WO2008110389A1 - Dispositif de commutateur micromécanique à amplification de force mécanique - Google Patents

Dispositif de commutateur micromécanique à amplification de force mécanique Download PDF

Info

Publication number
WO2008110389A1
WO2008110389A1 PCT/EP2008/002119 EP2008002119W WO2008110389A1 WO 2008110389 A1 WO2008110389 A1 WO 2008110389A1 EP 2008002119 W EP2008002119 W EP 2008002119W WO 2008110389 A1 WO2008110389 A1 WO 2008110389A1
Authority
WO
WIPO (PCT)
Prior art keywords
drive
switch
contact
switching
force
Prior art date
Application number
PCT/EP2008/002119
Other languages
German (de)
English (en)
Inventor
Jörg FRÖMEL
Sebastian Voigt
Steffen Kurth
Stefan Leidich
Andreas Bertz
Christian Kaufmann
Thomas Gessner
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Publication of WO2008110389A1 publication Critical patent/WO2008110389A1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate

Definitions

  • the invention relates to a micromechanical switch device for switching an interrupted RF signal line according to the preamble of the main claim.
  • a Surface technologies with structures actuated in a direction perpendicular to the device surface, as described, for example, in US Pat. No. 6,307,452 B1, or with structures activated in the lateral direction, as disclosed in US 2002/0153236 A1.
  • b Volume technology with structures actuated in the direction perpendicular to the component surface, as described, for example, in US 2004/0113727 A, or with structures activated laterally, as in M. Tang, et al. "A single-pole double-throw (SPDT) circuit using lateral metal-contact micromachined switches", from Sensors and Actuators A, Vol. 121, 2005, pages 187-196.
  • SPDT single-pole double-throw
  • ohmic switching contacts usually by the mechanical contact of at least two good conducting body and the capacitive switching function by the overlap of conductive surfaces with insulating layers therebetween arise, which at high signal frequencies only to develop a very small reaction.
  • Capacitive RF switches thus have a lower cut-off frequency at which the reactance becomes too high to transmit high-frequency signals with little loss and reflection. This disadvantage does not occur in ohmic working RF switches.
  • the reliability of an ohmic switch contact depends inter alia on the force with which the contact surfaces are pressed against each other or separated again.
  • the electrostatic force caused by a pair of driving electrodes is, according to equation (1), directly proportional to the discharge of the capacitance after the deflection of the electrodes, which in the hitherto known technical solutions corresponds to the movement of the switching contacts.
  • F el is the electrostatic force, which is directed to increase the capacitance C
  • U is the actuation voltage
  • ⁇ 0 is the permittivity of the vacuum
  • ⁇ r is the relative permittivity of the dielectric (usually air, shielding gas or vacuum)
  • X 0 is the electrode base distance without application of an actuation voltage U and A are the electrode base area
  • th the Electrode depth and x are the path of movement of the elec- trode in the direction of the electrostatic force. Since the change in the dielectric is practically impossible or all suitable media have similar relative permittivities, the electrostatic force can only be varied by varying the electrode base distance XQ or the electrode base area A.
  • the electrode base distance x 0 must be reduced or the electrode base area A must be increased.
  • the minimum electrode base distance x 0 to be set depends on the production technology and is generally between 1 and 10 ⁇ m. Any reduction of the electrode base distance X 0 is not permitted because in addition to numerous technological problems, the separation of the high frequency signal in the open state of the switch must be ensured and thus a certain contact distance is required. Capacitive crosstalk is only so sufficiently low.
  • Electrode base area A An essential parameter for increasing the contact force is therefore the electrode base area A, which is subject to a limitation of the magnification depending on the technology used.
  • the vertical actuation device described in US Pat. No. 6,307,452 Bl is, as mentioned, produced by means of surface technology.
  • Switch contact and movable actuator electrode are in this type of RF switch, the actual and only moving assembly.
  • An electrical separation between the switching contact and the actuator electrode is technologically difficult to achieve or not possible because of the use of the actuator electrode as an RF current path. Since the electrode base area A is directly connected to the RF current path in this case, the increase in the electrode base area A directly affects the high-frequency characteristics of the RF switch.
  • Electrode base area A can thus be designed independently of the behavior at high frequency.
  • a disadvantage of this technology is how For example, also shown in the cited document US 2004/0113727 Al, that the restoring force can be generated only by spring forces in the rule. The active resetting of the switching contact by means of electrostatic force in this case requires an additional wafer level and thus additional costs. Regardless of the technology used, vertical actuation is generally limited in that the electrode area can not be larger than the device footprint.
  • the invention has for its object to provide a micromechanical switch device for switching an RF signal line, which provides a high contact force for the switching contact for bridging the RF signal line and which is small and inexpensive to manufacture and good high-frequency properties and high reliability having.
  • the mechanical force amplification device has a lever arrangement with a predetermined transmission ratio, which is suspended by spring joints, since with such a lever arrangement, the force of the electrostatic drive is amplified, wherein the path of movement of the electrostatic drive is increased with respect to the travel of the switching contact ,
  • an elastic element with progressive action or a coupling is advantageously connected in the force flow of the drive to the switching contact, whereby in particular also the opening of the switching contact can be improved. Due to the increasing elongation of the elastic element with progressive action, the force transmitted to the switching contact is increased disproportionately larger and additionally reinforced by the kinetic energy of the comparatively faster movement of the electrostatic drive.
  • the electrostatic drive provided with a clutch by its kinetic energy, the force for opening the switching element and thus of the switch is generated. This happens because the drive is already in full motion when it is engaged by the coupling on the contact. attacks.
  • a further advantage of using a progressive-action elastic element is that by suitably dimensioning the progressive-action spring element using an electrostatic drive and varying the electrode distance, the relatively small generated electrostatic force at the beginning of the movement path can also counteract relatively small force of the spring element, ie the electrostatic drive with variation of the electrode spacing produces a force increasing progressively with respect to the travel, which can be better exploited with respect to maximum travel and end force when using a progressive spring joint or a spring element with progressive action than in combination with a linear spring element. This advantage also applies when using the coupling.
  • the variation of the electrode spacing in progressive spring makes sense, while the variation of the electrode coverage for levers with high gear ratio and a flywheel with clutch is to be selected.
  • the electrostatic drive is provided as a comb drive with a plurality of comb-like fixed electrodes and a plurality of comb-like movable electrodes which engage with each other.
  • the switch part by means of near-surface volume microtechnology is produced and the drive has a lateral actuation.
  • the structuring of monocrystalline silicon by means of anisotropic dry etching allows a largely free design of the drive and the high-frequency-carrying assemblies with high aspect ratio.
  • the electrode base area can be greatly increased with the same component base area and the realization of small ridge intervals and the implementation of force transmission are thus possible, with no additional material stresses in the silicon due to the use of monocrystalline silicon as the functional layer.
  • the electrostatic drive, the lever assembly, the spring joints and optionally the elastic element with progressive action and the coupling of a high-impedance silicon substrate are structured, wherein an insulating region is provided between the drive and switching contact for electrical isolation of the RF signal line.
  • the high-resistance silicon ensures sufficiently good insulation between the RF signal line and the electric drive.
  • the high-frequency-conducting switching contact can be electrically insulated from the drive carrying the electrode base area, and good high-frequency properties are ensured.
  • a substantial electrical insulation between the drive and the RF current path is given.
  • the switching contact may be rigid or preferably flexible, since in the latter case, the reliability of the switch is increased due to its lateral friction movement in conjunction with a high contact force.
  • the drive, the mechanical force amplification device with switching contact and the RF signal line are structured within a bonding frame of the switch part, which is tightly connected to a cover, wherein the cover has openings for access to electrical connection surfaces in a sealed manner. Due to the combination used near-surface micromechanics with encapsulation methods, which allows simultaneous encapsulation of all elements on the substrate
  • the ability to hermetically fire at wafer level allows the RF switch to be processed with conventional PCB technology, and by including a vacuum, switching times can be reduced.
  • the fabrication technology for this switch design is a near-surface volume technology such as Air Gap Insulated Microstructure (AIM) technology or Single Crystal Reactive Ion
  • Etching and Metallization (SCREAM) technology using highly resistive silicon as wafer material For electrostatic drive, these technologies allow for the production of an electrode area which can be larger than the chip area used for this purpose. Furthermore, these technologies enable the galvanic separation of the high-frequency signal line and the electrostatic drive.
  • a micromechanical HF switch which generates a higher contact force with the same operating parameters and the same chip footprint as in prior art RF switches, or which has a lower contact force for generating a contact force corresponding to the required reliability. voltage and / or a smaller chip area required.
  • To ensure good high-frequency characteristics of the switch contact is electrically isolated from the actuator and the reliability of the switch with a large number of switching cycles, eg 10 9 in terms of low contact resistance when switched on and high RF attenuation in the off state is given.
  • Fig. 1 is a schematic representation of the micromechanical switch device according to the invention with unidirectional drive
  • FIG. 2 is a schematic representation of the switch device according to the invention with a double-acting drive
  • Figure 3 is a schematic representation of a switch device according to the invention with double-acting drive and elastic elements with progressive action.
  • FIG. 4 shows a schematic illustration of the switch device according to the invention with a drive for closing and a drive for opening, wherein a coupling is provided between these drives;
  • Fig. 5 is a plan view of a switch part of the switch device according to the invention according to the operating principle of FIG.
  • FIG. 6 shows a plan view of a switch part of the switch device according to the invention according to the operating principle according to FIG. 2;
  • Figure 7 is a plan view of a switch part of the switch device according to the invention with a coupling according to the operating principle of FIG. 4.
  • Fig. 8 a closed with a lid Switch part in section, approximately corresponding to the dash-dotted section line in Fig. 7;
  • FIG. 9 shows a section through a switch device, which corresponds to that according to FIG. 8, but is manufactured by means of the AIM technology.
  • FIG. 1 shows an exemplary embodiment of the mechanism of action of the micromechanical switch device according to the invention, as implemented in the volume technology with structures activated in the lateral direction, as shown in FIG.
  • the mechanism of action according to FIG. 1 is provided with a lever arrangement 1 which is movable over a plurality of spring joints 2, wherein in the illustration according to FIG. 1 a spring joint 2 has an armature 3, which with the existing structure, in the present case with a Substrate, firmly connected.
  • a broken RF SignalIeitung 4 is indicated schematically, wherein a switching contact 5, which may be rigid or flexible, the broken line 4 can bridge.
  • the switching contact 5 is connected to one end of the lever arrangement 1.
  • End of the lever assembly is connected via the spring joint 2 with an electrostatic drive 6, which acts unidirectionally.
  • an electrostatic drive 6 which acts unidirectionally.
  • a force is applied to the lever assembly 1 via the spring joint 2, which transmits according to the gear ratio of the lever assembly 1 on the switching contact 5, whereby the switching contact is moved and pressed against the RF line and the switch is closed.
  • the switching contact 5 is replaced by the restoring force of the suspension Steer 2 opened and remains in the deactivated state of the drive in the open position.
  • the electrostatic drive 6 is, as will be described below, activated by an actuation voltage U.
  • a is the transmission ratio of the lever assembly 1 with respect to the force and k the rigidity of the spring joints on the contact side of the lever assembly 1 and x max the maximum distance covered by the switching contact 5. Since the force required to open depends mainly on the design of the switching contact 5, the contact material and the operating conditions such as RF power, humidity, etc., it can be assumed that a certain force for opening the contact, the causally only from the spring joints 2, for the sake of simplicity, is spoken only by a spring joint in the following. Thus, the path of movement of the electrostatic drive 6 ax max .
  • the applied by the electrostatic drive 6 for the closed switch state force on the contact Side of the lever assembly 1 results from the sum of the restoring force and the required for reliable closing contact force F k , which depends as well as the force to open the switching of the design of the switch contact 5, the contact material and the abovementioned operating conditions and by
  • the applied by the electrostatic drive 6 force is divided by the transmission ratio a and reduced. Under the exemplary assumption that the amounts of contact force for closing and opening the switch are the same, the force to be applied by the electrostatic drive 6 is about the
  • the force of the electrostatic drive 6 is amplified by the lever arrangement 1, wherein the movement path of the electrostatic drive 6 is increased with respect to the travel of the switching contact 5.
  • Electrostatic comb drive with variation of the electrode coverage are particularly suitable in this approach, because their force does not depend on the movement path x. With a long way on the drive side of the lever and a relatively small force of the drive with variation of the electrode coverage is low applicable. For mechanisms which require a small force at the beginning of the movement, which increases with increasing motion, the variation of the electrode spacing is useful (progressive spring).
  • a switch part 14 according to the operating principle of FIG.
  • the switch part 14 or the chip has a circumferential bonding frame 12, within which said components are arranged.
  • the switch part 14 is, as will be described below, connected to a cover through which the necessary for the electrical connection of the high-frequency line and the drive to the outside contacts or electrical connection surfaces 11 are accessible.
  • the RF line 4 which is produced by metal deposition, is denoted by 4, and the associated ground line with 13th RF line 4 and grounding line 13 are provided with pads 11, which surfaces are also surrounded by the bonding frame, which same hatching is indicated.
  • the bonding frame 12 itself is coated with an electrically conductive metallization, which, as will be explained below, serves as a bonding agent layer in the connection with the cover.
  • a comb drive which in the exemplary embodiment has two drive parts and which is designed according to the principle of varying the electrode cover.
  • a multiplicity of electrodes 28, which are fixedly connected to the substrate 27, and a multiplicity of movable electrodes 29 likewise arranged in the manner of a comb, are provided, wherein stationary and movable electrodes 28 and 29 intermesh with each other.
  • the movable electrodes 29 are connected to the lever assembly 1, wherein the lever assembly in this embodiment comprises two parallel in plan view in the resting state parallel beam members 30, each of which, as can be seen in the figure, with two rows of movable electrodes 29 are connected.
  • the beam parts 30 of the switching contact 5 is arranged, which may consist of one or, as shown, of two or more contact surfaces.
  • the beam parts branch off according to the drive 6 after both
  • FIG. 2 shows the basic illustration of a switch arrangement which differs from that according to FIG. 2 by a double-acting electrostatic drive 6 - 1, 6 - 2, ie this drive is designed such that it blocks the movement to close the Switching element 5 and also the opposite movement for opening the switching element 5 applies and thus acts bidirectionally. Since in this case the switching contact is not separated by the forces of the spring joint 2 but by the forces generated by the electrostatic drive 6, the spring joint can be dimensioned in comparison with the solution according to FIG. 1 or FIG. 5 with a much lower rigidity k , The spring joint 2 thus reduces the force of the electrostatic drive by a much smaller part than that in known solutions in which the Force is applied to open the switch contact by a spring, which is the case.
  • the spring joint 2 is expediently designed so that the switch remains in the switched-off position in the state without electrical activation.
  • a switch part 14 is shown with the principle of action of Fig. 2, wherein this embodiment to that of FIG. 5 in the lever assembly 1 and, as already mentioned, in the type of electrostatic drive 6 or 6-1 and 6-2 is different. Since the drive must be bidirectional, the implementation of a second fixed electrode system is necessary in the design as a comb drive. In the embodiment of FIG.
  • the entire drive 6 consists of two (in principle, it can be several) acting in the same direction areas (Teilananno ⁇ , which are arranged side by side and have ben ben the same structure, ie, both partial drives consist of two fixed electrode systems and a movable electrode system, wherein in each case the movable comb-like electrodes 33 are located between an electrode 31 of the first fixed electrode system and an electrode 32 of the second fixed electrode system.
  • the division into two or more partial drives has the advantage that the length of the bend due to the electrostatic force, the electromagnetically stressed electrodes and their deformation become smaller due to the electrostatic force.
  • the movable electrodes 33 are connected on the one hand via spring joints 2 fixedly connected to the substrate 27 anchors 3 and on the other hand in each case via a spring joint 2 with a relatively rigid beam 34 which acts on the end of an elongated lever 35.
  • This lever can, as can be seen from FIG. 6, be deflected by 90 ° and has the switching contact 5 at its end. Also, the lever is connected to a spring joint with an anchor.
  • the design of the lever arrangement 1 in interaction with the spring joints 2 and the electrical drives 6-1 and 6-2 effects the movement of the switching contact 5 in the direction of the RF signal line and away therefrom with power transmission and reduction of the travel.
  • the fixed first electrodes 31 of the drive 6-2 are subjected to a voltage, whereby the movable electrodes 33 move the lever arm over the beam 34 for closing the switching contact 5.
  • the same voltage is preferably applied to the second stationary electrodes 32 of the drive 6-1, whereby the drive 6-2 is no longer activated, as a result of which the movable electrodes 33 are connected to the beam 34 and the Move lever 35 in the opposite direction to open the switch contact 5.
  • lever arm 35 is provided in front of the switching contact 5 with an insulating region 20 which intersects the bonding ⁇ frame 5.
  • a further possible ⁇ ness of a device for power amplification or schematically - B transmission is provided, wherein in the power flow between the switching contact of the drive 6, an elastic member is inserted with progressive effect 7 and 5.
  • the two elasti ⁇ rule elements progressive power 7 serve to increase the force in opening and closing of the switch contact 5.
  • FIG. 4 A further basicSchsuspended coupling between a first on ⁇ drive 6 for opening and a second drive 6 for Closing the switch contact is arranged.
  • the left drive in FIG. 4 serves to close the contact element and the drive shown in the figure on the right is used together with the clutch 8 to open the switching contact 5.
  • the clutch 8 causes due to a built-in game that the power flow between the electrostatic right drive 6 and the switching contact only comes about when the drive 6 has already reached a certain speed. Its energy is used to generate the force required to open the switch on the switching contact.
  • An advantage of the embodiments of FIGS. 3 and 4 is that by suitable dimensioning of the spring element with progressive action 7 or the clutch 8 counteract when using an electrostatic drive while varying the electrode spacing of the relatively low electrostatic force generated at the beginning of the movement path also a relatively small force of the spring element can.
  • the force generated by the electrostatic drive 6 can better overcome the force of the spring joint 2 to achieve the maximum deflection.
  • a switch part 14 which implements the operation according to FIG. 4 with a lever arrangement and comprises a clutch 8.
  • the lever arrangement 1 corresponds in its embodiment to that according to FIG. 6.
  • the electrostatic drive 6 is divided in two oppositely acting areas 6-1 and 6-2 area.
  • the right drive 6-1 works on the principle of the distance variation of the electrodes and generates the
  • the movable electrodes 36 which in turn are suspended via spring joints 2 to anchors 3, connected to the end of the lever 35 of the lever assembly 1 via a spring joint.
  • the stiffness of the spring joints is much lower than that they could apply the force for opening the switching contact 5. Therefore, much of the power of the electrostatic drive 6-1 becomes effective as a contact force when the switch is closed.
  • the electrostatic drive 6-2 is not acted on during the closing of the switch or the switching contact 5 with an electrical voltage.
  • the electrostatic drive 6-2 operates on the principle of the variation of the electrode cover, wherein the drive is similar to that of FIG. 5 is formed. It has a plurality of interlocking fixed and movable comb-like electrodes 28, 29, wherein the movable electrodes 29 are connected to the coupling 8, which in turn is articulated to the lever 35.
  • the electrostatic drive 6-1 is not subjected to a voltage and the drive 6-2 is activated.
  • the latter is anchored elastically to the substrate 27 of the switch part 14 by means of spring joints 2 and armature 3 and moves in the direction of the increase in the electrical capacitance opposite to the effective direction of the electrostatic drive 6-1.
  • the clutch 8 causes by means of a built-in game, that the power flow between the electrostatic drive 6-2 and the lever 1 only comes about when the drive 6-2 and its movable electrode 29 have already reached a certain speed.
  • stored kinetic energy is a power surge transmitted via the lever 1 to the contact element 5, which is sufficiently large to disconnect the contacts.
  • pads 11 for the supply of voltages to the drives 6-2, 6-1 are provided.
  • the switching contact 5 is deformed when touching the high-frequency signal line 4 and thus enables reliable contact that a friction movement can take place.
  • FIG. 8 shows a section through a micromechanical switch device, wherein only the cover 9 is to be referred to here for the time being.
  • a lid is in the embodiments according to FIGS. 5 to 7 is used and a hermetic closure and a contacting of the electrostatic drive 6 and the high-frequency signal line 4 through the plated-through cover 9 made of glass or high-resistance silicon or other suitable material using a joining process, such as eutectic bonding, anodic bonding or glass-frit bonding achieved.
  • a joining process such as eutectic bonding, anodic bonding or glass-frit bonding
  • the switch part 14 is made of highly resistive silicon. After generating an SiO 2 layer 15 on the front and back of the substrate 27 of the switch part 14 trenches 16 and movable structures 17 are generated by means of lithographic structuring and a dry etching process with 9.wandpassivie- tion and subsequent free etching, which in the present case, for example include the lever 35. A subsequently produced partially or completely aluminum layer 18 serves as a high-frequency signal line and makes it possible to make contact with the electrodes of the electrostatic drive which are not to be recognized here, as well as the formation of the electrodes thereof.
  • the metallization is interrupted on the lever arrangement 1 in the insulating region 20 and thus an isolation of the high-frequency signal line 4 from the electrical potential of the electrostatic drive is achieved.
  • the region of the switching contact 5 and opposite regions of the high-frequency line 4 is coated with a layer or a layer stack of gold, platinum, titanium and tungsten or another suitable material.
  • the closure and the contacting of the connection surfaces is carried out with the aid of the plated-through cover 9 made of glass or another dielectric or another material which is dielectrically insulated in the region of the plated-through holes.
  • the lid 9 includes in the embodiment on the bottom etched recesses 19 to the mobility of the electrostatic drive 6, the lever assembly 1, the spring joints 2 and optionally the progressive spring element 7 or the clutch 8 to ensure.
  • the lid 9 is preferably thinned, e.g. to 50 microns thickness. This allows a simple etching of the openings 10. After removing the etching mask for the openings 10 are conductor structures and the
  • the contact pads 22 may be applied by chemical thickening and later provided with a solder bump for a flip-chip mounting process.
  • FIG. 9 shows a schematic cross-section of the high-frequency switch according to the invention in an alternative technology, partly using the AIM method.
  • the switch part 14 made of highly resistive silicon and the lid 9 of a substrate which is at least partially formed of polycrystalline, monocrystalline or amorphous silicon.
  • the aluminum layer 18 is produced and also structured.
  • the trenches 16 and movable structures 17 are worked out.
  • the undercutting of the aluminum support 23 takes place, so that the movable structures are mechanically connected only by these aluminum supports with the fixed areas.
  • Signal line 4 and the associated ground line 13 and the contact element 5 may e.g. metallized by means of shadow masks with gold and then the area of the switch contact 21 can also be metallized thick shadow mask.
  • the lid can in a wet or dry etching process recesses 19 obtained, which allow the movement of the structure. Thereafter, the underside is provided with a patterned gold metallization 24. The apertures 10 are etched from the top to the perforation.
  • the switch part 14 and the lid 9 are now connected in a eutectic joining process.
  • the SiO 2 layer 15 and the aluminum layer on the switch part 14 act as a barrier or conductive layer. This serves to prevent a continuous eutectic layer and is necessary because the contacting of the high-frequency signal line 4 with the connection surfaces 11 or the associated ground line 13 with corresponding connection surfaces 11 would not be sufficiently low due to the poor conductivity of the AuSi eutectic.
  • the above-described switch arrangement can be used in mobile communication for improving the flexibility of the terminals.
  • the use of small, high-quality micromechanical high-frequency switches according to the invention will bring about improvements in terms of insertion loss, isolation and above all in terms of energy efficiency in this context.

Abstract

L'invention concerne un dispositif de commutateur micromécanique destiné à commuter une ligne de signal HF interrompue, prévue sur un substrat. Le dispositif de commutateur comporte une partie de commutateur et un couvercle fermant la partie de commutateur. La partie de commutateur comporte au moins un contact de commutation ohmique destiné à ponter et séparer la ligne de signal HF, et un entraînement électrostatique présentant au moins une électrode fixe et une électrode mobile, destiné à actionner le contact de commutation. Un dispositif d'amplification de force mécanique est monté entre l'entraînement électrostatique et le contact de commutation. Le dispositif d'amplification de force peut être conçu en tant que système de levier et/ou élément élastique à effet progressif.
PCT/EP2008/002119 2007-03-14 2008-03-12 Dispositif de commutateur micromécanique à amplification de force mécanique WO2008110389A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007013102A DE102007013102A1 (de) 2007-03-14 2007-03-14 Mikromechanische Schaltervorrichtung mit mechanischer Kraftverstärkung
DE102007013102.1 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008110389A1 true WO2008110389A1 (fr) 2008-09-18

Family

ID=39651464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/002119 WO2008110389A1 (fr) 2007-03-14 2008-03-12 Dispositif de commutateur micromécanique à amplification de force mécanique

Country Status (2)

Country Link
DE (1) DE102007013102A1 (fr)
WO (1) WO2008110389A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2395533A1 (fr) 2010-06-09 2011-12-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif de commutation micro-mécanique à actionnement électrostatique
US10308506B2 (en) 2016-01-27 2019-06-04 International Business Machines Corporation Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011006397B4 (de) 2011-03-30 2020-06-04 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Verhakungsstruktur
WO2016086997A1 (fr) * 2014-12-04 2016-06-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Système microélectromécanique et son procédé de production
FR3095519B1 (fr) 2019-04-25 2021-03-26 Commissariat Energie Atomique Procédé non-invasif de détermination du genre d'un œuf
DE102020215027A1 (de) * 2020-11-30 2022-06-02 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanische Relaisvorrichtung und Verfahren zum Betreiben einer mikromechanischen Relaisvorrichtung
FR3135527A1 (fr) 2022-05-12 2023-11-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé et système de détermination d'une caractéristique d'un œuf d'un être vivant

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10031569A1 (de) * 1999-07-01 2001-02-01 Advantest Corp Integrierter Mikroschalter und Verfahren zu seiner Herstellung
US20060087390A1 (en) * 2004-10-21 2006-04-27 Fujitsu Component Limited Electrostatic relay
US20060144681A1 (en) * 2005-01-04 2006-07-06 Samsung Electronics Co., Ltd. Micro electro-mechanical system switch and method of manufacturing the same
EP1703532A1 (fr) * 2005-03-14 2006-09-20 Omron Corporation Commutateur microélectromécanique et son procédé de fabrication

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307452B1 (en) 1999-09-16 2001-10-23 Motorola, Inc. Folded spring based micro electromechanical (MEM) RF switch
US6535091B2 (en) * 2000-11-07 2003-03-18 Sarnoff Corporation Microelectronic mechanical systems (MEMS) switch and method of fabrication
US6621390B2 (en) 2001-02-28 2003-09-16 Samsung Electronics Co., Ltd. Electrostatically-actuated capacitive MEMS (micro electro mechanical system) switch
JP4066928B2 (ja) 2002-12-12 2008-03-26 株式会社村田製作所 Rfmemsスイッチ
JP4724488B2 (ja) * 2005-02-25 2011-07-13 日立オートモティブシステムズ株式会社 集積化マイクロエレクトロメカニカルシステム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10031569A1 (de) * 1999-07-01 2001-02-01 Advantest Corp Integrierter Mikroschalter und Verfahren zu seiner Herstellung
US20060087390A1 (en) * 2004-10-21 2006-04-27 Fujitsu Component Limited Electrostatic relay
US20060144681A1 (en) * 2005-01-04 2006-07-06 Samsung Electronics Co., Ltd. Micro electro-mechanical system switch and method of manufacturing the same
EP1703532A1 (fr) * 2005-03-14 2006-09-20 Omron Corporation Commutateur microélectromécanique et son procédé de fabrication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2395533A1 (fr) 2010-06-09 2011-12-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif de commutation micro-mécanique à actionnement électrostatique
US8610520B2 (en) 2010-06-09 2013-12-17 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Electrostatically actuated micro-mechanical switching device
US10308506B2 (en) 2016-01-27 2019-06-04 International Business Machines Corporation Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices
US11111136B2 (en) 2016-01-27 2021-09-07 International Business Machines Corporation Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices

Also Published As

Publication number Publication date
DE102007013102A1 (de) 2008-09-18

Similar Documents

Publication Publication Date Title
DE60314875T2 (de) Mikroelektromechanischer hf-schalter
WO2008110389A1 (fr) Dispositif de commutateur micromécanique à amplification de force mécanique
DE60222075T2 (de) Elektrostatischer Betätiger, und elektrostatisches Relais und andere Vorrichtungen unter Benutzung derselben
EP2510532B1 (fr) Dispositif micro-électromécanique (mems) pour commuter un signal électrique, système, circuit intégré et procédée de fabrication du circuit intégré
DE60313018T2 (de) Mikroelektromechanisches bauteil mit piezoelektrischem dünnfilmaktuator
DE60115086T2 (de) Kontaktstruktur für mikro-relais für rf-anwendungen
WO2006105924A1 (fr) Composant micromecanique, et son procede de production
DE602006000135T2 (de) Mikroelektromechanischer Schalter und Verfahren zu dessen Herstellung
DE102006061386B3 (de) Integrierte Anordnung, ihre Verwendung und Verfahren zu ihrer Herstellung
DE102015106260A1 (de) MEMS-Schalter mit internem leitenden Weg
WO2018162417A1 (fr) Actionneur mems électrostatique et procédé de fabrication de celui-ci
DE102007035633B4 (de) Verfahren zur Herstellung mikromechanischer Strukturen sowie mikromechanische Struktur
WO2021123147A1 (fr) Élément piézoélectrique mobile et son procédé de production
DE60311504T2 (de) Mikromechanisches relais mit anorganischer isolierung
DE60307136T2 (de) Mikromechanischer elektrostatischer schalter mit niedriger betätigungsspannung
EP1468436B1 (fr) Systeme micro-electromecanique et procede de fabrication
DE102006001321B3 (de) Mikromechanischer Hochfrequenz-Schalter für koplanare Wellenleiter
EP4057317A1 (fr) Élément commutateur mems encapsulé, dispositif et procédé de fabrication
EP1719144B1 (fr) Interrupteur mems haute frequence comportant un element de commutation courbe, et son procede de production
DE10360915A1 (de) Hochfrenquenz-Verriegelungsrelais mit Biegeschalterschiene
DE19800189A1 (de) Mikromechanischer Schalter und Verfahren zur Herstellung desselben
DE102006036499B4 (de) Mikromechanisches Bauelement
EP1246215B1 (fr) Microrelais à nouvelle construction
DE102008011175B4 (de) Mikromechanischer Aktuator und Verfahren zu seiner Herstellung
EP1665315B1 (fr) Composant pour la modification de l'impedance dans un guide d'ondes coplanaire, et procede de production d'un tel composant

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08716583

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08716583

Country of ref document: EP

Kind code of ref document: A1