WO2008069453A1

WO2008069453A1 - Heat control device and method of manufacturing the same

Info

Publication number: WO2008069453A1
Application number: PCT/KR2007/005459
Authority: WO
Inventors: Seok-Hwan Moon; Gunn Hwang
Original assignee: Electronics And Telecommunications Research Institute
Priority date: 2006-12-07
Filing date: 2007-10-31
Publication date: 2008-06-12
Also published as: JP2010511853A; US20100059212A1; JP5250559B2; KR100759826B1

Abstract

Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

Description

HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME

Technical Field

[1] The present invention relates to a heat control device and a method of manufacturing the same, and more particularly, to a heat control device which controls heat generated by an electronic device using the latent heat of a working fluid, and a method of manufacturing the same. Background Art

[2] As the performance of personal computers and the integration of semiconductor increases, heat generated by electronic parts such as CPUs significantly increases. Also, as cutting edge processing technology used for computer CPUs gradually finds it way into other electronic products, the dissipation of heat becomes an important matter to solve in a variety of electronic devices. Typically, for mobile phones which require compact designs more than notebook PCs, the heat problem would be more serious if the performance of mobile phones develops at the present speed.

[3] Mobile phone technology is mainly being developed in the area of data services such as color displays, multimedia, VOD (video on demand), video phone, and mobile games. Accordingly, the amount of processes performed in a system considerably increases. Also, it is expected that the amount of heat generated by such systems continue to increase. Considering the stability of mobile phones, heat dissipation technology for such systems needs to be developed. In addition, since portability is regarded important specially for mobile phones, technology for miniaturization is important together as is technology for lightness.

[4] To efficiently process heat generated in the above-described environment, the development of a heat control device that is particularly thin and exhibits superior heat transfer characteristics is needed. Typically, a heat generation portion of an electronic device is in the form of a hot spot having a relatively small area. For the heat control of an electronic device having an insufficient packaging space, the problem of the hot spot has been solved using a substance having a low conductive heat resistance. Alternatively, there has been a solution of attaching a heat transfer device such as a heat sink or a Peltier effect device for heat dissipation. However, these solutions have problems in that an installation space over a certain area is needed or operation power needs to be supplied. Thus, it is essential to develop a heat control device that has a superior heat control characteristic, that does not need a power supply and that is small and thin, to cope with the light and compact packaging trend. [5] A heat control device using the latent heat property of a working fluid is a typical example of a compact heat control device. Heat transfer devices or heat dissipation devices by a latent heat transfer effectively transfer heat without power when there is a small temperature difference using the evaporation pressure of a working fluid. FIG. 1 explains the operating principle of a heat control device using a latent heat method. Referring to FIG. 1, an envelope 90 made of metal and used as a path for a working fluid 40 and 50 is filled with the working fluid 40 and 50. Heat is absorbed as the working fluid 40 and 50 are vaporized at a vaporization unit 10 adjacent to a heat source of an electronic device. The working fluid 40 that is vaporized is concentrated at a concentration unit 30 and dissipates the heat while passing through a transfer unit 20. The working fluid 50 that is liquidized at the concentration unit 30 moves toward the vaporization unit 10 by a capillary force. To generate the capillary force, a wick (not shown) or a groove (not shown) is provided in the envelope 90. Disclosure of Invention Technical Problem

[6] However, as the thickness and size of electronic devices decrease, the envelope, wick, and groove are formed to have a micro structure. Thus, a new method is needed by which an envelope, wick, and groove having a micro structure can be manufactured with high precision. For example, there may be a method of forming a groove having a fine structure by etching silicon or glass. However, a new heat control device which is simpler and economical, and a method of manufacturing the same, are needed.

Technical Solution

[7] To solve the above and/or other problems, the present invention provides a heat control device which has a simple structure, can be simply manufactured, can be formed into a variety of shapes, can form an envelope, a wick, and a groove, each having a micro structure, can be easily installed in a limited space, and can improve the performance of heat unification and the dissipation of heat using the latent heat of a working fluid, and a method of manufacturing the heat control device.

[8] According to an aspect of the present invention, there is provided a method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

[9] In the providing of the first and second templates each including a protruding portion having a shape corresponding to the groove, each of the first and second templates may be provided using a mold having a concave portion corresponding to the protruding portion. The first and second templates may be formed of a polymer. The polymer may include at least polymethly methacrylate (PMMA). In the stacking of the first and second metal plates respectively on the first and second deposition films, the first and second metal plates may be respectively stacked by plating a metal forming the envelope on the first and second deposition films.

[10] According to another aspect of the present invention, there is provided a method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing an integrated single template including a protruding portion having a shape corresponding to the groove; forming a deposition film by depositing metal on the integrated single template; stacking an integrated single metal plate surrounding the deposition film; and burning out the integrated single template from the integrated single metal plate.

[11] In the providing of the integrated single template including a protruding portion having a shape corresponding to the groove, each of the first and second templates may be provided using a mold having a concave portion corresponding to the protruding portion.

[12] The integrated single template may be formed of a polymer. The polymer may include at least polymethly methacrylate (PMMA). In the stacking of the integrated single metal plate surrounding the deposition film, the integrated single metal plate may be stacked by plating a metal forming the envelope on the deposition film.

[13] According to another aspect of the present invention, there is provided a method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method may include: providing a pair of reinforcement templates, each having a reinforcement film at one side and a groove formed at the other side; pairing the reinforcement templates to contact each other; and forming the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates.

[14] In the providing a pair of rein forcement templates, each of the reinforcement templates may be provided using a mold having a protruding portion having a shape corresponding to the groove.

[15] The reinforcement template may be formed by stacking a polymer on the rein- forcement films. The polymer may include at least polymethly methacrylate (PMMA). In the forming of the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates, the integrated single metal plate may be stacked by plating a metal forming the envelope on the reinforcement film.

[16] According to another aspect of the present invention, there is provided a heat control device including: an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer; and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the groove or a protruding portion having a shape corresponding to the groove is formed on a template formed of a polymer, a metal deposition film is deposited on the template, metal forming the envelope is stacked on the deposition film and the template is burned out, thus forming the envelope.

Advantageous Effects

[17] The heat control device and a method of manufacturing the heat control device are to form a groove having a fine structure capable of generating a superior capillary force.

A template formed of a polymer having a superior molding characteristic is processed using a mold so that a groove or a protruding portion relief-type groove can be easily processed. The groove shape formed on the template can be transferred to the metal plate with high precision in a simple plating process. The envelope can be finally formed by a simple process of burning out the template.

Brief Description of the Drawings [18] The above and other features and advantages of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings in which:

[19] FIG. 1 illustrates the operating principle of a general heat control device;

[20] FIG. 2 is a perspective view of a heat control device according to an embodiment of the present invention; [21] FIGS. 3 A through 3E illustrate a method of manufacturing a heat control device according to an embodiment of the present invention; [22] FIGS. 4 A through 4D illustrate a method of manufacturing a heat control device according to another embodiment of the present invention step by step; and [23] FIGS. 5A through 5D illustrate a method of manufacturing a heat control device according to yet another embodiment of the present invention step by step.

Mode for the Invention [24] The attached drawings for illustrating preferred embodiments of the present invention are referred to in order to gain a sufficient understanding of the present invention, the merits thereof, and the objectives accomplished by the implementation of the present invention. Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the invention with reference to the attached drawings. Like reference numerals in the drawings denote like elements.

[25] FIG. 2 is a perspective view of a heat control device according to an embodiment of the present invention. In FIG. 2, a groove 301 is formed in an inner wall 401 of an envelope 400. The envelope 400 is filled with a working fluid and heat is absorbed/ dissipated by a latent heat transfer. The working fluid, which is liquidized as it dissipates heat, is moved along the groove 301 by a capillary force so as to cool down an electronic device which needs cooling.

[26] FIGS. 3 A through 3E illustrate a method of manufacturing a heat control device according to an embodiment of the present invention step by step. According to the present method, a protruding portion 201 is formed by pressing a first template 200a using a mold 100. A first deposition film 202a is deposited on the first template 200a to provide suitable conditions for coating the first template 200a with a metal. Metal forming the envelope 400 is plated on the first deposition film 202a to a desired thickness to stack a first metal plate 300a. The inner wall 401 of the envelope 400 is exposed by applying heat to the first metal plate 300a to burn out the first template 200a.

[27] Likewise, a second template 200b is formed using the mold 100 and a second deposition film 202b is deposited on the second template 200b to provide suitable conditions for coating the second template 200b with a metal. Metal forming the envelope 400 is plated on the second deposition film 202b to a desired thickness to stack a second metal plate 300b. The inner wall 401 of the envelope 400 is exposed by applying heat to the second metal plate 300b to burn out the second template 200b.

[28] The first metal plate 300a forms one surface of the envelope 400 while the second metal plate 300b forms the other surface of the envelope 400. When the first and second metal plates 300a and 300b where the groove 301 is formed are combined at a combination portion 303, the envelope 400 is completed. The present embodiment in which the first and second templates 200a and 200b are formed using the mold 100, may be more advantageous and simpler than forming a micro structure using an etching process using a photolithography process. The first and second templates 200a and 200b are formed of polymer in a manner which facilitates molding of the protruding portion 201 and burning out. In one possible embodiment, the polymer preferably includes at least polymethly methacrylate (PMMA).

[29] Referring to FIG. 3 A, the mold 100, which has a concave portion 101 corresponding to the protruding portion 201, is used to provide the protruding portion 201 having a shape corresponding to the groove 301. The first template 200a initially having a flat panel shape is pressed by the mold 100. As shown in FIG. 3B, the first deposition film 202a is formed by depositing metal on the surface of the first template 200a. As shown in FIG. 3C, the first metal plate 300a is stacked by plating a metal forming the envelope 400 on the surface of the first template 200a. Although it is preferable that the metal forming the first deposition film 202a and the first metal plate 300a is the same, different types of metal can be used. The first metal plate 300a is put into an electric furnace and heated to remove the first template 200a formed of a polymer substance.

[30] Next, by repeating the steps of FIGS. 3 A through 3C, the second metal plate 300b is stacked and the second template 200b is burned out. When the first and second metal plates 300a and 300b are welded to each other at the combination portion 303, the envelope 400 of FIG. 3E is completed. When the inner wall of the envelope 400 is rinsed and made vacuous and then sealed by filling the envelope 400 with working fluid, a micro heat control device which can be used as a heat transfer or heat dissipation device is obtained. In the heat control device according to the present embodiment, the shape of the section of the envelope is not limited to the above- described shape and an envelope having a polygonal or circular section can be manufactured. Also, the size of the envelope is not limited.

[31] FIGS. 4A through 4D illustrate a method of manufacturing a heat control device according to another embodiment of the present invention step by step. Referring to FIGS. 4A through 4D, an integrated single template 200c is formed using a pair of molds 100a and 100b. Suitable conditions for coating the integrated single template 200c with a metal are set by depositing the deposition film 202c on the integrated single template 200c. Then, metal forming the envelope 400 is plated on the deposition film 202c to a desired thickness to stack an integrated single metal plate 300c. When the integrated single template 200c is burned out by applying heat to the integrated single metal plate 300c, the inner wall 401 of the envelope 400 is exposed.

[32] When the integrated single template 200c is formed using the molds 100a and 100b, the micro structure can be formed more simply than by an etching process using a photolithography process. Also, process precision can be improved and the number of steps can be reduced. The integrated single template 200c is formed of a polymer in a manner which facilitates molding of the protruding portion 201 and burning out. The polymer preferably includes at least polymethly methacrylate (PMMA).

[33] Referring to FIG. 4A, the integrated single template 200c, which initially has a flat panel shape, is pressed using the molds 100a and 100b having a concave portion 101 to produce the protruding portion 201 having a shape corresponding to the groove 301. The deposition film 202c is formed by depositing the metal on the surface of the integrated single template 200c as shown in FIG. 4B. The integrated single metal plate 300c is stacked by plating the metal forming the envelope 400 on the surface of the deposition film 202c as shown in FIG. 4C. When the integrated single template 200c formed of a polymer is removed by putting the integrated single metal plate 300c in an electric furnace and heating the same, the integral envelope 400 of FIG. 4D is completed. When the inner wall of the envelope 400 is rinsed and made vacuous and sealed by filling the envelope 400 with the working fluid, a micro thermal control device which can be used as a heat transfer or heat dissipation device is obtained. According to another embodiment, as the molds 100a and 100b are simultaneously used to mold the envelope 400, the envelope 400 can be integrally manufactured without a seam. Also, a separate welding process to combine a pair of metal plates is not needed.

[34] According to FIGS. 3A through 4D, the heat control device manufactured according to the present embodiment includes the envelope 400 and the groove 301 included in the envelope 400. The templates 200a, 200b, and 200c, the deposition films 202a, 202b, and 202c, and the metal plates 300a, 300b, and 300c are sequentially manufactured and these are used for molding the envelope 400 and the groove 301. That is, the protruding portion 201 is formed on each of the templates 200a, 200b, and 200c formed of a polymer and the deposition films 202a, 202b, and 202c are formed thereon. The metal plates 300a, 300b, and 300c forming the envelope 400 are plated and the templates 200a, 200b, and 200c are burned out so that the envelope 400 and the groove 301 are formed.

[35] FIGS. 5A through 5D illustrate a method of manufacturing a heat control device according to yet another embodiment of the present invention step by step. The heat control device according to the present embodiment, which initially has a flat panel shape, needs a pair of reinforcement templates 20Od and 20Oe, each having a reinforcement film 203 formed of metal at one side and an exposure area, at the opposite side to the reinforcement film 203 where the groove 301 is to be formed. The groove 301 is directly formed using the mold 100 in the reinforcement templates 20Od and 20Oe. The integrated single metal plate 300c is stacked by performing metal plating after making the sides of the reinforcement templates 20Od and 20Oe where the groove 301 is formed face each other. The reinforcement templates 20Od and 20Oe are not burned out and the groove 301 and the inner wall 401 of the envelope 400 are formed without burning out. Although the reinforcement templates 20Od and 20Oe are not combined by a welding process, they are combined by the integrated single metal plate 300c. Since the groove 301 is not formed by the integrated single metal plate 300c, the integrated single metal plate 300c can be stacked to a very thin thickness.

[36] The reinforcement templates 20Od and 20Oe are preferably formed of a polymer to facilitate the molding of the groove 301. In one possible embodiment, the polymer preferably includes at least polymethily methacrylate (PMMA). When the groove 301 is formed using the mold 100, a micro structure can be formed more simply than by an etching process using a photolithography process, which is an advantage of the present invention.

[37] Referring to FIG. 5A, the reinforcement templates 20Od and 20Oe are formed using the mold 100 having the protruding portion 201 having a shape corresponding to the groove 301. As shown in FIGS. 5B and 5C, the reinforcement templates 20Od and 20Oe are assembled to face each other and can be simply assembled using an adhesive. As shown in FIG. 5D, the envelope 400 is completed by stacking the metal plate 300c by plating the reinforcement templates 20Od and 20Oe. When the inner wall of the envelope 400 is rinsed and made vacuous and then sealed by filling the envelope 400 with the working fluid, a micro heat control device which can be used as a heat transfer or heat dissipation device is obtained. According to the present embodiment, since the integrated single metal plate 300c is stacked on the reinforcement film 203 that is already provided, an additional welding process or a deposition film for plating is not needed and the reinforcement templates 20Od and 20Oe do not need to be removed.

[38] As described above, according to the heat control device according to the present invention and a method of manufacturing the heat control device, to form a groove having a fine structure capable of generating a superior capillary force, a template formed of a polymer having a superior molding characteristic is processed using a mold so that a groove or a protruding portion relief-type groove can be easily processed. The groove shape formed on the template can be transferred to the metal plate with high precision in a simple plating process. The envelope can be finally formed by a simple process of burning out the template.

[39] While this invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. For example, when a layer exists on another layer, the layer can contact directly a substrate or the other layer or a third layer may exist between the two layers. Industrial Applicability

[40] The present invention provides a heat control device and a method of manufacturing the same. The present invention provides a heat control device which controls heat generated by an electronic device using the latent heat of a working fluid, and a method of manufacturing the same.

Claims

[1] A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates. [2] The method of claim 1, wherein, in the providing of the first and second templates each including a protruding portion having a shape corresponding to the groove, each of the first and second templates is provided using a mold having a concave portion corresponding to the protruding portion. [3] The method of claim 2, wherein the first and second templates are formed of a polymer. [4] The method of claim 3, wherein the polymer includes at least polymethly methacrylate (PMMA). [5] The method of claim 2, wherein, in the stacking of the first and second metal plates respectively on the first and second deposition films, the first and second metal plates are respectively stacked by plating a metal forming the envelope on the first and second deposition films. [6] A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising: providing an integrated single template including a protruding portion having a shape corresponding to the groove; forming a deposition film by depositing metal on the integrated single template; stacking an integrated single metal plate surrounding the deposition film; and burning out the integrated single template from the integrated single metal plate. [7] The method of claim 6, wherein, in the providing of the integrated single template including a protruding portion having a shape corresponding to the groove, each of the first and second templates is provided using a mold having a concave portion corresponding to the protruding portion. [8] The method of claim 7, wherein the integrated single template is formed of a polymer. [9] The method of claim 8, wherein the polymer includes at least polymethly methacrylate (PMMA). [10] The method of claim 7, wherein, in the stacking of the integrated single metal plate surrounding the deposition film, the integrated single metal plate is stacked by plating a metal forming the envelope on the deposition film. [11] A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising: providing a pair of reinforcement templates, each having a reinforcement film at one side and a groove formed at the other side; pairing the reinforcement templates to contact each other; and forming the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates. [12] The method of claim 11, wherein, in the providing a pair of rein forcement templates, each of the reinforcement templates is provided using a mold having a protruding portion having a shape corresponding to the groove. [13] The method of claim 12, wherein the reinforcement template is formed by stacking a polymer on the reinforcement films. [14] The method of claim 13, wherein the polymer includes at least polymethly methacrylate (PMMA). [15] The method of claim 12, wherein, in the forming of the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates, the integrated single metal plate is stacked by plating a metal forming the envelope on the reinforcement film. [16] A heat control device comprising: an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer; and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the groove or a protruding portion having a shape corresponding to the groove is formed on a template formed of a polymer, a metal deposition film is deposited on the template, metal forming the envelope is stacked on the deposition film and the template is burned out, thus forming the envelope.