WO2008133211A1 - Thermally conductive compound and process for producing the same - Google Patents
Thermally conductive compound and process for producing the same Download PDFInfo
- Publication number
- WO2008133211A1 WO2008133211A1 PCT/JP2008/057619 JP2008057619W WO2008133211A1 WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1 JP 2008057619 W JP2008057619 W JP 2008057619W WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- conductive compound
- powders
- kneading
- vol
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A thermally conductive compound which has low heat transfer resistance and satisfactory heat resistance, is free from oil bleeding, can be used even in a wide gap, and has shape retentivity. The thermally conductive compound is obtained by kneading a resin composition comprising (A) 30-60 vol.% thermosetting liquid silicone and (B) 40-70 vol.% one or more thermally conductive powders selected from the group consisting of powders of aluminum oxide, aluminum hydroxide, zinc oxide, silica, silicon nitride, and boron nitride, the kneading being conducted either after the thermosetting liquid silicone (A) is reacted and cured or simultaneously with the reaction and curing. In particular, the thermally conductive compound is one in which the thermally conductive powders have an average particle diameter of 5-70 µm. Also provided are: an electronic circuit part employing the thermally conductive compound; and a domestic electrical appliance, OA apparatus, or motor vehicle each having the electronic circuit part incorporated therein.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-111106 | 2007-04-20 | ||
JP2007111106A JP2010155870A (en) | 2007-04-20 | 2007-04-20 | Thermally conductive compound and method for producing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133211A1 true WO2008133211A1 (en) | 2008-11-06 |
Family
ID=39925665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057619 WO2008133211A1 (en) | 2007-04-20 | 2008-04-18 | Thermally conductive compound and process for producing the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2010155870A (en) |
TW (1) | TW200911924A (en) |
WO (1) | WO2008133211A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100093493A (en) * | 2009-02-16 | 2010-08-25 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Semiconductor arrangement |
WO2012029538A1 (en) * | 2010-08-31 | 2012-03-08 | 東レ・ダウコーニング株式会社 | Polysiloxane composition, and cured product thereof |
JP4899137B2 (en) * | 2008-07-17 | 2012-03-21 | ニホンハンダ株式会社 | Thermally conductive oil composition, heat radiation agent and electronic device |
CN103333494A (en) * | 2013-05-28 | 2013-10-02 | 东莞上海大学纳米技术研究院 | Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof |
CN106935342A (en) * | 2009-12-04 | 2017-07-07 | Abb研究有限公司 | High voltage surge arrester |
CN107841282A (en) * | 2016-09-19 | 2018-03-27 | 阿特斯(中国)投资有限公司 | A kind of heat conduction casting glue and preparation method thereof |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5418298B2 (en) * | 2010-02-26 | 2014-02-19 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
US10683444B2 (en) | 2015-05-22 | 2020-06-16 | Momentive Performance Materials Japan Llc | Thermally conductive composition |
KR102544366B1 (en) * | 2015-05-22 | 2023-06-19 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | thermally conductive composition |
JP7070146B2 (en) * | 2018-06-25 | 2022-05-18 | 株式会社リコー | Light source module and optical device |
JP2020176201A (en) * | 2019-04-18 | 2020-10-29 | 信越化学工業株式会社 | Heat-conductive resin composition and heat-conductive resin cured product |
JP2021088621A (en) * | 2019-12-02 | 2021-06-10 | 信越化学工業株式会社 | Heat-conductive resin composition using boron nitride aggregate powder and heat-conductive resin cured product |
WO2022049815A1 (en) * | 2020-09-03 | 2022-03-10 | 富士高分子工業株式会社 | Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor |
JP6938808B1 (en) * | 2020-09-03 | 2021-09-22 | 富士高分子工業株式会社 | Thermally conductive silicone gel composition, thermally conductive silicone sheet and its manufacturing method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1121388A (en) * | 1997-07-02 | 1999-01-26 | Denki Kagaku Kogyo Kk | Polymeric material molding and its use |
JPH1121387A (en) * | 1997-07-02 | 1999-01-26 | Denki Kagaku Kogyo Kk | Polymeric material molding and its use |
JPH1187958A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Cooling spacer |
JPH1187580A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Heat-dissipating spacer |
JPH11121953A (en) * | 1997-10-16 | 1999-04-30 | Denki Kagaku Kogyo Kk | Heat dissipating spacer |
JP2001230353A (en) * | 2000-02-17 | 2001-08-24 | Denki Kagaku Kogyo Kk | Heat dissipation member |
JP2004363272A (en) * | 2003-06-04 | 2004-12-24 | Denki Kagaku Kogyo Kk | Heat-dissipating member |
JP2005209765A (en) * | 2004-01-21 | 2005-08-04 | Denki Kagaku Kogyo Kk | Mixed powder and application thereof |
-
2007
- 2007-04-20 JP JP2007111106A patent/JP2010155870A/en active Pending
-
2008
- 2008-04-18 TW TW97114561A patent/TW200911924A/en unknown
- 2008-04-18 WO PCT/JP2008/057619 patent/WO2008133211A1/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1121388A (en) * | 1997-07-02 | 1999-01-26 | Denki Kagaku Kogyo Kk | Polymeric material molding and its use |
JPH1121387A (en) * | 1997-07-02 | 1999-01-26 | Denki Kagaku Kogyo Kk | Polymeric material molding and its use |
JPH1187958A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Cooling spacer |
JPH1187580A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Heat-dissipating spacer |
JPH11121953A (en) * | 1997-10-16 | 1999-04-30 | Denki Kagaku Kogyo Kk | Heat dissipating spacer |
JP2001230353A (en) * | 2000-02-17 | 2001-08-24 | Denki Kagaku Kogyo Kk | Heat dissipation member |
JP2004363272A (en) * | 2003-06-04 | 2004-12-24 | Denki Kagaku Kogyo Kk | Heat-dissipating member |
JP2005209765A (en) * | 2004-01-21 | 2005-08-04 | Denki Kagaku Kogyo Kk | Mixed powder and application thereof |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4899137B2 (en) * | 2008-07-17 | 2012-03-21 | ニホンハンダ株式会社 | Thermally conductive oil composition, heat radiation agent and electronic device |
KR20100093493A (en) * | 2009-02-16 | 2010-08-25 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Semiconductor arrangement |
JP2010199578A (en) * | 2009-02-16 | 2010-09-09 | Semikron Elektronik Gmbh & Co Kg | Semiconductor device |
KR101630879B1 (en) | 2009-02-16 | 2016-06-15 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Semiconductor arrangement |
CN106935342A (en) * | 2009-12-04 | 2017-07-07 | Abb研究有限公司 | High voltage surge arrester |
WO2012029538A1 (en) * | 2010-08-31 | 2012-03-08 | 東レ・ダウコーニング株式会社 | Polysiloxane composition, and cured product thereof |
CN103180393A (en) * | 2010-08-31 | 2013-06-26 | 道康宁东丽株式会社 | Polysiloxane composition, and cured product thereof |
JP5856060B2 (en) * | 2010-08-31 | 2016-02-09 | 東レ・ダウコーニング株式会社 | Polysiloxane composition and cured product thereof |
US9328242B2 (en) | 2010-08-31 | 2016-05-03 | Dow Corning Toray Co., Ltd. | Polysiloxane composition and cured product thereof |
CN103333494A (en) * | 2013-05-28 | 2013-10-02 | 东莞上海大学纳米技术研究院 | Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof |
CN103333494B (en) * | 2013-05-28 | 2015-08-05 | 东莞上海大学纳米技术研究院 | A kind of Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof |
CN107841282A (en) * | 2016-09-19 | 2018-03-27 | 阿特斯(中国)投资有限公司 | A kind of heat conduction casting glue and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2010155870A (en) | 2010-07-15 |
TW200911924A (en) | 2009-03-16 |
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