WO2008126425A1 - パターン形成方法および電子素子の製造方法 - Google Patents

パターン形成方法および電子素子の製造方法 Download PDF

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Publication number
WO2008126425A1
WO2008126425A1 PCT/JP2008/050215 JP2008050215W WO2008126425A1 WO 2008126425 A1 WO2008126425 A1 WO 2008126425A1 JP 2008050215 W JP2008050215 W JP 2008050215W WO 2008126425 A1 WO2008126425 A1 WO 2008126425A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
pattern
electronic element
liquid constituent
forming
Prior art date
Application number
PCT/JP2008/050215
Other languages
English (en)
French (fr)
Inventor
Toshio Fukuda
Akihiro Nomoto
Original Assignee
Sony Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corporation filed Critical Sony Corporation
Priority to CN2008800107266A priority Critical patent/CN101647095B/zh
Priority to US12/593,846 priority patent/US8361372B2/en
Publication of WO2008126425A1 publication Critical patent/WO2008126425A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printing Methods (AREA)

Abstract

　微細で精密なパターンを安定して形成するパターン形成方法および電子素子の製造方法を提供する。第１版１０上に液組成物を塗布して、導電性膜Ｄを形成する工程と、第２版２０を第１版１０の導電性膜Ｄの形成面側に押圧し、第２版２０の凸部２０ａの頂面に、導電性膜Ｄの不要なパターンを転写して除去することで、第１版１０上に導電性パターンＤ’を形成する工程と、第１版１０の導電性パターンＤ’の形成面側を、被転写基板の表面に押圧することで、導電性パターンＤ’を転写する工程とを有し、第１版１０における液組成物が塗布される表面の表面張力をα、最大泡圧法による１００ｍｓｅｃ時の液組成物の動的表面張力をβ、第２版２０における凸部２０ａの頂面の表面張力をγとした場合、γ＞α≧βとなるように、液組成物の組成または第１版１０もしくは第２版２０の表面の材質を設定するパターン形成方法および電子素子の製造方法である。
PCT/JP2008/050215 2007-03-30 2008-01-10 パターン形成方法および電子素子の製造方法 WO2008126425A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800107266A CN101647095B (zh) 2007-03-30 2008-01-10 形成图案的方法和制作电子元件的方法
US12/593,846 US8361372B2 (en) 2007-03-30 2008-01-10 Method of forming pattern and method of producing electronic element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-092178 2007-03-30
JP2007092178A JP5109446B2 (ja) 2007-03-30 2007-03-30 パターン形成方法および電子素子の製造方法

Publications (1)

Publication Number Publication Date
WO2008126425A1 true WO2008126425A1 (ja) 2008-10-23

Family

ID=39863584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050215 WO2008126425A1 (ja) 2007-03-30 2008-01-10 パターン形成方法および電子素子の製造方法

Country Status (6)

Country Link
US (1) US8361372B2 (ja)
JP (1) JP5109446B2 (ja)
KR (1) KR20100014666A (ja)
CN (1) CN101647095B (ja)
TW (1) TWI381567B (ja)
WO (1) WO2008126425A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4432993B2 (ja) * 2007-04-16 2010-03-17 ソニー株式会社 パターン形成方法および半導体装置の製造方法
WO2012067225A1 (ja) * 2010-11-19 2012-05-24 凸版印刷株式会社 金属箔パターン積層体、金属箔の型抜き方法、回路基板、その製造方法、および太陽電池モジュール
KR102067846B1 (ko) 2011-06-06 2020-01-17 디에스엠 아이피 어셋츠 비.브이. 금속박 패턴 적층체, 금속박 적층체, 금속박 적층 기판, 태양 전지 모듈 및 금속박 패턴 적층체의 제조 방법
JP7382236B2 (ja) * 2020-01-15 2023-11-16 日本特殊陶業株式会社 シート体の製造方法
JP7450658B2 (ja) 2022-04-08 2024-03-15 日本航空電子工業株式会社 コネクタおよびコネクタ・ケーブル

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056736A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 異方導電性膜の製造方法、それにより得られる異方導電性膜及びそれを用いた回路接続方法
JP2005246790A (ja) * 2004-03-04 2005-09-15 Hitachi Chem Co Ltd レジストパターン形成法、電子部品の製造法、および電子部品
JP2006045294A (ja) * 2004-08-02 2006-02-16 Hitachi Chem Co Ltd 印刷インキ組成物、塗膜及びその形成方法、並びに、電子部品及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514503A (en) * 1994-10-17 1996-05-07 Corning Incorporated Apparatus and method for printing a color filter
JP3689536B2 (ja) 1997-08-12 2005-08-31 光村印刷株式会社 画像形成法
JP4828791B2 (ja) 2003-10-24 2011-11-30 光村印刷株式会社 精密パターニング用インキ組成物
JP2005353770A (ja) * 2004-06-09 2005-12-22 Hitachi Chem Co Ltd 印刷配線板の製造方法
JP2006124546A (ja) * 2004-10-29 2006-05-18 Hitachi Chem Co Ltd 印刷インキ組成物、レジストパターンの形成法、電子部品の製造法及び電子部品
JP2006156426A (ja) * 2004-11-25 2006-06-15 Seiko Epson Corp 導電性パターンの形成方法
JP4772465B2 (ja) * 2004-11-26 2011-09-14 パナソニック株式会社 薄膜の間欠塗工方法
JP4984446B2 (ja) * 2005-07-11 2012-07-25 大日本印刷株式会社 発光層、正孔注入層の形成方法およびそれらを用いた有機発光デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056736A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 異方導電性膜の製造方法、それにより得られる異方導電性膜及びそれを用いた回路接続方法
JP2005246790A (ja) * 2004-03-04 2005-09-15 Hitachi Chem Co Ltd レジストパターン形成法、電子部品の製造法、および電子部品
JP2006045294A (ja) * 2004-08-02 2006-02-16 Hitachi Chem Co Ltd 印刷インキ組成物、塗膜及びその形成方法、並びに、電子部品及びその製造方法

Also Published As

Publication number Publication date
CN101647095A (zh) 2010-02-10
TW200845446A (en) 2008-11-16
JP5109446B2 (ja) 2012-12-26
TWI381567B (zh) 2013-01-01
US8361372B2 (en) 2013-01-29
JP2008251887A (ja) 2008-10-16
KR20100014666A (ko) 2010-02-10
CN101647095B (zh) 2011-04-20
US20100044905A1 (en) 2010-02-25

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