WO2008081878A1 - Composition de résine ignifuge extrêmement résistante à la chaleur - Google Patents

Composition de résine ignifuge extrêmement résistante à la chaleur Download PDF

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Publication number
WO2008081878A1
WO2008081878A1 PCT/JP2007/075143 JP2007075143W WO2008081878A1 WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1 JP 2007075143 W JP2007075143 W JP 2007075143W WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
flame
resistant resin
highly heat
retardant highly
Prior art date
Application number
PCT/JP2007/075143
Other languages
English (en)
Japanese (ja)
Inventor
Takaaki Miyoshi
Fumiki Murakami
Original Assignee
Asahi Kasei Chemicals Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corporation filed Critical Asahi Kasei Chemicals Corporation
Priority to JP2008552154A priority Critical patent/JPWO2008081878A1/ja
Publication of WO2008081878A1 publication Critical patent/WO2008081878A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne une composition de résine contenant un polyamide, un éther de polyphénylène et un composé de phosphazène. Le polyamide est composé d'un polyamide aromatique ayant un rapport molaire (A/B) entre la structure (A) et la structure (B) représentées, respectivement par les formules ci-dessous se situant dans la plage allant de 30/70 à 100/0. Structure (A) Structure (B) (Dans les formules, R représente un groupe alkylène ayant de 6 à 12 atomes de carbone).
PCT/JP2007/075143 2007-01-02 2007-12-27 Composition de résine ignifuge extrêmement résistante à la chaleur WO2008081878A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552154A JPWO2008081878A1 (ja) 2007-01-02 2007-12-27 難燃性高耐熱樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88310107P 2007-01-02 2007-01-02
US60/883101 2007-01-02

Publications (1)

Publication Number Publication Date
WO2008081878A1 true WO2008081878A1 (fr) 2008-07-10

Family

ID=39588558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075143 WO2008081878A1 (fr) 2007-01-02 2007-12-27 Composition de résine ignifuge extrêmement résistante à la chaleur

Country Status (2)

Country Link
JP (1) JPWO2008081878A1 (fr)
WO (1) WO2008081878A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (ja) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp 樹脂組成物及びその成形体
JP2011093439A (ja) * 2009-10-30 2011-05-12 Jtekt Corp 電動パワーステアリング装置
JP2011162753A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性樹脂組成物およびその製造方法ならびに該導電性樹脂組成物を用いて得られる成形品
JP2011162752A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性マスターバッチおよびその製造方法ならびに該導電性マスターバッチを用いて得られる導電性樹脂組成物およびその成形品
JP2015030751A (ja) * 2013-07-31 2015-02-16 三菱樹脂株式会社 ポリアミド系樹脂組成物、及びそれを成形してなるフィルム、射出成形体
CN105017525A (zh) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 一种支化改性剂及相应的阻燃尼龙树脂
JP2019073657A (ja) * 2017-10-18 2019-05-16 上野製薬株式会社 液晶ポリエステル樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (ja) * 1997-10-20 1999-04-27 Unitika Ltd ポリアミド樹脂組成物及びその製造法
JP2001131409A (ja) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd 難燃性芳香族ポリアミド樹脂組成物
JP2001335699A (ja) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd 難燃性樹脂組成物
JP2002053751A (ja) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp 難燃性樹脂組成物
JP2003176408A (ja) * 2001-09-21 2003-06-24 Kuraray Co Ltd 電気・電子部品封止用ポリアミド組成物
WO2006043460A1 (fr) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation Composition ignifuge
WO2006112058A1 (fr) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation Composition d’une resine de polyamide/polyether de phenylene
JP2008050509A (ja) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp 難燃性ポリアミド系樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (ja) * 1997-10-20 1999-04-27 Unitika Ltd ポリアミド樹脂組成物及びその製造法
JP2001131409A (ja) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd 難燃性芳香族ポリアミド樹脂組成物
JP2002053751A (ja) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp 難燃性樹脂組成物
JP2001335699A (ja) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd 難燃性樹脂組成物
JP2003176408A (ja) * 2001-09-21 2003-06-24 Kuraray Co Ltd 電気・電子部品封止用ポリアミド組成物
WO2006043460A1 (fr) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation Composition ignifuge
WO2006112058A1 (fr) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation Composition d’une resine de polyamide/polyether de phenylene
JP2008050509A (ja) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp 難燃性ポリアミド系樹脂組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (ja) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp 樹脂組成物及びその成形体
JP2011093439A (ja) * 2009-10-30 2011-05-12 Jtekt Corp 電動パワーステアリング装置
JP2011162753A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性樹脂組成物およびその製造方法ならびに該導電性樹脂組成物を用いて得られる成形品
JP2011162752A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性マスターバッチおよびその製造方法ならびに該導電性マスターバッチを用いて得られる導電性樹脂組成物およびその成形品
JP2015030751A (ja) * 2013-07-31 2015-02-16 三菱樹脂株式会社 ポリアミド系樹脂組成物、及びそれを成形してなるフィルム、射出成形体
CN105017525A (zh) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 一种支化改性剂及相应的阻燃尼龙树脂
JP2019073657A (ja) * 2017-10-18 2019-05-16 上野製薬株式会社 液晶ポリエステル樹脂組成物
JP7032904B2 (ja) 2017-10-18 2022-03-09 上野製薬株式会社 液晶ポリエステル樹脂組成物

Also Published As

Publication number Publication date
JPWO2008081878A1 (ja) 2010-04-30

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