WO2008144856A2 - Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques - Google Patents

Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques Download PDF

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Publication number
WO2008144856A2
WO2008144856A2 PCT/BR2007/000129 BR2007000129W WO2008144856A2 WO 2008144856 A2 WO2008144856 A2 WO 2008144856A2 BR 2007000129 W BR2007000129 W BR 2007000129W WO 2008144856 A2 WO2008144856 A2 WO 2008144856A2
Authority
WO
WIPO (PCT)
Prior art keywords
cabinet
electric
housing
electronic appliances
board
Prior art date
Application number
PCT/BR2007/000129
Other languages
English (en)
Other versions
WO2008144856A3 (fr
Inventor
Milton Flavio De Macedo
Original Assignee
Techinvest Ltda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techinvest Ltda filed Critical Techinvest Ltda
Priority to PCT/BR2007/000129 priority Critical patent/WO2008144856A2/fr
Publication of WO2008144856A2 publication Critical patent/WO2008144856A2/fr
Publication of WO2008144856A3 publication Critical patent/WO2008144856A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention now described has as main purposes to facilitate the heat dissipating board fixation to the cabinet, as well as to facilitate the fixation between the semi-conductors and said dissipating board, turning needless, therefore, the use of screws and similar items.
  • the dissipated device here described shall further be integral part of the cabinet, saving this way raw material for its manufacture and causing the transfer of internal heat outside the cabinet so as to maintain an environment which impedes the deterioration of the electronic components.
  • the dissipator consists of an aluminum board or another metal of big thermal conductivity, smooth, not perforated and not prepared or worked, which shall be one of the cabinet faces.
  • the dissipator shall serve as interface between the cabinet internal and external part upon being pressed and introduced by fit, conducting heat inside out, forming a passage of thermal energy so as to create an internal environment which will favor the already housed electronic component performance.
  • a vertical support incorporated in a studied distance from the dissipating board fixation point, through its wedge boss, shall press the semiconductors against said dissipating board upon its introduction into the the cabinet, firmly fixing such electric-electronic elements on the printed circuit board, avoiding, therefore, the use of screws or other means of fixation conventionally used in such assembly stage.
  • Figure 1 Upper back view in perspective of a closed cabinet of an electric-electronic appliance
  • Figure 2 Upper front view in perspective of a closed cabinet of an electric-electronic appliance control, outlining the dissipator position;
  • Figure 3 Upper back view in perspective of a cabinet without cover, showing the main components' position;
  • Figure 6 Section view of Figure 5; Figure 7 - Detail view of section of Figure 6.
  • the "CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES”, object of the present invention patent request, is made up of a design for a plastic cabinet which, from housings duly prepared, may receive a dissipating metallic board, as well electronic semi-conductive devices, whose thermal energy must be dissipated, avoiding also the use of screws or other fixation means, through simple fits and special conformations, both to the board and to said electronic components, upon the assembly stage.
  • the cabinet (4) is equipped with fits (7), along the whose length of one of its side faces, said fits (7) with the proper format and with the function of housing the metallic dissipating board (1), which possesses big thermal conductivity, being smooth, not perforated and not prepared or worked, and, once introduced, locked along the fits, the cabinet (4) is closed.
  • the board (1) operates, thus, as interface between the cabinet internal and external part
  • the cabinet (4) starts to incorporate a vertical support equipped with upper wedge boss (5), arranged in parallel and in a studied distance in relation to the fixation point of the dissipating board (1).
  • a vertical support equipped with upper wedge boss (5) arranged in parallel and in a studied distance in relation to the fixation point of the dissipating board (1).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif d'aménagement dans un corps pour un système de dissipation thermique et l'installation de composants dans des appareils électriques-électroniques. Le dispositif est constitué d'un corps (7), formé spécialement sur une des faces (6) du boîtier (4) pour que des appareils électriques-électroniques puissent recevoir une carte (1) de dissipation servant d'interface entre une partie (4) interne et externe de boîtier et qui forme un passage d'énergie thermique conduisant la chaleur de l'intérieur vers l'extérieur, afin de former un environnement favorable à l'usinage des composants électroniques déjà inclus, ce qui permet aussi d'éviter la pénétration d'eau, de poussière et d'autres corps étrangers; et ce, grâce à une protubérance (5) de calage d'un support intégré verticalement dans la partie interne (4) du boîtier, à une distance définie de la carte (1) de dissipation. Lors de l'introduction de cette protubérance, les semi-conducteurs (2) doivent être positionnés sur la carte à circuit imprimé (3) pressée, bloquée de manière appropriée.
PCT/BR2007/000129 2007-05-30 2007-05-30 Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques WO2008144856A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/BR2007/000129 WO2008144856A2 (fr) 2007-05-30 2007-05-30 Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/BR2007/000129 WO2008144856A2 (fr) 2007-05-30 2007-05-30 Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques

Publications (2)

Publication Number Publication Date
WO2008144856A2 true WO2008144856A2 (fr) 2008-12-04
WO2008144856A3 WO2008144856A3 (fr) 2009-04-02

Family

ID=40075562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/BR2007/000129 WO2008144856A2 (fr) 2007-05-30 2007-05-30 Dispositif d'aménagement dans un corps pour système de dissipation thermique et installation de composants dans des appareils électriques-électroniques

Country Status (1)

Country Link
WO (1) WO2008144856A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104104223A (zh) * 2014-07-22 2014-10-15 四川升华电源科技有限公司 Dc-dc模块电源机架结构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6418021B1 (en) * 1997-12-24 2002-07-09 Denso Corporation Electronic circuit apparatus and method for assembling the same
US6753603B2 (en) * 2000-09-19 2004-06-22 Matsushita Electric Industrial Co., Ltd. Electronic equipment having insulating heat dissipation plate
US20070053164A1 (en) * 2005-09-06 2007-03-08 Lear Corporation Heat sink
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6418021B1 (en) * 1997-12-24 2002-07-09 Denso Corporation Electronic circuit apparatus and method for assembling the same
US6753603B2 (en) * 2000-09-19 2004-06-22 Matsushita Electric Industrial Co., Ltd. Electronic equipment having insulating heat dissipation plate
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
US20070053164A1 (en) * 2005-09-06 2007-03-08 Lear Corporation Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104104223A (zh) * 2014-07-22 2014-10-15 四川升华电源科技有限公司 Dc-dc模块电源机架结构
CN104104223B (zh) * 2014-07-22 2015-04-08 杨燕平 Dc-dc模块电源机架结构

Also Published As

Publication number Publication date
WO2008144856A3 (fr) 2009-04-02

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