WO2008126143A1 - 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置 - Google Patents

金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置 Download PDF

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Publication number
WO2008126143A1
WO2008126143A1 PCT/JP2007/000346 JP2007000346W WO2008126143A1 WO 2008126143 A1 WO2008126143 A1 WO 2008126143A1 JP 2007000346 W JP2007000346 W JP 2007000346W WO 2008126143 A1 WO2008126143 A1 WO 2008126143A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
simulation
ultrasonic bonding
frictional coefficient
intermetallic
Prior art date
Application number
PCT/JP2007/000346
Other languages
English (en)
French (fr)
Inventor
Mami Nakadate
Tadashi Tateno
Naoki Ishikawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009508697A priority Critical patent/JP5149894B2/ja
Priority to PCT/JP2007/000346 priority patent/WO2008126143A1/ja
Publication of WO2008126143A1 publication Critical patent/WO2008126143A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

　本発明の超音波接合のシミュレーション方法は、第１の金属と、第２の金属とを超音波接合するシミュレーションを実行する超音波接合シミュレーション方法である。この方法は、各時刻で算出された応力に基づく変位により、他方の金属に入り込んだ節点数を算出する接合節点数算出ステップと、高速歪み速度領域における上記第１および上記第２の金属間の摩擦係数を、他方の金属に入り込んだ節点数と対応付けて記憶する仮想摩擦係数記憶部を基に、その他方の金属に入り込んだ節点の数に対応する、高速歪み速度領域における上記第１および上記第２の金属間の摩擦係数を取得する仮想摩擦係数取得ステップと、を備える。
PCT/JP2007/000346 2007-03-30 2007-03-30 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置 WO2008126143A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009508697A JP5149894B2 (ja) 2007-03-30 2007-03-30 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置
PCT/JP2007/000346 WO2008126143A1 (ja) 2007-03-30 2007-03-30 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/000346 WO2008126143A1 (ja) 2007-03-30 2007-03-30 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置

Publications (1)

Publication Number Publication Date
WO2008126143A1 true WO2008126143A1 (ja) 2008-10-23

Family

ID=39863329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/000346 WO2008126143A1 (ja) 2007-03-30 2007-03-30 金属間の超音波接合のシミュレーション方法、シミュレーション・プログラム、および、シミュレーション装置

Country Status (2)

Country Link
JP (1) JP5149894B2 (ja)
WO (1) WO2008126143A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN114741999A (zh) * 2022-06-09 2022-07-12 武汉飞恩微电子有限公司 一种基于数字孪生技术的引线键合在线监测方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09192851A (ja) * 1996-01-08 1997-07-29 Sekisui Chem Co Ltd 溶接適正判定装置
JPH1094883A (ja) * 1996-09-24 1998-04-14 Matsushita Electric Ind Co Ltd 抵抗溶接機の溶接条件制御方法
JPH10323620A (ja) * 1997-05-26 1998-12-08 Mitsubishi Electric Corp 超音波振動装置
JP2006181623A (ja) * 2004-12-28 2006-07-13 Nissan Motor Co Ltd 超音波接合方法および超音波接合装置
JP2006212687A (ja) * 2005-02-07 2006-08-17 Nissan Motor Co Ltd 超音波接合用装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3997712B2 (ja) * 2001-01-19 2007-10-24 Ｊｆｅスチール株式会社 Ｅｉコア用の方向性電磁鋼板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09192851A (ja) * 1996-01-08 1997-07-29 Sekisui Chem Co Ltd 溶接適正判定装置
JPH1094883A (ja) * 1996-09-24 1998-04-14 Matsushita Electric Ind Co Ltd 抵抗溶接機の溶接条件制御方法
JPH10323620A (ja) * 1997-05-26 1998-12-08 Mitsubishi Electric Corp 超音波振動装置
JP2006181623A (ja) * 2004-12-28 2006-07-13 Nissan Motor Co Ltd 超音波接合方法および超音波接合装置
JP2006212687A (ja) * 2005-02-07 2006-08-17 Nissan Motor Co Ltd 超音波接合用装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN114741999A (zh) * 2022-06-09 2022-07-12 武汉飞恩微电子有限公司 一种基于数字孪生技术的引线键合在线监测方法

Also Published As

Publication number Publication date
JP5149894B2 (ja) 2013-02-20
JPWO2008126143A1 (ja) 2010-07-15

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