WO2008090653A1 - Appareil d'imagerie, procédé d'assemblage d'appareil d'imagerie et terminal portable - Google Patents

Appareil d'imagerie, procédé d'assemblage d'appareil d'imagerie et terminal portable Download PDF

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Publication number
WO2008090653A1
WO2008090653A1 PCT/JP2007/070802 JP2007070802W WO2008090653A1 WO 2008090653 A1 WO2008090653 A1 WO 2008090653A1 JP 2007070802 W JP2007070802 W JP 2007070802W WO 2008090653 A1 WO2008090653 A1 WO 2008090653A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging apparatus
package sensor
wiring board
printed wiring
lens unit
Prior art date
Application number
PCT/JP2007/070802
Other languages
English (en)
Japanese (ja)
Inventor
Shigenori Kiyosue
Yoshito Katagiri
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2008517665A priority Critical patent/JP4211874B2/ja
Publication of WO2008090653A1 publication Critical patent/WO2008090653A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

L'invention concerne un appareil d'imagerie qui peut entretenir la conduction au niveau du joint de soudure d'un détecteur de boîtier de type BGA et d'une carte de circuits imprimés par un agencement simple, même lorsqu'une charge d'impact est appliquée. L'appareil d'imagerie comprend une unité de lentille comprenant une lentille d'imagerie pour former l'image objet dans un élément d'imagerie, un détecteur de boîtier de type BGA comprenant l'élément d'imagerie, une carte de circuits imprimés liée par soudure au détecteur de boîtier, et un boîtier de protection formé d'une plaque métallique et recouvrant le détecteur de boîtier à partir du côté de l'unité de lentille. Dans un état où l'unité de lentille et le détecteur de boîtier sont liés et où l'unité de lentille est amenée à adhérer au boîtier de protection, le détecteur de boîtier et la carte de circuits imprimés sont reliés par soudure et l'extrémité du boîtier de protection est reliée par soudure à la carte de circuits imprimés.
PCT/JP2007/070802 2007-01-24 2007-10-25 Appareil d'imagerie, procédé d'assemblage d'appareil d'imagerie et terminal portable WO2008090653A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008517665A JP4211874B2 (ja) 2007-01-24 2007-10-25 撮像装置、撮像装置の組立方法及び携帯端末

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007013587 2007-01-24
JP2007-013587 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090653A1 true WO2008090653A1 (fr) 2008-07-31

Family

ID=39644231

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070802 WO2008090653A1 (fr) 2007-01-24 2007-10-25 Appareil d'imagerie, procédé d'assemblage d'appareil d'imagerie et terminal portable

Country Status (2)

Country Link
JP (1) JP4211874B2 (fr)
WO (1) WO2008090653A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013108996A (ja) * 2013-03-12 2013-06-06 Mega Chips Corp 衝撃検知装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002247425A (ja) * 2001-02-15 2002-08-30 Sony Corp 電子スチルカメラ
JP2004296862A (ja) * 2003-03-27 2004-10-21 Seiko Precision Inc 固体撮像装置
JP2005086100A (ja) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd 固体撮像装置
JP2005303079A (ja) * 2004-04-13 2005-10-27 Fujitsu Ltd 実装基板
JP2005312002A (ja) * 2004-04-23 2005-11-04 Premier Image Technology Corp レンズモジュールの実装方法及びその構造
JP2005347660A (ja) * 2004-06-07 2005-12-15 Alps Electric Co Ltd 面実装部品の取付構造、及びその取付方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002247425A (ja) * 2001-02-15 2002-08-30 Sony Corp 電子スチルカメラ
JP2004296862A (ja) * 2003-03-27 2004-10-21 Seiko Precision Inc 固体撮像装置
JP2005086100A (ja) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd 固体撮像装置
JP2005303079A (ja) * 2004-04-13 2005-10-27 Fujitsu Ltd 実装基板
JP2005312002A (ja) * 2004-04-23 2005-11-04 Premier Image Technology Corp レンズモジュールの実装方法及びその構造
JP2005347660A (ja) * 2004-06-07 2005-12-15 Alps Electric Co Ltd 面実装部品の取付構造、及びその取付方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013108996A (ja) * 2013-03-12 2013-06-06 Mega Chips Corp 衝撃検知装置

Also Published As

Publication number Publication date
JPWO2008090653A1 (ja) 2010-05-13
JP4211874B2 (ja) 2009-01-21

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