WO2008143049A1 - 放射線検出器 - Google Patents

放射線検出器 Download PDF

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Publication number
WO2008143049A1
WO2008143049A1 PCT/JP2008/058731 JP2008058731W WO2008143049A1 WO 2008143049 A1 WO2008143049 A1 WO 2008143049A1 JP 2008058731 W JP2008058731 W JP 2008058731W WO 2008143049 A1 WO2008143049 A1 WO 2008143049A1
Authority
WO
WIPO (PCT)
Prior art keywords
common electrode
pedestal
incidence side
radiation detector
semiconductor
Prior art date
Application number
PCT/JP2008/058731
Other languages
English (en)
French (fr)
Inventor
Junichi Suzuki
Toshiyuki Sato
Hiroshi Koyama
Kenji Sato
Original Assignee
Shimadzu Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corporation filed Critical Shimadzu Corporation
Priority to US12/601,256 priority Critical patent/US20100163741A1/en
Priority to JP2009515157A priority patent/JP5104857B2/ja
Publication of WO2008143049A1 publication Critical patent/WO2008143049A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • G01T1/241—Electrode arrangements, e.g. continuous or parallel strips or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L27/14636—
    • H01L31/022408—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L27/14659—

Landscapes

  • Engineering & Computer Science (AREA)
  • Molecular Biology (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Measurement Of Radiation (AREA)
  • Light Receiving Elements (AREA)

Abstract

　この発明の放射線検出器において、台座５の少なくとも一部を覆うように台座５の入射側に第２共通電極３ｂが形成され、その第２共通電極３ｂが第１共通電極３ａに接続されるので、半導体２と台座５との境界付近で第２共通電極３ｂが屈曲されて、その屈曲部分で尖る。この尖った第２共通電極３ｂの下側（すなわち入射側とは逆側）には、半導体２の入射側に沿って形成された第１共通電極３ａが存在するので、下側（入射側とは逆側）から見た共通電極３の形状が均一となり、異常な電界集中が発生しない。その結果、電界集中による暗電流を抑制することができる。
PCT/JP2008/058731 2007-05-21 2008-05-12 放射線検出器 WO2008143049A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/601,256 US20100163741A1 (en) 2007-05-21 2008-05-12 Radiation detector
JP2009515157A JP5104857B2 (ja) 2007-05-21 2008-05-12 放射線検出器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-134205 2007-05-21
JP2007134205 2007-05-21

Publications (1)

Publication Number Publication Date
WO2008143049A1 true WO2008143049A1 (ja) 2008-11-27

Family

ID=40031758

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058731 WO2008143049A1 (ja) 2007-05-21 2008-05-12 放射線検出器

Country Status (3)

Country Link
US (1) US20100163741A1 (ja)
JP (1) JP5104857B2 (ja)
WO (1) WO2008143049A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125608A1 (ja) * 2009-04-30 2010-11-04 株式会社島津製作所 放射線検出器
WO2015125443A1 (ja) * 2014-02-19 2015-08-27 パナソニックＩｐマネジメント株式会社 受光デバイスおよびその製造方法
DE102009015563B4 (de) * 2009-03-30 2018-02-22 Siemens Healthcare Gmbh Röntgenstrahlungsdetektor zur Detektion von ionisierender Strahlung, insbesondere zur Verwendung in einem CT-System

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024145434A2 (en) * 2022-12-28 2024-07-04 Massachusetts Institute Of Technology Low cost, robust and high sensitivity ion-conducting polycrystalline radiation detectors

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982932A (ja) * 1995-09-20 1997-03-28 Hitachi Ltd 固体撮像素子
WO2001075478A1 (fr) * 2000-03-30 2001-10-11 Matsushita Electric Industrial Co., Ltd. Detecteur de rayonnement et son procede de fabrication
JP2003133575A (ja) * 2001-10-22 2003-05-09 Shimadzu Corp 放射線検出装置
JP2005086059A (ja) * 2003-09-10 2005-03-31 Shimadzu Corp 放射線検出器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6879014B2 (en) * 2000-03-20 2005-04-12 Aegis Semiconductor, Inc. Semitransparent optical detector including a polycrystalline layer and method of making
CN101390213B (zh) * 2006-02-23 2010-06-16 株式会社岛津制作所 放射线检测器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982932A (ja) * 1995-09-20 1997-03-28 Hitachi Ltd 固体撮像素子
WO2001075478A1 (fr) * 2000-03-30 2001-10-11 Matsushita Electric Industrial Co., Ltd. Detecteur de rayonnement et son procede de fabrication
JP2003133575A (ja) * 2001-10-22 2003-05-09 Shimadzu Corp 放射線検出装置
JP2005086059A (ja) * 2003-09-10 2005-03-31 Shimadzu Corp 放射線検出器

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009015563B4 (de) * 2009-03-30 2018-02-22 Siemens Healthcare Gmbh Röntgenstrahlungsdetektor zur Detektion von ionisierender Strahlung, insbesondere zur Verwendung in einem CT-System
WO2010125608A1 (ja) * 2009-04-30 2010-11-04 株式会社島津製作所 放射線検出器
DE112009004716T5 (de) 2009-04-30 2012-08-16 Shimadzu Corp. Strahlungsdetektor
JP5222398B2 (ja) * 2009-04-30 2013-06-26 株式会社島津製作所 放射線検出器
WO2015125443A1 (ja) * 2014-02-19 2015-08-27 パナソニックＩｐマネジメント株式会社 受光デバイスおよびその製造方法
JPWO2015125443A1 (ja) * 2014-02-19 2017-03-30 パナソニックＩｐマネジメント株式会社 受光デバイスおよびその製造方法

Also Published As

Publication number Publication date
US20100163741A1 (en) 2010-07-01
JP5104857B2 (ja) 2012-12-19
JPWO2008143049A1 (ja) 2010-08-05

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