WO2008068859A1

WO2008068859A1 - Conveying equipment

Info

Publication number: WO2008068859A1
Application number: PCT/JP2006/324294
Authority: WO
Inventors: Shojiro Hirata
Original assignee: Hirata Corporation
Priority date: 2006-12-05
Filing date: 2006-12-05
Publication date: 2008-06-12

Abstract

High mobility vacuum conveying equipment which can be extended and can deal with increase/decrease in production flexibly. In the conveying equipment comprising an equipment front end module, a load lock chamber, and/or a vacuum conveyance chamber arranged to be coupled sequentially on a common frame, a conveyance robot movable substantially horizontally along a straight line is provided in the vacuum conveyance chamber. The vacuum conveyance chamber is constituted by coupling at least one module chamber along the moving direction of the conveyance robot. Various utilities are arranged under the installation plane of the common frame on the outside of the vacuum conveyance chamber and the conveyance robot exhibits its function depending on the position thereof.

Description

Specification

Transport device

Technical field

[0001] The present invention is a transfer device used when transferring a sample in an apparatus that requires a consistent operation under vacuum, such as a semiconductor manufacturing apparatus, and in particular, a thin plate such as a wafer or the like is used in each processing chamber. The present invention relates to a vacuum transfer device suitable for transfer to each processing chamber.

Background art

[0002] In semiconductor manufacturing, each process such as crystal growth, patterning, etching, doping, regrowth, and electrode formation is continuously performed in an ultra-high vacuum without causing deterioration of the processed surface. Development of integrated vacuum process for manufacturing. In this vacuum integrated process, a high-vacuum transfer device that transfers samples to each process device under ultra-high vacuum is indispensable.

[0003] A conventional ultra-high vacuum transfer device uses a stainless steel pipe that can be baked (heat degassing treatment) via a gasket such as copper in order to reach a vacuum level to the ultra-high vacuum region. The system is connected with a flange. Therefore, the sample conveyance path and the process apparatus are connected by a rigid conveyance path (for example, Patent Document 1). Therefore, it is not easy to add process equipment.

[0004] Further, when there are a plurality of process apparatuses, a semiconductor manufacturing apparatus including these process apparatuses is disclosed around a transfer apparatus under high vacuum (for example, Patent Document 2). However, the number of process equipment that can be connected is limited, and a lot of processing is required. This is not necessarily preferable for semiconductor manufacturing equipment.

Patent Document 1: Japanese Patent Laid-Open No. 2002-176090

Patent Document 2: Japanese Patent No. 3522796

Disclosure of the invention

Problems to be solved by the invention

[0005] In view of the above-mentioned problems of conventional power, the number of processing chambers can be increased, and the number of processing chambers is not limited. It is an object of the present invention to provide a highly mobile transfer apparatus that can flexibly cope with the decrease.

Means for solving the problem

[0006] In order to solve the above-described problem, the transfer apparatus of the present invention is a transfer apparatus that transfers a thin plate in a vacuum transfer chamber, and the vacuum transfer chamber includes at least one module chamber, and includes at least one process. Connected to the chamber. The vacuum transfer chamber includes a transfer robot that can move linearly, and a moving guide that defines a moving direction of the transfer robot. On the other hand, various utilities are provided outside the vacuum transfer chamber. Then, the various robots can perform various functions by the various utilities.

More specifically, the following can be provided.

(1) A transport apparatus for transporting a thin plate comprising a load lock chamber and a vacuum transport chamber that can be connected,

The vacuum transfer chamber is

It has at least one module chamber, and the second force module chamber is connected linearly via the connecting part,

The module chamber is connected in a direction different from the connection direction in which the module chambers are linearly connected so that at least one processing chamber and the thin plate can be moved in and out,

A linearly movable transfer robot is provided in the chamber, and the transfer robot takes out the thin plate from the load lock chamber, transfers it to the processing chamber for a predetermined process, and a connection direction in which the module chamber is linearly connected. A linear movement guide is provided in the chamber so as to define the movement direction of the transfer robot,

Various utilities are provided above and Z or below corresponding to the movement position of the transfer robot in the vacuum transfer chamber,

A transfer device characterized in that the transfer robot performs various functions by the various utilities.

Here, the load lock chamber is a device that connects the atmospheric system and the vacuum system. Usually, a vacuum pump provided separately depressurizes the material carried from the atmospheric system into a vacuum atmosphere, and then creates a vacuum. Remove the item from the system. On the other hand, the items brought in from the vacuum system are placed in an atmosphere (including special atmospheres such as argon) under a different pressure such as atmospheric pressure by a leak valve, etc., and are transported to that system. The vacuum transfer chamber means a chamber (chamber) capable of transferring an object in a vacuum. For example, the vacuum transfer chamber includes a device for transferring a substrate or the like through a linear motor or the like in a passage placed in a vacuum. It's okay. The load lock chamber and the vacuum transfer chamber are connected through a valve (for example, a gate valve) and a door at a connecting portion that can be sealed. The thin plate may be a component that is subjected to a predetermined treatment, and typically includes a component having a dimension in the thickness direction smaller than the dimension in the vertical and horizontal directions, such as a substrate. For example, a silicon wafer may be included.

The module chamber includes a vacuum chamber used as a unit, and each module chamber is connected by a sealable connecting portion. The second module chamber may be an additional module chamber connected to the first module chamber. A vacuum transfer chamber composed of a module chamber is connected to the load lock chamber via a gate and a z or gate valve at one end of the first module chamber. A connecting portion is provided at the other opposite end of the first module chamber, and is connected to the second module chamber. At the other end opposite to the connecting part that connects the first and second module chambers, there is a connecting part that can connect the third module chamber. O The fourth and subsequent module chambers The same applies to. In this way, the plurality of module chambers are linearly connected. The other end of the module chamber to be finally connected is kept closed from the outside system by a valve, a door, or the like that is not connected. Therefore, it may be in a state where no connection is made. Thus, a plurality of module chambers can be connected linearly or linearly like a train. In general, the direction of such connection coincides with the longitudinal direction of each module chamber. Then, the transfer robot provided in each module chamber can move in the longitudinal direction or the connecting direction to transfer the thin plate. In this way, it is possible to provide a powerful connecting portion at each end portion of each module chamber facing the longitudinal direction. This allows connections to be made in series or linearly and is particularly limited. It can continue to be connected without being connected. Here, the term “linear” may include a meaning that represents a state of being connected in series. The gate valve is a valve that partitions the inside and outside of the system, and its shape and structure are not limited. Therefore, it may include things such as a butterfly valve, a screw-type stop valve, and a slide door that opens and closes in a sliding manner.

[0010] Here, the processing chamber may mean a chamber (chamber) in which various processes such as etching, coating, doping, and heat treatment are performed on a thin plate to be transported or not. . The content of the treatment can be changed as appropriate depending on the required characteristics of the product, manufacturing conditions, and the like. The transfer robot holds the transfer object including the transfer device and auxiliary equipment, the gripping device that holds the transfer object, and auxiliary equipment, and moves the transfer object by its own movement. It may mean something that can be done. “Linearly movable transfer robot” means a transfer robot that can move substantially linearly.

[0011] In addition, the connection direction in which the module chambers are linearly connected generally does not need to be a straight line or substantially a straight line along the longitudinal direction of the module chamber. It may be a zigzag or meandering direction. The inside of the chamber may include being in a vacuum chamber. The outside of the chamber is basically a system having a different pressure or a different atmosphere, and can be referred to as the inside of the chamber in order to distinguish between the inside and outside of the system. The linear movement guide may be a substantially linear guide member. Therefore, it is preferable to have a linear guide surface. Thereby, the transfer robot can move substantially linearly. This linear is preferably moving substantially linearly on substantially the same horizontal plane. This is because the weight of the transfer robot is added as a necessary force when moving if it deviates from the horizontal plane.

[0012] The movement position of the transfer robot may mean a position where the transfer robot can move in the vacuum transfer chamber. At this time, if the transfer robot itself does not move, the position where the transfer robot can move does not change even if the arm or the like is moved or driven to move the object to be transferred. This movement position may be grasped as a position on the plane of the vacuum transfer chamber. This is because the trajectory in the vacuum transfer chamber is substantially the same in the height direction if the transfer robot moves substantially in a horizontal plane. Various utilities and vacuum transport In the feed chamber, auxiliary members such as auxiliary members, auxiliary equipment, and auxiliary devices for performing necessary functions may be included, and energy sources such as a power source and a driving source may be included. For example, it may include control equipment, pneumatic equipment wiring, piping, and the like that require only a lifting drive source. With the help of such utilities, the necessary treatment can be performed in the vacuum transfer chamber. Such a utility is arranged above and Z or below the vacuum transfer chamber corresponding to the movement position, for example, because the transfer robot is a driving source for moving, and a hand for delivering the object to be transferred. This is because the driving or the like is performed according to the location. More specifically, for example, when the transfer robot moves to a position closest to the load lock chamber and stops, the direction of the hand is changed so that a thin plate can be delivered from the load lock chamber, and the height of the hand is also increased. Change the position or hold it with your hand. At this time, it is preferable to assist these movements by utility. Further, even when it is moved to a predetermined position near each processing chamber where it can be carried into each processing chamber and stopped, the delivery of the thin plate can be performed smoothly with the assistance of the utility.

[0013] (2) The transport apparatus according to (1), wherein the transport apparatus includes at least a mount on which the vacuum transfer chamber is placed, and the mount includes a space in which the various utilities can be stored.

[0014] Here, the pedestal includes a simple pedestal with an angle. Moreover, what forms a so-called platform may be used. The gantry mounts the vacuum transfer chamber, but it may be fixed to the mounting surface with screws or the like. The mounting surface does not need to be flat, but it is preferable that the moving surface (the surface including the moving direction) of the transfer robot in the mounted vacuum transfer chamber is substantially horizontal. The gantry may also be a dense block, such as a ramen structure with a gap or a wall-supported structure such as an empty box. However, in dense blocks where it is preferred that utilities be provided in the cradle, it is preferable to have a hole for that purpose.

(3) The transfer robot includes a hand that holds the thin plate, and the transfer robot drives the lifting and lowering of the hand by the various utilities corresponding to the movement position in the vacuum transfer chamber, The transfer apparatus according to (1) or (2) above, wherein the thin plate is transferred to and from the processing chamber. [0016] Here, the hand may be one that can hold a thin plate against gravity. For example, it may be a member that holds the weight of the thin plate by three points that can define a substantially horizontal plane. Moreover, the apparatus which can be fixed by pinching | interposing a board | substrate may be sufficient. When sandwiching the substrate, the substrate may be sandwiched in the thickness direction, but may be sandwiched in a direction parallel to the surface of the substrate. For example, like a forklift fork, two protruding flat plates or round bars can be used as a node. Delivery can be performed from the hand to the shelf using the weight of the thin plate in the same way as a forklift.

[0017] (4) The raising and lowering of the hand is performed outside the vacuum transfer chamber by pushing up a lifting pin of the vacuum transfer robot by pushing up a lifting pin provided in the various utilities. It is possible to provide the transfer device described in (3) above.

[0018] The lift pins are not particularly limited in shape, but are located outside the vacuum transfer chamber, that is, in an atmosphere other than vacuum, and drive the lift shaft in the vacuum transfer chamber. Therefore, since the raising / lowering pin operates between two different systems, a sealing maintaining structure such as an oiled O-ring can be provided in the middle thereof. Therefore, the lifting pins are preferably dense rods and the outer peripheral surface is preferably smooth. As other methods, for example, the lifting pin may be airtightly held in the bellows structure, and the lifting pin may be allowed to move up and down by the bellows. Specific examples of the bellows structure include bellows (including vacuum bellows).

[0019] (5) The load lock chamber includes a mounting shelf having a plurality of stages in the chamber, and when the thin plate is loaded and unloaded, the mounting shelf is moved up and down to deliver the plurality of thin plates, and Z Alternatively, the number of stages of the mounting shelf that is configured to be able to perform noffering is determined according to the number of connected processing chambers and module chambers. (4) A transfer device can be provided with V or misalignment.

[0020] Here, the mounting shelf is, for example, two flat plates or a round bar so that a thin plate to be placed can be easily delivered including a shelf partitioned by a normal plate. You may include what you have passed. For delivery, for example, a method that generally uses a forklift to take out shelf-strength materials or places materials on the shelves can be used. Noffering means that the object to be processed stays between two processes where the processing speed is likely to fluctuate. It can mean to prevent deficiency. Specifically, intermediate products from the previous process can be collected to some extent and then passed to the next process. At this time, it is possible to receive intermediate products from the previous process and carry them out to the next process sufficiently quickly.If the previous process becomes faster, more intermediate products are received and stored in stock, and the speed required by the next process. The intermediate product can be passed to the next process. On the other hand, when the previous process is slow, the intermediate product can flow to the next process at the speed required by the next process regardless of the receiving speed from the previous process. In the delivery mode of a plurality of thin plates, if there is a sufficient number of steps without increasing or decreasing the number of steps, the number of thin plates (substrates) placed on the mounting shelf can be changed to change the number of steps. You can also adjust the speed. EFEM force If a plurality of thin plates are transferred simultaneously and placed on the mounting shelf at the same time (or one at a time), the substrate transfer speed can be increased. For this purpose, for example, conveyance or delivery for each pallet or simple shelf can be performed.

[0021] (6) The load lock chamber includes a device front end module on the opposite side of the vacuum transfer chamber side, and can be opened and closed on the side opposite to the load lock chamber side of the device front end module. A front opening type storage box having a carry-out door is placed, and the front end module of the apparatus is provided with a carry-in door that faces the carry-out door and opens and closes in the same manner, and the carry-in door and the carry-out door are synchronized. (1) to (5) V, deviation, which is characterized by opening and closing, can be provided.

Here, for example, in the case of a door that is slid down and closed, both doors slide down and close synchronously.

The invention's effect

[0023] According to the present invention, a vacuum having a space that allows smooth connection between the EFEM and a variable number of processing apparatuses by expansion and allows installation of a robot lifting / lowering unit and utility below the substrate transfer height. A transportation platform can be provided. This makes it possible to provide a platform that meets various layout requirements. Since the vacuum chamber and robot set can be connected in a modular structure, a vacuum transfer (robot) module that can be expanded to accommodate changes in the number of processing equipment can be easily realized. Also, even if the transport amount increases due to expansion, etc., it is possible to flexibly cope with increase / decrease in throughput by providing a load lock chamber having a multistage cassette that moves up and down. On the other hand, even if there is no expansion, increase / decrease in the number of boards Can respond flexibly. A lifting drive source necessary for the delivery of the substrate by the robot is provided outside the chamber, reducing the burden on the robot itself and simplifying it, making it easy to construct a vacuum transfer module structure. As a result, it is possible to provide a highly mobile transfer robot in which a lifting drive source is provided outside the chamber.

BEST MODE FOR CARRYING OUT THE INVENTION

[0024] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, this is for explaining the present invention, and the contents of the present invention are limited to the following embodiments. Well! , That's ugly! /.

[0025] FIGS. 1 and 2 show a transfer apparatus 10 having a substrate transfer platform. FIG. 1 is a plan view of the substrate transfer platform. The transfer device 10 having a substrate transfer platform includes, in order from the left, an EFEM (Equipment Front End Module) 12, a load lock chamber 14, a first vacuum transfer module (or first module channel) 16, and a second vacuum. A vacuum transfer chamber including a transfer module (or second module chamber) 18 and a third vacuum transfer module (or third module chamber) 20 is mainly configured. Here, EFEM means a module device in which an atmospheric transfer wafer robot is installed in a frame equipped with an FFU (Fan Filter Unit) and a load port is attached to the front. Usually installed in front of process equipment. This EFEM 12 has three front-opening unified pods (FOUPs) 13a, 13b and 13c at the left end of the force, which is a specific example of the front end module. Here, FOUP is a carrier for 300 mm wafers used in mini-environment semiconductor factories as defined in SEMI Standard E 47.1. A storage box. In these FOUPs 13a, 13b, and 13c, wafers 11a, l lb, and 11c for processing are arranged, respectively, and are indicated by arrows by the transfer robot 41 in the atmosphere corresponding to the first transfer robot on the EFEM 12. As shown in the figure, move in the vertical direction and stop before each FOUP 13a, 13b, 13c. Access one of the FOUPs that were stopped before that, and remove the processing ueno l la, l ib, 11c. At this time, the doors of FOUPs 13a, 13b, and 13c open and close in synchronization with the doors of EFEM12. More specifically, the door plates of each door move up and down synchronously to open and close the door. In addition, the transfer robot 41 The processing wafer l la, l lb, 11c is moved to a position facing the chamber 14 and placed in the load lock chamber 14. At this time, there is a door 12a between the EFEM 12 and the load lock chamber 14 (see FIG. 4), and after placing, the door 12a is closed and evacuation is performed.

FIG. 11 shows a transparent side view of the load lock chamber (or chamber) 14. The load lock chamber 14 includes an opening 14b on the EFEM 12 side and a door 14a that can close the opening 14c, and an opening 14c on the opposite side (vacuum transfer module side) and a vacuum chamber side door 14d that can close the opening 14c. Is provided. In the load lock chamber 14, a substrate mounting shelf 14e is disposed on the mounting shelf lifting mechanism 14f. The substrate mounting shelf 14e has a plurality of stages (shelf stages), and a wafer substrate can be placed on each stage. The mounting shelf elevating mechanism 14f raises and lowers the entire substrate mounting shelf 14e so as to adjust the height between the transfer surface of the transfer robot 41 and the corresponding step of the substrate mounting shelf 14e. After mounting, the doors 14a and 14d on both sides are closed, and the load lock chamber 14 is evacuated.

[0027] Returning to FIG. The degree of vacuum in the load lock chamber 14 When the vacuum level of the first vacuum transfer module 16 is almost equal, the door 14d is opened and the load lock chamber 14 is opened by the vacuum transfer robot 40 corresponding to the second transfer robot. Take the board l id. At this time, the position of the corresponding stage of the substrate mounting shelf 14e is adjusted by the mounting shelf lifting mechanism 14f so as to match the transfer surface of the vacuum transfer robot 40.

[0028] The first vacuum transfer module 16 includes a processing chamber 22 and a gate valve capable of closing the opening and the opening through a processing chamber side door 22a as a gate valve capable of closing the opening and the opening. Are connected to the processing chamber 24 via a processing chamber side door 24a. The height positions of the doors 22a and 24a are arranged at positions corresponding to the transfer surface of the vacuum transfer robot 40. The vacuum transfer robot 40 takes out the substrate 11 from the mounting shelf elevating mechanism 14f, and places the substrate 11 on the hand to transfer the substrate 11. Transport is performed by moving straight to the right along the horizontal arrow in the figure. When accessing the processing chambers 22, 24, the vacuum transfer robot 40 stops at a position corresponding to each processing chamber 22, 24 on the line (left and right arrowheads) extending left and right in the figure. Then, by the motor provided in the vacuum transfer robot 40 in the first vacuum transfer module 16, the upper and lower hand forces rotate together by about 90 degrees along the direction of the vertical arrow in the figure. And along the direction of the vertical arrow in the figure, Only the lower hand uses the hand protrusion mechanism to transfer the substrate into the processing chamber 22 when the door 22a is open.

[0029] The first vacuum transfer module 16 is connected to the second vacuum transfer module 18 via a module connecting part (or connecting part) 16a. Accordingly, the first vacuum transfer module 16 and the second vacuum transfer module 18 maintain substantially the same degree of vacuum. Similarly, the third vacuum transfer module 20 is connected to the second vacuum transfer module 18 via a module connecting portion (or connecting portion) 18a.

[0030] The vacuum transfer robot 40 moves between the vacuum transfer modules 16, 18, 20 through the module connecting portions 16a, 18a. Similar to the first vacuum transfer module 16, the second vacuum transfer module 18 is connected to the processing chambers 26 and 28 via doors 26a and 28a. Similarly to the first vacuum transfer module 16, the third vacuum transfer module 20 is connected to the processing chambers 30 and 32 through doors 30a and 32a. The vacuum transfer robot 40 places the substrates l le, l lf, l lg, 11 h, l li, and I lk in these processing chambers 22, 24, 26, 28, 30, and 32, respectively. Giving

Can do.

[0031] In this way, it is possible to provide a total of six processing chambers, and furthermore, since they can be connected one after another simply by an airtight connecting portion, a desired number of processing chambers can be provided, The configuration of the substrate transfer apparatus can be flexibly changed according to the number of necessary processes.

FIG. 3 is a perspective view of a transfer apparatus 10a in which one vacuum transfer module 16 is incorporated, FIG. 4 is a plan view, and FIG. 5 is a front view. Similar to the transfer device 10 described above, a plurality of FOUPs 13a, 13b, 13c, and 13d force are provided at the left end of the EFEM 12, and the load lock chamber 14 is disposed at a substantially central position at the opposite right end, and the load A vacuum transfer chamber including a vacuum transfer module 16 is disposed on the right side of the lock chamber 14. The load lock chamber 14 and the vacuum transfer module 16 are placed on the upper surface of a common platform (platform) 50 and are configured so that the upper and lower positions of the opening closed by the gate valve or the door 14d can be easily aligned. Since the common frame (or frame) 50 has a structure that is configured by assembling angles, a utility or utility storage unit 22b, 24b is installed in the gap of the frame and directly under the vacuum transfer module 16. Is done. These you Tility drives the lifting mechanism of the vacuum transfer robot 40 when the vacuum transfer robot 40 stops at a predetermined position in the vacuum transfer module 16. In addition, other functions of the vacuum transfer robot 40 can be exhibited. Details of the drive mechanism of the vacuum transfer robot 40 will be described later.

[0033] The EFEM 12 is not placed on the common platform 50, but stands on its own leg, and is adjusted so that the height of the door 12a matches the opening 14b of the load lock chamber 14. Under each FOUP 13a, 13b, 13c, 13d, a door opening / closing mechanism is installed, and the doors are opened and closed synchronously to prevent contamination. Of course, EFEM can be mounted on a common platform.

FIG. 6 corresponds to the perspective plan view of FIG. 4 and shows the atmospheric transfer robot 41 in the EFEM 12 and the vacuum transfer robot 40 in the vacuum transfer chamber composed of the vacuum transfer module 16. Although not shown in FIG. 4, the processing chambers 22 and 24 are connected to the vacuum transfer chamber 16 via processing chamber side doors 22a and 24a, respectively. The atmospheric transfer robot 41 moves so as to be able to stop in front of each FOUP 13a, 13b, 13c, 13d by traveling on a substantially horizontal traveling path 43. The stopped atmospheric transfer robot 41, like the vacuum transfer robot 40, changes the direction of the hand 40a on which the wafer 11 is placed by the rotation of the motor provided, and takes out the wafer 11 in each FOUP 13a, 13b, 13c, 13d. I can do it.

FIG. 7 is a diagram for explaining the function of the vacuum transfer robot 40. The vacuum transfer robot 40 is arranged in each connected vacuum transfer module 16, 18, 20 and can move linearly in these modules. The travel guide 40b that defines the moving direction extends substantially linearly in the connecting direction of the modules. The upper surface of the travel guide 40b becomes the travel guide surface, and the moving body 40i straddling the travel guide 40b moves along the travel guide 40b. Specifically, the driving force is below the traveling guide 40b and a vacuum system external force is also applied. The traveling guide 40b guides together with the auxiliary traveling guide 40g (see FIG. 6) so that the vacuum transfer robot 40 can move horizontally. In particular, in the traveling guide 40b, a mechanism for driving the moving body 40i of the vacuum transfer robot 40 is provided outside the vacuum chamber. Such a mechanism can be, for example, a ball screw or a linear motor. In the case of a ball screw, a strong magnet that moves in the travel guide 40b with the ball screw is installed on the moving body. It is driven in a non-contact manner by a martensitic stainless steel that can stick to the magnet.

[0036] An elevating shaft 40c is guided to the movable body 40i so as to be movable up and down, and the elevating table 40d is fixed on the elevating shaft 40c. The rotary table 40e is rotated on the lifting table 40d by a motor (not shown), and the hand guide 40f and the hand 40a fixed to the rotary table 40e rotate together. A mechanism for sliding the upper and lower hands 40a is provided on the upper part of the hand guide 40f. In this mechanism, for example, the timing belt is stretched along the upper surface of the guide 40f, pulleys are placed on the left and right ends in the figure, and the member fixed to the timing belt is connected to the upper or lower hand 40a. It can be a thing! When two timing belts are stretched side by side, the upper and lower hands 40a can be moved independently to the left and right in the figure by connecting the V ヽ shift to the upper or lower hand 4 Oa. . When the vacuum transfer robot 40 arrives at a position where the substrate 11 is transferred (for example, a predetermined position of the vacuum transfer robot 40 that can transfer the substrate 11 to the processing devices 22, 24, 26, 28, 30, 32) ), The lift shaft 40c is raised by pushing up the lift pin 17a disposed outside the vacuum transfer chamber having the force of the vacuum transfer module 16, 18, 20 where the travel guide 40b is disposed.

FIG. 8 is a cross-sectional view illustrating the operation of the vacuum transfer robot 40 in a vacuum transfer chamber in which a plurality of vacuum transfer modules 16 and 18 are connected. FIG. 9 is a BB cross-sectional view of FIG. FIG. 10 is a cross-sectional view taken along the line AA in FIG. In FIG. 7, the vacuum transfer robot 40 is in a place where it is not necessary to perform its loading / unloading function (the lifting pin 17a and the lifting shaft 40c are shifted in the figure), so that the lifting shaft is raised or lowered. Absent. However, in FIG. 8, the vacuum transfer robot 40 can exert its function because it has come to a predetermined position in front of the processing chamber 22. FIG. 8 is a partial cross-sectional view of the vacuum transfer chamber when the transfer apparatus 10 is viewed from the front side. The elevating pins 17a of the utility storage unit arranged in the gantry 50 are pushed by winding an O-ring into an opening opened in the bottom wall of the vacuum transfer module. This prevents inflow of air into the vacuum transfer module. At this time, it is preferable to apply grease or oil with low vapor pressure to the O-ring.

[0038] The utility storage unit is provided with a mechanism for pushing up the lifting pins 17a. At this timing, the lifting pin 17a is pushed up, and the lifting shaft 40e is pushed up further. As a result, all the equipment on the lifting table 40d is pushed up, and the necessary height for loading and unloading the substrate 11 can be secured. Thus, since the drive system is out of the vacuum system, the mechanism of the vacuum transfer robot 40 is simple, lightweight and easy to move. The same applies when the vacuum transfer robot 40 comes on the utility storage unit 24b on the right.

[0039] In the first vacuum transfer module 16, the traveling guide 40b has a continuous cross-sectional cap shape (a cup shape inverted) (Fig. 10). Inside, it is connected by another traveling guide 40b and a joint 16b. At this time, the upper surface serves as a guide surface and is joined by a pliers so that the traveling body 40i can be easily moved. Needless to say, it is possible to introduce an integrated long traveling guide that does not connect the traveling guides in this way. Which one to choose can be decided in view of cost, ease and other conditions.

As shown in FIG. 9, at the connecting portion between the first vacuum transfer module 16 and the load lock chamber 14, the vacuum chamber side door 14 d is located above the door opening / closing mechanism, and the opening of the first vacuum transfer module 16. Is closed. FIG. 10 shows an AA cross-sectional view, and the traveling body 40i moves on the traveling guide 40b and the auxiliary traveling guide 40g. Although not shown, a drive mechanism for the traveling body 40i is provided in the cap of the traveling guide 40b.

[0041] As described above, the transfer device of the present invention can be expanded, can flexibly respond to increase / decrease in production volume, and has the great effect of high mobility. Further, these examples are merely used to explain the present invention, and the contents of the present invention are not limited to these examples. For example, in the above embodiment, the case where there is only one vacuum transfer robot has been described, but there may be two, three, or more. Also, the moving route may have a straight route with a force of 2 or more, which has been made almost straight. Furthermore, it does not exclude that these routes cross each other.

Brief Description of Drawings

FIG. 1 is a plan configuration diagram of a substrate transfer platform.

FIG. 2 is a layout diagram of a substrate transfer platform.

FIG. 3 is a perspective view of a substrate transfer platform having one vacuum transfer module. FIG. 4 is a plan view of the substrate transfer platform.

FIG. 5 is a front view of the substrate transfer platform.

FIG. 6 is a partially transparent plan view of the substrate transfer platform.

FIG. 7 is a schematic configuration diagram (side view) of a vacuum transfer robot.

FIG. 8 is a partial cross-sectional view of a vacuum transfer chamber of a substrate transfer platform.

FIG. 9 is a BB sectional view of FIG.

FIG. 10 is a cross-sectional view taken along the line AA in FIG.

FIG. 11 is a transparent side view of the interior of the load lock chamber.

Explanation of symbols

10, 10a Transfer device

11 Board

12 EFEM

14 Road, lock room

16, 18, 20 Vacuum transfer module

16b joint

17a Lift pin

22, 24, 26, 28, 30, 32 Processing chamber

40 Vacuum transfer robot

40a node

40b Driving Guide

40c lifting shaft

40g Auxiliary travel guide

401 traveling body

41 Airborne robot

50 Common mount

Claims

The scope of the claims

[1] A transport device for transporting a thin plate comprising a load lock chamber and a vacuum transport chamber that can be connected,

The vacuum transfer chamber is

It has at least one module chamber, and the second force module chamber is connected linearly at the connecting part,

[2] comprising a gantry on which at least the vacuum transfer chamber is placed;

The transport apparatus according to claim 1, wherein the gantry includes a space in which the various utilities can be stored.

[3] The transfer robot includes a hand for holding the thin plate,

The transfer robot drives the raising and lowering of the hand by the various utilities corresponding to the moving position in the vacuum transfer chamber, and transfers the thin plate to and from the processing chamber. The transport apparatus according to claim 1 or 2.

[4] The raising and lowering of the hand is performed outside the vacuum transfer chamber by pushing up an elevating shaft of the vacuum transfer robot by pushing up an elevating pin provided in the various utilities. 3. The transfer device according to 3.

[5] The load lock chamber includes a mounting shelf having a plurality of stages in the chamber, The loading shelf is moved up and down at the time of loading and unloading the thin plate, and a plurality of thin plates are delivered and Z or buffered, and the number of loading shelf stages having the plurality of steps is 42. The transfer apparatus according to claim 1, wherein the transfer apparatus is determined according to the number of connected processing chambers and module chambers.

The load lock chamber includes a device front end module on the opposite side of the vacuum transfer chamber side,

A front open storage box having an openable / closable exit door is placed on the opposite side of the load lock chamber side of the device front end module,

6. The apparatus front end module includes a loading door that faces the loading door and opens and closes in the same manner, and the loading door and the loading door open and close synchronously. Or a transfer device.