WO2008087851A1 - Flexible substrate and semiconductor device - Google Patents

Flexible substrate and semiconductor device Download PDF

Info

Publication number
WO2008087851A1
WO2008087851A1 PCT/JP2007/075243 JP2007075243W WO2008087851A1 WO 2008087851 A1 WO2008087851 A1 WO 2008087851A1 JP 2007075243 W JP2007075243 W JP 2007075243W WO 2008087851 A1 WO2008087851 A1 WO 2008087851A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
wiring patterns
semiconductor device
metal foil
forming region
Prior art date
Application number
PCT/JP2007/075243
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuyuki Naitoh
Hiroaki Kitazaki
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008087851A1 publication Critical patent/WO2008087851A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Abstract

Disclosed is a flexible substrate (1) which comprises a base (3) having an upper surface including a semiconductor chip-mounting region (8) and a metal foil pattern-forming region (4). A plurality of wiring patterns (2) composed of a copper foil are formed in the metal foil pattern-forming region (4). In a part of the metal foil pattern-forming region (4), a plurality of wiring patterns (2) are formed so that the ratio of the width of the wiring patterns (2) to the interval between the wiring patterns (2) is more than 1 but not more than 8.7.
PCT/JP2007/075243 2007-01-19 2007-12-28 Flexible substrate and semiconductor device WO2008087851A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007010157A JP4185954B2 (en) 2007-01-19 2007-01-19 Flexible substrate and semiconductor device
JP2007-010157 2007-01-19

Publications (1)

Publication Number Publication Date
WO2008087851A1 true WO2008087851A1 (en) 2008-07-24

Family

ID=39635856

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075243 WO2008087851A1 (en) 2007-01-19 2007-12-28 Flexible substrate and semiconductor device

Country Status (3)

Country Link
JP (1) JP4185954B2 (en)
TW (1) TW200843071A (en)
WO (1) WO2008087851A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022093692A (en) * 2019-08-27 2022-06-23 ルネサスエレクトロニクス株式会社 Semiconductor device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4983386B2 (en) * 2007-05-15 2012-07-25 住友金属鉱山株式会社 COF wiring board
JP5325684B2 (en) * 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 Semiconductor device
US8917227B2 (en) * 2011-10-05 2014-12-23 Panasonic Corporation Display
JP2014082481A (en) * 2012-09-28 2014-05-08 Nichia Chem Ind Ltd Light-emitting device
EP3417760A1 (en) * 2012-10-23 2018-12-26 Olympus Corporation Semiconductor apparatus, and manufacturing method of semiconductor apparatus
JP6076048B2 (en) * 2012-11-12 2017-02-08 オリンパス株式会社 Imaging apparatus and endoscope
JP5657767B2 (en) * 2013-10-30 2015-01-21 ルネサスエレクトロニクス株式会社 Semiconductor device
JP5878611B2 (en) * 2014-11-26 2016-03-08 ルネサスエレクトロニクス株式会社 Semiconductor device
JP6870043B2 (en) * 2019-08-27 2021-05-12 ルネサスエレクトロニクス株式会社 Semiconductor device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032229A (en) * 1996-03-26 1998-02-03 Canon Inc Tcp structure, circuit connection structure, and display device
JPH1145913A (en) * 1997-05-26 1999-02-16 Seiko Epson Corp Film carrier and semiconductor device
JP2000031612A (en) * 1998-07-09 2000-01-28 Seiko Epson Corp Wiring board
JP2000323525A (en) * 1999-05-10 2000-11-24 Nec Corp Mounting structure of semiconductor device and its manufacture
JP3093150U (en) * 2002-10-01 2003-04-18 船井電機株式会社 IC positioning structure for printed circuit board of remote controller and IC positioning structure for printed circuit board.
JP2003289087A (en) * 2002-03-28 2003-10-10 Seiko Epson Corp Wiring board, semiconductor device, its manufacturing method, panel module, and electronic apparatus
JP2004096072A (en) * 2003-05-12 2004-03-25 Victor Co Of Japan Ltd Wiring board
JP2005109254A (en) * 2003-09-30 2005-04-21 Optrex Corp Integrated circuit mounting substrate and display device equipped with same
JP2005294639A (en) * 2004-04-01 2005-10-20 Ibiden Co Ltd Flex rigid wiring board
JP2006032872A (en) * 2004-07-22 2006-02-02 Sony Corp Circuit board and semiconductor device
JP2006196878A (en) * 2004-12-16 2006-07-27 Mitsui Mining & Smelting Co Ltd Flexible printed wiring board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110202A (en) * 2001-09-28 2003-04-11 Toshiba Corp Card-type electronic equipment
JP2006351976A (en) * 2005-06-20 2006-12-28 Murata Mfg Co Ltd Circuit module and circuit device
JP2008010496A (en) * 2006-06-27 2008-01-17 Victor Co Of Japan Ltd Method of making mounting substrate

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032229A (en) * 1996-03-26 1998-02-03 Canon Inc Tcp structure, circuit connection structure, and display device
JPH1145913A (en) * 1997-05-26 1999-02-16 Seiko Epson Corp Film carrier and semiconductor device
JP2000031612A (en) * 1998-07-09 2000-01-28 Seiko Epson Corp Wiring board
JP2000323525A (en) * 1999-05-10 2000-11-24 Nec Corp Mounting structure of semiconductor device and its manufacture
JP2003289087A (en) * 2002-03-28 2003-10-10 Seiko Epson Corp Wiring board, semiconductor device, its manufacturing method, panel module, and electronic apparatus
JP3093150U (en) * 2002-10-01 2003-04-18 船井電機株式会社 IC positioning structure for printed circuit board of remote controller and IC positioning structure for printed circuit board.
JP2004096072A (en) * 2003-05-12 2004-03-25 Victor Co Of Japan Ltd Wiring board
JP2005109254A (en) * 2003-09-30 2005-04-21 Optrex Corp Integrated circuit mounting substrate and display device equipped with same
JP2005294639A (en) * 2004-04-01 2005-10-20 Ibiden Co Ltd Flex rigid wiring board
JP2006032872A (en) * 2004-07-22 2006-02-02 Sony Corp Circuit board and semiconductor device
JP2006196878A (en) * 2004-12-16 2006-07-27 Mitsui Mining & Smelting Co Ltd Flexible printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022093692A (en) * 2019-08-27 2022-06-23 ルネサスエレクトロニクス株式会社 Semiconductor device
JP7318055B2 (en) 2019-08-27 2023-07-31 ルネサスエレクトロニクス株式会社 semiconductor equipment

Also Published As

Publication number Publication date
JP4185954B2 (en) 2008-11-26
TW200843071A (en) 2008-11-01
JP2008177402A (en) 2008-07-31

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