JPS61225025A - Preparation of embossed mark - Google Patents

Preparation of embossed mark

Info

Publication number
JPS61225025A
JPS61225025A JP6559085A JP6559085A JPS61225025A JP S61225025 A JPS61225025 A JP S61225025A JP 6559085 A JP6559085 A JP 6559085A JP 6559085 A JP6559085 A JP 6559085A JP S61225025 A JPS61225025 A JP S61225025A
Authority
JP
Japan
Prior art keywords
mark
base material
temple
embossed
mark parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6559085A
Other languages
Japanese (ja)
Inventor
Mikio Oomikawa
大見川 幹生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku KK filed Critical Nippon Kogaku KK
Priority to JP6559085A priority Critical patent/JPS61225025A/en
Publication of JPS61225025A publication Critical patent/JPS61225025A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prepare a surface embossed mark in integral relation to a base material, by pressing a plastic base material by a mold, of which the embossed pattern is reverse to a designed embossed mark to depress the mark parts from the surface of the base material and grinding the surface of the base material other than the mark parts to make the surfaces of the mark parts flush with the new surface of the base material. CONSTITUTION:A preheated temple 2 is pressed by a mold 1, of which the embossed pattern is reverse to a desired embossed mark, to depress mark parts and subsequently cooled to room temp. Next, the surface layer 2a of the temple 2 other than the depressed mark parts is removed by grinding and polished not only to make the surfaces of the mark parts flush with the new surface of the temple 2 but also to simultaneously finish a temple configuration. Subsequently, the temple 2 is again heated to naturally raise up the mark parts 2b and an embossed mark is prepared.

Description

【発明の詳細な説明】 (発明の技術分野) 本発明は、プラスチック基材の表面に浮き出しマーク(
例えば突出した文字、数字、図形、模様など)を基材と
一体に製造する方法に関する。
Detailed Description of the Invention (Technical Field of the Invention) The present invention provides an embossed mark (
For example, it relates to a method for manufacturing protruding letters, numbers, figures, patterns, etc.) integrally with a base material.

(発明の背景) 従来、プラスチック基材例えばメガネフレームの表面に
浮き出しマーク(例えばメーカー名、ブランド名、飾り
模様など)を付けたい場合、マーク部分を別に作って、
それを接着剤で基材に接着していた。
(Background of the Invention) Conventionally, when it is desired to attach an embossed mark (for example, a manufacturer's name, brand name, decorative pattern, etc.) on the surface of a plastic substrate, such as an eyeglass frame, the mark part is made separately.
It was attached to the base material with adhesive.

しかし、この方法では、接着剤がはみ出して美感を損ね
るとか、接着剤が経時変化で劣化してマーク部分が剥が
れてしまうとか、マーク部分が小さいときには、接着作
業が難しいなどの欠点があった。
However, this method has disadvantages, such as the adhesive protruding out and spoiling the aesthetic appearance, the adhesive deteriorating over time and causing the mark to peel off, and the difficulty of gluing when the mark is small.

(発明の目的) 従って、本発明の目的は、前記諸欠点がなく、しかも少
量多品種生産であってもコストの安い、浮き出しマーク
の製造方法を提供することにある。
(Object of the Invention) Therefore, an object of the present invention is to provide a method for producing raised marks that does not have the above-mentioned drawbacks and is inexpensive even when producing a wide variety of products in small quantities.

(発明の概要) 本発明者は、プラスチック基材の表面をプレスして「(
ぼみ」を作った後、常温付近では「(ぼみ」はそのまま
であるものの、加熱すると「くぼみ」が盛り上がり、一
旦盛り上がると、常温付近に戻しても、もはや「くぼみ
」は元に戻らなくなる現象を偶然に見い出し、この現象
をヒントして、新規な浮き出しマークの製造方法を発明
した。
(Summary of the Invention) The present inventor presses the surface of a plastic base material to
After creating a dent, the dent will remain as it is at room temperature, but when heated, the dent will swell, and once it swells, it will no longer return to its original state even if the temperature is returned to around room temperature. He discovered this phenomenon by chance, and using this as a hint, he invented a new method for producing raised marks.

即ち、本発明は、 第1工程:所望の浮き出しマークとは凹凸の反転した金
型で、プラスチック基材を(場合により、加熱下に)プ
レスし、マーク部分を基材表面より(ぼます工程、 第2工程:マーク部分以外の基材表面を研削して該マー
ク部分の表面と新たな基材表面とを一致又はほぼ一致さ
せる工程、 第3工程二基材を加熱してマーク部分を基材表面より浮
き出させる工程、 よりなることを特徴とする浮き出しマークの製造方法を
提供する。
That is, the present invention has the following steps: 1st step: Pressing the plastic base material (with heating in some cases) using a mold with an inverted concave and convex shape to form the desired embossed mark, and removing the mark from the surface of the base material. , 2nd step: Grinding the surface of the base material other than the mark part to make the surface of the mark part match or almost match the surface of the new base material, 3rd step: Heat the 2nd base material to make the mark part the base material. To provide a method for producing an embossed mark, characterized by the step of embossing it from the surface of a material.

使用可能なプラスチック基材としては、(1) ポリオ
レフィン系の単独または共重合体例えばPR,PP等、
アクリル系樹脂例えばポリアクリル酸エステル、ポリメ
タクリル酸エステル(PMMAその他)、ポリスチレン
系の単独または共重合体例えばポリスチレン、スチレン
−MMA共重合体、スチレン−アクリロニトリル共重合
体、アクリロニトリル−ブタジェン−スチレン共重合体
、塩化ビニル又は塩化ビニリデンの単独または共重合体
、フッソ樹脂例えばポリテトラフルオロエチレン、ポリ
トリフルオロエチレン、ポリフッ化ビニル、PVA、P
VAc、ポリアセタール系樹脂例えばポリビニルアセタ
ール、ポリビニルブチラール、ポリビニルフォルマール
、ポリエステル系樹脂例えばPET、PBT、ボリアリ
レート、ポリアミド系樹脂例えばナイロン66、ポリイ
ミド系樹脂、ポリウレタン、セルロース系樹脂例えばセ
ルロイド、セルロースアセテート、セルロースプロピオ
ネート、セルロースブチレート、ポリサルホン、ポリエ
ーテルサルホン、ポリアラミドなどの熱可塑性樹脂単独
またはブレンド、(2) フェノール樹脂、ユリア樹脂
、メラミン樹脂、不飽和ポリエステル、エポキシ樹脂、
アリル樹脂例えばCR−39樹脂、ジアリルフタレート
樹脂、カゼイン樹脂、熱硬化性ウレタン樹脂、シリコン
樹脂などの熱硬化性樹脂が挙げられる。
Usable plastic base materials include (1) polyolefin-based homopolymers or copolymers such as PR, PP, etc.
Acrylic resins such as polyacrylic esters, polymethacrylic esters (PMMA and others), polystyrene-based homopolymers or copolymers such as polystyrene, styrene-MMA copolymers, styrene-acrylonitrile copolymers, acrylonitrile-butadiene-styrene copolymers polymers, vinyl chloride or vinylidene chloride homopolymers or copolymers, fluorocarbon resins such as polytetrafluoroethylene, polytrifluoroethylene, polyvinyl fluoride, PVA, P
VAc, polyacetal resins such as polyvinyl acetal, polyvinyl butyral, polyvinyl formal, polyester resins such as PET, PBT, polyarylate, polyamide resins such as nylon 66, polyimide resins, polyurethane, cellulose resins such as celluloid, cellulose acetate, cellulose Thermoplastic resins alone or blends such as propionate, cellulose butyrate, polysulfone, polyethersulfone, polyaramid, (2) phenolic resins, urea resins, melamine resins, unsaturated polyesters, epoxy resins,
Examples of allyl resins include thermosetting resins such as CR-39 resin, diallyl phthalate resin, casein resin, thermosetting urethane resin, and silicone resin.

基材は、製品使用中に分離することがなければ、同一種
又は2種以上の基材の張り合わせ(又は接合材)でもよ
い、特に2種の張り合わせ材で表面基材をマーク部分に
使用して、それ以外の部分を第2工程で研削除去してし
まうと、残る表面基材は、マーク部分だけとなるので、
仮に表面基材を下地基材とは異なる色調にしておけば、
マーク部分が(新たな)基材から目立つことになり、目
立たせたい場合には好ましい。
The base material may be the same type of base material or two or more types of base materials laminated together (or a bonding material), as long as the base material does not separate during product use.In particular, two types of base materials may be laminated together and the surface base material is used for the mark part. If the other parts are polished away in the second step, the only remaining surface material will be the mark parts.
If you make the surface material a different color than the base material,
This is preferable when the mark part stands out from the (new) base material and is desired to stand out.

以下、実施例により本発明を具体的に説明するが、本発
明はこれに限定されるものではない。
EXAMPLES Hereinafter, the present invention will be specifically explained with reference to Examples, but the present invention is not limited thereto.

(実施例) 第1図(1)〜(5)に従い説明する。(Example) This will be explained according to FIGS. 1 (1) to (5).

厚さ3.5 m+mのセルロイド板をプレスして粗い形
状のテンプル(メガネフレームのつる)を切り出す。
Press a 3.5m+m thick celluloid board and cut out roughly shaped temples (the temples of glasses frames).

第1工程:次に所望の浮き出しマーク(ここでは単なる
島状矩形突起)とは凹凸の反転した金型(1)で、予め
40〜50℃に加熱しておいた前記テンプル(2)をプ
レスしてマーク部分を0.3ff111りぼました(第
1図(3)参照)後、テンプル(2)を室温に戻す。
First step: Next, press the temple (2), which has been preheated to 40 to 50°C, using a mold (1) with an inverted concave and convex shape to form the desired raised mark (in this case, a simple island-shaped rectangular protrusion). After doing this, the marked part was recessed by 0.3ff111 (see Figure 1 (3)), and then the temple (2) was returned to room temperature.

第2工程:前記テンプル(2)のくぼんだマーク部分以
外の表面層(2a)を0.3su++研削除去した後、
研磨して、マーク部分の表面と新たなテンプル(2)表
面とを一致させる(第1図(4)参照)と同時にテンプ
ル形状を仕上げる。
Second step: After removing the surface layer (2a) other than the recessed mark portion of the temple (2) by 0.3su++ polishing,
Polishing is performed to match the surface of the mark portion and the surface of the new temple (2) (see FIG. 1 (4)) and at the same time finish the temple shape.

第3工程:テンプル(2)を再び70’C付近に加熱す
ると、自然にマーク部分(2b)が盛り上がり、浮き出
しマークが製造された(第1図(5)参照)。
Third step: When the temple (2) was heated again to around 70'C, the mark portion (2b) naturally rose, producing an embossed mark (see FIG. 1 (5)).

このマークは、基材テンプルと同色なので、やや目立た
ないが、マークに色付けして目立たせてもよい。
Since this mark is the same color as the base temple, it is somewhat inconspicuous, but the mark may be colored to make it more noticeable.

(実施例2) 第1図(1)〜(5)に従い説明する。(Example 2) This will be explained according to FIGS. 1 (1) to (5).

まず、厚さ41の褐色透明セルロイド下地に厚さ0.5
+wmの白色不透明セルロイド表面層が張り合わされた
プラスチック基材を準備し、これをプレスして、粗い形
状のテンプル(2)を切り出す。
First, the thickness is 0.5 on a brown transparent celluloid base with a thickness of 41.
A plastic base material laminated with a +wm white opaque celluloid surface layer is prepared and pressed to cut out a roughly shaped temple (2).

第1工程:実施例1と同一の金型(1)で予め40〜5
0℃に加熱しておいた前記テンプル(2)をプレスして
マーク部分を0.5mm<ぼませて、マーク部分の表面
と下地表面とをほぼ一致させた(第2図(3)参照)。
1st step: 40 to 50% in advance in the same mold (1) as in Example 1
The temple (2), which had been heated to 0°C, was pressed to recess the mark part by 0.5 mm, so that the surface of the mark part and the underlying surface almost coincided (see Figure 2 (3)). .

第2工程:室温に戻したテンプル(2)のくぼんだマー
ク部分以外の表面層(2a)を研削除去した後、研磨し
て、マーク部分の表面と新たなテンプル(2)表面(つ
まり下地表面)とを一致させる(第2図(4)参照)と
同時にテンプル形状を仕上げる。
2nd step: After polishing and removing the surface layer (2a) of the temple (2) other than the recessed mark part which has been returned to room temperature, the surface of the mark part and the new temple (2) surface (that is, the base surface) are polished. ) (see Figure 2 (4)) and finish the temple shape at the same time.

第3工程:テンプル(2)を再び70℃付近に加熱・ 
 すると、自然に白色のマーク部分(2b)が盛り上が
り、浮き出しマークが鮮やかに製造された(第1図(5
)参照)。
3rd step: Heat the temple (2) again to around 70℃.
Then, the white mark part (2b) naturally rose, and a bright raised mark was produced (see Figure 1 (5)).
)reference).

(発明の効果) 以上のとおり、本発明によれば、浮き出しマークが基材
と一体に製造されるので、別個に作って接着剤で接着し
た場合の諸欠点が解消される。
(Effects of the Invention) As described above, according to the present invention, the embossed mark is manufactured integrally with the base material, which eliminates the various drawbacks that would otherwise occur when the embossed mark was made separately and bonded with an adhesive.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の実施例1にかかる製造工程を説明す
る概略縦断面図である。 第2図は、本発明の実施例2にかかる製造工程を説明す
る概略縦断面図である。 〔主要部分の符号の説明〕 l・−・−金型
FIG. 1 is a schematic longitudinal sectional view illustrating the manufacturing process according to Example 1 of the present invention. FIG. 2 is a schematic longitudinal sectional view illustrating the manufacturing process according to Example 2 of the present invention. [Explanation of symbols of main parts] l・-・-Mold

Claims (1)

【特許請求の範囲】 第1工程:所望の浮き出しマークとは凹凸の反転した金
型で、プラスチック基材をプレスし、マーク部分を基材
表面よりくぼます工程、 第2工程:マーク部分以外の基材表面を研削して該マー
ク部分の表面と新たな基材表面とを一致又はほぼ一致さ
せる工程、 第3工程:基材を加熱してマーク部分を基材表面より浮
き出させる工程、 よりなることを特徴とする浮き出しマークの製造方法。
[Claims] First step: The desired raised mark is a step in which the plastic base material is pressed using a mold with inverted concave and convex portions, and the mark portion is recessed from the surface of the base material. Second step: Other than the mark portion. A step of grinding the surface of the base material to make the surface of the mark portion coincide or almost coincide with the surface of the new base material; Third step: a step of heating the base material to make the mark portion stand out from the surface of the base material. A method for manufacturing an embossed mark characterized by:
JP6559085A 1985-03-29 1985-03-29 Preparation of embossed mark Pending JPS61225025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6559085A JPS61225025A (en) 1985-03-29 1985-03-29 Preparation of embossed mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6559085A JPS61225025A (en) 1985-03-29 1985-03-29 Preparation of embossed mark

Publications (1)

Publication Number Publication Date
JPS61225025A true JPS61225025A (en) 1986-10-06

Family

ID=13291381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6559085A Pending JPS61225025A (en) 1985-03-29 1985-03-29 Preparation of embossed mark

Country Status (1)

Country Link
JP (1) JPS61225025A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100759826B1 (en) 2006-12-07 2007-09-18 한국전자통신연구원 Heat control device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100759826B1 (en) 2006-12-07 2007-09-18 한국전자통신연구원 Heat control device and method for manufacturing the same

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