WO2008132926A1 - Etching solution, and method for metallization of plastic surface employing the method - Google Patents
Etching solution, and method for metallization of plastic surface employing the method Download PDFInfo
- Publication number
- WO2008132926A1 WO2008132926A1 PCT/JP2008/056042 JP2008056042W WO2008132926A1 WO 2008132926 A1 WO2008132926 A1 WO 2008132926A1 JP 2008056042 W JP2008056042 W JP 2008056042W WO 2008132926 A1 WO2008132926 A1 WO 2008132926A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- etching solution
- metallization
- plastic surface
- surface employing
- acid salt
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880012274A CN101680093A (en) | 2007-04-18 | 2008-03-28 | Etching solution, and method for metallization of plastic surface employing the method |
JP2009511723A JPWO2008132926A1 (en) | 2007-04-18 | 2008-03-28 | Etching solution and method of metallizing plastic surface using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007108853 | 2007-04-18 | ||
JP2007-108853 | 2007-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008132926A1 true WO2008132926A1 (en) | 2008-11-06 |
Family
ID=39925386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056042 WO2008132926A1 (en) | 2007-04-18 | 2008-03-28 | Etching solution, and method for metallization of plastic surface employing the method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2008132926A1 (en) |
KR (1) | KR20100014699A (en) |
CN (1) | CN101680093A (en) |
TW (1) | TW200907110A (en) |
WO (1) | WO2008132926A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094277A (en) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | Composition for smear removal |
JP2011520142A (en) * | 2008-05-01 | 2011-07-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Low pH mixture for removal of high density implanted resist |
JP2013124390A (en) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | Electroless plating treatment method and electroless plating treatment material |
WO2015060196A1 (en) | 2013-10-22 | 2015-04-30 | 奥野製薬工業株式会社 | Composition for etching treatment of resin material |
WO2015183304A1 (en) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
JP2016507009A (en) * | 2013-02-13 | 2016-03-07 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Method for forming a first metal layer on a non-conductive polymer |
WO2017056285A1 (en) * | 2015-10-01 | 2017-04-06 | 株式会社Jcu | Etching solution for resin molded body and use thereof |
CN110709535A (en) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | Multi-stage etching method for resin surface and method for plating resin using the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124434A (en) * | 1976-04-14 | 1977-10-19 | Matsushita Electric Ind Co Ltd | Resin plating method and surface treating agent therefor |
JPS61501460A (en) * | 1984-06-07 | 1986-07-17 | エンソ−ン、インコ−ポレ−テッド | Compositions and methods for treating plastics with alkaline permanganate solutions |
JPH01195280A (en) * | 1987-11-25 | 1989-08-07 | Schering Ag | Pretreatment of plastic for chemical metallization in order to enhance adhesion and produced printed wiring board |
JP2002530529A (en) * | 1998-11-13 | 2002-09-17 | エントン・オーエムアイ・インコーポレイテッド | Metallization process for plastic surfaces |
WO2007122869A1 (en) * | 2006-04-18 | 2007-11-01 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin molded article |
-
2008
- 2008-03-28 JP JP2009511723A patent/JPWO2008132926A1/en active Pending
- 2008-03-28 KR KR1020097020452A patent/KR20100014699A/en not_active Application Discontinuation
- 2008-03-28 WO PCT/JP2008/056042 patent/WO2008132926A1/en active Application Filing
- 2008-03-28 CN CN200880012274A patent/CN101680093A/en active Pending
- 2008-04-15 TW TW097113670A patent/TW200907110A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124434A (en) * | 1976-04-14 | 1977-10-19 | Matsushita Electric Ind Co Ltd | Resin plating method and surface treating agent therefor |
JPS61501460A (en) * | 1984-06-07 | 1986-07-17 | エンソ−ン、インコ−ポレ−テッド | Compositions and methods for treating plastics with alkaline permanganate solutions |
JPH01195280A (en) * | 1987-11-25 | 1989-08-07 | Schering Ag | Pretreatment of plastic for chemical metallization in order to enhance adhesion and produced printed wiring board |
JP2002530529A (en) * | 1998-11-13 | 2002-09-17 | エントン・オーエムアイ・インコーポレイテッド | Metallization process for plastic surfaces |
WO2007122869A1 (en) * | 2006-04-18 | 2007-11-01 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin molded article |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094277A (en) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | Composition for smear removal |
JP2011520142A (en) * | 2008-05-01 | 2011-07-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Low pH mixture for removal of high density implanted resist |
JP2013124390A (en) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | Electroless plating treatment method and electroless plating treatment material |
JP2016507009A (en) * | 2013-02-13 | 2016-03-07 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Method for forming a first metal layer on a non-conductive polymer |
EP3327175A1 (en) | 2013-10-22 | 2018-05-30 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
US9657226B2 (en) | 2013-10-22 | 2017-05-23 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
KR20170077274A (en) | 2013-10-22 | 2017-07-05 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | Composition for etching treatment of resin material |
WO2015060196A1 (en) | 2013-10-22 | 2015-04-30 | 奥野製薬工業株式会社 | Composition for etching treatment of resin material |
EP3327176A1 (en) | 2013-10-22 | 2018-05-30 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
WO2015183304A1 (en) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
WO2017056285A1 (en) * | 2015-10-01 | 2017-04-06 | 株式会社Jcu | Etching solution for resin molded body and use thereof |
JPWO2017056285A1 (en) * | 2015-10-01 | 2018-10-04 | 株式会社Jcu | Etching solution for resin molding and its use |
CN110709535A (en) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | Multi-stage etching method for resin surface and method for plating resin using the same |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008132926A1 (en) | 2010-07-22 |
TW200907110A (en) | 2009-02-16 |
KR20100014699A (en) | 2010-02-10 |
CN101680093A (en) | 2010-03-24 |
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