WO2008140033A1 - 封止パッケージ用のリッド又はケース及びそれらの製造方法 - Google Patents

封止パッケージ用のリッド又はケース及びそれらの製造方法 Download PDF

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Publication number
WO2008140033A1
WO2008140033A1 PCT/JP2008/058607 JP2008058607W WO2008140033A1 WO 2008140033 A1 WO2008140033 A1 WO 2008140033A1 JP 2008058607 W JP2008058607 W JP 2008058607W WO 2008140033 A1 WO2008140033 A1 WO 2008140033A1
Authority
WO
WIPO (PCT)
Prior art keywords
lid
case
brazing material
sealing package
manufacturing
Prior art date
Application number
PCT/JP2008/058607
Other languages
English (en)
French (fr)
Inventor
Tomohiro Shimada
Kenichi Miyazaki
Original Assignee
Tanaka Kikinzoku Kogyo K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo K.K. filed Critical Tanaka Kikinzoku Kogyo K.K.
Priority to KR1020097013839A priority Critical patent/KR20090106393A/ko
Priority to JP2008542119A priority patent/JPWO2008140033A1/ja
Priority to US12/305,035 priority patent/US20100006336A1/en
Priority to CN2008800010222A priority patent/CN101558488B/zh
Priority to EP08752493A priority patent/EP2043146A4/en
Priority to TW097139377A priority patent/TW201016100A/zh
Publication of WO2008140033A1 publication Critical patent/WO2008140033A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Closures For Containers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

　本発明は、接合面上に枠形状のろう材を備える封止パッケージ用のリッド又はケースにおいて、枠形状のろう材が粒径１０～３００μｍのボール状のろう材を整列配置させて形成さたものである。このリッド又はケースは、（１）溶融状態のろう材を液滴化し、（２）液滴化されたろう材をリッド又はケースの接合面に吐出することによりボール状のろう材を固定し、（３）これら（１）、（２）の工程を繰り返し行なうことで製造可能である。
PCT/JP2008/058607 2007-05-11 2008-05-09 封止パッケージ用のリッド又はケース及びそれらの製造方法 WO2008140033A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097013839A KR20090106393A (ko) 2007-05-11 2008-05-09 봉지 패키지용 리드 또는 케이스 및 그들의 제조방법
JP2008542119A JPWO2008140033A1 (ja) 2007-05-11 2008-05-09 封止パッケージ用のリッド又はケース及びそれらの製造方法
US12/305,035 US20100006336A1 (en) 2007-05-11 2008-05-09 Lid or case for sealed package and method for manufacturing the same
CN2008800010222A CN101558488B (zh) 2007-05-11 2008-05-09 密封封装体用的盖或容器及其制造方法
EP08752493A EP2043146A4 (en) 2007-05-11 2008-05-09 HOOD OR HOUSING FOR ENABLING THE SEALING OF AN INTEGRATED CIRCUIT BOX AND METHOD OF MAKING THE COVER OR HOUSING
TW097139377A TW201016100A (en) 2007-05-11 2008-10-14 Lid or case for sealed package and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-126336 2007-05-11
JP2007126336 2007-05-11

Publications (1)

Publication Number Publication Date
WO2008140033A1 true WO2008140033A1 (ja) 2008-11-20

Family

ID=40002229

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058607 WO2008140033A1 (ja) 2007-05-11 2008-05-09 封止パッケージ用のリッド又はケース及びそれらの製造方法

Country Status (7)

Country Link
US (1) US20100006336A1 (ja)
EP (1) EP2043146A4 (ja)
JP (1) JPWO2008140033A1 (ja)
KR (1) KR20090106393A (ja)
CN (1) CN101558488B (ja)
TW (1) TW201016100A (ja)
WO (1) WO2008140033A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541850A (ja) * 2010-10-21 2013-11-14 レイセオン カンパニー 電子デバイスをパッケージングするためのシステムおよび方法
US10673274B2 (en) 2011-10-17 2020-06-02 Auckland Uniservices Limited Inductive power transfer apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111712912B (zh) * 2018-02-13 2023-12-22 田中贵金属工业株式会社 由透光性材料构成的密封用盖
US10690559B1 (en) 2018-03-28 2020-06-23 Flex Ltd. Pressure sensor array and the method of making
US10650946B1 (en) 2018-08-08 2020-05-12 Flex Ltd. Trimming method of DCR sensing circuits

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000311993A (ja) * 1999-04-28 2000-11-07 Matsushita Electronics Industry Corp 固体撮像装置の製造方法
JP2001196485A (ja) 2000-01-12 2001-07-19 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2003142621A (ja) * 2001-11-02 2003-05-16 Kyocera Corp 半導体装置
JP2006156513A (ja) * 2004-11-26 2006-06-15 Sohki:Kk パッケージ用リッド及びその製造方法
JP2006269970A (ja) 2005-03-25 2006-10-05 Yoshikawa Kogyo Co Ltd 電子部品のはんだ接合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943686A (en) * 1988-04-18 1990-07-24 Andrzej Kucharek Seal frame and method of use
US5230759A (en) * 1989-10-20 1993-07-27 Fujitsu Limited Process for sealing a semiconductor device
US5081327A (en) * 1990-03-28 1992-01-14 Cabot Corporation Sealing system for hermetic microchip packages
JP2001176999A (ja) * 2000-11-27 2001-06-29 Tanaka Kikinzoku Kogyo Kk 電子部品の気密封止方法
US6627814B1 (en) * 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
JP2004186428A (ja) * 2002-12-03 2004-07-02 Citizen Watch Co Ltd 電子デバイス用パッケージの蓋体の製造方法
EP1679149B1 (en) * 2003-10-07 2012-05-02 Senju Metal Industry Co., Ltd. Lead-free solder ball
CN1670978B (zh) * 2004-02-26 2010-12-29 京瓷株式会社 电子装置的制造方法
US7842891B2 (en) * 2005-01-21 2010-11-30 Citizen Holdings Co. Ltd. Sealing board and method for producing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000311993A (ja) * 1999-04-28 2000-11-07 Matsushita Electronics Industry Corp 固体撮像装置の製造方法
JP2001196485A (ja) 2000-01-12 2001-07-19 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2003142621A (ja) * 2001-11-02 2003-05-16 Kyocera Corp 半導体装置
JP2006156513A (ja) * 2004-11-26 2006-06-15 Sohki:Kk パッケージ用リッド及びその製造方法
JP2006269970A (ja) 2005-03-25 2006-10-05 Yoshikawa Kogyo Co Ltd 電子部品のはんだ接合方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HATA H ET AL.: "Uncooled IRFPA with chip scale vacuum package", PROCEEDINGS OF SPIE, vol. 6206, 2006, pages 620619 - 1,620619-10
See also references of EP2043146A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541850A (ja) * 2010-10-21 2013-11-14 レイセオン カンパニー 電子デバイスをパッケージングするためのシステムおよび方法
JP2015122513A (ja) * 2010-10-21 2015-07-02 レイセオン カンパニー 電子デバイスをパッケージングするためのシステムおよび方法
US10673274B2 (en) 2011-10-17 2020-06-02 Auckland Uniservices Limited Inductive power transfer apparatus

Also Published As

Publication number Publication date
CN101558488A (zh) 2009-10-14
CN101558488B (zh) 2012-04-11
EP2043146A4 (en) 2012-02-01
US20100006336A1 (en) 2010-01-14
TW201016100A (en) 2010-04-16
KR20090106393A (ko) 2009-10-08
JPWO2008140033A1 (ja) 2010-08-05
EP2043146A1 (en) 2009-04-01

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