WO2008065880A1 - Procédé de liaison de substrats de micropuce et micropuce - Google Patents

Procédé de liaison de substrats de micropuce et micropuce Download PDF

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Publication number
WO2008065880A1
WO2008065880A1 PCT/JP2007/071984 JP2007071984W WO2008065880A1 WO 2008065880 A1 WO2008065880 A1 WO 2008065880A1 JP 2007071984 W JP2007071984 W JP 2007071984W WO 2008065880 A1 WO2008065880 A1 WO 2008065880A1
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WO
WIPO (PCT)
Prior art keywords
microchip
resin
coating solution
substrate
microchip substrate
Prior art date
Application number
PCT/JP2007/071984
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Hirayama
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2008546935A priority Critical patent/JP4992123B2/ja
Publication of WO2008065880A1 publication Critical patent/WO2008065880A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
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    • B29C66/112—Single lapped joints
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    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054

Definitions

  • the present invention relates to a method for bonding a microchip substrate in which a channel groove is formed, and a microchip manufactured by the bonding method.
  • a fine flow path circuit is formed on a silicon or glass substrate, and chemical reactions, separation, and analysis of liquid samples such as nucleic acids, proteins, and blood are carried out in a micro space.
  • a micro-analysis chip to perform, or an apparatus called u TAS (Micro Total Analysis Systems) has been put into practical use.
  • u TAS Micro Total Analysis Systems
  • a microchip is manufactured by bonding two members that have been subjected to micromachining to at least one member.
  • a glass substrate is used for the microchip, and various microfabrication methods have been proposed.
  • glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin macrochips is desired.
  • Examples of the treatment for imparting hydrophilic properties to the flow channel surface include organic / inorganic coating, plasma treatment, and surface modification by flowing a solution in the flow channel.
  • the coating of SiO film is sufficiently hydrophilic and is used as a material because it is inorganic.
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-80569
  • Patent Document 2 Japanese Patent Laid-Open No. 2005-77239
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-771218
  • Patent Document 4 Japanese Patent Laid-Open No. 2005-74796
  • the resin microchip substrates can be bonded to each other by the method described above. In ultrasonic fusion, thermal fusion, and laser fusion, the resin surface of the substrate is melted and solidified again to join the resin microchip substrates together. When a hydrophilic film is formed and a hydrophilic film is also formed on the bonding surface, it becomes difficult to bond the microchip substrates together.
  • an inorganic SiO film when used as the hydrophilic film, it is usually a microchip substrate.
  • FIG. 7 is a cross-sectional view of a microchip substrate for explaining a conventional method for bonding microchip substrates.
  • a SiO film 103 is formed on a microchip substrate 101 having a fine flow path 102 formed on the surface.
  • an SiO film 105 is formed on a flat microchip substrate 104 for covering the fine flow path 102, and both substrates are bonded by an adhesive 106.
  • Adhesive 106 is a resin whose main component after curing is hydrophobic and exhibits hydrophobicity.
  • an SiO film 103 is formed only on the inner surface of the fine channel 102, and the An SiO film 105 is formed on the chip substrate 104 at a position corresponding to the fine flow path 102.
  • the substrates are bonded together by the adhesive 106. Even in this case, since the adhesive 106 is thicker than the SiO film 105, the adhesive 106 oozes out into the fine flow path 102.
  • an SiO film 103 is formed only on the inner surface of the fine channel 102 to
  • a SiO film 105 is formed at a position corresponding to the fine channel 102.
  • the substrates are bonded together by heat fusion, laser fusion, or ultrasonic fusion.
  • the patterning of the SiO film is observed on both the microchip substrate 101 and the microchip substrate 104.
  • the deposition position of the SiO film 105 on the microchip substrate 104 is accurately determined.
  • the surface (resin) of the microchip substrate 104 is exposed to the fine flow path 102 as shown by the broken-line circle, and the fine flow path 102 is covered only with the SiO film having a hydrophilic function.
  • the present invention solves the above-described problem, and a bonding method capable of forming a hydrophilic film on the inner surface of a fine flow path and easily bonding substrates together to manufacture a microchip, And a microchip manufactured by the bonding method.
  • At least one resin member of two resin members is formed with a channel groove, and the two resin members are formed with the channel groove.
  • a second embodiment of the present invention is a bonding method for a microchip substrate according to the first embodiment, wherein the flow path groove is formed in one of the two resin members.
  • the other resin member is a plate-like member, the coating solution is applied to the surface of the one resin member on which the channel groove is formed, and the other resin member is joined.
  • the surface to be joined of the two resin members is formed by forming a SiO film mainly composed of SiO on the surface to be bonded.
  • the two resin members are overlapped with each other facing each other, and then the one resin member and the other resin member are joined by curing the coating solution.
  • a third aspect of the present invention is the bonding method of the microchip substrate according to the first aspect, wherein the flow path groove is formed in one of the two resin members.
  • the other resin member is a flat plate member, and the application solution is applied to the joining surface of the other resin member so that the flow path groove of the one resin member is formed.
  • the surface to be joined of the two resin members is formed by forming a SiO film containing SiO as a main component on the other surface.
  • the two resin members are overlapped with each other facing each other, and then the one resin member and the other resin member are joined by curing the coating solution.
  • a fourth embodiment of the present invention is the method for joining the microchip substrates of the first embodiment, wherein the flow path groove is formed in one of the two resin members.
  • the other resin member is a flat plate member, and an SiO film containing SiO as a main component is formed on each of the surfaces to be joined of the two resin members, and the contact of the other resin member is made.
  • the coating solution is applied to the mating surfaces, the two resin members are stacked with the two resin members facing each other, and then the coating solution is cured to cure the one of the two resin members. A resin member is joined to the other resin member.
  • a fifth aspect of the present invention is the method for joining microchip substrates according to the first aspect, wherein the flow path groove is formed in one of the two resin members. And others
  • the one resin member is a flat plate member, and the coating solution is applied to the surface of the one resin member on which the channel groove is formed, and the other resin member is joined to the surface to be joined. Applying the coating solution, overlapping the two resin members with the surfaces to be joined of the two resin members facing each other, and then curing the coating solution, the one resin member and the The other resin member is joined.
  • a sixth aspect of the present invention is the microchip substrate bonding method according to the first aspect, wherein one of the two resin members and the other resin member are connected with the flow. A surface groove is formed, the coating solution is applied to the surface of the one resin member and the other resin member on which the channel groove is formed, and the two resin members are joined to each other The two resin members are overlapped with each other facing each other, and then the one resin member and the other resin member are joined by curing the coating solution.
  • a seventh aspect of the present invention is a microchip characterized by being bonded by the method for bonding microchip substrates according to any one of the first to sixth aspects.
  • a flow path groove is formed in at least one of the two resin members, and the flow path groove is formed in the two resin members.
  • the microchip is bonded with its surface facing inward, and a SiO film mainly composed of SiO is formed on the surface where the two resin members are bonded, and the SiO film is interposed through the SiO film.
  • the microchip is characterized in that the resin members are joined.
  • a ninth aspect of the present invention is the microchip according to the eighth aspect, wherein the resin member in which the channel groove is formed is a plate-like member out of the two resin members. In addition, the channel groove is formed, and the resin member is a film-like resin member.
  • a coating solution containing SiO as a main component after curing is applied to a resin member.
  • the coating solution is cured to form an SiO film on the inner surface of the channel groove and to join the two resin members.
  • FIG. 1 is a cross-sectional view of a microchip substrate for illustrating a microchip substrate bonding method according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a microchip substrate for explaining a bonding method of a microchip substrate according to Modification 1;
  • FIG. 3 is a cross-sectional view of a microchip substrate for explaining a bonding method of a microchip substrate according to Modification 2.
  • FIG. 4 is a cross-sectional view of a microchip substrate for explaining a microchip substrate bonding method according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a microchip substrate for explaining a microchip substrate bonding method according to a third embodiment of the present invention.
  • FIG. 6 is a table showing conditions for each example.
  • FIG. 7 is a cross-sectional view of a microchip substrate for explaining a microchip substrate bonding method according to the prior art.
  • FIG. 1 is a cross-sectional view of a microchip substrate for explaining a method of bonding microchip substrates according to the first embodiment of the present invention.
  • a groove-shaped fine channel 11 is formed on the surface of the microchip substrate 10.
  • the microchip substrate 20 that is the counterpart to which the microchip substrate 10 is joined is a flat substrate.
  • the microchip substrate 20 becomes a microchannel. It functions as an 11 lid and a microchip is manufactured.
  • the microchip substrates 10 and 20 correspond to an example of the “resin member” of the present invention.
  • a resin is used for the microchip substrates 10 and 20.
  • the resin is particularly limited in terms of force S, such as good moldability (transferability, releasability), high transparency, and low autofluorescence for ultraviolet light and visible light. It is not a thing.
  • force S such as good moldability (transferability, releasability), high transparency, and low autofluorescence for ultraviolet light and visible light. It is not a thing.
  • polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polybutyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, ring Polyolefins are preferred. Particularly preferred are polymethyl methacrylate and cyclic polyolefin.
  • the microchip substrate 10 and the microchip substrate 20 may use the same material or different materials.
  • the shape of the microchip substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a size of about 10 mm square to 200 mm square is preferable, and 10 mm square to 100 mm square is more preferable.
  • the shape of the microchip substrates 10 and 20 is preferably a square, rectangle, circle or the like according to the analysis method and analysis apparatus.
  • the shape of the microchannel 11 is 10 111 to both in width and depth in consideration of the fact that the amount of analysis sample and reagent used can be reduced, and the fabrication accuracy of the mold, transferability, releasability, etc.
  • the value is preferably within the range of 200 111, but is not particularly limited.
  • the aspect ratio (groove depth / groove width) is preferably about 0.2;! ⁇ 3, more preferably about 0.2 ⁇ 2.
  • the width and depth of the fine channel 11 may be determined according to the use of the microchip.
  • the cross-sectional shape of the microchannel 11 shown in FIG. 1 is a rectangular shape! / However, this shape is an example of the microchannel 11 and is a curved surface. It may be.
  • the thickness of the microchip substrate 10 on which the microchannel 11 is formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of formability.
  • the thickness of the microchip substrate 20 functioning as a lid (cover) for covering the microchannel 11 is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of formability.
  • a film-like resin member (sheet-like member) that is not a plate-like member may be used. in this case
  • the thickness of the finolem is preferably 30 ⁇ m to 300 ⁇ m, and more preferably 50 ⁇ m to 150 ⁇ m.
  • a coating solution 12 containing SiO as a main component after curing is applied to the surface of the microchip substrate 10 on which the microchannels 11 are formed.
  • a coating solution 21 containing SiO as a main component after curing is applied to the surface of the substrate 20.
  • the coating solution 21 is also applied to the inner surface of the fine channel 11 for the mouth chip substrate 10.
  • the coating solution for example, a solution obtained by dissolving a polysiloxane oligomer obtained by hydrolysis and condensation polymerization of alkoxysilane in an alcohol solvent is used.
  • a SiO film is formed.
  • a group made by JSR JSR
  • Examples include lath force 7003 and methyl silicate 51 manufactured by Colcoat.
  • perhydropolysilazane dissolved in xylene and dibutyl ether solvent is used for the coating solution.
  • the coating solution is heated to volatilize the solvent and at the same time react with water to form a SiO film.
  • Examples include aquamica.
  • an inorganic mono-organic hybrid polymer obtained by hydrolyzing and co-condensing an alkoxysilyl group-containing polymer and alkoxysilane is used as a coating solution by dissolving it in an alcohol solvent.
  • the alcohol solvent is volatilized by heating, and the main component is SiO.
  • coating solutions 12 and 21 it is important to uniformly apply the coating solutions 12 and 21 to the microchip substrates 10 and 20.
  • physical properties viscosity, volatility, surface tension, wettability
  • coating method select the coating method as appropriate. Examples include date bubbling, spray coating, spin coating, slit coating, screen printing, pad printing, and ink jet printing.
  • the thickness of the coating solutions 12 and 21 is such that the entire inner surface of the fine channel 11 is covered with SiO.
  • the film thickness according to the characteristics and type of coating solutions 12 and 21. For example, a value in the range of 101 111 to 3 111 is preferred 10 nm to 2 i um A value within the range is more preferable.
  • the microchip substrate 10 and the microphone port chip substrate 20 are overlapped with the fine channel 11 inside.
  • the coating solutions 12 and 21 are not cured, the microchip substrate 10 and the microchip substrate 20 are attached by the coating solutions 12 and 21.
  • the coating solutions 12 and 21 are cured to form SiO films 13 and 22.
  • thermosetting coating For example, thermosetting coating
  • Coating solutions 12, 21 function as an adhesive and can be cured
  • the microchip substrate 10 and the microchip substrate 20 can be bonded. As a result, a microchip is manufactured. Between the microchip substrate 10 and the microchip substrate 20, only SiO films 13 and 22 are interposed.
  • the curing method is appropriately selected in consideration of the physical properties (viscosity, volatility, catalyst) of liquids 12 and 21.
  • the coating solutions 12, 21 are allowed to cure at room temperature, the coating solutions 12, 21 are cured by heating at a temperature of 60 ° C to 100 ° C, or the coating solutions 12, 21 are heated at a high temperature. Curing under humidity (such as 90% humidity at 60 ° C, 90% humidity at 80 ° C). It is also possible to cure the coating solutions 12, 21 using UV curing or visible light curing.
  • the coating solutions 12 and 21 containing SiO as a main component after curing are applied to the microchip substrate.
  • the microchip substrate 10 and the microchip substrate 20 by applying them to the plates 10 and 20 and causing the coating solutions 12 and 21 to function as adhesives. Furthermore, by applying the coating solution 12 to the inner surface of the microchannel 11 and curing it, it is possible to form a SiO film having a hydrophilic function on the inner surface of the microchannel 11.
  • an SiO film is formed on the inner surface of the fine channel 11 and the micro
  • the substrate 10 and the microchip substrate 20 can be bonded, it is possible to perform the two steps of hydrophilic processing and bonding processing in one step.
  • the SiO film has a hydrophilic function, a small flow of a low molecule such as protein or a polymer
  • microchip substrates 10 and 20 are made of resin, they are usually hydrophobic, and low molecules and polymers such as proteins tend to adhere to the microchannel 11, but by forming a SiO film, Suppresses its adhesion
  • the SiO film is chemically stable, the hydrophilic function must be stably maintained.
  • the force effect that can be hydrophilized decreases with time, and the hydrophilic function is often lost within a few days. It is also possible to modify the surface of the microchip substrate 10 or 20 with a polymer such as oligoethylene glycol or 2-methacryloyloxychetyl phosphorylcholine by dipping or the like to make it hydrophilic. A uniform hydrophilic surface may not be obtained due to weak adsorption force or unevenness.
  • the microchip substrate 20 functioning as a bar
  • the same surface state can be formed even when the resin materials of the microchip substrate 10 and the microchip substrate 20 are different. As a result, the accuracy and reliability of the analysis can be increased. If the surface condition of the substrate is different, there will be variations in the flow rate and reaction of the liquid to be analyzed, and the detection sensitivity of the analysis chip will be reduced.
  • the SiO membrane is made into a fine channel 11
  • the coating solution is applied to both substrates of the microchip substrate 10 in which the microchannel 11 is formed and the flat microchip substrate 20 that functions as a cover for covering the microchannel 11.
  • the force that applied SiO2 to form the SiO film Either microchip substrate
  • the microchip substrate 10 and the microchip substrate 20 may be bonded to each other by applying a coating solution.
  • a coating solution is applied to one of the microchip substrates.
  • FIG. 2 is a cross-sectional view of a microchip substrate for explaining the microchip substrate bonding method according to Modification 1.
  • a microchip substrate 10 having a microchannel 11 formed on the substrate surface and a flat microchip substrate 20 are prepared.
  • the SiO film 23 is formed on the surface of the flat microchip substrate 20.
  • a SiO film 23 can be formed by CVD, or a coating solution containing SiO as a main component after curing can be used.
  • a coating solution 12 containing SiO as a main component after curing is applied to the surface on which the microchannel 11 is formed, on the microchip substrate 10 on which is formed.
  • the microchip substrate 10 and the mic chip substrate 20 are overlapped with the fine channel 11 inside.
  • the coating solution 12 is not cured, the microchip substrate 10 and the microchip substrate 20 are bonded by the coating solution 12.
  • the coating solution 12 is cured to form the SiO film 13.
  • the coating solution 12 functions as an adhesive and can be cured to bond the microchip substrate 10 and the microchip substrate 20 together. As a result, the microchip is manufactured. Between the microchip substrate 10 and the microchip substrate 20, there is an SiO film
  • the coating solution 12 containing SiO as a main component after curing is applied to one microchip.
  • the coating solution 12 can function as an adhesive, and the microchip substrate 10 and the microchip substrate 20 can be bonded. Furthermore, by applying the coating solution 12 to the inner surface of the microchannel 11 and curing it, it is possible to form a SiO film having a hydrophilic function on the inner surface of the microchannel 11. in this way,
  • the SiO film is formed on the inner surface of the fine channel 11 and
  • microchip substrate 10 and the microchip substrate 20 can be bonded, It is possible to perform the two steps of aqueous treatment and bonding treatment in one step.
  • FIG. 3 is a cross-sectional view of a microchip substrate for explaining a bonding method of the microchip substrate according to the second modification.
  • the force is changed by applying the coating solution 12 mainly composed of SiO after curing to the microchip substrate 10 on which the microchannel 11 is formed to form the SiO film.
  • the coating liquid 21 was applied to the microchip substrate 20 to be bonded, and the SiO2 film was formed on the microphone tip chip substrate 10 before the substrates were stacked.
  • a microchip substrate 10 having a microchannel 11 formed on the substrate surface and a flat microchip substrate 20 are prepared.
  • the SiO film is formed on the surface of the microchip substrate 10 on which the microchannel 11 is formed.
  • SiO film 14 is formed by CVD, or SiO is the main component after curing.
  • a coating solution is applied to the substrate surface and then cured to form the SiO film 14.
  • the SiO film 14 is also formed on the inner surface of the fine channel 11.
  • the substrate 20 is coated with a coating solution 21 containing SiO as a main component after curing.
  • the microchip substrate 10 and the mic chip substrate 20 are overlapped with the fine channel 11 inside.
  • the coating solution 21 is not cured, the microchip substrate 10 and the microchip substrate 20 are bonded together by the coating solution 21.
  • the coating solution 21 is cured to form the SiO film 22.
  • the coating solution 21 functions as an adhesive and can be cured to bond the microchip substrate 10 and the microchip substrate 20 together. As a result, the microchip is manufactured. Between the microchip substrate 10 and the microchip substrate 20, there is an SiO film
  • the coating solution 12 containing SiO as a main component after curing is applied to one microchip. Even when applied to the substrate 20, the coating solution 21 can function as an adhesive, and the microchip substrate 10 and the microchip substrate 20 can be bonded.
  • FIG. 4 is a cross-sectional view of a microchip substrate for explaining a method for bonding microchip substrates according to a second embodiment of the present invention.
  • the fine flow path is formed only on one of the microchip substrates, but in the second embodiment, the fine flow paths are formed on both microchip substrates.
  • a microchip substrate 10 having a microchannel 11 formed on the surface and a microchip substrate 30 having a microchannel 31 formed on the same surface are prepared.
  • a deeper microchannel can be formed.
  • a coating solution 12 containing SiO as a main component after curing is applied to the surface on which the microchannel 11 is formed on the microchip substrate 10.
  • the surface on which the fine flow path 31 is formed has SiO as a main component after curing.
  • coating solution 32 Apply coating solution 32.
  • the coating solutions 12 and 32 are also applied to the inner surfaces of the microchannels 11 and 31 for both substrates.
  • the microchip substrate 10 and the microchip substrate 30 are overlapped with the fine flow paths 11 and 31 inside.
  • the fine channels 11 and 31 are aligned so that the fine channel 11 and the fine channel 31 overlap at the same position.
  • the coating solutions 12 and 32 are not cured, the microchip substrate 10 and the microchip substrate 30 are bonded by the coating solutions 12 and 32.
  • the coating films 12 and 32 are cured to form the SiO films 13 and 33.
  • the coating solutions 12 and 32 function as an adhesive and can be cured to bond the microchip substrate 10 and the microchip substrate 30 together. By this bonding, it is possible to form a fine channel 40 having a large groove aspect ratio.
  • both the microchip substrate 10 and the microchip substrate 30 are Although the coating solution is applied to the plate, the microchip substrates may be bonded to each other by applying the coating solution to any one of the microphone chip substrates as in the first and second modifications.
  • FIG. 5 is a cross-sectional view of a microchip substrate for explaining a microchip substrate bonding method according to a third embodiment of the present invention.
  • a microchip substrate 50 on which a microchannel 51 is formed and a flat microchip substrate 60 are prepared.
  • the microchip substrate 50 has a SiO film 52 formed in advance on the surface on which the microchannel 51 is formed, and the microchip substrate 60 also has an SiO film.
  • SiO films 52 and 61 are pre-formed.
  • SiO films 52 and 61 are formed by CVD, or after curing, S
  • the coating solution that forms the coating film 52, 61 is applied to the substrate surface, and then cured to form a SiO film 52, 61.
  • the microchip substrate 50 and the microphone port chip substrate 60 are overlapped with the fine flow path 51 inside.
  • the coating solution 70 is not cured, the microchip substrate 50 and the microchip substrate 60 are bonded together by the coating solution 70.
  • the coating solution 70 is cured to form the SiO film 71.
  • Coating solution 70 functions as an adhesive and cures
  • the microchip substrate 50 and the microchip substrate 60 can be joined. Thereby, the microchip is manufactured. Just like a conventional SiO film between the microchip substrate 50 and the microchip substrate 60, the adhesive, etc.
  • FIG. 6 is a table showing the conditions of each example. (Example 1)
  • Example 1 a specific example of the first embodiment will be described.
  • a polymethylmethacrylate resin (Mitsubishi Rayon, Ataripet VH), which is a transparent resin material, is molded using an injection molding machine, and the width is 50 ⁇ m and the depth is 50 m on a plate-shaped member with an opening dimension of 50 mm x 50 mm x 1 mm.
  • a channel-side micro-chip chip substrate composed of a plurality of microchannels and a plurality of through-holes having an inner diameter of 2 mm was produced.
  • This flow path-side microchip substrate force S corresponds to the microchip substrate 10 on which the fine flow path 11 in the first embodiment is formed.
  • a cover-side microchip substrate having an opening size of 50 mm ⁇ 50 mm ⁇ lmm was produced.
  • This cover-side microchip substrate force S corresponds to the microphone chip substrate 20 that functions as a lid (cover) in the first embodiment.
  • a spray coater manufactured by EVG, nanospray coating
  • EVG nanospray coating
  • JSR glass force 7506
  • JSR glass force 7506
  • the coated surfaces of the channel-side microchip substrate and the cover-side microchip substrate are overlapped with each other and placed in an 80 ° C. oven for 30 minutes to cure the coating solution, and the channel-side microchip substrate and the cover are covered.
  • the side microchip substrate was bonded.
  • Si silicon
  • a hybrid film composed mainly of an O film was formed. This produced a microchip.
  • Example 2 In Example 2, a specific example of the first embodiment will be described. In Example 2, a film was used for the cover-side microphone opening chip substrate.
  • An injection molding machine is used to mold a cyclic polyolefin resin (Zeon, made by Nippon Zeon Co., Ltd.), and a plate-shaped member with external dimensions of 50 mm x 50 mm x lmm. Then, a flow path side microchip substrate composed of a plurality of through holes having an inner diameter of 2 mm was produced.
  • This flow path side microchip substrate corresponds to the microchip substrate 10 on which the fine flow path 11 in the first embodiment is formed.
  • a transparent resin film manufactured by Nippon Zeon Co., Ltd., Zeonor film
  • the film thickness is 100 m.
  • This film-like cover-side microchip substrate force corresponds to the microchip substrate 20 functioning as a lid (cover) in the first embodiment.
  • a spray coater (USC-200ST, manufactured by Usio Electric Co., Ltd.) is used on the joint surface between the flow path side microchip substrate and the cover side microchip substrate, and the coating solution (AZ Electric Nick Materials, AQUAMICA) is used.
  • the coating was adjusted to a thickness.
  • a spray coater it was possible to apply the coating solution evenly inside the fine channel with a width of 50 Hm and a depth of 50 Hm.
  • the thickness of the coating film in the microchannel was 0.5 m.
  • the flow path side microchip substrate and the cover side microchip substrate were firmly bonded, they did not sufficiently react with water, and thus contained a small amount of organic components. Therefore, by putting it in a high-temperature and high-humidity tank with a temperature of 80 ° C and a humidity of 90%, the SiO film was formed.
  • Example 3 a specific example of Modification 2 will be described.
  • the coating solution was applied to a flat microchip substrate that functions as a lid (cover), and the substrates were bonded together.
  • An injection molding machine is used to form a cyclic polyolefin resin (Zeon Corporation, made by Nippon Zeon Co., Ltd.), and a plate-shaped member with outer dimensions of 50mm x 50mm x lmm. Then, a flow path side microchip substrate composed of a plurality of through holes having an inner diameter of 2 mm was produced. This flow path side microchip substrate corresponds to the microchip substrate 10 in which the fine flow path 11 in the second modification is formed. Further, a transparent resin film (manufactured by Nippon Zeon Co., Ltd., Zeonor film) was used for the cover side microchip substrate. The film is rolled into a roll with a width of 900 mm and a thickness of 00 m. This film-like cover-side microchip substrate force is equivalent to the microchip substrate 20 in Modification 2 above.
  • a transparent resin film manufactured by Nippon Zeon Co., Ltd., Zeonor film
  • a SiO film having a thickness of 150 nm was formed on the bonding surface of the flow path side microchip substrate by a CVD film forming apparatus (PD-270ST, manufactured by Samco).
  • the raw material for CVD is TEOS (made by ADEKA).
  • the coating solution manufactured by AZ Electronic Materials, Aquamica was applied so as to have a thickness of l ⁇ m.
  • the surfaces of the substrate coated with the coating solution were stacked and placed in an oven at 100 ° C for 1 hour for temporary curing.
  • the flow path side microchip substrate and the cover side microchip substrate are strong.
  • the SiO film was formed by placing it in a high-temperature and high-humidity tank with a temperature of 80 ° C and a humidity of 90% for 3 hours. Thereby, the microchip is manufactured.
  • the SiO film can be finely flowed by using a dry process such as CVD. It becomes possible to form uniformly in the path.
  • the coating solution By applying the coating solution to the side microchip substrate using a slit coater, it is possible to apply a large area coating solution at a time. Furthermore, a large number of channel-side microchip substrates can be stacked and bonded onto a film-like cover-side microchip substrate having a large area, and an SiO film can be simultaneously formed on a plurality of microchips.
  • Example 4 a specific example of the third embodiment will be described.
  • An injection molding machine is used to form a cyclic polyolefin resin (Zeon Corporation, made by Nippon Zeon Co., Ltd.), and a plate-shaped member with outer dimensions of 50mm x 50mm x lmm. Then, a flow path side microchip substrate composed of a plurality of through holes having an inner diameter of 2 mm was produced.
  • This flow path side microchip substrate corresponds to the microchip substrate 50 in which the fine flow path 51 in the third embodiment is formed.
  • a transparent resin film manufactured by Nippon Zeon Co., Ltd., Zeonor film
  • the film thickness is 100 m.
  • This film-like cover-side microchip substrate force corresponds to the microchip substrate 60 functioning as a lid (cover) in the third embodiment.
  • the raw material for VD was TEOS (manufactured by ADEKA). Using a CVD film deposition system, it was possible to form a uniform SiO film inside a fine channel with a width of 50 111 and a depth of 50 m.
  • the thickness of the SiO film inside the microchannel was lOOnm. Furthermore, the cover side microchip
  • the surfaces of the substrate coated with the coating solution were stacked and placed in an oven at 100 ° C for 1 hour for temporary curing.
  • the Si02 film was formed by placing it in a high-temperature and high-humidity tank with a temperature of 80 ° C and a humidity of 90% for 3 hours. Thereby, the microchip is manufactured.
  • the SiO film can be finely flowed by using a dry process such as CVD. It becomes possible to form uniformly on the road
  • Example 4 a dense SiO film was formed on the surface of the film-like cover-side microchip substrate using a CVD apparatus or the like.
  • Example 4 instead of a force SiO film using a SiO film as a coating on the surface of the film-like cover-side microphone opening chip substrate.
  • an acrylic or silicon hard coat film may be formed on the film-like microchip substrate on the cover side.
  • the coating solution is cured to form a SiO film.
  • a microchip can be manufactured by bonding a black chip substrate.
  • a coating solution containing SiO as a main component after curing is applied to the inner surface of the fine flow path to form a microchip substrate.

Abstract

Cette invention concerne un procédé de liaison qui permet de fabriquer facilement une micropuce en liant simplement des substrats les uns aux autres en tirant avantage d'un film hydrophile sur un passage d'écoulement fin dans sa face interne. Le procédé de liaison comprend les étapes suivantes : une solution de revêtement (12), qui est convertie en SiO2 lors du durcissement, est appliquée en revêtement sur un substrat de micropuce (10), avec un passage d'écoulement fin (11) formé dans celui-ci, sur son côté formé de passage d'écoulement fin (11) ; par ailleurs, une solution de revêtement (21), qui est convertie en SiO2 lors du durcissement, est appliquée en revêtement sur un substrat (20) de micropuce de type plaque plate sur son côté auquel le substrat de micropuce (10) doit être lié. Les substrats de micropuce (10, 20) sont superposés de telle sorte que le substrat de micropuce (10) sur son côté de passage d'écoulement fin (11) revêtu de la solution de revêtement (12) est tourné vers le substrat de micropuce (20) sur son côté revêtu de solution de revêtement (21). Les solutions de revêtement (12, 21) sont ensuite amenées à durcir et sont converties en films de SiO2 (13, 22), ce par quoi les substrats de micropuce (10, 20) sont liés entre eux.
PCT/JP2007/071984 2006-12-01 2007-11-13 Procédé de liaison de substrats de micropuce et micropuce WO2008065880A1 (fr)

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EP3738923A1 (fr) * 2019-05-13 2020-11-18 Tokyo Ohka Kogyo Co., Ltd. Procédé de fabrication d'un dispositif de trajet d'écoulement

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JP2019002932A (ja) * 2012-07-09 2019-01-10 ソニー株式会社 マイクロチップ
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US11167540B2 (en) 2019-05-13 2021-11-09 Tokyo Ohka Kogyo Co., Ltd. Method for manufacturing flow path device

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