WO2008133089A1 - Conductive contact unit - Google Patents

Conductive contact unit Download PDF

Info

Publication number
WO2008133089A1
WO2008133089A1 PCT/JP2008/057290 JP2008057290W WO2008133089A1 WO 2008133089 A1 WO2008133089 A1 WO 2008133089A1 JP 2008057290 W JP2008057290 W JP 2008057290W WO 2008133089 A1 WO2008133089 A1 WO 2008133089A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive contact
conductive contacts
holding
contact unit
Prior art date
Application number
PCT/JP2008/057290
Other languages
French (fr)
Japanese (ja)
Inventor
Koji Ishikawa
Kazuya Soma
Jun Tominaga
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2009511797A priority Critical patent/JPWO2008133089A1/en
Priority to TW097114080A priority patent/TW200848743A/en
Publication of WO2008133089A1 publication Critical patent/WO2008133089A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Provided is a conductive contact unit, which can be suitably applied even to a reduced arrangement interval between electrodes or terminals to be tested by means of simple configuration, and achieves sure contact with the electrode or the terminal. The conductive contact unit is provided with a plurality of conductive contacts each of which has a board shape and inputs/outputs an electric signal between different circuit structures by electrically connecting between the circuit structures; and a conductive contact holder for storing and holding the conductive contacts. The conductive contact holder is provided with a plurality of holding sections for holding a part of each of the conductive contacts by arranging the conductive contacts in a row with their board thickness directions in the same way. The direction wherein the holding sections hold the conductive contacts in a row are parallel to each other.
PCT/JP2008/057290 2007-04-20 2008-04-14 Conductive contact unit WO2008133089A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009511797A JPWO2008133089A1 (en) 2007-04-20 2008-04-14 Conductive contact unit
TW097114080A TW200848743A (en) 2007-04-20 2008-04-18 Electrically conductive contactor unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007112340 2007-04-20
JP2007-112340 2007-04-20

Publications (1)

Publication Number Publication Date
WO2008133089A1 true WO2008133089A1 (en) 2008-11-06

Family

ID=39925547

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057290 WO2008133089A1 (en) 2007-04-20 2008-04-14 Conductive contact unit

Country Status (3)

Country Link
JP (1) JPWO2008133089A1 (en)
TW (1) TW200848743A (en)
WO (1) WO2008133089A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2384443A4 (en) * 2009-01-30 2013-06-19 Capital Formation Inc Flat plunger round barrel test probe
JP2016125943A (en) * 2015-01-06 2016-07-11 オムロン株式会社 Kelvin probe and kelvin inspection unit with the same
JP2017009569A (en) * 2015-06-23 2017-01-12 インクス株式会社 Laminate contact probe
WO2018216273A1 (en) * 2017-05-24 2018-11-29 山一電機株式会社 Mems-type probe and electrical inspection device using same
TWI677687B (en) * 2017-04-21 2019-11-21 日商日本麥克隆尼股份有限公司 Electrical connection device
CN112955754A (en) * 2018-11-08 2021-06-11 欧姆龙株式会社 Probe and inspection tool
JP2021128055A (en) * 2020-02-13 2021-09-02 オムロン株式会社 Inspection socket

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11133060A (en) * 1997-10-31 1999-05-21 Tani Denki Kogyo Kk Testing terminal
JP2000046870A (en) * 1998-07-30 2000-02-18 Denso Corp Terminal-connecting apparatus
JP2002365308A (en) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp Vertical blade type probe, vertical blade type probe unit and vertical blade type probe card using the same
JP2004138405A (en) * 2002-10-15 2004-05-13 Renesas Technology Corp Probe for measuring semiconductor device
JP2004138391A (en) * 2002-10-15 2004-05-13 Renesas Technology Corp Method for manufacturing semiconductor device
JP2005201844A (en) * 2004-01-16 2005-07-28 Micronics Japan Co Ltd Contact and electrical connection system
JP2006226907A (en) * 2005-02-18 2006-08-31 Nhk Spring Co Ltd Conductive contact unit and conductive contact
WO2007123150A1 (en) * 2006-04-18 2007-11-01 Tokyo Electron Limited Probe card and glass substrate drilling method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11133060A (en) * 1997-10-31 1999-05-21 Tani Denki Kogyo Kk Testing terminal
JP2000046870A (en) * 1998-07-30 2000-02-18 Denso Corp Terminal-connecting apparatus
JP2002365308A (en) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp Vertical blade type probe, vertical blade type probe unit and vertical blade type probe card using the same
JP2004138405A (en) * 2002-10-15 2004-05-13 Renesas Technology Corp Probe for measuring semiconductor device
JP2004138391A (en) * 2002-10-15 2004-05-13 Renesas Technology Corp Method for manufacturing semiconductor device
JP2005201844A (en) * 2004-01-16 2005-07-28 Micronics Japan Co Ltd Contact and electrical connection system
JP2006226907A (en) * 2005-02-18 2006-08-31 Nhk Spring Co Ltd Conductive contact unit and conductive contact
WO2007123150A1 (en) * 2006-04-18 2007-11-01 Tokyo Electron Limited Probe card and glass substrate drilling method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2384443A4 (en) * 2009-01-30 2013-06-19 Capital Formation Inc Flat plunger round barrel test probe
JP2016125943A (en) * 2015-01-06 2016-07-11 オムロン株式会社 Kelvin probe and kelvin inspection unit with the same
WO2016111293A1 (en) * 2015-01-06 2016-07-14 オムロン株式会社 Kelvin probe and kelvin inspection unit provided with same
JP2017009569A (en) * 2015-06-23 2017-01-12 インクス株式会社 Laminate contact probe
TWI677687B (en) * 2017-04-21 2019-11-21 日商日本麥克隆尼股份有限公司 Electrical connection device
WO2018216273A1 (en) * 2017-05-24 2018-11-29 山一電機株式会社 Mems-type probe and electrical inspection device using same
CN112955754A (en) * 2018-11-08 2021-06-11 欧姆龙株式会社 Probe and inspection tool
JP2021128055A (en) * 2020-02-13 2021-09-02 オムロン株式会社 Inspection socket

Also Published As

Publication number Publication date
JPWO2008133089A1 (en) 2010-07-22
TW200848743A (en) 2008-12-16

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