WO2008132926A1 - Solution de gravure et procédé de métallisation d'une surface en matière plastique employant le procédé - Google Patents
Solution de gravure et procédé de métallisation d'une surface en matière plastique employant le procédé Download PDFInfo
- Publication number
- WO2008132926A1 WO2008132926A1 PCT/JP2008/056042 JP2008056042W WO2008132926A1 WO 2008132926 A1 WO2008132926 A1 WO 2008132926A1 JP 2008056042 W JP2008056042 W JP 2008056042W WO 2008132926 A1 WO2008132926 A1 WO 2008132926A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- etching solution
- metallization
- plastic surface
- surface employing
- acid salt
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009511723A JPWO2008132926A1 (ja) | 2007-04-18 | 2008-03-28 | エッチング液およびこれを用いたプラスチック表面の金属化方法 |
CN200880012274A CN101680093A (zh) | 2007-04-18 | 2008-03-28 | 蚀刻液以及采用所述蚀刻液的塑料表面金属化方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007108853 | 2007-04-18 | ||
JP2007-108853 | 2007-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008132926A1 true WO2008132926A1 (fr) | 2008-11-06 |
Family
ID=39925386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056042 WO2008132926A1 (fr) | 2007-04-18 | 2008-03-28 | Solution de gravure et procédé de métallisation d'une surface en matière plastique employant le procédé |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2008132926A1 (fr) |
KR (1) | KR20100014699A (fr) |
CN (1) | CN101680093A (fr) |
TW (1) | TW200907110A (fr) |
WO (1) | WO2008132926A1 (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094277A (ja) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | スミア除去用組成物 |
JP2011520142A (ja) * | 2008-05-01 | 2011-07-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 高密度注入レジストの除去のための低pH混合物 |
JP2013124390A (ja) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | 無電解めっき処理方法および無電解めっき処理材 |
WO2015060196A1 (fr) | 2013-10-22 | 2015-04-30 | 奥野製薬工業株式会社 | Composition pour le traitement par gravure une matiere de resine |
WO2015183304A1 (fr) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Pré-traitement d'adhérence sans chrome pour des matières plastiques |
JP2016507009A (ja) * | 2013-02-13 | 2016-03-07 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 非導電性ポリマー上に第一の金属層を成膜する方法 |
WO2017056285A1 (fr) * | 2015-10-01 | 2017-04-06 | 株式会社Jcu | Solution d'attaque pour corps moulé en résine et utilisation associée |
CN110709535A (zh) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | 树脂表面的多段蚀刻方法以及利用其向树脂镀覆的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124434A (en) * | 1976-04-14 | 1977-10-19 | Matsushita Electric Ind Co Ltd | Resin plating method and surface treating agent therefor |
JPS61501460A (ja) * | 1984-06-07 | 1986-07-17 | エンソ−ン、インコ−ポレ−テッド | プラスチックをアルカリ性過マンガン酸塩溶液で処理するための組成物および方法 |
JPH01195280A (ja) * | 1987-11-25 | 1989-08-07 | Schering Ag | 付着強固に化学的金属化するためのプラスチックの前処理方法、およびそれにより製造されたプリント配線板 |
JP2002530529A (ja) * | 1998-11-13 | 2002-09-17 | エントン・オーエムアイ・インコーポレイテッド | プラスチック面の金属化処理プロセス |
WO2007122869A1 (fr) * | 2006-04-18 | 2007-11-01 | Okuno Chemical Industries Co., Ltd. | Composition PERMETTANT UN traitement d'attaque chimique d'un article MOULÉ en RÉSINE |
-
2008
- 2008-03-28 KR KR1020097020452A patent/KR20100014699A/ko not_active Application Discontinuation
- 2008-03-28 WO PCT/JP2008/056042 patent/WO2008132926A1/fr active Application Filing
- 2008-03-28 CN CN200880012274A patent/CN101680093A/zh active Pending
- 2008-03-28 JP JP2009511723A patent/JPWO2008132926A1/ja active Pending
- 2008-04-15 TW TW097113670A patent/TW200907110A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124434A (en) * | 1976-04-14 | 1977-10-19 | Matsushita Electric Ind Co Ltd | Resin plating method and surface treating agent therefor |
JPS61501460A (ja) * | 1984-06-07 | 1986-07-17 | エンソ−ン、インコ−ポレ−テッド | プラスチックをアルカリ性過マンガン酸塩溶液で処理するための組成物および方法 |
JPH01195280A (ja) * | 1987-11-25 | 1989-08-07 | Schering Ag | 付着強固に化学的金属化するためのプラスチックの前処理方法、およびそれにより製造されたプリント配線板 |
JP2002530529A (ja) * | 1998-11-13 | 2002-09-17 | エントン・オーエムアイ・インコーポレイテッド | プラスチック面の金属化処理プロセス |
WO2007122869A1 (fr) * | 2006-04-18 | 2007-11-01 | Okuno Chemical Industries Co., Ltd. | Composition PERMETTANT UN traitement d'attaque chimique d'un article MOULÉ en RÉSINE |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094277A (ja) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | スミア除去用組成物 |
JP2011520142A (ja) * | 2008-05-01 | 2011-07-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 高密度注入レジストの除去のための低pH混合物 |
JP2013124390A (ja) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | 無電解めっき処理方法および無電解めっき処理材 |
JP2016507009A (ja) * | 2013-02-13 | 2016-03-07 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 非導電性ポリマー上に第一の金属層を成膜する方法 |
EP3327175A1 (fr) | 2013-10-22 | 2018-05-30 | Okuno Chemical Industries Co., Ltd. | Composition pour le traitement par gravure d'un matériau résineux |
US9657226B2 (en) | 2013-10-22 | 2017-05-23 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
KR20170077274A (ko) | 2013-10-22 | 2017-07-05 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 재료의 에칭 처리용 조성물 |
WO2015060196A1 (fr) | 2013-10-22 | 2015-04-30 | 奥野製薬工業株式会社 | Composition pour le traitement par gravure une matiere de resine |
EP3327176A1 (fr) | 2013-10-22 | 2018-05-30 | Okuno Chemical Industries Co., Ltd. | Composition pour le traitement par gravure d'un matériau résineux |
WO2015183304A1 (fr) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Pré-traitement d'adhérence sans chrome pour des matières plastiques |
US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
WO2017056285A1 (fr) * | 2015-10-01 | 2017-04-06 | 株式会社Jcu | Solution d'attaque pour corps moulé en résine et utilisation associée |
JPWO2017056285A1 (ja) * | 2015-10-01 | 2018-10-04 | 株式会社Jcu | 樹脂成形体用エッチング液およびその用途 |
CN110709535A (zh) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | 树脂表面的多段蚀刻方法以及利用其向树脂镀覆的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101680093A (zh) | 2010-03-24 |
TW200907110A (en) | 2009-02-16 |
JPWO2008132926A1 (ja) | 2010-07-22 |
KR20100014699A (ko) | 2010-02-10 |
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