WO2008087796A1 - Holding apparatus and holding method - Google Patents

Holding apparatus and holding method Download PDF

Info

Publication number
WO2008087796A1
WO2008087796A1 PCT/JP2007/072662 JP2007072662W WO2008087796A1 WO 2008087796 A1 WO2008087796 A1 WO 2008087796A1 JP 2007072662 W JP2007072662 W JP 2007072662W WO 2008087796 A1 WO2008087796 A1 WO 2008087796A1
Authority
WO
WIPO (PCT)
Prior art keywords
holding
support
protective sheet
jet holes
state
Prior art date
Application number
PCT/JP2007/072662
Other languages
French (fr)
Japanese (ja)
Inventor
Masaki Tsujimoto
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2008087796A1 publication Critical patent/WO2008087796A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

This invention provides a holding apparatus comprising a support (13), which faces a large number of chips (W) supported by a protective sheet (S), and gas supply means (14) for supplying gas to the support (13). The support (13) comprises a plurality of jet holes (25) and a cylindrical part (23) for discharging gas ejected from the jet holes (25) upward. Even when the protective sheet (S) is in a warped or other unfavorable state, the heated gas ejected from the jet holes (25) acts on the protective sheet (S) so as to correct the state, whereby the chips (W) can be held in a non-contact state by Bernoulli effect.
PCT/JP2007/072662 2007-01-15 2007-11-22 Holding apparatus and holding method WO2008087796A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-005712 2007-01-15
JP2007005712A JP5080090B2 (en) 2007-01-15 2007-01-15 Holding device and holding method

Publications (1)

Publication Number Publication Date
WO2008087796A1 true WO2008087796A1 (en) 2008-07-24

Family

ID=39635802

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072662 WO2008087796A1 (en) 2007-01-15 2007-11-22 Holding apparatus and holding method

Country Status (3)

Country Link
JP (1) JP5080090B2 (en)
TW (1) TW200834806A (en)
WO (1) WO2008087796A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008147558A1 (en) * 2007-05-25 2008-12-04 Corning Incorporated Apparatus for handling a glass sheet
WO2010048254A1 (en) * 2008-10-23 2010-04-29 Corning Incorporated High temperature sheet handling system and methods
CN104179781A (en) * 2013-05-22 2014-12-03 由田新技股份有限公司 Adsorption device and vacuum adsorption equipment capable of adsorbing soft object
CN106505019A (en) * 2016-11-30 2017-03-15 武汉帝尔激光科技股份有限公司 A kind of anti-light laser process equipment that declines of full automatic solar cell piece
WO2018171909A1 (en) * 2017-03-21 2018-09-27 Applied Materials, Inc. Apparatus and method for holding a substrate, apparatus and method for loading a substrate into a vacuum processing module, and system for vacuum processing of a substrate
WO2019018786A1 (en) * 2017-07-21 2019-01-24 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
GB2572016A (en) * 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
CN111115286A (en) * 2019-12-21 2020-05-08 江苏达晨冠图电气科技有限公司 Automatic test production line for zinc oxide resistance card with high work smoothness
EP3866184A1 (en) * 2012-11-30 2021-08-18 Nikon Corporation Carrier system, exposure apparatus and carry-in method
CN113921441A (en) * 2021-11-18 2022-01-11 苏州尊恒半导体科技有限公司 Suspension type wafer positioning device
US11235939B2 (en) 2017-08-10 2022-02-01 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter
US11420830B2 (en) 2017-08-10 2022-08-23 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009028862A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
US8231157B2 (en) * 2008-08-28 2012-07-31 Corning Incorporated Non-contact manipulating devices and methods
JP5159528B2 (en) * 2008-09-09 2013-03-06 リンテック株式会社 Device and method for supporting plate member
JP5145209B2 (en) * 2008-12-25 2013-02-13 株式会社アルバック Vacuum processing equipment
EP2863421B1 (en) 2010-12-20 2021-04-14 EV Group E. Thallner GmbH Holder device for holding wafers
JP2013141651A (en) * 2012-01-11 2013-07-22 Lintec Corp Energy ray irradiation apparatus
JP5778054B2 (en) * 2012-02-13 2015-09-16 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
KR102373075B1 (en) * 2012-11-30 2022-03-11 가부시키가이샤 니콘 Transfer system, exposure apparatus, transfer method, exposure method, device manufacturing method, and suction apparatus
WO2017017750A1 (en) * 2015-07-27 2017-02-02 株式会社ニレコ Fruit and vegetable gripper
EP3417477B1 (en) 2016-02-16 2020-01-29 EV Group E. Thallner GmbH Method for bonding substrates
JP2017085177A (en) * 2017-02-10 2017-05-18 東京エレクトロン株式会社 Substrate conveyance device and peeling system
CN108469299B (en) * 2018-03-13 2020-08-21 四川众望安全环保技术咨询有限公司 Four-degree-of-freedom clamping device of laser vibration meter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251948A (en) * 2004-03-03 2005-09-15 Izumi Akiyama Non-contact holding device and non-contact holding/conveying device
JP2005340522A (en) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd Bernoulli chuck
JP2006282345A (en) * 2005-04-01 2006-10-19 Hiroshi Akashi Non-contact carrying device
JP2006341346A (en) * 2005-06-09 2006-12-21 Fujifilm Holdings Corp Non-contact type carrier apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246682A (en) * 1999-03-02 2000-09-12 Sony Corp Suction device
JP3565079B2 (en) * 1999-03-16 2004-09-15 松下電器産業株式会社 Apparatus and method for mounting conductive ball
JP3283026B2 (en) * 1999-04-30 2002-05-20 新光電気工業株式会社 Ball-shaped terminal suction device and ball-shaped terminal mounting method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251948A (en) * 2004-03-03 2005-09-15 Izumi Akiyama Non-contact holding device and non-contact holding/conveying device
JP2005340522A (en) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd Bernoulli chuck
JP2006282345A (en) * 2005-04-01 2006-10-19 Hiroshi Akashi Non-contact carrying device
JP2006341346A (en) * 2005-06-09 2006-12-21 Fujifilm Holdings Corp Non-contact type carrier apparatus

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008147558A1 (en) * 2007-05-25 2008-12-04 Corning Incorporated Apparatus for handling a glass sheet
WO2010048254A1 (en) * 2008-10-23 2010-04-29 Corning Incorporated High temperature sheet handling system and methods
CN102197455A (en) * 2008-10-23 2011-09-21 康宁股份有限公司 High temperature sheet handling system and methods
US8443863B2 (en) 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
CN102197455B (en) * 2008-10-23 2013-08-21 康宁股份有限公司 High temperature sheet handling system and methods
EP3866184A1 (en) * 2012-11-30 2021-08-18 Nikon Corporation Carrier system, exposure apparatus and carry-in method
CN104179781A (en) * 2013-05-22 2014-12-03 由田新技股份有限公司 Adsorption device and vacuum adsorption equipment capable of adsorbing soft object
CN104179781B (en) * 2013-05-22 2016-03-16 由田新技股份有限公司 The vacuum adsorption equipment of adsorbent equipment and adsorbable soft object
CN106505019A (en) * 2016-11-30 2017-03-15 武汉帝尔激光科技股份有限公司 A kind of anti-light laser process equipment that declines of full automatic solar cell piece
CN106505019B (en) * 2016-11-30 2023-09-08 武汉帝尔激光科技股份有限公司 Full-automatic solar cell anti-light-attenuation laser processing equipment
WO2018171909A1 (en) * 2017-03-21 2018-09-27 Applied Materials, Inc. Apparatus and method for holding a substrate, apparatus and method for loading a substrate into a vacuum processing module, and system for vacuum processing of a substrate
WO2018171907A1 (en) * 2017-03-21 2018-09-27 Applied Materials, Inc. Apparatus and method for holding a substrate, method for loading a substrate into a vacuum processing module, and system for vacuum processing of a substrate
WO2019018786A1 (en) * 2017-07-21 2019-01-24 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
CN110869299A (en) * 2017-07-21 2020-03-06 伊雷克托科学工业股份有限公司 Non-contact handler and method of handling a workpiece using a non-contact handler
US11254014B2 (en) 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
US11235939B2 (en) 2017-08-10 2022-02-01 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter
US11420830B2 (en) 2017-08-10 2022-08-23 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter
GB2572016A (en) * 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
US11926489B2 (en) 2018-03-16 2024-03-12 Kongsberg Precision Cutting Systems Belgium Bv Vacuum plate, sheet material handling apparatus comprising such vacuum plate, and method for making the plate
CN111115286A (en) * 2019-12-21 2020-05-08 江苏达晨冠图电气科技有限公司 Automatic test production line for zinc oxide resistance card with high work smoothness
CN113921441A (en) * 2021-11-18 2022-01-11 苏州尊恒半导体科技有限公司 Suspension type wafer positioning device

Also Published As

Publication number Publication date
JP5080090B2 (en) 2012-11-21
TW200834806A (en) 2008-08-16
JP2008168413A (en) 2008-07-24

Similar Documents

Publication Publication Date Title
WO2008087796A1 (en) Holding apparatus and holding method
TW200736143A (en) Apparatus and method for transferring a glass substrate
DE602006012862D1 (en) DRUG SUPPLY
TW200943454A (en) Apparatus for treating substrate
WO2008014312A3 (en) Printing on a heated substrate
SG143241A1 (en) Substrate support and lithographic process
WO2011041267A3 (en) Laser system for processing solar wafers in a carrier
IL173373A0 (en) Thermal energy storage apparatus
TW200802561A (en) Control device and method for a substrate processing apparatus
TW200701345A (en) Film-forming apparatus and film-forming method
WO2008022296A3 (en) Metering apparatus for grouping and spacing articles with independent tool drive means
MY146842A (en) Supply mechanism for the chuck of an integrated circuit dicing device
WO2009042212A3 (en) Impinging jet nozzles in stretched or deformed substrates
WO2008060426A3 (en) Automatic wagering game generator
WO2009102502A3 (en) Apparatus and method for batch non-contact material characterization
TW200746255A (en) Substrate processing apparatus
WO2009068807A3 (en) Method for controlling thermal effluents generated by an aircraft and cooling device for an aircraft implementing said method
WO2010126750A3 (en) System and method for fiducial deployment
WO2010109206A3 (en) Holder for a cylindrical article
EP2226700A3 (en) Clock supply method and information processing apparatus
MX2020010962A (en) Printing system for printing substrates, method for operating the printing system.
MX2010005442A (en) Device for transporting a hollow body, installation provided with such devices, and method for conveying a hollow body attached to such a device.
TW200701399A (en) Energy beam irradiator and irradiating method
HK1137382A1 (en) Ink-jet head and ink-jet device
EP1815993A3 (en) Liquid ejecting head and liquid ejecting apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07832391

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07832391

Country of ref document: EP

Kind code of ref document: A1