WO2008117685A1 - 粘着テープ - Google Patents

粘着テープ Download PDF

Info

Publication number
WO2008117685A1
WO2008117685A1 PCT/JP2008/054823 JP2008054823W WO2008117685A1 WO 2008117685 A1 WO2008117685 A1 WO 2008117685A1 JP 2008054823 W JP2008054823 W JP 2008054823W WO 2008117685 A1 WO2008117685 A1 WO 2008117685A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive tape
substrate
thickness
Prior art date
Application number
PCT/JP2008/054823
Other languages
English (en)
French (fr)
Inventor
Kiyoaki Moriuchi
Hiroshi Hayami
Shuji Azuma
Ryouhei Fujita
Original Assignee
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Fine Polymer, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Ltd., Sumitomo Electric Fine Polymer, Inc. filed Critical Sumitomo Electric Industries, Ltd.
Priority to JP2009506288A priority Critical patent/JPWO2008117685A1/ja
Publication of WO2008117685A1 publication Critical patent/WO2008117685A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Abstract

　粘着テープ３は、５０～２００μｍの厚みを有する基材５と、１０～５０μｍの厚みを有するとともに、基材５の少なくとも片面５ａに設けられた粘着剤層６とを備えている。基材５は、ポリオレフィン樹脂とハロゲン系難燃剤とを含有する樹脂組成物からなり、ハロゲン元素を、樹脂組成物全体の１５重量％～３５重量％の割合で含有する。それにより、難燃性、柔軟性および機械的強度に優れた粘着テープが提供される。
PCT/JP2008/054823 2007-03-26 2008-03-14 粘着テープ WO2008117685A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009506288A JPWO2008117685A1 (ja) 2007-03-26 2008-03-14 粘着テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-079959 2007-03-26
JP2007079959 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008117685A1 true WO2008117685A1 (ja) 2008-10-02

Family

ID=39788421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054823 WO2008117685A1 (ja) 2007-03-26 2008-03-14 粘着テープ

Country Status (3)

Country Link
JP (1) JPWO2008117685A1 (ja)
CN (1) CN101631841A (ja)
WO (1) WO2008117685A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150482A (ja) * 2008-12-26 2010-07-08 Japan Wavelock Co Ltd モール用装飾テープバッキング材、モール用装飾テープ、及び、モール
JP2014077093A (ja) * 2012-10-11 2014-05-01 Furukawa Electric Co Ltd:The 電線接続部用難燃性絶縁防水カバー
EP3026717A1 (en) * 2014-11-28 2016-06-01 LG Innotek Co., Ltd. Light emitting device package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012056284A (ja) * 2010-09-13 2012-03-22 Sumitomo Electric Ind Ltd 耐摩耗性難燃テープ、耐摩耗性難燃粘着テープ及びワイヤーハーネス
JP5881391B2 (ja) * 2011-01-25 2016-03-09 日立マクセル株式会社 防水用両面粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259938A (ja) * 1990-03-09 1991-11-20 Sumitomo Electric Ind Ltd ポリオレフィン樹脂組成物及びそれからの耐熱テープ
JP2001164209A (ja) * 1999-12-10 2001-06-19 Sumitomo Chem Co Ltd 基材シート又はフィルム、及び粘着シート又はフィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000136361A (ja) * 1998-08-26 2000-05-16 Sekisui Chem Co Ltd 粘着シ―ト
JP4652060B2 (ja) * 2005-01-11 2011-03-16 日東電工株式会社 粘着テープ及び粘着テープ用基材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259938A (ja) * 1990-03-09 1991-11-20 Sumitomo Electric Ind Ltd ポリオレフィン樹脂組成物及びそれからの耐熱テープ
JP2001164209A (ja) * 1999-12-10 2001-06-19 Sumitomo Chem Co Ltd 基材シート又はフィルム、及び粘着シート又はフィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150482A (ja) * 2008-12-26 2010-07-08 Japan Wavelock Co Ltd モール用装飾テープバッキング材、モール用装飾テープ、及び、モール
JP2014077093A (ja) * 2012-10-11 2014-05-01 Furukawa Electric Co Ltd:The 電線接続部用難燃性絶縁防水カバー
EP3026717A1 (en) * 2014-11-28 2016-06-01 LG Innotek Co., Ltd. Light emitting device package
JP2016103636A (ja) * 2014-11-28 2016-06-02 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
US9673357B2 (en) 2014-11-28 2017-06-06 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
CN101631841A (zh) 2010-01-20
JPWO2008117685A1 (ja) 2010-07-15

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