WO2008099798A1 - ヒータおよびその製造方法 - Google Patents
ヒータおよびその製造方法 Download PDFInfo
- Publication number
- WO2008099798A1 WO2008099798A1 PCT/JP2008/052224 JP2008052224W WO2008099798A1 WO 2008099798 A1 WO2008099798 A1 WO 2008099798A1 JP 2008052224 W JP2008052224 W JP 2008052224W WO 2008099798 A1 WO2008099798 A1 WO 2008099798A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- heater
- resistive element
- heat resistive
- metal component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000009792 diffusion process Methods 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2064—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat combined with pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Landscapes
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/527,088 US9125241B2 (en) | 2007-02-13 | 2008-02-12 | Heater and method for manufacturing the same |
CN200880004815XA CN101606433B (zh) | 2007-02-13 | 2008-02-12 | 加热器 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-031639 | 2007-02-13 | ||
JP2007031639A JP2008198459A (ja) | 2007-02-13 | 2007-02-13 | ヒータおよびその製造方法 |
JP2007-161040 | 2007-06-19 | ||
JP2007161040A JP4937008B2 (ja) | 2007-06-19 | 2007-06-19 | ヒータ |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099798A1 true WO2008099798A1 (ja) | 2008-08-21 |
Family
ID=39690027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/052224 WO2008099798A1 (ja) | 2007-02-13 | 2008-02-12 | ヒータおよびその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9125241B2 (ja) |
WO (1) | WO2008099798A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10631371B2 (en) * | 2015-01-30 | 2020-04-21 | Rohm Co., Ltd. | Heater |
US10763018B2 (en) * | 2017-04-14 | 2020-09-01 | Panasonic Intellectual Property Management Co., Ltd. | Chip resistor |
JP7478344B2 (ja) * | 2020-04-09 | 2024-05-07 | 株式会社リコー | 電気コネクタ、加熱部材、定着装置及び画像形成装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003109727A (ja) * | 2001-09-28 | 2003-04-11 | Harison Toshiba Lighting Corp | 板状ヒータおよび定着装置ならびに画像形成装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4536887B2 (ja) * | 2000-08-25 | 2010-09-01 | ローム株式会社 | 発熱体、それを用いた定着器および発熱体の製造方法 |
JP2002108120A (ja) * | 2000-09-28 | 2002-04-10 | Toshiba Lighting & Technology Corp | 定着ヒータ、定着装置および画像形成装置 |
JP4593824B2 (ja) * | 2001-03-23 | 2010-12-08 | ローム株式会社 | 発熱体、それを用いた定着器および発熱体の製造方法 |
JP4170807B2 (ja) | 2002-04-01 | 2008-10-22 | ローム株式会社 | 画像定着装置 |
JP4675688B2 (ja) * | 2005-06-16 | 2011-04-27 | ローム株式会社 | 加熱体 |
-
2008
- 2008-02-12 US US12/527,088 patent/US9125241B2/en not_active Expired - Fee Related
- 2008-02-12 WO PCT/JP2008/052224 patent/WO2008099798A1/ja active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003109727A (ja) * | 2001-09-28 | 2003-04-11 | Harison Toshiba Lighting Corp | 板状ヒータおよび定着装置ならびに画像形成装置 |
Also Published As
Publication number | Publication date |
---|---|
US9125241B2 (en) | 2015-09-01 |
US20100032427A1 (en) | 2010-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010025696A3 (de) | Verfahren zur herstellung eines organischen strahlungsemittierenden bauelements und organisches strahlungsemittierendes bauelement | |
WO2008146243A3 (en) | An electronic device comprising a convertible structure, and a method of manufacturing an electronic device | |
WO2008045230A3 (en) | Contact electrode for microdevices and etch method of manufacture | |
EP1693478A3 (en) | Diffusion barrier for assemblies with metallic and silicon containing components and method therefor | |
WO2008029060A3 (fr) | Substrat pour dispositif electroluminescent organique, utilisation et procede de fabrication de ce substrat, ainsi que dispositif electroluminescent organique. | |
WO2006004929A3 (en) | Electrochemical deposition method utilizing microdroplets of solution | |
WO2007147602A3 (de) | Verfahren zur herstellung eines schaltungsteils auf einem substrat | |
WO2008019349A3 (en) | Thin film solar cell with finger pattern | |
WO2007137097A3 (en) | Single layer carbon nanotube-based structures and methods for removing heat from solid-state devices | |
WO2012129033A3 (en) | Conductive foils having multiple layers and methods of forming same | |
EP2107600A3 (en) | Demountable interconnect structure | |
TW200707643A (en) | Semiconductor device having through electrode and method of manufacturing the same | |
WO2008079247A3 (en) | Heater assembly for suture welder | |
EP2495768A3 (en) | Processes for forming photovoltaic conductive features from multiple inks | |
WO2010009716A3 (de) | Strahlungsemittierende vorrichtung und verfahren zur herstellung einer strahlungsemittierenden vorrichtung | |
TW200729516A (en) | Semiconductor device and method for fabricating the same | |
TW200802743A (en) | High frequency device module and method for manufacturing the same | |
WO2010134734A3 (ko) | 기판 표면 실장용 도전성 접촉 단자 | |
WO2006056999A3 (en) | Methods for manufacturing a sensor assembly | |
WO2007117829A3 (en) | Method for bonding a semiconductor substrate to a metal substrate | |
WO2006039907A3 (de) | Elektrischer schaltkreis mit einer nanostruktur und verfahren zum herstellen einer kontaktierung einer nanostruktur | |
WO2009005041A1 (ja) | 耐フレッティング性コネクタおよびその製造方法 | |
WO2010034304A3 (de) | Organisches elektronisches bauelement und verfahren zu dessen herstellung | |
WO2013090545A8 (en) | Photovoltaic cell and method of forming the same | |
TW200737382A (en) | Method of manufacturing semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880004815.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08711088 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12527088 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08711088 Country of ref document: EP Kind code of ref document: A1 |