JP5474538B2 (ja) 2014-04-16
JPWO2008149656A1 (ja) 2010-08-26

Similar Documents

Publication Publication Date Title
TWI373105B (en) Electronic component embedded substrate and method for manufacturing the same
WO2008091742A3 (en) Pre-molded clip structure
WO2007084540A3 (en) Electrode arrays and methods of fabrication thereof
WO2009063850A1 (ja) 有機エレクトロニクス素子の製造方法
WO2012004699A3 (en) Panel and method for manufacturing panels
EP4039471A4 (en) HEAT CONDUCTING FILM AND METHOD FOR PRODUCING IT
WO2009017032A1 (ja) バリア層つき基板、表示素子および表示素子の製造方法
GB2439001B (en) Method of forming organic compound layer, method of manufacturing organic el element and organic el element
WO2011099831A3 (ko) 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법
WO2008081904A1 (ja) 凹版及びこれを用いた導体層パターン付き基材
EP4044268A4 (en) ORGANIC LIGHT EMITTING DEVICE, METHOD FOR THE PRODUCTION THEREOF AND COMPOSITION FOR ORGANIC MATERIAL LAYER OF AN ORGANIC LIGHT EMITTING DEVICE
WO2010009716A3 (de) Strahlungsemittierende vorrichtung und verfahren zur herstellung einer strahlungsemittierenden vorrichtung
WO2008002430A3 (en) Wetsuit and associated method of manufacture
WO2010056500A3 (en) Sub-wavelength metallic apertures as light enhancement devices
WO2006094313A3 (en) Forming method for polymeric laminated wafers comprising different film materials
EP2453635A3 (en) Portable terminal and method for manufacturing the same
WO2007124209A3 (en) Stressor integration and method thereof
WO2008053008A3 (en) Method for manufacturing a micromachined device
EP3989263A4 (en) Method for manufacturing composite substrate, and composite substrate
EP2264755A3 (en) Method for manufacturing silicon on insulator wafers and corresponding wafer
TW200735433A (en) Manufacturing method of semiconductor device
WO2008112883A3 (en) Die attachment method with a covex surface underfill
TW200644104A (en) Manufacturing method for electronic component, electronic component, and electronic equipment
AU2003294188A1 (en) Method for manufacturing an organic electroluminescent display device, substrate to be used with such a method and an organic electroluminescent display device obtained with the method
EP2224472B8 (en) Substrate and method for manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752934

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009517770

Country of ref document: JP

122 Ep: pct application non-entry in european phase

Ref document number: 08752934

Country of ref document: EP

Kind code of ref document: A1