WO2008099641A1 - Ｍｅｍｓマイクロホン装置 - Google Patents

Ｍｅｍｓマイクロホン装置 Download PDF

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Publication number
WO2008099641A1
WO2008099641A1 PCT/JP2008/050713 JP2008050713W WO2008099641A1 WO 2008099641 A1 WO2008099641 A1 WO 2008099641A1 JP 2008050713 W JP2008050713 W JP 2008050713W WO 2008099641 A1 WO2008099641 A1 WO 2008099641A1
Authority
WO
WIPO (PCT)
Prior art keywords
mems
mems microphone
microphone device
emphasis processing
mems chip
Prior art date
Application number
PCT/JP2008/050713
Other languages
English (en)
French (fr)
Inventor
Norio Kimura
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/526,744 priority Critical patent/US20100119087A1/en
Publication of WO2008099641A1 publication Critical patent/WO2008099641A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Pressure Sensors (AREA)

Abstract

　ＭＥＭＳマイクロホンの出力信号のＳ／Ｎ比が向上するとともに高域まで平坦な周波数特性が得られ、リフロー実装可能なＭＥＭＳマイクロホン装置を提供する。 　本発明のＭＥＭＳマイクロホンは、音信号を電気信号に変換するＭＥＭＳチップと、前記ＭＥＭＳチップを覆うシールドケースと、前記ＭＥＭＳチップが出力する信号にデエンファシス処理を施すデエンファシス回路と、を備え、前記シールドケースは、前記ＭＥＭＳチップに入力される信号にプリエンファシス処理を施す構造である。
PCT/JP2008/050713 2007-02-14 2008-01-21 Ｍｅｍｓマイクロホン装置 WO2008099641A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/526,744 US20100119087A1 (en) 2007-02-14 2008-01-21 Mems microphone device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-033297 2007-02-14
JP2007033297A JP4850086B2 (ja) 2007-02-14 2007-02-14 Ｍｅｍｓマイクロホン装置

Publications (1)

Publication Number Publication Date
WO2008099641A1 true WO2008099641A1 (ja) 2008-08-21

Family

ID=39689887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050713 WO2008099641A1 (ja) 2007-02-14 2008-01-21 Ｍｅｍｓマイクロホン装置

Country Status (4)

Country Link
US (1) US20100119087A1 (ja)
JP (1) JP4850086B2 (ja)
CN (1) CN101611634A (ja)
WO (1) WO2008099641A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073598A1 (ja) * 2008-12-24 2010-07-01 パナソニック株式会社 平衡信号出力型センサー

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4944760B2 (ja) * 2007-12-27 2012-06-06 ホシデン株式会社 エレクトレットコンデンサマイクロホン
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
JP5325554B2 (ja) * 2008-12-05 2013-10-23 船井電機株式会社 音声入力装置
JP5481852B2 (ja) 2008-12-12 2014-04-23 船井電機株式会社 マイクロホンユニット及びそれを備えた音声入力装置
JP2010245645A (ja) * 2009-04-01 2010-10-28 Panasonic Corp 半導体装置とその製造方法
JP5375311B2 (ja) 2009-04-28 2013-12-25 オムロン株式会社 電子部品実装装置及びその製造方法
JP4505035B1 (ja) * 2009-06-02 2010-07-14 パナソニック株式会社 ステレオマイクロホン装置
JP2011004097A (ja) * 2009-06-17 2011-01-06 Ube Industries Ltd 撥水性通気カバー、撥水性通気カバー付きトランスデューサー
JP2011049752A (ja) * 2009-08-26 2011-03-10 Star Micronics Co Ltd コンデンサマイクロホン
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
US8461655B2 (en) * 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
CN102868965A (zh) * 2012-09-14 2013-01-09 瑞声声学科技(深圳)有限公司 Mems麦克风的制造方法
CN105225671B (zh) 2014-06-26 2016-10-26 华为技术有限公司 编解码方法、装置及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230895A (ja) * 1989-03-03 1990-09-13 Nippon Telegr & Teleph Corp <Ntt> 音響信号入力装置
JPH0965482A (ja) * 1995-08-25 1997-03-07 Canon Inc 集音方法及び該方法を実施するマイクロホン装置
JPH11346394A (ja) * 1998-06-01 1999-12-14 Shinko Electric Co Ltd 消音装置用マイクロフォン
WO2005086534A1 (ja) * 2004-03-03 2005-09-15 Matsushita Electric Industrial Co., Ltd. エレクトレットコンデンサーマイクロフォンユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067363A (en) * 1996-06-03 2000-05-23 Ericsson Inc. Audio A/D convertor using frequency modulation
JP4004705B2 (ja) * 2000-02-29 2007-11-07 松下電器産業株式会社 撮像装置と撮像装置組立方法
DE102004011149B3 (de) * 2004-03-08 2005-11-10 Infineon Technologies Ag Mikrophon und Verfahren zur Herstellung eines Mikrophons
US7912232B2 (en) * 2005-09-30 2011-03-22 Aaron Master Method and apparatus for removing or isolating voice or instruments on stereo recordings
US7916879B2 (en) * 2005-12-16 2011-03-29 Novusonic Corporation Electrostatic acoustic transducer based on rolling contact micro actuator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230895A (ja) * 1989-03-03 1990-09-13 Nippon Telegr & Teleph Corp <Ntt> 音響信号入力装置
JPH0965482A (ja) * 1995-08-25 1997-03-07 Canon Inc 集音方法及び該方法を実施するマイクロホン装置
JPH11346394A (ja) * 1998-06-01 1999-12-14 Shinko Electric Co Ltd 消音装置用マイクロフォン
WO2005086534A1 (ja) * 2004-03-03 2005-09-15 Matsushita Electric Industrial Co., Ltd. エレクトレットコンデンサーマイクロフォンユニット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073598A1 (ja) * 2008-12-24 2010-07-01 パナソニック株式会社 平衡信号出力型センサー
CN102265644A (zh) * 2008-12-24 2011-11-30 松下电器产业株式会社 平衡信号输出型传感器
JPWO2010073598A1 (ja) * 2008-12-24 2012-06-07 パナソニック株式会社 平衡信号出力型センサー

Also Published As

Publication number Publication date
CN101611634A (zh) 2009-12-23
JP4850086B2 (ja) 2012-01-11
JP2008199353A (ja) 2008-08-28
US20100119087A1 (en) 2010-05-13

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