WO2008094009A1 - Appareil de génération uniforme de plasma à la pression atmosphérique - Google Patents

Appareil de génération uniforme de plasma à la pression atmosphérique Download PDF

Info

Publication number
WO2008094009A1
WO2008094009A1 PCT/KR2008/000617 KR2008000617W WO2008094009A1 WO 2008094009 A1 WO2008094009 A1 WO 2008094009A1 KR 2008000617 W KR2008000617 W KR 2008000617W WO 2008094009 A1 WO2008094009 A1 WO 2008094009A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma generation
generation apparatus
gas
electrode
power
Prior art date
Application number
PCT/KR2008/000617
Other languages
English (en)
Inventor
Bang Kwon Kang
Original Assignee
Bang Kwon Kang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080010285A external-priority patent/KR100872682B1/ko
Application filed by Bang Kwon Kang filed Critical Bang Kwon Kang
Priority to US12/449,252 priority Critical patent/US8373088B2/en
Priority to JP2009548157A priority patent/JP5594820B2/ja
Publication of WO2008094009A1 publication Critical patent/WO2008094009A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric

Definitions

  • the present invention relates to a plasma generation apparatus and, in particular, to an atmospheric pressure plasma generation method capable of uniformly and stably generating plasma at the atmospheric pressure with stable voltage supply.
  • the atmospheric pressure means the pressure exerted by the atmosphere as a result of gravitational attraction.
  • the atmospheric plasma or low temperature plasma
  • the atmospheric plasma processing technique allows iterative surface treatments, thereby dramatically increasing the productivity.
  • processing materials at atmospheric pressure reduce the capital cost of the vacuum chamber and eliminates restriction to the size of the workpiece.
  • FIG. 1 is a cross sectional view illustrating a conventional atmospheric plasma generation apparatus disclosed in Korean Patent Laid-Open Publication No. 10-516329 filed by the same applicant.
  • the plasma generation apparatus 100 includes a power supply electrode
  • a main plasma ground electrode 120 an auxiliary plasma ground electrode 130, a gas flow passage 140, and a power source 150.
  • the power supply electrode has a long cylindrical shape.
  • the main plasma ground electrode 120 is arranged below the power supply electrode 110, and the auxiliary plasma ground electrode 130 is arranged at one side of the power supply electrode 110.
  • the power supply electrode 110 is coated by a dielectric layer 111.
  • the gas flow passage 140 is formed between the power supply electrode 110 and the auxiliary plasma ground electrode 130 for supplying gas.
  • the power source 150 supplies radio frequency (RF) power to the power supply electrode 110.
  • the plasma generation apparatus 100 further includes a matching box (MB) 150.
  • the gas flow passage 140 is provided with a first passage 141, a second passage
  • the first passage 141 receives the gas input from outside of the plasma generation apparatus 100, and the second passage 143 is connected to the first passage 141 and formed in parallel with the power supply electrode 110.
  • the orifices 145 are formed along the longitudinal direction of the power supply electrode 110 so as to be connected to the second passage 143.
  • the gas mixture chamber 147 is formed along the longitudinal direction of the power supply electrode 110 and connected to the orifices 145 independently.
  • the gas mixture chamber 147 is connected to a discharge space formed between the power supply electrode 110 and the auxiliary plasma ground electrode 130.
  • a workpiece (M) is transferred to be positioned between the power supply electrode 110 and the main plasma ground electrode 140.
  • the plasma generation apparatus 100 of FIG. 1 can generates auxiliary plasma at a low voltage since the auxiliary plasma ground electrode 130 is positioned close the power supply electrode 110. As passing the auxiliary plasma, the energy level of the gas increases such that the gas passing the reactive space between the power supply electrode 110 and the main plasma ground electrode 120 can be changed to the plasma state with low voltage.
  • the cylindrical power supply electrode is connected to the power source 150 at its one end such that the RF power is not uniformly applied to the power supply electrode 100 in its longitudinal direction, resulting in unstable generation of plasma.
  • the convention plasma generation apparatus 100 is configured such that the outlets of the orifices 145 are directly oriented to the reaction space adjacent to the power supply electrode 110, whereby the gas passed the orifices 145 are not mixed enough. This causes irregular pressure distribution in the mixture space and fails supplying uniform pressure gas along the longitudinal direction of the power supply electrode 110, resulting in unstable plasma generation. Disclosure of Invention Technical Problem
  • the present invention has been made in an effort to solve the above problems, and it is an object of the present invention to provide an atmospheric plasma generation apparatus that is capable of stably generating uniform plasma at the atmospheric pressure.
  • the plasma generation apparatus includes a first conductor arranged to face a workpiece and having a power plate through power is applied; a second conductor arranged oppositely to a surface facing the workpiece along the first conductor for define a discharge space; and a gas supply unit having a gas supply passage for guiding gas to the discharge space and supporting the first and second conductors.
  • the first conductor includes a power supply electrode connected to the power plate, and at least one plasma generation electrode connected to the power supply electrode, at least one part, along a longitudinal direction.
  • the plasma generation apparatus further includes a dielectric member surrounding the plasma generation electrode except for one side connected to the power supply electrode.
  • the power supply unit is provided with a dielectric part adjacent to the dielectric member.
  • the power plate is formed having a width wider than that of the plasma generation electrode.
  • the plasma generation apparatus further includes a fixing means for fixing the plasma generation electrode to the gas supply unit.
  • the power plate includes a temperature adjustment means for adjusting temperature of the first conductor.
  • the temperature adjustment means is a hollow passage formed inside of the power plate.
  • the hollow passage penetrates the power plate in a zigzag pattern.
  • the power plate is provided with a gas supply passage for guiding the gas between the plasma generation electrodes.
  • the gas supply unit is made of a dielectric material.
  • the gas supply passage includes a gas inlet passage for leading the gas from outside; a buffer space formed to communicate with the gas inlet passage in a longitudinal direction; a mixture space formed having a distance with the buffer space and communicate with the discharge space along the longitudinal direction; and a plurality of orifices formed so as to orient from the buffer space to the mixture space horizontally.
  • the gas inlet passage is formed on a top surface of the gas supply unit in multiple numbers, and the buffer space is provided with sub-buffer spaces corresponding to the respective gas inlet passage, adjacent sub-buffer spaces being provided with a plurality of orifices isolated from each other.
  • the power is provided at a frequency range between 400Hhz and 600
  • the gas is a mixture gas including over 50% of inert gas, and the inert gas is any of argon, helium, or neon, or a mixture of at least two of the gases.
  • the plasma generation apparatus further includes a third conductor on which the workpiece is placed, the third conductor being not connected to ground.
  • the plasma generation apparatus further includes a dielectric plate on a top surface of the third conductor, the workpiece being placed on the dielectric plate.
  • the plasma generation apparatus further includes a third conductor on which the workpiece is placed, the third conductor being applied by a pulse power or a direct current power.
  • a power supply electrode of a plasma generation apparatus includes a power plate to which a power is applied; and at least one plasma generation electrode connected to the power supply electrode, at least one part, along a longitudinal direction.
  • the power supply electrode further includes a dielectric member surrounding the plasma generation electrode except for one side connected to the power supply electrode.
  • the dielectric member surrounds the plasma generation electrode expert for one side connected to the power plate, the dielectric member being made of at least one of quartz, glass, silicon, aluminum, and ceramic.
  • the power plate is provided with a temperature adjustment means for adjusting temperature of the plasma generation electrode.
  • the temperature adjustment means is a hollow passage formed inside of the power plate.
  • the hollow passage penetrates the power plate in a zigzag pattern.
  • the power plate is provided with a gas supply passage for guiding the gas between the plasma generation electrodes.
  • the atmospheric plasma generation apparatus of the present invention is advantageous since uniform plasma can be generated in stable manner at an atmospheric pressure on the basis of a stable voltage supply.
  • the atmospheric plasma generation apparatus of the present invention can supply gas into a discharge space in a stable manner.
  • FIG. 1 is a cross sectional view illustrating a conventional atmospheric plasma generation apparatus
  • FIG. 2 is a perspective view illustrating an atmospheric plasma generation apparatus according to an exemplary embodiment of the present invention
  • FIG. 3 is a disassembled perspective view illustrating the atmospheric plasma generation apparatus of FIG. 2
  • FIG. 4 is a perspective view illustrating a power supply electrode and a plasma generation electrode of the plasma generation apparatus according to an exemplary embodiment of the present invention
  • FIG. 45 FIG.
  • FIG. 5 is a perspective view illustrating a power electrode of a plasma generation apparatus according to an exemplary embodiment of the present invention
  • FIG. 6 is a perspective view illustrating an atmospheric plasma generation apparatus according to anther exemplary embodiment of the present invention
  • FIG. 7 is a perspective view illustrating a gas supply plate of the atmospheric plasma generation apparatus of FIG. 6
  • FIG. 8 is a perspective view illustrating a configuration of a plasma generation apparatus according to another exemplary embodiment of the present invention
  • FIG. 9 is a cross sectional view illustrating a configuration of a plasma generation apparatus according to another exemplary embodiment
  • FIG. 10 is a perspective view illustrating a gas supply plate of the plasma generation apparatus of FIG. 9
  • FIGs. 11 to 13 are cross sectional view illustrating a third ground of a plasma generation apparatus according to an exemplary embodiment of the present invention
  • FIGs. 14 to 17 are schematic views illustrating configurations of plasma generation apparatus according to exemplary embodiments of the present invention.
  • FIG. 2 is a perspective view illustrating an atmospheric plasma generation apparatus according to an exemplary embodiment of the present invention
  • FIG. 3 is a disassembled perspective view illustrating the atmospheric plasma generation apparatus of FIG. 2.
  • the atmospheric plasma generation apparatus 200 includes a gas supply unit 210, a first connection member 220, a second connection member 230, a cover 240, a first gas supplier 250a, a second gas supplier 250b, a first conductor including a power supply electrode 260 and a plasma generation electrode 270, and an interconnector 280.
  • the atmospheric plasma generation apparatus 200 may further include a dielectric member 271.
  • the atmospheric plasma generation apparatus 200 may include a second conductor in addition to the first conductor. Structures and operations of the plasma generation apparatus according to an exemplary embodiment of the present invention are described herein after with reference to FIGs. 3 to 7.
  • the first conductor is aligned to face the object to be processed. Referring to FIG.
  • the first conductor includes the power supply electrode 260 and the plasma generation electrode 270, and the power supply electrode 260 is provided with a power plate.
  • the power is stably supplied to the plasma generation electrode 270.
  • the size of the power plate increases as the length of the plasma generation electrode 270 increases such that the power can be uniformly supplied to the plasma generation electrode 270.
  • a plurality of plasma generation electrodes can be arranged and connected to the power supply electrode.
  • the plasma generation apparatus of the present invention is provided with one plasma generation electrode 270.
  • the frequency of the power is in the range of 400 kHz ⁇ 60 MHz. That is, the plasma generation apparatus of the present invention uses a voltage of high frequency.
  • the gas is a mixture gas including over 50% of inert gas, and the inert gas is any of argon, helium, or neon, or a mixture of at least two of the gases.
  • the plasma generation electrode 270 of the first conductor is arranged to face the object to be processed.
  • the plasma generation electrode 270 is formed in a semicircular rod.
  • the shape of the plasma generation electrode 270 is not limited thereto.
  • the plasma generation electrode 270 can be formed having a shape of a rectangular rod. That is, the shape of the surface of the plasma generation electrode 270, which is facing the object can be changed according to the shape of the plasma generation electrode 270.
  • the plasma generation electrode 270 is connected to the power supply electrode 260 at least one longitudinal end thereof.
  • the power plate forming the upper surface of the power supply electrode 260 is preferably formed to be wider than the upper surface of the plasma generation electrode 270.
  • the power supply electrode 260 is preferably formed such that its width is narrower than that of the upper surface of the plasma generation electrode 270. How the power supply electrode 260 and the plasma generation electrode 270 are connected to each other is described with reference to FIGs. 4 and 5.
  • FIG. 4 is a perspective view illustrating a power supply electrode and a plasma generation electrode of the plasma generation apparatus according to an exemplary embodiment of the present invention.
  • the power supply electrode 260 is formed in a shape of "T" in cross section.
  • the plasma generation electrode 270 is formed such that its top surface is entirely connected to the bottom surface of the power supply electrode 260 (see FIGs. 3 and 40. In this manner, the power supply electrode 260 and the plasma generation electrode 270 are connected with large connection surfaces to supply the power uniformly in longitudinal direction of the plasma generation electrode 270.
  • Each of the power supply electrode 260 and the plasma generation electrode is provided with at least one connection hole such that the power supply electrode 260 and the plasma generation electrode 270 are tightly connected by means of coupling member such as bolt.
  • the plasma generation apparatus 200 is provided with a dielectric member 271 surrounding the plasma generation electrode 270. As shown in FIG. 3, the dielectric member 271 surrounds the plasma generation electrode 270 except for the surface contacted with the power supply electrode 260.
  • the dielectric member 271 is made of any of quartz, glass, silicon, aluminum, and ceramic.
  • the entire top surface of the plasma generation electrode 270 is contacted with the bottom surface of the power supply electrode 260, and the dielectric member 271 surrounds the plasma generation electrode 270.
  • the plasma generation apparatus 200 further includes a fixing member 290 for fixing the plasma generation electrode to the gas supply unit 210.
  • the plasma generation electrode 270 connected to the power supply electrode 260 is connected to the gas supply unit 210 by means of the fixing member 290 such that the first conductor is fixed to the gas supply unit 210.
  • the power plate may be provided with a temperature adjustment means (not shown) for controlling the temperature of the first conductor. As shown in FIG. 3, the power plate is formed with a predetermined thickness and of which temperature is adjusted by the temperature adjustment means installed thereon.
  • the temperature adjustment means can be a temperature adjusting passage (not shown) formed so as to penetrate the power plate.
  • the temperature adjusting passage can be filled with fluid such as water.
  • the fluid can be cooled or heated water for decreasing or increasing the temperature of the power plate and, in turn, the first conductor. It is preferred that the temperature adjusting passage is formed in a zigzag pattern for improving the temperature adjustment effect.
  • the second conductor arranged with a distance to the object to be processed along the first conductor.
  • low parts of the gas supply plates 250a and 250b act as the second conductor.
  • mixture space 251a and 251b is formed between the plasma generation electrode 270 and the second conductor.
  • the gas supply unit 210 is provided with a gas supply passage for supplying the gas to the discharge space.
  • the first conductor is supported by the gas supply unit 210. The structure and function of the gas supply function is described later.
  • the first and second connection member 220 and 230 are provided with a plurality of connection holes for connecting to the gas supply unit 210 so as to be connected to the gas supply unit 210 by means of various coupling means such as bolt.
  • the first connection member 220 is provided with a power connection hole 221 to which a power source is connected and a gas supply hole 223 for supplying the gas from outside.
  • the power is supplied to the power plate of the first electrode 260 and 270 through a connector 280 penetrating the power connection hole 221.
  • the connector 280 and the power plate are connected to each other in various manners known to those skilled in the art.
  • the gas is guided to the gas supply passage of the gas supply unit 210 through the gas supply hole 223.
  • the gas is guided into the gas supply hole 223 through a gas supply line (e.g., hose).
  • a connection means are installed at the inlet of the gas supply hole 223 for receiving the gas supply line.
  • the inlet of the gas supply hole 223 is preferably formed with relatively large aperture for easy flowing of the gas.
  • a gas guide passage (not shown) is formed in the first connection member 220 in width direction. The gas guide passage is formed to communicate between the gas supply hole 233 and the gas inlet passage 225a and 225b. The detailed structure of the gas supply passage communicated with the gas guide passage is described later.
  • FIG. 6 is a perspective view illustrating an atmospheric plasma generation apparatus according to anther exemplary embodiment of the present invention
  • FIG. 7 is a perspective view illustrating a gas supply plate of the atmospheric plasma generation apparatus of FIG. 6.
  • the gas supply passage is formed along the gas supply member and the gas supply plate. Referring to FIGs. 6 and 7, the gas supply passage is formed with the gas inlet passages 255a and 255b, buffer spaces 253a and 253b, mixture space 251a and 251b, and a plurality of orifices 252a.
  • the gas led from outside through the gas supply hole 223 is guided to the gas inlet passages 255a and 255b via the gas guide passage communicating between the gas supply hole 223 and the gas inlet passage 255a and 255b.
  • the gas supply passage is formed in symmetrical manner on an axis of the first conductor. Accordingly, the right part of the gas supply passage is representatively described.
  • the gas inlet passage 255a is formed on the first conductor in its longitudinal direction.
  • a hole is formed for guiding the gas to the buffer space 253a. Accordingly, it is enough to form the gas inlet passage 255a to the hole rather than along the entire length of the gas supply unit 210. In order to secure the stable gas supply to the buffer space 253a, more than one hole can be formed.
  • the buffer space 253a is formed along the first conductor in its longitudinal direction and communicated with the gas inlet passage 255a through the hole.
  • the gas guided to the buffer space 253a through gas inlet passage 255a is buffered therein so as to be uniformly supplied along the longitudinal direction of the first conductor.
  • the buffered gas is supplied into the mixture space through the orifices 252a. As shown in FIG. 7, the orifices 252a are formed to the mixture space 251a at predetermined intervals along the first gas supply plate 250a.
  • the mixture space 25 Ia is formed along the buffer space 253a with a bank in between so as to communicate with the discharge space formed along the first conductor.
  • the mixture space 251a is provided with a vertical space and a horizontal space communicated with the discharge space.
  • the gas guided to the mixture space 251a through the orifices 252a formed in horizontal direction is buffered again in the vertical space and regulated by bumping to the vertical inner wall.
  • the gas regulated in such manner is mixed with the oxygen and then supplied to the discharge space.
  • the gas led to the discharge space through the gas supply passage is buffered and regulated twice in the buffer space 253a and the mixture space 251a. Accordingly, the plasma generation apparatus of the present invention can improve the uniformity of the mixture gas supplied in the discharge space in comparison with the conventional plasma generation apparatus.
  • the gas supply unit 210 is partially formed with an insulation part 210a facing the dielectric member 271. Without the insulation part 210a, capacitor effect generates at some portion adjacent to any of the plasma generation electrode 270, dielectric member 271, and gas supply unit 210 such that the power to be supplied to the plasma generation electrode is wasted.
  • the capacitor effect can be removed by forming the insulation part 210a on the gas supply unit 210 so as to protect unnecessary power waste, thereby increasing the reaction of the gas to the plasma generation electrode 270, resulting in improvement of the plasma generation efficiency.
  • the entire of the gas supply unit 210 can be made of a dielectric material. In this case, it is possible to protecting the generation of capacity between the dielectric member 271 and the portion 210a, thereby increasing the plasma generation efficiency.
  • the plasma generation electrode 270 is provided with passage holes 270a formed inside of the plasma generation electrode 270 unlike in FIG. 4. By flowing a temperature adjustment liquid such as water, the temperature of the plasma generation electrode 270 can be adjusted.
  • gas inlet passages 255a and 255b for guiding the gas to the buffer space are formed in the longitudinal direction, the gas inlet passages can be changed in various shapes.
  • FIG. 8 shows exemplary gas inlet passages.
  • FIG. 8 is a perspective view illustrating a configuration of a plasma generation apparatus according to another exemplary embodiment of the present invention.
  • the plasma generation apparatus has the same structure as in the FIG. 2 except for the structure of the gas inlet passages 255a' and 255b'. That is, the gas inlet passages 255a' and 255b' of the plasma generation apparatus of FIG. 8 is formed in vertical direction relative to the top surface of the gas supply unit so as to communicate to the buffer space 253a.
  • FIG. 9 is a cross sectional view illustrating a configuration of a plasma generation apparatus according to another exemplary embodiment
  • FIG. 10 is a perspective view illustrating a gas supply plate of the plasma generation apparatus of FIG. 9.
  • the plasma generation apparatus of FIG. 9 is similar to the plasma generation apparatus of FIG. 8 in the directions of the gas inlet passages 255al, 255a2, and 255a3. However, the shapes of the gas inlet passages of the two plasma generation apparatus are different from each other.
  • the buffer space of the gas supply plate is provided with a plurality sub-buffer space 253al, 253a2, and 253a3 corresponding to the gas inlet passages 255al, 255a2, and 255a3.
  • the sub-buffer spaces 253al, 253a2, and 253a3 are independently formed and have respective orifices 252a.
  • the plasma generation apparatus can selectively supply the gas to the plasma generation electrode. If only the first gas inlet passage 255al is selected, the gas is supplied to the plasma generation electrode through its corresponding orifices 252a of the sub-buffer space 253al such that the plasma is generated at a corresponding portion.
  • the buffer space is divided into several sub-buffer spaces by partitions (P), and each sub-buffer space is provided with gas outlets corresponding to the gas inlet passage.
  • FIGs. 11 to 13 are cross sectional view illustrating a third ground of a plasma generation apparatus according to an exemplary embodiment of the present invention.
  • the plasma generation apparatus is provided with a third conductor 300.
  • the object (PS) is placed on the third conductor 300 and processed by the plasma gas.
  • the third conductor is connected to ground. This is because, in the case of using low frequency voltage, plasma may not be generated without ground connection.
  • high frequency voltage is used such that the plasma is generated without ground connection of the third conductor 300.
  • the plasma generation apparatus is provided with a dielectric member 310 between the third conductor 300 and the object to be processed.
  • the dielectric member 310 prevents an electric art from being generated between the first conductor and the third conductor 300 when a high voltage is applied therebetween.
  • the third conductor 300 on which the object to be processed is placed, is applied by a pulse power or a direct current power (BS).
  • BS direct current power
  • the negative ions and positive ions are accelerated, thereby improving efficiency of the deposition or etching process.
  • the plasma generation apparatus of the present invention is not limited to such configuration.
  • the plasma generation apparatus of the present invention can be configured with more than on plasma generation electrode.
  • FIGs. 14 to 17 are schematic views illustrating configurations of plasma generation apparatus according to exemplary embodiments of the present invention.
  • FIGs. 14 to 17 are schematically depicted in the drawings, however, it is obvious to those skilled in the art that the configurations of the plasma generation apparatus depicted in FIGs. 14 to 17 are not deviate from the scope of the present invention.
  • the plasma generation apparatus' of FIGs. 14 to 17 are implemented with one or three plasma generation electrodes, the number of the plasma generation electrodes is not limited thereto.
  • FIG. 14 is a conceptual view illustrating the plasma generation apparatus configured as in FIGs. 2 to 7, and FIG. 15 is a conceptual view illustrating a modified version of the plasma generation apparatus of FIG. 14.
  • the power supply electrode (i.e., the first conductor) of the plasma generation apparatus is provided with a power plate, to which the power is applied, and at least one plasma generation electrode.
  • the plasma generation electrode is connected to the power plate entirely or partially in longitudinal direction.
  • the plasma generation apparatus of FIG. 16 is implemented with three plasma generation electrodes that are surrounded by dielectric material and isolated from each other by means of the dielectric materials in between.
  • the plasma generation apparatus of FIG. 17 is implemented with three plasma generation electrodes that are independently surrounded by respective dielectric materials, and the gas can flow through gaps formed between the plasma generation electrodes.
  • the plasma generation apparatus of the present invention can be applied to various plasma processing fields.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)

Abstract

L'invention concerne un appareil de génération de plasma à la pression atmosphérique permettant de générer le plasma à la pression atmosphérique par une alimentation en tension stable. L'appareil de génération de plasma de cette invention comprend un premier conducteur disposé de façon à être opposé à une pièce et possédant une plaque électrique dans laquelle est envoyé le courant; un second conducteur disposé à l'opposé d'une surface opposée à la pièce le long du premier conducteur pour définir un espace d'évacuation; et une unité d'alimentation de gaz comportant un passage pour guider le gaz vers l'espace d'évacuation et supportant les premier et second conducteurs. L'appareil de génération de plasma à la pression atmosphérique de cette invention est avantageux puisque le plasma peut être généré de manière uniforme et stable à une pression atmosphérique sur la base d'une alimentation en tension stable.
PCT/KR2008/000617 2007-02-02 2008-02-01 Appareil de génération uniforme de plasma à la pression atmosphérique WO2008094009A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/449,252 US8373088B2 (en) 2007-02-02 2008-02-01 Apparatus for uniformly generating atmospheric pressure plasma
JP2009548157A JP5594820B2 (ja) 2007-02-02 2008-02-01 均一な常圧プラズマ発生装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070011149 2007-02-02
KR10-2007-0011149 2007-02-02
KR1020080010285A KR100872682B1 (ko) 2007-02-02 2008-01-31 균일한 상압 플라즈마 발생장치
KR10-2008-0010285 2008-01-31

Publications (1)

Publication Number Publication Date
WO2008094009A1 true WO2008094009A1 (fr) 2008-08-07

Family

ID=39674262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/000617 WO2008094009A1 (fr) 2007-02-02 2008-02-01 Appareil de génération uniforme de plasma à la pression atmosphérique

Country Status (1)

Country Link
WO (1) WO2008094009A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052250A (zh) * 2012-12-10 2013-04-17 中国科学院等离子体物理研究所 大气压弥散型冷等离子体发生装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338398A (ja) * 2002-05-17 2003-11-28 Sekisui Chem Co Ltd 放電プラズマ処理方法及びその装置
JP2006073354A (ja) * 2004-09-02 2006-03-16 Matsushita Electric Ind Co Ltd プラズマ処理装置
US20060152163A1 (en) * 2003-06-20 2006-07-13 Ngk Insulators, Ltd. Plasma generating electrode, plasma generation device, and exhaust gas purifying apparatus
JP2006244938A (ja) * 2005-03-07 2006-09-14 Tokai Univ プラズマ発生装置及びプラズマ発生方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338398A (ja) * 2002-05-17 2003-11-28 Sekisui Chem Co Ltd 放電プラズマ処理方法及びその装置
US20060152163A1 (en) * 2003-06-20 2006-07-13 Ngk Insulators, Ltd. Plasma generating electrode, plasma generation device, and exhaust gas purifying apparatus
JP2006073354A (ja) * 2004-09-02 2006-03-16 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2006244938A (ja) * 2005-03-07 2006-09-14 Tokai Univ プラズマ発生装置及びプラズマ発生方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052250A (zh) * 2012-12-10 2013-04-17 中国科学院等离子体物理研究所 大气压弥散型冷等离子体发生装置

Similar Documents

Publication Publication Date Title
US8373088B2 (en) Apparatus for uniformly generating atmospheric pressure plasma
TWI440405B (zh) 電容式耦合電漿反應器
KR100736218B1 (ko) 횡 방향의 다중 전극 구조를 가지는 평행 평판형 플라즈마소스
JP5519498B2 (ja) 単一の平面アンテナを備えた誘導結合二重ゾーン処理チャンバ
US8518284B2 (en) Plasma treatment apparatus and method for plasma-assisted treatment of substrates
TW521298B (en) Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma
JP2021093363A (ja) プラズマ点源のアレイによってワークピースを処理するためのプラズマリアクタ
US8097217B2 (en) Atmospheric pressure plasma generating apparatus by induction electrode
KR101496841B1 (ko) 혼합형 플라즈마 반응기
KR20090008932A (ko) 멀티 코어 플라즈마 발생 플레이트를 구비한 플라즈마반응기
KR101607520B1 (ko) 기판 처리 장치 및 기판 처리 방법
WO2008094009A1 (fr) Appareil de génération uniforme de plasma à la pression atmosphérique
KR20110118206A (ko) 축전 결합 플라즈마 발생 장치 및 그 형성 방법
KR101507390B1 (ko) 용량 결합 플라즈마 반응기
KR101273233B1 (ko) 플라즈마 처리장치
KR100785404B1 (ko) 유도 결합형 플라즈마 안테나 및 이를 이용한 기판 처리장치와 방법
KR101092881B1 (ko) 축전 결합 플라즈마 발생 장치 및 축전 결합 플라즈마 발생 방법
KR20090073327A (ko) 고밀도 원격 플라즈마 처리 장치
KR20160081006A (ko) 샤워 헤드 유닛 및 이를 포함하는 기판 처리 장치
KR100883561B1 (ko) 자속 채널에 결합된 기판 처리 챔버를 구비한 플라즈마반응기
KR101213391B1 (ko) 기판처리장치
KR102518875B1 (ko) 대기압 플라즈마 기판처리장치
KR100855705B1 (ko) 상압 플라즈마 발생장치
KR20100136857A (ko) 다중 플라즈마 발생 영역을 갖는 플라즈마 반응기
KR102398023B1 (ko) 고밀도 상압 플라즈마 발생장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08712273

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009548157

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12449252

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08712273

Country of ref document: EP

Kind code of ref document: A1