WO2008062870A1 - Élément de guidage optique, procédé de production de celui-ci, guide d'ondes optique et plaque de guidage de lumière - Google Patents

Élément de guidage optique, procédé de production de celui-ci, guide d'ondes optique et plaque de guidage de lumière Download PDF

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Publication number
WO2008062870A1
WO2008062870A1 PCT/JP2007/072665 JP2007072665W WO2008062870A1 WO 2008062870 A1 WO2008062870 A1 WO 2008062870A1 JP 2007072665 W JP2007072665 W JP 2007072665W WO 2008062870 A1 WO2008062870 A1 WO 2008062870A1
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WIPO (PCT)
Prior art keywords
light guide
layer
less
guide member
layers
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Application number
PCT/JP2007/072665
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English (en)
Japanese (ja)
Inventor
Naoki Ito
Jun Okamoto
Masami Aihara
Yoshie Kamata
Yutaka Mori
Original Assignee
Alps Electric Co., Ltd
Mitsubishi Chemical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Alps Electric Co., Ltd, Mitsubishi Chemical Corporation filed Critical Alps Electric Co., Ltd
Publication of WO2008062870A1 publication Critical patent/WO2008062870A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1223—Basic optical elements, e.g. light-guiding paths high refractive index type, i.e. high-contrast waveguides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements

Definitions

  • Light guide member method for manufacturing the same, light guide and light guide plate
  • the present invention relates to a novel light guide member, a method for manufacturing the same, and an optical waveguide and a light guide plate.
  • the light guide member excellent in heat resistance, light resistance, film formability, adhesion to the substrate and adhesion on the laminated surface, a method for producing the same, and an optical waveguide and a light guide plate including the light guide member About.
  • optical equipment for example, when displaying a display unit of a display device such as a display, a button part of a facsimile, a telephone, a mobile phone, and other various household appliances, light emitted from a light source is emitted at a desired part.
  • the required level of high quality is also increasing in the light guide plate.
  • Cited Document 1 a siloxane polymer having a specific weight-average molecular weight and number-average molecular weight is used for the purpose of providing an optical waveguide having excellent environmental reliability such as a temperature cycle with few cracks.
  • the invention of the optical waveguide used is disclosed.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-91579
  • Patent Document 2 Pamphlet of International Publication No. 2006/090804
  • the conventional conventional light guide member including S et al., Cited reference 1 is hard and brittle, so if it is thickened or a coating is applied to a complicated substrate, it will crack.
  • conventional light guide members include substrates and film materials that are laminated for moisture-proof purposes.
  • the coating film Because of insufficient adhesiveness.
  • the conventional light guide member has a problem of peeling of the coating film because the adhesion on the laminated surface is not sufficient when layers of different materials are laminated.
  • the light guide member is also required to have heat resistance and light resistance that can be applied for long-term use.
  • the present invention has been made in view of the above problems. That is, the first object of the present invention is excellent in heat resistance, light resistance, film formability, adhesion to substrates and film materials, and adhesion on the laminated surface, and cracks and peeling even after long-term use.
  • An object of the present invention is to provide a light guide member that does not cause coloring, and an optical waveguide and a light guide plate using the same.
  • the second object of the present invention is to have flexibility, excellent adhesion to a substrate or a film material, etc., and adhesion on a laminated surface.
  • An object of the present invention is to provide a light guide member that does not occur, and an optical waveguide and a light guide plate using the same.
  • a third object of the present invention is to provide a light guide member manufacturing method, a light guide member, and a light guide member capable of efficiently transmitting light source light and designing a light guide portion in a free shape and color.
  • Optical waveguide used And it aims at obtaining a light-guide plate.
  • NMR nuclear magnetic resonance
  • the first light guide member of the present invention is a light guide member formed by laminating two or more layers having different refractive indexes, and at least two-layer force of the layers contacting each other. (Claim 1).
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.3 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region of chemical shift—80 ppm or more—less than 40 ppm, and the peak half-value width is 0.3 ppm or more and 5. Oppm or less.
  • the content of silicon is 10% by weight or more.
  • the content of silanol is 0.01% by weight or more and 10% by weight or less.
  • Hardness measured by Durometer Type A is 5 or more and 90 or less.
  • the second light guide member of the present invention is a light guide member formed by laminating two or more layers having different refractive indexes, and at least two-layer force of the layers in contact with each other. (Claim 2).
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.5 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region of chemical shift—more than 80ppm and less than 40ppm
  • the peak half-value width is 1. Oppm or more and 5. Oppm or less
  • the content of silicon is 10% by weight or more.
  • the content of silanol is 0.01% by weight or more and 10% by weight or less.
  • the refractive index of at least one of the layers in contact with each other is 1.45 or more (claim 3).
  • the first and second light guide members of the present invention include at least one of the layers in contact with each other.
  • the refractive index of one layer is 1.45 or more and the refractive index of at least one other layer is less than 1.45! / ⁇ (Claim 4).
  • the third light guide member of the present invention is a light guide member formed by laminating two or more layers having different haze values, and at least two-layer force of the layers contacting each other satisfies the following conditions: (Claim 5).
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.3 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region of chemical shift—80 ppm or more—less than 40 ppm, and the peak half-value width is 0.3 ppm or more and 5. Oppm or less.
  • the content of silicon is 10% by weight or more.
  • the content of silanol is 0.01% by weight or more and 10% by weight or less.
  • Hardness measured by Durometer Type A is 5 or more and 90 or less.
  • a fourth light guide member of the present invention is a light guide member formed by laminating two or more layers having different haze values, and at least two layer forces of the layers contacting each other satisfy the following conditions: (Claim 6).
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.5 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region of chemical shift—more than 80ppm and less than 40ppm
  • the peak half-value width is 1. Oppm or more and 5. Oppm or less
  • the content of silicon is 10% by weight or more.
  • the content of silanol is 0.01% by weight or more and 10% by weight or less.
  • a fifth light guide member of the present invention is a light guide member in which two or more layers having different refractive indexes are laminated, and at least one of the layers has the following characteristics and emits light:
  • a light source having a peak dominant wavelength of 5 OOnm or less is provided (claim 7).
  • Hardness of Shore A is 5 or more and 100 or less, or Shore D is 0 or more and 85 or less.
  • a sixth light guide member of the present invention is a light guide member formed by laminating two or more layers having different refractive indexes, and at least two-layer force of the layers in contact with each other. (Claim 8).
  • Hardness of Shore A is 5 or more and 100 or less, or Shore D is 0 or more and 85 or less.
  • a seventh light guide member of the present invention is a light guide member in which two or more layers having different haze values are laminated, and has at least one layer force of the layer, and has the following characteristics, and emits light
  • a light source having a peak main wavelength power of S500 nm or less is provided (claim 9).
  • Hardness of Shore A is 5 or more and 100 or less, or Shore D is 0 or more and 85 or less.
  • An eighth light guide member of the present invention is a light guide member formed by laminating two or more layers having different haze values, and at least two-layer force of the layers in contact with each other. (Claim 10).
  • Hardness of Shore A is 5 or more and 100 or less, or Shore D is 0 or more and 85 or less.
  • the layer satisfying the above conditions (5) to (8) contains a bull group and / or a hydrosilyl group (claim 11). ).
  • the third, fourth, seventh and eighth light guide members of the present invention preferably have at least one layer force S of the above-mentioned layer, and a ⁇ 1 value of 50 or more! / ⁇ (Claim 12).
  • the first to eighth light guide members of the present invention it is preferable that at least one of the layers contains inorganic particles (claim 13). At this time, it is preferable that the median particle diameter of the inorganic particles is;! -10 nm! / ⁇ (claim 14)
  • At least one of the layers has a median particle size of 0.
  • the inorganic particles of 05 to 50 111 are contained, and that the layer and / or at least one other layer contains inorganic particles of a median particle size;! To lOnm! / (Claim 15).
  • At least one of the layers includes a phosphor! (Claim 16).
  • an angle formed between the side surface and the laminated surface of the member is 30 degrees or more and 80 degrees or less! Section 17).
  • first to eighth light guide members of the present invention include a boundary portion penetrating at least two of the layers (claim 18).
  • a method for producing a light guide member of the present invention is a method for producing a light guide member comprising a light guide layer formed by curing a fluid curable material on a substrate, the method comprising: The method includes a step of providing a weir for partitioning the light guide layer, a step of coating the curable material on the substrate, and a step of curing the curable material (claim 19).
  • the weir is preferably provided by a dispenser (claim 20).
  • a ninth light guide member of the present invention is a light guide member including a substrate, a light guide layer, and a weir that partitions the light guide layer, wherein the light guide layer includes a high refractive index layer and A low refractive index layer is provided, and the weir does not have a ridgeline (claim 21).
  • the light guide layer is formed by curing a curable material (claim 22).
  • the light guide layer has a scattering layer (claim 23).
  • the light guide layer has a phosphor-containing layer (claim 24).
  • the optical waveguide of the present invention is formed using the first to ninth light guide members of the present invention (claim 25).
  • the light guide plate of the present invention is characterized by being formed using the first to ninth light guide members of the present invention (claim 26).
  • the optical waveguide and the light guide plate formed using the first to fourth light guide members of the present invention suppress the generation of cracks even in the thick film portion where the degree of freedom in the film thickness design is high, and the substrate Peeling from the surface and peeling on the laminated surface are suppressed, and the heat resistance and light resistance are excellent.
  • the fifth to eighth light guide members of the present invention are flexible, have excellent adhesion at the time of lamination, and can be used for a long period of time! And peeling on the laminated surface are suppressed.
  • the optical waveguide and the light guide plate formed by using the fifth to eighth light guide members of the present invention can freely set the film thickness to a thin film force and a thin film, and the generation of cracks is suppressed even in long-term use. Peeling from the substrate and peeling on the laminated surface are suppressed.
  • the shape and specification of the light guide member and the light guide plate can be changed. Even if it is not done, the light emitting part can be designed freely.
  • FIG. 1 Figs. 1 (a) to 1 (f) are specific examples of the relationship between any two layers constituting the fifth to eighth light guide members of the present invention! /, FIG.
  • FIG. 2 is a schematic sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 3 is a schematic cross section showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 6 is a schematic sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 7 is a schematic sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 8 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 9 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 10 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 11 is a schematic cross-sectional view showing an embodiment of a light guide plate using the first to eighth light guide members of the present invention.
  • FIG. 12 (a) to FIG. 12 (c) are cross-sectional views schematically showing a method for manufacturing a light guide member as an eleventh embodiment of the present invention.
  • FIG. 13 (a) and FIG. 13 (b) are perspective views schematically showing a weir for explaining an embodiment of the present invention.
  • FIG. 17 is a schematic cross-sectional view of a light guide member as a fifteenth embodiment of the present invention.
  • FIG. 20 A schematic cross-sectional view of a light guide member according to an eighteenth embodiment of the present invention.
  • FIG. 21 is a schematic cross-sectional view of a light guide member as a nineteenth embodiment of the present invention.
  • FIG. 22 is a schematic cross-sectional view of a light guide member as a twentieth embodiment of the present invention.
  • FIG. 23 is a schematic cross-sectional view of a light guide member as a twenty-first embodiment of the present invention.
  • FIG. 24 is a schematic cross-sectional view of a light guide member as a 22nd embodiment of the present invention.
  • FIG. 25 is a schematic cross-sectional view of a light guide member as a 23rd embodiment of the present invention.
  • FIG. 26 is a schematic cross-sectional view of a light guide member as a 24th embodiment of the present invention.
  • FIG. 27 is a schematic cross-sectional view of a light guide member as a 25th embodiment of the present invention.
  • FIG. 28 is a schematic cross-sectional view of a light guide member as a 26th embodiment of the present invention.
  • FIG. 29 is a schematic cross-sectional view of the light-emitting device fabricated in Example C-15 of the present invention. Explanation of symbols
  • the first to fourth light guide members of the present invention are characterized in that two or more layers are laminated.
  • At least two layers in contact with each other have the following characteristics. Above all, it is preferable that the above-mentioned laminated layer has the following characteristics as V and deviation! /.
  • At least two layers in contact with each other among the layers constituting the light guide member have the following characteristics (1) to (4).
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.3 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region of chemical shift—80 ppm or more—less than 40 ppm, and the peak half-value width is 0.3 ppm or more and 5. Oppm or less.
  • Characteristic (2) The content of silicon is 10% by weight or more.
  • At least two layers in contact with each other have the above characteristics (2) (3) and the following characteristics (5). Have.
  • the peak top position is in the region of chemical shift-40 ppm or more and Oppm or less, and the peak half-value width is 0.5 ppm or more and 3. Oppm or less, and
  • the peak top position is in the region where the chemical shift is 80 ppm or more and less than 40 ppm, and the peak half-value width is 1. Oppm or more and 5. Oppm or less
  • the specific layer A according to the present invention satisfies the characteristics (1) or (5). That is, the specific layer A according to the present invention is formed of a material that satisfies the above characteristic (1) or (5). These materials are usually compounds having a main component of key or a composition containing the compound. The compound whose main component is Ca is expressed by the SiO 2 ⁇ ⁇ 2 ⁇ formula, but structurally,
  • an oxygen atom ⁇ is bonded to each vertex of the tetrahedron of the key atom Si, and a key atom Si is further bonded to these oxygen atoms o to have a net-like structure.
  • the schematic diagram shown below shows the net structure of Si o ignoring the tetrahedral structure described above, but in the repeating unit of Si—O—Si o, some of the oxygen atoms o are others. Some of them are substituted with a member of (for example, H, -CH, etc.).
  • each Q ° Q 4 peak derived from the Q site is referred to as a Q n peak group.
  • the Q n peak group of silica films that do not contain organic substituents is usually observed as multi-peaks that are continuous in the region of chemical shift – 80–130 ppm.
  • a C atom with three oxygen atoms and one other atom (usually carbon) is generally called a T site.
  • the peaks derived from the T site are observed as T ° T 3 peaks, as in the Q site.
  • each peak derived from the ⁇ site is referred to as ⁇ ⁇ peak group.
  • the ⁇ peak group is generally observed as a multimodal peak in the higher magnetic field side (usually chemical shift – 80 to 40 ppm) than the Q n peak group.
  • a key atom in which two oxygen atoms are bonded and two other atoms (usually carbon) are bonded is generally referred to as a D site.
  • the peaks originating from the D site are also observed as D ° D n peaks (D n peak groups), as well as the peak groups originating from the Q site and T site, and are further observed from the Q n and T n peak groups. It is observed as a multi-modal peak in the high magnetic field region (normally chemical shift 0 40 ppm region).
  • the ratio of the area of each peak group of D n T n Q n is equal to the molar ratio of the key atoms in the environment corresponding to each peak group.
  • the total area of the D n peak group and the T n peak group usually corresponds to the molar amount of all the atoms bonded directly to carbon atoms.
  • peaks below 80 ppm correspond to Q n peaks as described above, and peaks above 80 ppm correspond to D n and T n peaks.
  • the Q n peak is not essential, but at least one, preferably a plurality of peaks are observed in the D n and T n peak regions.
  • the chemical shift value of the specific layer can be calculated based on the results obtained by performing solid Si-NMR measurement using the method described later in the description of Examples, for example! it can.
  • analysis of measurement data is performed by dividing and extracting each peak by, for example, waveform separation analysis using a Gaussian function or a mouth-lentz function.
  • the specific layer A is hardened without cracks even in the thick film portion, and has excellent adhesion to the substrate and the laminated surface between the layers.
  • the above-mentioned characteristics (1) or (5) are desirable for exhibiting excellent characteristics when it is possible to obtain a cured product with excellent heat resistance. The reason is not clear. ! / Is estimated as follows.
  • a melting method in which low melting point glass is melted and sealed, and a solution obtained by hydrolyzing and polycondensing alkoxysilane or the like at a relatively low temperature is applied and dried and cured.
  • a sol-gel method There is a sol-gel method.
  • the member obtained from the melting method is mainly a force S in which only the Qn peak is observed, a high temperature of at least 350 ° C is required for melting, and the light guide member is thermally deteriorated. .
  • sol-gel glass When sol-gel glass is used as the light guide member, there is a problem that a sufficient film thickness must be secured because it is applied to a substrate having a complicated shape.
  • heating at a high temperature of 400 ° C. or more is required, and the peripheral members including the substrate are thermally deteriorated. It was not.
  • a trifunctional having a Tn peak is used to adjust the crosslinking density and to make the film flexible.
  • silane and / or a bifunctional silane having a D ⁇ peak are used to adjust the crosslinking density and to make the film flexible.
  • the volume reduction due to dehydrocondensation and the crosslinking density can be reduced appropriately within a range that does not hinder the function.
  • the hydrolysis / condensation process and the drying process it is possible to obtain a transparent glass film-like member having a film thickness of 1000 m. Therefore, in the present invention, the presence of a T n peak and / or a D n peak observed at 80 ppm or more is essential.
  • a technique for thickening a bifunctional or trifunctional raw material as a main component for example, a technique of hard coat film technology such as glasses is known. is there. Since these hard coat films are thin, solvent volatilization is easy and uniform curing is possible. Differences in adhesion to the base material and linear expansion coefficient were the main causes of cracks. In contrast, in the first to fourth light guide members of the present invention having flexibility, since the film thickness is as large as the paint, the film itself has a certain degree of strength, and there is a slight difference in the linear expansion coefficient. Absorbable. If such a film is not flexible, the generation of internal stress, which is different from the case of a thin film, becomes a new problem due to volume reduction by solvent drying.
  • the half-value width of the peak observed in the region of -80 ppm or higher is smaller than the half-value width range of the light guide member known so far by the Solgenole method (narrow! /,).
  • the half-width of the T n peak group in which the peak top position is observed at ⁇ 80 ppm or more and less than 40 ppm is usually 5 Oppm or less, preferably 4. Oppm or less, usually 0.3 ppm or more, and preferably 0.5 ppm or more (characteristic (1)).
  • the half width of the T n peak group observed at a peak top position of 80 ppm or more and less than 40 ppm is usually 5.
  • Oppm or less preferably 4.
  • Oppm or less and usually 1.
  • Oppm or more preferably 1.5 ppm or more (Characteristic (5)).
  • the half width of D n peak group the position of the peak top is observed below 4 Oppm above Oppm is small fry constraints of molecular motion T n sag lower than the one peak group usually 3.
  • Oppm following general, preferably 2.
  • the half-value width of the D n peak group in which the peak top position is observed at 40 ppm or more and Oppm or less is because the constraint of molecular motion is small! / ⁇ Usually sag lower than the one of T n peak group 3.
  • the half-value width of the peak observed in the chemical shift region is larger than the above range, the molecular motion is constrained and the strain is large, resulting in cracks and from the coated substrate. As soon as peeling occurs, it may become a member with poor heat resistance and weather resistance. For example, when a large amount of tetrafunctional silane is used, or when a large internal stress is accumulated by rapid drying in the drying process, the full width at half maximum is larger than the above range.
  • the peak half-value width is smaller than the above range! /
  • the Si atoms in the environment It will be not involved in hexane crosslinking, for example example only D 2 peak of crosslinking portion is formed by Si- c binding dimethyl siloxane chain as a silicone resin is observed and, trifunctional silane-residual uncrosslinked state
  • the material is inferior in heat resistance and weather resistance to a material formed mainly of a siloxane bond.
  • the solid Si nuclear magnetic resonance spectrum of the specific layer of the first to fourth light guide members of the present invention is selected from the group consisting of the D n peak group and the T n peak group having a half-value width in the above-described range. It is desirable to have at least one peak, preferably two or more peaks.
  • the specific layer of the first to fourth light guide members of the present invention must have a key content of 10% by weight or more (characteristic (2)). That is, the specific layer A according to the present invention must have a silicon content of 10% by weight or more of the material forming the specific layer A.
  • the basic skeleton of the specific layer A of the first to fourth light guide members of the present invention is the same inorganic siloxane bond as glass (silicate glass). As is apparent from the chemical bond comparison table shown in Table 1 below, this siloxane bond has the following excellent characteristics as a light guide member.
  • the specific layer A which is a silicone-based layer formed of a skeleton in which siloxane bonds are bonded three-dimensionally and with a high degree of cross-linking, uses other materials such as epoxy resin V, Unlike layers, it is close to inorganic substances such as glass or rock, and it can be understood that it becomes a protective film with high heat resistance and light resistance.
  • the specific layer A having a methyl group as a substituent does not absorb in the ultraviolet region, and therefore is excellent in light resistance in which photolysis is difficult to occur.
  • the key layer content of the specific layer A of the first to fourth light guide members of the present invention is not less than 10% by weight as described above. Usually 20 weights as it is not necessary to contain the ingredients necessary for refractive index. / Is 0 or more, among them preferably at least 25 wt%, more preferably 30 weight 0/0 above. On the other hand, the upper limit is usually 47% for the reason that the silicon content of the glass composed only of SiO is 47% by weight. / 0 or less.
  • the content ratio of the specific layer A of the first to fourth light guide members of the present invention is determined by, for example, inductively coupled high-frequency plasma spectroscopy using a method described later in the description of the embodiments.
  • Plasma spectrometry hereinafter abbreviated as “ICP” where appropriate.
  • Analysis can be performed and calculated based on the results.
  • the specific layer A of the first to fourth light guide members of the present invention usually has a silanol content of 0.01. % By weight or more, preferably 0.1% by weight or more, more preferably 0.3% by weight or more, and usually 10% by weight or less, preferably 8% by weight or less, more preferably 6% by weight or less. (Characteristic (3)). That is, in the specific layer A according to the present invention, the silanol content of the material forming the specific layer A is in the above range.
  • a glass body obtained by a sol-gel method using alkoxysilane as a raw material is 150 ° C,
  • the fracture surface of the member has more silanol and less moisture permeability, but it has high surface hygroscopicity and is likely to invade water! /. It is possible to reduce the silanol content by high-temperature firing at 400 ° C or higher, but the heat resistance of the light guide member is almost 260 ° C or lower, which is not realistic.
  • the first to fourth light guide members of the present invention have a low silanol content in the specific layer A! /, And therefore have excellent long-term performance stability with little change over time. Low! / Excellent performance.
  • the member or layer containing no silanol is inferior in the adhesion to the substrate or the adhesion on the laminated surface when the light guide member is a laminate, the silanol content is optimal as described above in the present invention. Range exists.
  • the specific layer A contains an appropriate amount of silanol
  • silanol is hydrogen bonded to the polar portion present on the substrate or the laminated surface of each layer.
  • Adhesion is developed.
  • the polar part include hydroxyl group and metalloxane-bonded oxygen.
  • the silanol content of the specific layer A of the first to fourth light guide members of the present invention is, for example, measured by a solid Si-NMR spectrum using the method described below, and derived from silanol with respect to the total peak area. From the ratio of peak area, silanol in all the key atoms Obtain the ratio ratio ((%%)) of the key element and the atomic ratio of the content of the key element that was analyzed separately. This is where you can compare the comparison here and the comparison here. .
  • Nana any Aerosilojiru, such as any non-inorganic inorganic particles containing Sishiraran noorru.
  • AA may contain Sishiraranol, but it may be a force SS, or it may be a special fixed layer.
  • the compound compound strength SS which forms the main body, forms the layer AA. It's a good idea to have Sicilara nonor contained here. .
  • the first to fourth to fourth specific light guide members of the light guide and light guide member are fixed solid layers AA, solid solid SSii——NNMMRR spectrum If you are going to perform a solid-state SSii——NNMMRR spectrum measurement and data analysis under the following conditions: I'll do it. .
  • the ratio ratio ((%%)) of the key element that is the silarananol of the middle is determined and analyzed separately.
  • the content ratio of sishiraranol content can be determined by comparing with the content ratio of the key element. .
  • the analysis of measurement measurement data is, for example, a Gagarous function number
  • Prolo Robe :: 77 .. 55mmmm ⁇ Propro Robe for CCPP // MMAASS
  • Measurement measurement method Shishingugururupaparurusu method
  • 512 points are taken as measurement data, zero-filled to 8192 points, and Fourier transformed.
  • optimization calculation is performed by nonlinear least square method with the center position, height, and half width of the peak shape created by Lorentz waveform and Gaussian waveform or a mixture of both as variable parameters. Do.
  • the silanol content of the specific layer A of the first to fourth light guide members of the present invention can also be determined by the following IR measurement.
  • IR measurement is easy to identify the silanol peak, but the shape of the peak is broad, the area error occurs, and it is necessary to accurately prepare a sample with a fixed film thickness for the quantitative work immediately. Therefore, it is preferable to use solid-state Si-NMR for strict quantification.
  • the concentration of silanol can be determined by complementary IR measurement.
  • Measurement example A thin film sample with a film thickness of 200 11 m is coated on a Si wafer, and the infrared absorption spectrum of each Si wafer is measured by the transmission method to determine the total silanol peak area of wave numbers SYSlcnT 1 and SYOlcnT 1 .
  • trimethylsilanol is anhydrous as a known concentration sample. It is possible to measure the infrared absorption spectrum by the transmission method using a liquid cell with an optical path length of 200 m after diluting in carbon tetrachloride and calculating the silanol concentration by comparing the peak area ratio with the actual sample. .
  • the peak derived from the sample adsorbed water is detected as the background of the silanol peak, so the sample thin film must be heated at 150 ° C for 20 minutes or more at normal pressure before measurement, Remove adsorbed water by vacuuming for 10 minutes or longer.
  • the hardness measurement value is an index for evaluating the hardness of the specific layer A of the first to fourth light guide members of the present invention, and is measured by the following hardness measurement method.
  • the specific layer A of the first to fourth light guide members of the present invention is preferably a member exhibiting an elastomeric shape. That is, the first to fourth light guide members of the present invention are forces that normally use a plurality of members having different thermal expansion coefficients in the substrate or each layer. As described above, the specific layer A is an elastomer. By exhibiting the shape, the first to fourth light guide members of the present invention using the specific layer A and the specific layer A can relieve stress due to expansion and contraction of the respective parts. Therefore, it is possible to provide a light guide member that is excellent in reflow resistance and temperature cycle resistance, which is difficult to cause peeling, cracking, and disconnection during use.
  • the specific layer A of the first to fourth light guide members of the present invention has a hardness measurement value (Shore A) by durometer type A of usually 5 or more, preferably 7 or more, more preferably Is 10 or more, and usually 90 or less, preferably 80 or less, more preferably 70 or less (characteristic (4)).
  • a hardness measurement value (Shore A) by durometer type A of usually 5 or more, preferably 7 or more, more preferably Is 10 or more, and usually 90 or less, preferably 80 or less, more preferably 70 or less (characteristic (4)).
  • the hardness measurement value (Shore A) can be measured by the method described in JIS K6253. Specifically, measurement can be performed using an A-type rubber hardness meter manufactured by Furusato Seiki Seisakusho.
  • the specific layer A of the first to fourth light guide members of the present invention is mainly characterized by the above characteristics.
  • the specific layer A of the first to fourth light guide members of the present invention emits light from the light source with a film thickness of lmm when a semiconductor light emitting device or the like is used as a light source for an optical waveguide or a light guide plate. It is preferable that the light transmittance (transmittance) at a wavelength is usually 80% or more, particularly 85% or more, and more preferably 90% or more! /.
  • the specific layer A is used as a light-transmitting part in the light guide member, if the transparency of the light-transmitting part is low, the luminance of the light source using the light-transmitting part is reduced. Or it becomes difficult to obtain final products, such as a light-guide plate.
  • the “emission wavelength of the light source” for example, in the case of a semiconductor light emitting device, the value varies depending on the type, but is generally 300 nm or more, preferably 350 nm or more, and usually 900 nm.
  • the wavelength is preferably in the range of 500 nm or less. If the light transmittance at a wavelength in this range is low, the specific layer A absorbs light, and the light extraction efficiency decreases, making it impossible to obtain a high-intensity optical waveguide or light guide plate. Furthermore, the energy corresponding to the decrease in light extraction efficiency is changed to heat, which causes thermal deterioration of the optical waveguide or the light guide plate.
  • the optical material In the ultraviolet to blue region (300 nm to 500 nm), the optical material is susceptible to light degradation. Therefore, if the specific layer A having excellent durability is used as a light source having an emission wavelength in this region, the optical material Since an effect becomes large, it is preferable.
  • the light transmittance of the optical material such as the material of the specific layer A is measured with an ultraviolet spectrophotometer using a sample of a single cured film having a smooth surface molded to a film thickness of 1 mm, for example, by the following method. I can do that.
  • the wavelength is between 200 nm and 800 nm. ! /, Measure the light transmittance.
  • the specific layer A of the first to fourth light guide members of the present invention preferably satisfies the following conditions. That is, the specific layer A of the first to fourth light guide members of the present invention is the solid Si nuclear magnetism described above.
  • the ratio of (total area of peaks with chemical shift of 40 ppm or more and Oppm or less) / (total area of peaks with chemical shift of less than 40 ppm) (hereinafter referred to as “peak area ratio according to the present invention” as appropriate) is usually It is preferably 3 or more, preferably 5 or more, more preferably 10 or more, and usually 200 or less, preferably 100 or less, more preferably 50 or less.
  • the specific layer A of the first to fourth light guide members of the present invention is difunctional silane, trifunctional silane or tetrafunctional. This indicates that it has more than trifunctional or higher silanes such as silane. As described above, the presence of many silanes having two or less functional groups makes it possible for the specific layer A to exhibit an elastomeric shape and to relieve stress.
  • the specific layer A may exhibit an elastomeric shape even if it does not satisfy the above-described conditions regarding the peak area ratio, which is a force of the present invention.
  • this is the case when the specific layer A is produced using a coupling agent such as an alkoxide of a metal other than silicon as a crosslinking agent.
  • the method for causing the specific layer A to exhibit an elastomeric shape is arbitrary, and is not limited to the above-mentioned conditions!
  • the specific layer A of the first to fourth light guide members of the present invention includes a predetermined functional group (for example, hydroxyl group, oxygen in a metalloxane bond, etc.) present on the surface of a resin such as polyphthalamide, ceramic or metal. ) And a functional group capable of hydrogen bonding.
  • the substrate for installing the light guide member is usually made of resin, ceramic or metal.
  • a hydroxyl group usually exists on the surface of ceramic or metal.
  • the specific layer A usually has a functional group capable of hydrogen bonding with the hydroxyl group. Therefore, the first to fourth light guide members of the present invention having the specific layer A are excellent in adhesion to the substrate by the hydrogen bond.
  • Examples of the functional group capable of hydrogen bonding to the hydroxyl group of the specific layer A include silanol and alkoxy group.
  • the functional group may be one kind or two or more kinds.
  • the specific layer A according to the present invention has these functional groups and thus has excellent adhesion, It is a noteworthy feature that it is possible to laminate by means of. Utilizing this property, it is possible to easily produce a light guide member having a light guide function, an optical waveguide, a light guide plate, etc. by laminating two or more layers with adjusted refractive indexes.
  • the specific layer A has a functional group capable of hydrogen bonding to a hydroxyl group depends on solid Si-NMR, solid 1 H-NMR, infrared absorption spectrum (IR), It can be confirmed by spectroscopic techniques such as Raman spectra.
  • the specific layer A of the first to fourth light guide members of the present invention is excellent in heat resistance. That is, even when left under high temperature conditions, the transmittance of light having a predetermined wavelength does not easily change.
  • the specific layer A has a transmittance maintaining power for light having a wavelength of 400 nm before and after being left at 200 ° C. for 500 hours, usually 80% or more, preferably 90% or more, more preferably 95% or more. In addition, it is usually 110% or less, preferably 105% or less, more preferably 100% or less.
  • the variation ratio can be measured by the transmittance measurement using an ultraviolet / visible spectrophotometer in the same manner as the light transmittance measurement method described above in [A-15 1].
  • the specific layer A of the first to fourth light guide members of the present invention is excellent in light resistance. That is, even when UV (ultraviolet light) is irradiated, the transmittance with respect to light having a predetermined wavelength is not easily changed.
  • the specific layer A has a transmittance maintenance factor of light at a wavelength of 400 nm before and after irradiation with light having a center wavelength of 380 nm and a radiation intensity of 0.4 kW / m 2 for 72 hours. It is 90% or more, more preferably 95% or more, and usually 110% or less, preferably 105% or less, more preferably 100% or less.
  • the variation ratio can be measured by the transmittance measurement using an ultraviolet / visible spectrophotometer in the same manner as the light transmittance measurement method described above in [A-15 1].
  • the specific layer A of the first to fourth light guide members of the present invention is usually produced using an organometallic compound catalyst containing at least one element selected from zirconium, hafnium, tin, zinc, and titanium. The Therefore, these catalysts usually remain in the specific layer A. ing.
  • the specific layer A contains the above organometallic compound catalyst in terms of metal element, usually 0.001% by weight or more, preferably 0.01% by weight or more, more preferably 0.02% by weight or more, Further, it is usually contained in an amount of not more than 0.3% by weight, preferably not more than 0.2% by weight, more preferably not more than 0.1% by weight.
  • the oxide particles containing the above metal element are blended for the purpose of adjusting the refractive index of the specific layer A, an amount of the metal element exceeding the above range is detected.
  • the content of the organometallic compound catalyst is as follows: It can be measured by ICP analysis.
  • the specific layer A of the first to fourth light guide members of the present invention is obtained by measuring the material forming the specific layer A (specific layer forming liquid A described later) by GPC (gel permeation chromatography).
  • the polystyrene-reduced weight average molecular weight (Mw) is usually 500 or more, preferably 900 or more, more preferably ⁇ 3200 or more, usually 400 or less, preferably ⁇ is 70,000 or less, Preferably it is 27,000 or less. If the weight average molecular weight is too small, bubbles tend to be generated during curing after substrate coating, or liquid leakage tends to occur from minute gaps between the package and the substrate. There is a tendency to increase in viscosity over time, complex shape on the board, and filling efficiency to the wiring part.
  • the molecular weight distribution (Mw / Mn, where Mw represents the weight average molecular weight and Mn represents the number average molecular weight) is usually 20 or less, preferably 10 or less, more preferably 6 or less. . If the molecular weight distribution is too large, the member tends to thicken over time even at low temperatures and the coating efficiency to the substrate tends to deteriorate. Mn can be measured in terms of polystyrene by GPC, the same as Mw.
  • the specific layer forming liquid A for the first to fourth light guide members of the present invention preferably has a low molecular weight component having a specific molecular weight or less.
  • the component having a molecular weight of 800 or less in the GPC area ratio in the specific layer forming liquid A is usually 10% or less, preferably 7.5% or less, more preferably 5% or less of the whole. If there are too many low molecular weight components, bubbles may be generated at the time of curing after coating the substrate, and the weight yield (solid content ratio) at the time of curing may decrease due to volatilization of the main component.
  • the specific layer forming liquid A of the first to fourth light guide members of the present invention has a specific molecular weight or more. Those having a low molecular weight component are preferred. Specifically, in the GPC analysis value of the specific layer forming liquid A, the molecular weight force at which the high molecular weight fractionation range is 5% is usually 1000000 or less, preferably 30000 or less, more preferably 110000 or less. If there are too many high molecular weight fractions in GPC,
  • the specific layer forming liquid A for the first to fourth light guide members of the present invention is preferably in the molecular weight range shown above. The following methods can be mentioned.
  • reaction rate and conditions during the synthesis reaction are appropriately controlled so that the polymerization reaction proceeds uniformly, and the molecular weight distribution is not increased more than necessary.
  • the specific layer A is formed from a polycondensate obtained by hydrolysis and polycondensation of a specific compound as in "[A-2] Method for producing a light guide member"
  • the specific layer is formed.
  • Hydrolysis during synthesis of liquid A ⁇ It is preferable to proceed the polymerization reaction uniformly while maintaining an appropriate reaction rate.
  • Hydrolysis ⁇ Polymerization is usually in the range of 15 ° C or higher, preferably 20 ° C or higher, more preferably 40 ° C or higher, and usually 140 ° C or lower, preferably 135 ° C or lower, more preferably 130 ° C or lower. To do.
  • the hydrolysis / polymerization time varies depending on the reaction temperature, but is usually 0.1 hour or longer, preferably 1 hour or longer, more preferably 3 hours or longer, and usually 100 hours or shorter, preferably 20 hours or shorter, more preferably 15 hours. It is carried out in the range of less than time. If the reaction time is shorter than this, the force that does not reach the required molecular weight, i.e., the reaction proceeds non-uniformly, resulting in the presence of high molecular weight components while the low molecular weight raw material remains, resulting in poor cured product quality and storage stability. May become poor. Also, if the reaction time is longer than this, the polymerization catalyst may be deactivated, or the synthesis may take a long time and the productivity may deteriorate.
  • reaction activity of the raw material is low and the reaction is difficult to proceed, if necessary, for example, an inert gas such as argon gas, helium gas, nitrogen gas, etc. is circulated so that moisture generated in the condensation reaction can be reduced.
  • the reaction may be accelerated by removing the alcohol accompanied.
  • the reaction time is preferably adjusted as appropriate while controlling the molecular weight by GPC and viscosity measurement. Furthermore, it is preferable to adjust in consideration of the temperature rising time.
  • the solvent distillation When using a solvent, it is preferable to carry out the solvent distillation at normal pressure as required. Further, when the boiling point of the solvent or the low molecular weight substance to be removed is the curing start temperature (usually 120 ° C or higher), it is preferable to carry out distillation under reduced pressure as necessary. On the other hand, depending on the purpose of use, such as thin coating of the light guide film, a part of the solvent may remain for reducing the viscosity. A solvent different from the reaction solvent may be mixed after the reaction solvent is distilled off.
  • the upper limit and the lower limit of the molecular weight distribution of the specific layer forming liquid A are not necessarily limited to one if the upper limit and the lower limit are preferably within the above range.
  • the molecular weight distribution curve may be multimodal. For example, in order to give mechanical strength to the specific layer A, a small amount of the second specific layer forming liquid A having a low molecular weight containing a large amount of adhesion components is contained in the first specific layer forming liquid A finished to a high molecular weight. This is the case.
  • the specific layer forming liquid A and the specific layer A of the first to fourth light guide members of the present invention are those of the heat generation gas in the range of 40 ° C to 210 ° C in the TG-mass (pyrolysis MS chromatogram). It is preferable that the chromatogram integral area is small!
  • TG-mass is a chromatogram integral in the temperature range of 40 ° C to 210 ° C that detects the low-boiling components in the specified layer forming solution A and the specified layer A by raising the temperature of the specified layer forming solution A.
  • a large area indicates that low-boiling components such as water, solvent, and 3- to 5-membered cyclic siloxane are present in the component.
  • the amount of low-boiling components increases, the generation of bubbles or bleed-out during the curing process, and the lower the adhesion to the substrate, the more insufficient the curing or the weight loss during curing.
  • the specific layer forming liquid A and the specific layer A have few such low-boiling components. Those are preferred.
  • the TG-mass can be measured by the following operation under the following measurement conditions.
  • Heating furnace Frontier 'Lab PY—2010 type
  • Reheating furnace heating program 40 ° C ⁇ 10 ° C / min ⁇ 400 ° C
  • Ionization chamber temperature 200 ° C
  • the gas components generated from the heated sample are introduced into the gas chromatograph through an empty column and MS analysis is performed.
  • About 10 mg of sample solution is put into a platinum cell (cup) and heated at 40 ° C to 400 ° C and 10 ° C / min under He flow.
  • the specific layer forming liquid A is solidified at around 120 ° C .; After that, it is heated in a solid state.
  • examples of a method for reducing the amount of the low boiling point component detected by TG mass include the following methods.
  • the hydrolysis / polycondensation reaction time varies depending on the reaction temperature, usually 0.1 hour or more, preferably 1 hour or more, more preferably 3 hours or more, and usually 100 hours or less, preferably 20 hours or less, Preferably, it is carried out for 15 hours or less.
  • the reaction time is preferably adjusted appropriately while sequentially controlling the molecular weight by GPC and viscosity measurement. Furthermore, it is preferable to adjust the temperature in consideration of the heating time.
  • the curing start temperature during the synthesis of the specific layer forming liquid A While suppressing unnecessary polymerization at the following temperatures, natural distillation, light-boiling concomitant removal by circulation of inert gas such as argon gas, nitrogen gas, helium gas, etc. It is preferable to remove low boiling components having a boiling point of about room temperature to 260 ° C.
  • the temperature condition when the solvent is distilled off is usually 60 ° C or higher, preferably 80 ° C or higher, more preferably 100 ° C or higher, and usually 150 ° C or lower, preferably 130 ° C or lower, more preferably 120 ° C or lower. It is also possible to remove unnecessary light-boiling substances by using a separate raw material before synthesis! /.
  • the first to fourth light guide members of the present invention have layers other than the specific layer A as long as at least two of the layers of the light guide member are the specific layer A. Also good.
  • a known layer can be arbitrarily applied.
  • the layers other than the specific layer A may be provided with only one layer, or may be provided with two or more layers.
  • more of the layers of the first to fourth light guide members of the present invention have the characteristics as the specific layer A. It is more preferable that all the layers have the characteristics as the specific layer A described above.
  • each layer which comprises the 1st-4th light guide member of this invention can each be manufactured by arbitrary methods.
  • the specific layer A is obtained by, for example, hydrolyzing and polycondensing a compound represented by the following general formula (1) or general formula (2) and / or an oligomer thereof, to form a polycondensate (hydrolysis / polycondensate). ) Can be obtained by drying.
  • the specific layer A is mainly composed of a siloxane bond, it is desirable that the compound represented by the general formula (1) or the oligomer thereof is mainly composed of a raw material.
  • the hydrolysis polycondensate contains a solvent, the solvent may be distilled off in advance before drying.
  • the hydrolyzed polycondensate or a composition containing it is referred to as a specific layer forming liquid A that is obtained before the drying step. Therefore, when the specific layer A of the first to fourth light guide members of the present invention is manufactured by the manufacturing method described here (hereinafter referred to as “the specific layer manufacturing method according to the present invention” as appropriate), this specific What was obtained from the layer forming liquid A through the drying step is the specific layer A.
  • compound (1) a compound represented by the following general formula (1) (hereinafter referred to as “compound (1)”) and / or an oligomer thereof is used.
  • M is at least one element selected from the group consisting of silicon, aluminum, zirconium, and titanium. Of these, key is preferable.
  • X is a hydrolyzable group that is hydrolyzed by water in the solution or moisture in the air to form a highly reactive hydroxyl group. It can be used arbitrarily. For example, a C1-C5 lower alkoxy group, acetoxy group, butanoxime group, chloro group and the like can be mentioned.
  • Ci (i is a natural number) indicates that the number of carbon atoms is i.
  • X may be a hydroxyl group.
  • a C1-C5 lower alkoxy group is preferable because a component liberated after the reaction is neutral.
  • a methoxy group or an ethoxy group is preferable because it is highly reactive and the solvent to be liberated is light boiling.
  • Y 1 can be arbitrarily selected and used as a monovalent organic group of a so-called silane coupling agent.
  • the organic group particularly useful as Y 1 in the general formula (1) in the present invention is selected from the following group represented by Y ° (useful organic group group).
  • other organic groups may be appropriately selected for improving the affinity between the specific layer and other materials, improving adhesion, adjusting the refractive index of the specific layer A, and the like.
  • ⁇ ° A monovalent or higher-valent organic group derived from an aliphatic compound, alicyclic compound, aromatic compound, or aliphatic aromatic compound.
  • the carbon number of the organic group belonging to the group is usually 1 or more, usually 1000 or less, preferably 500 or less, more preferably 100 or less, and still more preferably 50 or less.
  • the hydrogen atoms of the organic group belonging to the group may be substituted with a substituent such as the atoms and / or organic functional groups exemplified below.
  • a plurality of hydrogen atoms of the organic group belonging to the group ⁇ ° are substituted with the following substituents. In this case, it may be substituted by one or a combination of two or more selected from the substituents shown below!
  • substituents that can be substituted with hydrogen atoms of organic groups belonging to the group Y ° include atoms such as F, Cl, Br, and I; bur group, methacryloxy group, attaryloxy group, styryl group, mercapto group, Organic functional groups such as epoxy group, epoxycyclohexyl group, glycidoxy group, amino group, cyano group, nitro group, sulfonic acid group, carboxy group, hydroxy group, acyl group, alkoxy group, imino group, and phenyl group Etc.
  • the organic functional group is at least one of the hydrogen atoms of the organic functional group. Some may be substituted with halogen atoms such as F, Cl, Br, and I. However, among those exemplified as substituents capable of substituting hydrogen for organic groups belonging to the group Y °, organic functional groups are examples of those that are easy to introduce, and various other types of physical chemistry depending on the purpose of use. An organic functional group having functional functionality may be introduced.
  • the organic group belonging to the group ⁇ ° may have various atoms or atomic groups such as ⁇ , ⁇ , or S as a linking group.
  • Y 1 is a group capable of selecting various groups depending on the purpose from the organic groups belonging to the useful organic group group Y ° described above. From the viewpoint of excellent ultraviolet resistance and heat resistance, a methyl group is The main body is preferable.
  • Specific examples of the compound (1) are as follows.
  • Examples of the compound in which ⁇ is a key include phenyloxysilane, butyltrimethoxysilane, butyltriethoxysilane, butylmethoxysilane, and orange.
  • Examples include trichlorosilane, butururis (2-methoxyethoxy) silane, trifluoropropyltrimethoxysilane, and the like.
  • examples of the compound in which ⁇ ⁇ is aluminum include, for example, aluminum triisopropoxide, aluminum tri- ⁇ butoxide, aluminum tri-t-butoxide
  • Examples of the compound (1) in which M is zirconium include, for example, zirconium tetramethoxide, zirconium tetraethoxide, and zirconium tetra n propoxide.
  • Zirconium tetra i propoxide Zirconium tetra n butoxide, Zirconium tetra i-butoxide, Zirconium tetra-butoxide, Zirconium dimethacrylate dibutoxide and the like.
  • examples of the compound in which M is titanium include, for example, titanium tetrasopropoxide, titanium tetra n butoxide, titanium tetra ibutoxide, titanium methacrylate triisopropoxide, titanium tetramethoxy.
  • examples include propoxide, titanium tetra n propoxide, titanium tetraethoxide.
  • the compounds specifically exemplified in these are some of the commercially available coupling agents that are readily available. For more details, see, for example, “Optimum Utilization Technology for Coupling Agents”, Chapter 9 Coupling agent and related product list. Of course, the coupling agents that can be used in the present invention are not limited by these examples.
  • compound (2) the compound represented by the following general formula (2) (hereinafter referred to as "compound (2)” as appropriate) and / or an oligomer thereof are also the same as the compound (1) and / or the oligomer thereof. Use with power S.
  • M, X and Y 1 each independently represents the same as in the general formula (1).
  • s represents the valence of ⁇ and is an integer of 2 or more and 4 or less. “S +” indicates that it is a positive integer.
  • Y 2 represents a u-valent organic group.
  • u represents an integer of 2 or more. Therefore, in the general formula (2), Y 2 can be arbitrarily selected from divalent or higher ones among the known organic groups of so-called silane coupling agents.
  • t represents an integer of 1 or more and s ⁇ l or less. However, t ⁇ s.
  • Examples of the compound (2) include various organic polymers and oligomers in which a plurality of hydrolyzable silyl groups are bonded as side chains! /, Or a hydrolyzable silyl group at multiple terminals of the molecule. Examples include those in which the group is bonded! /.
  • compound (1), compound (2), and / or oligomers thereof are used as raw materials. That is, in the method for producing a specific layer according to the present invention, as a raw material, compound (1), oligomer of compound (1), compound (2), oligomer of compound (2), and compound (1) and compound ( Any of the oligomers with 2) may be used.
  • the molecular weight of the oligomer is The force S is arbitrary as long as the specific layer A relating to light can be obtained, usually 400 or more.
  • the main chain structure in the system may be an organic bond main body and may be inferior in durability.
  • compound (1) and / or its oligomer (component derived from compound (1)) and compound (2) and / or its oligomer (component derived from compound (2)) are used at the same time,
  • the proportion of the component (2) -derived component used is usually 30% by weight or less, preferably 20% by weight or less, more preferably 10% by weight or less.
  • the oligomer is prepared in advance.
  • the oligomer may be prepared in the manufacturing process. That is, a monomer such as the compound (1) or the compound (2) may be used as a raw material, and this may be used as an oligomer once in the production process, and the subsequent reaction may proceed from this oligomer.
  • oligomer has a structure similar to that obtained from the monomer such as compound (1) or compound (2) as a result, a commercially available product having such a structure is sufficient. Can also be used. Specific examples of such oligomers include the following.
  • XC96-723, XF3905, YF3057, YF3800, YF3802, YF3807, and YF3897 can be cited as examples of the hydroxy-terminated dimethylpolysiloxane manufactured by Momentive 'Performance' Materials Japan GK.
  • Examples of the both-end silanol polydimethylsiloxane manufactured by Gelest include DMS-S12 and DMS-S14.
  • Examples of the double-end silanol diphenylsiloxane-dimethylsiloxane copolymer manufactured by Gelest include PDS-1615.
  • An example of the double-end silanol polydiphenylsiloxane manufactured by Gelest is PDS-9931.
  • silicone alkoxy oligomers (methyl / methoxy type) manufactured by Shin-Etsu Chemical include KC-89S, KR-500, X-40-9225, X-40-9246, and X-40-9250.
  • silicone alkoxy oligomers phenyl / methoxy type manufactured by Shin-Etsu Chemical
  • KR-217 examples of silicone alkoxy oligomers manufactured by Shin-Etsu Chemical
  • silicone alkoxy oligomers (methylphenyl / methoxy type) manufactured by Shin-Etsu Chemical include KR-9218, KR-213, KR-510, X-40-9227, and X-40-9247.
  • the oligomer consisting only of the bifunctional cage has a great effect of giving flexibility to the specific layer A of the first to fourth light guide members of the present invention, but the mechanical functionality is obtained only with the bifunctional cage. Intensity tends to be insufficient. For this reason, the specific layer A can obtain mechanical strength useful as a sealant by polymerizing with a monomer composed of trifunctional or higher functional monomer or an oligomer containing trifunctional or higher functional cage.
  • those having silanol as a reactive group do not need to be hydrolyzed in advance, and do not require the use of a solvent such as alcohol as a compatibilizer for adding water.
  • water for hydrolysis is required as in the case of using a monomer having an alkoxy group as a raw material.
  • the compound (1), the compound (2) and the oligomer thereof that have been hydrolyzed in advance that is, X is an OH group in the general formulas (1) and (2)! /.
  • the compound (1), the compound (2), and the compound (1) which contain C as M and have at least one organic group Y 1 or organic group Y 2 It is necessary to use at least one oligomer (including hydrolyzed one).
  • cross-linking in the system is mainly formed by inorganic components including siloxane bonds. Therefore, when both the compound (1) and the compound (2) are used, it is preferable that the compound (1) is mainly used.
  • the oligomer of 1) and / or the oligomer of compound (2) is more preferably composed of a bifunctional composition.
  • the bifunctional unit of the oligomer of the compound (1) and / or the oligomer of the compound (2) is preferably used as a bifunctional oligomer.
  • bifunctional component oligomer when a bifunctional one (hereinafter referred to as "bifunctional component oligomer") is used as a main component, these bifunctional component oligomers
  • the amount of is usually 50% by weight or more, preferably 60% by weight or more, more preferably, based on the total weight of the raw materials (that is, the sum of the weights of compound (1), compound (2), and oligomers thereof). 70% by weight or more.
  • the upper limit of the amount used is usually 97% by weight. This is because the use of the bifunctional component oligomer as the main ingredient is one of the factors that enable the specific layer A to be easily manufactured by the specific layer manufacturing method according to the present invention.
  • a hydrolysis / polycondensate obtained by hydrolysis and polycondensation of the raw material (a material contained in a coating liquid (hydrolysis liquid)) is used.
  • a solvent such as alcohol
  • the polymerization in the system proceeds and cures quickly, making molding and handling difficult.
  • a solvent such as alcohol
  • it may be cured even when the temperature is about 40 ° C to 50 ° C. Therefore, in order to ensure the polarity and properties of the hydrolyzed / polycondensate obtained after the hydrolysis, it was essential to allow a solvent to coexist in the hydrolyzed / polycondensed product.
  • the weight yield decreases when the number of low boiling ring increases.
  • the low boiling ring is volatilized from the cured product and causes stress generation S.
  • the light guide member containing a large amount of low-boiling annular bodies may have low heat resistance. For these reasons, it has heretofore been difficult to obtain a light guide member as a high-performance elastomeric cured body.
  • a bifunctional component is oligomerized in advance in a separate system (that is, a system that does not participate in the hydrolysis / polycondensation step) and is reactive.
  • a material obtained by distilling off low-boiling impurities having no terminal is used as a raw material. Therefore, even if a large amount of bifunctional components (that is, the above-mentioned bifunctional component oligomers) is used, the low-boiling impurities do not volatilize, and the cured product weight yield can be improved and the performance is good.
  • An elastomer-like cured product can be obtained.
  • the reaction activity of the hydrolyzed polycondensate can be suppressed. This is presumably due to the steric hindrance and electronic effect of the hydrolyzed polycondensate, and the decrease in the amount of silanol terminals due to the use of bifunctional component oligomers.
  • the hydrolysis 'polycondensate does not cure without the presence of a solvent. Therefore, the hydrolysis' polycondensate can be made into a one-pack type and solvent-free system. .
  • [0144] Hydrolysis and polycondensation process
  • the above compound (1), compound (2), and / or oligomer thereof is subjected to hydrolysis / polycondensation reaction (hydrolysis / polycondensation step).
  • This hydrolysis / polycondensation reaction can be carried out by a known method.
  • raw material compounds when referring to the compound (1), the compound (2), and the oligomer thereof without distinction, they are referred to as “raw material compounds”.
  • Equation (3) represents an example in which M in the general formulas (1) and (2) is a key element.
  • ⁇ Si” and Si ⁇ are the abbreviations of three of the four bonds of the key atom.
  • the theoretical amount of water required for this hydrolysis that is, the amount of water corresponding to a 1/2 molar ratio of the total amount of hydrolyzable groups is used as the standard (hydrolysis rate 100%).
  • the amount of water used is expressed as a percentage of this reference amount, ie “hydrolysis rate”.
  • the amount of water used for carrying out the hydrolysis / polycondensation reaction is usually 80% or more, especially 100% when expressed by the above hydrolysis rate. A range of at least% is preferred. If the hydrolysis rate is less than this range, the hydrolysis and polymerization are insufficient, so that the raw material may volatilize during curing or the strength of the cured product may be insufficient. On the other hand, if the hydrolysis rate exceeds 200%, free water always remains in the system during curing, causing deterioration of the phosphor and other contents due to moisture, or the substrate absorbing water and foaming during curing. May cause cracking and peeling.
  • hydrolysis-polycondensation is carried out with near 100% or more (for example, 80% or more) of water. If a process for removing free water is added before coating, 20 It is possible to apply hydrolysis rates above 0%. In this case, if an excessive amount of water is used, the amount of water to be removed and the amount of solvent used as a compatibilizer increase, the concentration process becomes complicated, and the polycondensation proceeds so much that each of the light guide members is formed. Since the coating performance of the specific layer A may deteriorate, the upper limit of the hydrolysis rate is usually 500% or less, particularly 300% or less, preferably 200% or less.
  • the raw material compound is subjected to hydrolysis / condensation polymerization, it is preferable to promote the hydrolysis / condensation polymerization in the presence of a catalyst or the like.
  • the catalyst used include organic acids such as acetic acid, propionic acid and butyric acid; inorganic acids such as nitric acid, hydrochloric acid, phosphoric acid and sulfuric acid; organometallic compound catalysts.
  • organic acids such as acetic acid, propionic acid and butyric acid
  • inorganic acids such as nitric acid, hydrochloric acid, phosphoric acid and sulfuric acid
  • organometallic compound catalysts are examples of these, in the case of a composition layer used in a portion in direct contact with the substrate.
  • the organometallic compound catalyst does not only refer to a catalyst consisting of an organometallic compound in a narrow sense in which an organic group and a metal atom are directly bonded, but an organometallic complex, a metal alkoxide, an organic acid and a metal.
  • the catalyst which consists of an organic metal compound of a broad meaning including the salt with.
  • organometallic compound catalysts containing zirconium are more preferred, which are preferred to organometallic compound catalysts containing at least one element selected from zirconium, hafnium, tin, zinc and titanium. preferable.
  • organometallic compound catalysts containing zirconium include soot, zirconium dibutoxy diacetyl acylate, zirconium tetranormal pro-zirconium acylate, and zirconium tributoxy systemate. .
  • organometallic compound catalyst containing titanium examples include titanium tetraisopropoxide, titanium tetranormal butoxide, butyl titanate dimer, and tetraethylacetoacetate.
  • organometallic compound catalyst containing zinc is zinc triacetyl acetate.
  • organometallic compound catalysts containing tin include tetraptyltin, monooctyltin, dioctyltin dichloride, dioctyltin oxide, tetramethyltin, dibutyltin laurate, dioctyltin.
  • Laurate bis (2-ethylhexanoate) tin, bis (neodecanoate) tin, di-n-butylbis (ethylhexylmalate) tin, di-normal butylbis (2,4-pentanedionate) tin, di- Normal Butinore Examples include tin laurate and dimethyldineodecanoate tin.
  • organometallic compound catalysts may be used alone or in combination of two or more in any combination and ratio.
  • the first to fourth light guide members of the present invention using the specific layer A and the specific layer A can achieve high heat resistance.
  • the organometallic compound not only promotes the hydrolysis / polycondensation reaction of the raw material compound as a catalyst, but also temporarily at the silanol ends of the hydrolysis / polycondensation product and its cured product.
  • these actions (i) to (iii) will be described.
  • the organometallic compound catalyst is bonded to the silanol, so that the polymer main chain is broken by the intramolecular attack of the silanol and the cyclic siloxane. It is presumed that the heat resistance is improved by suppressing the weight loss by heating due to the formation of.
  • the preferred compounding amount of the organometallic compound catalyst is appropriately selected depending on the type of the catalyst used, but is usually 0.01% by weight or more, preferably not less than the total weight of the raw materials to be hydrolyzed / polycondensed. It is 0.05% by weight or more, more preferably 0.1% by weight or more, and usually 5% by weight or less, preferably 2% by weight or less, particularly preferably 1% by weight or less. If the amount of the organometallic compound catalyst is too small, it may take too much time for curing, or sufficient mechanical strength and durability may not be obtained due to insufficient curing.
  • the curing will be too fast and it will be difficult to control the physical properties of the specific layer A, which is a cured product, or the catalyst will not dissolve and disperse and will precipitate and impair the transparency of the specific layer A.
  • the specific layer A which can increase the amount of organic substances brought by the catalyst itself, may become colored when used at high temperatures.
  • organometallic catalysts may be mixed into the raw material system at the time of hydrolysis and condensation, or may be divided and mixed. Further, a solvent may be used to dissolve the catalyst during hydrolysis / polycondensation, or the catalyst may be dissolved directly in the reaction solution. However, when used as the specific layer forming liquid A, it is desirable to strictly distill off the solvent after the hydrolysis and polycondensation step in order to prevent foaming during heating and coloring due to heat.
  • a solvent may be used.
  • the solvent for example, C1 to C3 lower alcohols, dimethylformamide, dimethyl sulfoxide, acetone, tetrahydrofuran, methylcetosolve, ethylcellosolve, methylethylketone, toluene, water and the like can be used arbitrarily. Those which are not acidic or basic are preferred because they do not adversely affect hydrolysis and polycondensation.
  • the solvent one kind may be used alone, but two kinds or more may be used in any combination and ratio. The amount of solvent used can be freely selected.
  • the solvent is often removed when it is applied to the substrate and on each layer, and therefore it is preferably set to the minimum necessary amount.
  • a solvent such as alcohol is generated by a hydrolysis reaction without mixing a solvent from the outside, it may be heterogeneous at the beginning of the reaction or even during the reaction.
  • the hydrolysis / polycondensation reaction of the above raw material compound is carried out at normal pressure, it is usually 15 ° C or higher, preferably 20 ° C or higher, more preferably 40 ° C or higher, and usually 140 ° C.
  • Hydrolysis / polycondensation reaction time varies depending on the reaction temperature, but is usually 0.1 hour or more, preferably 1 hour or more, more preferably 3 hours or more, and usually 100 hours or less, preferably 20 hours or less, and more Preferably, it is carried out for 15 hours or less. It is preferable to adjust the reaction time appropriately while managing the molecular weight!
  • the obtained hydrolysis / polycondensate is stored at room temperature or lower until its use S, and polycondensation proceeds slowly during this period. Therefore, especially when used as a thick film member, it is usually within 60 days, preferably within 30 days, more preferably 15 days at room temperature storage after the completion of the hydrolysis / polycondensation reaction by heating. Preferable to use within days! /. This period can be extended by cryogenic storage in the range! It is preferable to adjust the storage period while controlling the molecular weight!
  • hydrolysis of the above raw material compound (polycondensate) is obtained.
  • This hydrolyzed 'polycondensate is preferably liquid.
  • a solid hydrolysis-polycondensation product can be used as long as it becomes liquid by using a solvent.
  • the liquid hydrolysis / polycondensate thus obtained is a specific layer forming liquid A that becomes the specific layer A of the first to fourth light guide members of the present invention by curing in the steps described later. is there.
  • [0165] Evaporation of solvent
  • a solvent is used in the hydrolysis / polycondensation step, it is usually preferable to distill off the solvent from the hydrolysis / polycondensate before drying (solvent distillation step).
  • the specific layer forming liquid A (liquid hydrolysis / polycondensate) containing no solvent can be obtained.
  • the hydrolysis / polycondensation product is cured, so that it has been difficult to handle the hydrolysis / polycondensation product.
  • the method for producing a specific layer according to the present invention when bifunctional component oligomers are used, the reactivity of the hydrolysis' polycondensate is suppressed. The condensate does not cure and the solvent can be distilled off. By distilling off the solvent before drying, cracking, peeling, disconnection, etc. due to solvent removal shrinkage can be prevented.
  • water used for hydrolysis is also distilled off when the solvent is distilled off.
  • the solvent to be distilled off also includes a solvent represented by XH or the like produced by hydrolysis of the raw material compounds represented by the above general formulas (1) and (2). Furthermore, low-molecular cyclic siloxane by-produced during the reaction is also included.
  • the method for distilling off the solvent is arbitrary as long as the effects of the present invention are not significantly impaired. However, it should be avoided to distill off the solvent at a temperature higher than the curing start temperature of the hydrolysis and polycondensate.
  • the specific range of the temperature conditions when the solvent is distilled off is usually 60 ° C or higher, preferably 80 ° C or higher, more preferably 100 ° C or higher, and usually 150 ° C. C or lower, preferably 130 ° C. or lower, more preferably 120 ° C. or lower. Below the lower limit of this range, the solvent may be insufficiently distilled, and when the upper limit is exceeded, the hydrolyzate / polycondensate may gel.
  • the pressure condition for distilling off the solvent is usually atmospheric pressure. If necessary, reduce the pressure so that the boiling point of the reaction mixture does not reach the curing start temperature (usually 120 ° C or higher).
  • the lower limit of the pressure is such that the main component of the hydrolysis and polycondensate does not distill.
  • light boiling components can be efficiently distilled off under high temperature and high vacuum conditions.However, if the amount of light boiling components is very small, if it cannot be distilled off precisely due to the shape of the apparatus, the polymerization proceeds further due to high temperature operation and the molecular weight increases too much. there is a possibility.
  • a certain type of catalyst is used, In some cases, if subjected to a high temperature reaction for a long time, it may be deactivated and the specific layer forming liquid A may be difficult to cure. Therefore, in these cases, the light boiling component may be distilled off at low temperature and normal pressure by blowing nitrogen or steam distillation, if necessary.
  • the molecular weight of the main component of the hydrolysis and polycondensate should be increased by a moderate hydrolysis / polycondensation reaction so that the main component of the polycondensate does not distill. It is desirable to keep it.
  • the light guide member having the specific layer A produced by using the specific layer forming liquid A from which light boiling components such as solvent, moisture, by-product low molecular cyclic siloxane, and dissolved air are sufficiently removed by these methods is light boiling. This is preferable because foaming at the time of curing due to vaporization of water and peeling from the substrate or each layer when used at a high temperature can be reduced.
  • distilling off the solvent is not an essential operation.
  • a solvent having a boiling point equal to or lower than the hydrolysis temperature of the hydrolysis / polycondensate when used, when the hydrolysis / polycondensation product is dried, before the hydrolysis of the hydrolysis / polycondensation product starts, Therefore, the generation of cracks and the like due to desolvation shrinkage can be prevented even without performing a solvent distillation step.
  • the volume of the hydrolysis / polycondensate may change due to volatilization of the solvent, it is preferable to distill off the solvent from the viewpoint of precisely controlling the size and shape of the light guide member.
  • the specific layer forming liquid A thus obtained is applied to a desired site such as a substrate to form a coating film.
  • This coating film becomes the specific layer A by drying as described later.
  • the coating may be performed before the solvent is distilled off, or the coating may be applied after the solvent is distilled off.
  • the film thickness of the coating film may be set to an appropriate size according to the film thickness of the specific layer A to be formed.
  • the specific layer A according to the present invention can be made thicker than a layer formed by the conventional technique, there is an advantage that the degree of freedom of dimension setting is large.
  • the method used for coating is not limited, but for example, a casting method, a spin method, a dipping method, or the like can be used.
  • [0173] [A-2-5] Drying The ability to obtain the specific layer A can be obtained by drying the hydrolysis / polycondensate obtained by the hydrolysis / polycondensation reaction described above (drying process or curing process). This hydrolyzed polycondensate is normally a liquid force as described above, and is dried in a state where it is put in a mold of the desired shape to form a specific layer A having the desired shape. Is possible. Further, by drying the hydrolyzed polycondensate applied to the target site as described above, the specific layer A can be formed directly on the target site.
  • the solvent does not necessarily evaporate, but here it is called the drying process, including the phenomenon that the hydrolyzed hydrolyzate / polycondensate loses its fluidity and hardens. . Therefore, when there is no evaporation of the solvent, the above “drying” may be read as “curing”.
  • the hydrolysis / polycondensate is further polymerized to form a metalloxane bond, and the polymer is dried and cured to obtain the specific layer A.
  • the hydrolysis / polycondensate is heated to a predetermined curing temperature to be cured.
  • the specific temperature range is arbitrary as long as hydrolysis / drying of the polycondensate is possible. Since the metalloxane bond is usually formed efficiently at 100 ° C or higher, preferably 120 ° C or higher, more preferably Implemented above 150 ° C.
  • a light guide member including a light source such as a substrate or a semiconductor light-emitting device
  • it is usually dried at a temperature lower than the heat-resistant temperature of a component such as a light source such as a substrate or a semiconductor light-emitting device, preferably 200 ° C or lower. It is preferable to carry out.
  • the time for maintaining the curing temperature (curing time) for drying the hydrolyzed / polycondensate is not generally determined by the catalyst concentration, the thickness of the member, etc., but usually 0.1 hour or more, Preferably it is 0.5 hours or more, more preferably 1 hour or more, and usually 10 hours or less, preferably 5 hours or less, more preferably 3 hours or less.
  • the temperature raising conditions in the drying step are not particularly limited. That is, during the drying process, the temperature may be maintained at a constant temperature, or the temperature may be changed continuously or intermittently. In addition, the drying process may be further divided into a plurality of times. Furthermore, the temperature may be changed stepwise in the drying process. By changing the temperature stepwise, it is possible to obtain the advantage that foaming due to residual water vapor can be prevented. Also low When cured at a high temperature and then cured at a high temperature, it is possible to obtain an advantage that internal stress is not easily generated in the obtained specific layer A, and cracks and peeling are unlikely to occur.
  • the hydrolysis / polycondensation reaction described above was performed in the presence of a solvent, the hydrolysis / polycondensate was not performed even if the solvent distillation step was not performed or the solvent distillation step was performed. If the solvent remains in the solvent, this drying step is dried at a temperature not lower than the boiling point of the solvent and a first drying step that substantially removes the solvent at a temperature not higher than the boiling point of the solvent. It is preferable to perform it separately from the second drying step.
  • the “solvent” mentioned here includes a solvent represented by XH or the like and a low-molecular cyclic siloxane produced by hydrolysis / polycondensation reaction of the above-mentioned raw material compounds.
  • drying refers to a step of hydrolysis of the above-mentioned raw material compound, in which the polycondensate loses the solvent, and further polymerizes and cures to form a metalloxane bond.
  • the first drying step hydrolysis of the raw material compound 'the contained solvent without actively proceeding further polymerization of the polycondensate is substantially removed at a temperature below the boiling point of the solvent. It is what you do. That is, the product obtained in this step is hydrolyzed prior to drying, the polycondensate is concentrated, the hydrogen-bonded viscous liquid or soft film-like force, and the solvent are removed. Hydrolysis ⁇ Polycondensate is present in liquid form.
  • the first drying step it is usually preferable to perform the first drying step at a temperature lower than the boiling point of the solvent.
  • the first drying is performed at a temperature equal to or higher than the boiling point of the solvent, the resulting film is foamed by the vapor of the solvent, and a uniform film having no defects is obtained.
  • This first drying process may be performed in a single step when the evaporation efficiency of the solvent is good, such as when a thin film member is used, but when the evaporation efficiency is poor, the first drying process is divided into a plurality of steps. You can warm it. In the case of a shape with extremely poor evaporation efficiency, it may be dried and concentrated beforehand in another efficient container, and then applied in a state where fluidity remains, and further dried. When the evaporation efficiency is poor, it is preferable to devise a method in which the entire member is uniformly dried without taking a means of concentrating only the surface of the member, such as ventilation drying with a large amount of air.
  • the hydrolysis' polycondensate in the state where the solvent of the above-mentioned hydrolysis 'polycondensate has substantially disappeared by the first drying step, the hydrolysis' polycondensate is heated to a temperature equal to or higher than the boiling point of the solvent.
  • the hydrolysis' polycondensate is heated to a temperature equal to or higher than the boiling point of the solvent.
  • the second drying step is preferably performed at 100 ° C or higher, more preferably 120 ° C or higher.
  • the temperature is usually lower than the heat resistant temperature of a component such as a light source such as a substrate or a semiconductor light emitting device, preferably 200 ° C or lower. It is preferable to carry out drying with!
  • the curing time in the second drying step is not generally determined depending on the catalyst concentration and the thickness of the member, but is usually 0.1 hour or more, preferably 0.5 hour or more, more preferably 1 hour or more, and usually 10 It is carried out for a period of time or less, preferably 5 hours or less, more preferably 3 hours or less.
  • each drying step may be maintained at a constant temperature, or the temperature may be changed continuously or intermittently.
  • each drying step may be further divided into a plurality of times.
  • the temperature temporarily exceeds the boiling point of the solvent during the first drying step, or a period during which the temperature is lower than the boiling point of the solvent is interposed during the second drying step even if the temperature temporarily exceeds the boiling point of the solvent during the first drying step, or a period during which the temperature is lower than the boiling point of the solvent is interposed during the second drying step.
  • the solvent removal step (first drying step) and the curing step (second drying step) as described above can be achieved independently, they are included in the scope of the present invention.
  • the hydrolyzed 'polycondensate becomes a liquid hydrolyzed' polycondensate containing no solvent. After that, it is dried at a temperature higher than the boiling point of the solvent (that is, the curing temperature).
  • the process of curing the hydrolysis / polycondensate proceeds. Therefore, when a solvent having a boiling point equal to or lower than the curing temperature is used as the solvent, the first drying step and the second drying step are performed even if they are not intended to be performed. . For this reason, the use of a solvent having a boiling point equal to or lower than the curing temperature of the hydrolysis polycondensate, preferably less than the above curing temperature, is that the hydrolysis / polycondensate contains a solvent during the drying step. Even if it is, the quality of the specific layer A and the light guide member provided with the specific layer A is not greatly affected.
  • the obtained specific layer A may be subjected to various post treatments as necessary.
  • the post-treatment include surface treatment for improving adhesion, production of an antireflection film, production of a fine uneven surface for improving light extraction efficiency, and the like.
  • the specific layer forming liquid A of the present invention is a liquid material obtained by the hydrolysis / polycondensation step, and becomes the specific layer A by being cured in the drying step.
  • the specific layer forming liquid A is a curable organopolysiloxane
  • a branched organopolysiloxane is preferred to a linear organopolysiloxane in terms of the thermal expansion coefficient of the cured product.
  • the cured product of linear organopolysiloxane is in the form of an elastomer, and its thermal expansion coefficient is large! /,
  • the thermal expansion coefficient of the cured product of branched organopolysiloxane is that of linear onoreganopolysiloxane. This is because the change in optical properties accompanying thermal expansion is small because it is smaller than the thermal expansion coefficient of the product.
  • the viscosity of the specific layer forming liquid A of the present invention is not limited, but at a liquid temperature of 25 ° C, it is usually 20 mPa's or more, preferably lOOmPa's or more, more preferably 200 mPa's or more, Usually, it is 1500 mPa's or less, preferably lOOOmPa's or less, more preferably 800 mPa's or less.
  • the viscosity can be measured with an RV viscometer (for example, RV viscometer “R VDV-II + Proj” manufactured by Brookfield).
  • the weight average molecular weight and molecular weight distribution of the specific layer forming solution A of the present invention are not limited. Usually, as described in “[A-1-5-7] Molecular weight”. Furthermore, it is preferable that the low-boiling component in the specific layer forming liquid A of the present invention is small, like the specific layer A of the present invention described in “[A-15-8] Low-boiling component”. .
  • the fifth to eighth light guide members of the present invention are characterized in that two or more layers are laminated.
  • the fifth and seventh light guide members of the present invention include a light source whose emission peak has a dominant wavelength of 500 nm or less, and at least one of the stacked layers has the following characteristics: .
  • at least two layers in contact with each other among the above layers have the characteristics shown below.
  • each of the stacked layers has the following characteristics.
  • Hardness of Shore A is 5 or more and 100 or less, or Shore D is 0 or more and 85 or less.
  • the specific layer B contains a polar group at the interface with other layers. That is, the specific layer B contains a compound having a polar group so as to have a polar group at the interface with another layer.
  • a polar group There is no limitation on the type of such a polar group. Examples include lanol groups, amino groups and derivatives thereof, alkoxysilyl groups, carbonyl groups, epoxy groups, carboxy groups, carbinol groups (one COH), methacryl groups, cyanos groups, and sulfone groups.
  • the specific layer B may contain only one kind of polar group at any time, or may contain two or more kinds of polar groups in any combination and ratio.
  • the specific layer B has a polar group at the interface with other layers, so that the two layers are strongly adhered and can be stacked by overcoating.
  • the polar group contained in the specific layer B according to the present invention is a predetermined functional group present on the surface of a resin, ceramic or metal such as polyphthalamide (for example, a hydroxyl group or an oxygen in a metalloxane bond). Etc.) and hydrogen bond is possible, and high adhesion is expressed.
  • the substrate for installing the light guide member is usually made of resin, ceramic or metal. Further, a hydroxyl group usually exists on the surface of the ceramic metal.
  • the specific layer B usually has a functional group capable of hydrogen bonding with the hydroxyl group. Therefore, the fifth to eighth light guide members of the present invention having the specific layer B are excellent in adhesion to the substrate due to the hydrogen bond.
  • these polar groups may be added to the surface of the specific layer B later by application of a primer or surface treatment which may be contained in the specific layer B from the beginning. Therefore, from this point of view, specific examples are given of the relationship between any two layers (including the specific layer B and the layer other than the specific layer B) constituting the fifth to eighth light guide members of the present invention.
  • the configuration shown in Fig. 1 (a) to Fig. 1 (f) can be mentioned.
  • the relationship of the layers constituting the fifth to eighth light guide members of the present invention is not limited to the following specific examples.
  • Fig. 1 (a) there is a configuration in which the two laminated layers are both formed from a specific layer B S containing a polar group from the beginning.
  • both specific layers B adhere well due to the polar group contained in the specific layer B S.
  • one of the two laminated layers is a specific layer BS containing a polar group from the beginning, and the other does not contain a polar group.
  • a configuration formed of layer O can be mentioned. Even in this case, it is more dense due to the polar group contained in the specific layer BS. Wearability is improved than before.
  • the two laminated layers are initially formed of a layer O not containing a polar group, and between the two layers O and O.
  • the primer P is applied to
  • polar groups are imparted to the surfaces of both layers O and O by the primer P.
  • adhesiveness improves.
  • the part containing the polar group is only an interface between the two layers, which is substantially a thin film. Therefore, even if a polar group that is easily colored by light or heat is introduced, the light guide function is hardly affected. .
  • layer O satisfies characteristics (7) and (8), these layers O will have polar groups due to primer P, and thus function as specific layer B.
  • the two laminated layers are both formed from a specific layer BS containing a polar group from the beginning, and both specific layers BS, S A configuration in which primer P is applied in between is mentioned.
  • the adhesion between the two specific layers B S and S is particularly excellent due to the primer P.
  • one of the two laminated layers is a specific layer BS containing a polar group from the beginning, and the other contains a polar group at the beginning.
  • An example is a configuration in which the primer P is applied between the specific layer BS and the layer O.
  • the adhesion between the specific layer B S and the layer O is improved by the primer P as compared with the case described in FIG.
  • layer O satisfies characteristics (7) and (8), these layers O will have polar groups due to primer P. I will be in a storehouse.
  • a specific layer BS containing a polar group is first laminated on a layer O that does not contain a polar group at first, A configuration in which the component partially soaks into layer O to assist adhesion is exemplified. Such impregnation of the component is carried out by soaking the formation liquid of the specific layer B S as the upper layer into the layer O as the lower layer.
  • the hardness measurement value is an index for evaluating the hardness of the specific layer of the fifth to eighth light guide members of the present invention, and is measured by the following hardness measurement method.
  • the specific layer B is preferably a member having a relatively low hardness, preferably a member having an elastomeric shape. That is, the fifth to eighth light guide members of the present invention are forces that use a plurality of members having different thermal expansion coefficients in the substrate or each layer.
  • the specific layer B has a relatively low hardness.
  • the specific layer B and the fifth to eighth light guide members of the present invention having the specific layer can relieve stress due to expansion and contraction of the respective components. Therefore, it is possible to provide a light guide member that is excellent in reflow resistance and temperature cycle resistance, which is difficult to cause peeling, cracking, disconnection, and the like during use.
  • the specific layer B has a durometer type A hardness measurement Shore A) 15 or more, preferably 7 or more, more preferably 10 or more, and usually 100 or less, preferably 80 or less. More preferably, it is 70 or less.
  • the hardness measurement value (Shore D) force by durometer type D is 0 or more, and usually 85 or less, preferably 80 or less, more preferably 75 or less.
  • the substrate on which the specific layer B is applied is a thin substrate such as a flexible substrate
  • the substrate and the specific layer B may be warped due to the curing shrinkage stress force due to the lamination of the specific layer B.
  • the specific layer B is formed of a material having rubber elasticity with a Shore A of 5 to 80.
  • the hardness measurement value (Shore A) can be measured by the method described in JIS K6253. Specifically, the measurement can be performed using an A-type rubber hardness meter manufactured by Furusato Seiki Seisakusho, while the hardness measurement value (Shore D) can be measured by the method described in JIS K6253. Specifically, measurement can be performed using a D-type plastic hardness tester manufactured by Furusato Seiki Seisakusho.
  • the specific layer B contains a siloxane bond.
  • the specific layer B is formed including a compound having a siloxane bond.
  • the compound having a siloxane bond include inorganic materials, glass materials, and organic materials.
  • specific examples of inorganic materials include a solution containing silicon oxide, nitride nitride, oxynitride, metal alkoxide, ceramic precursor polymer or metal alkoxide by a sol-gel method.
  • examples thereof include inorganic materials obtained by solidifying a solution obtained by decomposition polymerization or a combination thereof.
  • glass materials include glass materials such as borosilicate, phosphosilicate, and alkali silicate.
  • organic materials include organic materials (silicone materials) such as polyorganosiloxane.
  • the compound which has a siloxane bond may use only 1 type, and may use 2 or more types together by arbitrary combinations and ratios.
  • a silicone material is preferable from the viewpoint of easy handling.
  • this silicone material will be described in detail.
  • the silicone-based material usually refers to an organic polymer having a siloxane bond as a main chain, and examples thereof include a compound represented by the general composition formula (4) and / or a mixture thereof.
  • R 1 to R 6 represent those selected from the group consisting of an organic functional group, a hydroxyl group and a hydrogen atom.
  • R 1 to R 6 may be the same or different.
  • the specific layer B may be sealed using a liquid silicone material and then cured by heat or light.
  • silicone materials are classified according to the curing mechanism, they are usually addition-polymerized curing types.
  • silicone materials such as condensation polymerization curing type, ultraviolet curing type and peroxide crosslinking type.
  • addition polymerization curing type addition type silicone are preferred to be a polymer-based material
  • condensation-curing type condensation-type silicone material
  • ultraviolet-curing type ultraviolet-curing type
  • Addition-type silicone materials refer to those in which polyorganosiloxane chains are bridged by organic additional bonds.
  • a typical example is a compound having a Si—C C Si bond at a crosslinking point obtained by reacting butylsilane and hydrosilane in the presence of an addition catalyst such as a Pt catalyst.
  • an addition catalyst such as a Pt catalyst.
  • Specific examples of addition polymerization curing type trade names include “LPS-1400”, “LPS-2410”, and “LPS-3400” manufactured by Shin-Etsu Chemical Co., Ltd. Note that the specific layer B formed using such an addition-type silicone material usually contains a small amount of a bur group and / or a hydrosilyl group.
  • the addition-type silicone material is specifically represented by, for example, (A) an alkenyl group-containing organopolysiloxane represented by the following average composition formula (5) and the following average composition formula (6). (B) Hydrosilyl group-containing organopolysiloxane and (B) the total alkenyl group in (B) are mixed in an amount ratio such that the total hydrosilyl group amount of (B) is 0.5 to 2.0 times. (C) It can be obtained by reacting in the presence of an addition reaction catalyst.
  • A an alkenyl group-containing organopolysiloxane represented by the following average composition formula (5) and the following average composition formula (6).
  • Hydrosilyl group-containing organopolysiloxane and (B) the total alkenyl group in (B) are mixed in an amount ratio such that the total hydrosilyl group amount of (B) is 0.5 to 2.0 times.
  • C It can be obtained by reacting in the presence of an addition reaction catalyst.
  • the alkenyl group-containing organopolysiloxane is an organopolysiloxane having an alkenyl group bonded to at least two silicon atoms in one molecule represented by the following composition formula (5).
  • R is the same or different substituted or unsubstituted monovalent hydrocarbon group, alkoxy group, or hydroxyl group, and n is a positive number satisfying l ⁇ n ⁇ 2. And at least one of R is an alkenyl group.
  • the hydrosilyl group-containing polyorganosiloxane is an organohydrogen polysiloxane having hydrogen atoms bonded to at least two silicon atoms in one molecule represented by the following composition formula (6).
  • R ′ is the same or different substituted or unsubstituted monovalent hydrocarbon group excluding the alkenyl group, and the symbols a and b are 0.7 ⁇ a ⁇ 2.1, 0. 001 ⁇ b ⁇ l. 0 and a positive number satisfying 0.8.8 ⁇ a + b ⁇ 2.
  • the alkenyl group is preferably an alkenyl group having 2 to 8 carbon atoms such as a bur group, a allyl group, a butyr group, or a pentyl group.
  • R is a hydrocarbon group
  • an alkyl group such as a methyl group or an ethyl group, a carbon group such as a bur group or a phenyl group; one selected from monovalent hydrocarbon groups having! More preferably, they are a methyl group, an ethyl group, and a phenyl group.
  • Each R may be different, but if UV resistance is required, 80% or more of R is preferably a methyl group! /.
  • R may be an alkoxy group having 1 to 8 carbon atoms or a hydroxyl group, but the content of the alkoxy group or hydroxyl group is preferably 3% or less of the weight of (A)! /.
  • n is a positive force satisfying l ⁇ n ⁇ 2. If this value is 2 or more, sufficient strength as a sealing material cannot be obtained. The synthesis of this organopolysiloxane becomes difficult.
  • the (B) hydrosilyl group-containing polyorganosiloxane acts as a crosslinking agent for curing the composition by hydrosilylation reaction with the (A) alkenyl group-containing organopolysiloxane.
  • R ′ represents a monovalent hydrocarbon group excluding an alkenyl group.
  • R ′ a group similar to R in the composition formula (5) (however, excluding the alkenyl group) can be exemplified.
  • at least 80% is preferably a methyl group.
  • the symbol a is usually a positive number of 0.7 or more, preferably 0.8 or more, and usually 2.1 or less, preferably 2 or less.
  • the sign b is a positive number that is usually 0.001 or more, preferably 0.01 or more, and usually 1.0 or less.
  • a + b is 0.8 or more, preferably 1 or more, 2.6 or less, preferably 2.4 or less.
  • the (B) hydrosilyl group-containing polyorganosiloxane has at least 2, preferably 3 or more SiH bonds in one molecule.
  • the molecular structure of the (B) hydrosilyl group-containing polyorganosiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, but the number of silicon atoms in one molecule (or polymerization) The degree) can be 3 to 1000, especially about 3 to 300.
  • hydrosilyl group containing polyorganosiloxane may use only 1 type, and may use 2 or more types together by arbitrary combinations and ratios.
  • the blending amount of the (B) hydrosilyl group-containing polyorganosiloxane depends on the total alkenyl group amount of the (A) alkenyl group-containing organopolysiloxane.
  • the total SiH power of (B) hydrosilyl group-containing polyorganosiloxane with respect to the total alkenyl groups of (A) anoalkenyl group-containing organopolysiloxane is usually 0.5 mol times or more, preferably 0.8 mol.
  • the amount may be not less than twice, and usually not more than 2.0 mol times, preferably not more than 1.5 mol times.
  • the addition reaction catalyst promotes the hydrosilylation addition reaction between (A) an alkenyl group in an alkenyl group-containing organopolysiloxane and (B) a SiH group in a hydrosilyl group-containing polyorganosiloxane. It is a catalyst.
  • the (C) addition reaction catalyst include platinum black, platinous chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chlorophosphoric acid and olefins, platinum bismuth.
  • platinum group catalysts such as platinum catalysts such as cetoacetate, palladium catalysts and rhodium catalysts.
  • the compounding amount of this addition reaction catalyst can be a catalytic amount, but is usually based on the total weight of (A) an alkenyl group-containing organopolysiloxane and (B) a hydrosilyl group-containing polyorganosiloxane as a platinum group metal. 1 ppm or more, particularly 2 ppm or more, and 500 ppm or less, particularly preferably 10 ppm or less.
  • the composition for obtaining an addition-type silicone material includes (A) an alkenyl group-containing nonreganopolysiloxane, (B) a hydrosilyl group-containing polyorganosiloxane, and (C) an addition reaction catalyst.
  • Addition control agent to give curability and pot life as optional components In addition to linear diorganopolysiloxane having an alkenyl group for adjusting hardness and viscosity, for example, linear non-reactive organopolysiloxane, linear having about 2 to 10 key atoms or A cyclic low molecular weight organopolysiloxane or the like may be incorporated in a range that does not impair the effects of the present invention.
  • the curing conditions for the composition are not particularly limited, but are preferably 120 to 180 ° C, 30 to 180 minutes.
  • the linear expansion coefficient is larger than that of rubber resin or hard plastic silicone resin, so it can be cured at a low temperature around room temperature for 10 to 30 hours. Force S to suppress the generation of internal stress.
  • addition-type silicone material a known material can be used, and an additive or an organic group for improving adhesion to metal or ceramics may be further introduced.
  • silicone materials described in Japanese Patent Nos. 39 09826, 3910080, 2003-128922, 2004 221308, and 2004-186168 are suitable.
  • condensation type silicone material examples include a compound having a Si 2 O 3 Si bond obtained by hydrolysis and polycondensation of an alkylalkoxysilane at a crosslinking point.
  • Specific examples include a polycondensate obtained by hydrolysis and polycondensation of a compound represented by the following general formula (1) and / or (2) and / or its oligomer.
  • M represents at least one element selected from the group consisting of silicon, aluminum, zirconium, and titanium
  • X represents a hydrolyzable group
  • Y 1 represents a monovalent group.
  • M represents an integer of 1 or more that represents the valence of M
  • n represents an integer of 1 or more that represents the number of X groups, where m ⁇ n.
  • M represents at least one element selected from the group consisting of silicon, aluminum, zirconium, and titanium
  • X represents a hydrolyzable group
  • Y 1 represents a monovalent group
  • Y 2 represents a u-valent organic group
  • s represents an M valence
  • an integer of 1 or more T represents an integer of 1 or more and s—1 or less
  • u represents an integer of 2 or more.
  • the condensation type silicone material may contain a curing catalyst.
  • any catalyst can be used as long as the effects of the present invention are not significantly impaired.
  • any catalyst can be used as long as it is active in the dehydration or dealcohol condensation of an alkoxysilyl group or silanol. May be.
  • Specific examples include metal salts such as Ti, Al, Sn, Ta, Zn, Zr, and Hf, metal chelate compounds, and amines. Of these, metal chelate compounds are preferred.
  • the metal salt and the metal chelate compound are any force selected from the group consisting of Ti, Al, Sn, Ta, Zn and Zr, and those containing 1 or more are more preferable. Only one type of curing catalyst may be used, or two or more types may be used in any combination and ratio! /.
  • the specific layers B of the fifth to eighth light guide members of the present invention are mainly characterized by the above-mentioned characteristics, but preferably have the following structure and properties. .
  • the specific layer B according to the present invention is used for an optical waveguide or a light guide plate with a semiconductor light emitting element as a light source
  • the light transmittance (transmittance) at the emission wavelength of the light source at a film thickness of 1 mm is usually It is preferable to be 80% or more, particularly 85% or more, and more preferably 90% or more.
  • the specific layer B is used as the translucent part in the light guide member, if the translucency of the translucent part is low, the luminance of the light source using the translucent part is reduced. It becomes difficult to obtain the final product.
  • the “emission wavelength of the light source” means, for example, a power that varies depending on the type of the semiconductor light emitting device. Generally, it is usually 300 nm or more, preferably 350 nm or more, and usually 900 nm or less. Preferably, it refers to a wavelength in the range of 500 nm or less. If the light transmittance at wavelengths in this range is low, the specific layer B absorbs light and the light extraction efficiency decreases, A high-intensity optical waveguide or light guide plate cannot be obtained. Furthermore, the energy corresponding to the decrease in the light extraction efficiency is changed to heat, which causes thermal deterioration of the optical waveguide or the light guide plate, which is not preferable.
  • the optical material In the ultraviolet to blue region (wavelength 300 nm to 500 nm), the optical material is likely to be light-degraded. Therefore, the specific layer B according to the present invention having excellent durability is used as a light source having an emission wavelength in this region. If so, the effect will be great!
  • the light transmittance of the optical material such as the material of the specific layer B is measured with an ultraviolet spectrophotometer using a sample of a single cured film having a smooth surface molded to a film thickness of 1 mm by the following method, for example. I can do that.
  • the wavelength is between 200 nm and 800 nm. ! /, Measure the light transmittance.
  • the coating liquid used for forming the specific layer B is a polystyrene-converted weight average obtained by measuring the material forming the specific layer B by GPC (gel permeation chromatography).
  • the molecular weight (Mw) is usually 200 or more, preferably 500 or more, more preferably 900 or more, more preferably 3200 or more, and usually 400,000 or less, preferably 70,000 or less, more preferably 50,000 or less. It is.
  • the weight average molecular weight is too small, it will volatilize during curing or contain a high concentration of crosslinkable terminals such as alkoxy groups, hydroxyl groups, bur groups, hydrosilyl groups, etc. Therefore, when used in the vicinity of blue to ultraviolet LEDs, there is a tendency for the transmittance from the catalyst to decrease.
  • the weight average molecular weight is too large, the liquid will have a high viscosity, resulting in poor leveling during coating, penetration of fine wiring and uneven parts on the substrate, and spilling of the liquid. There is a tendency for the filling efficiency to become poor due to insufficiency.
  • the weight average molecular weight is the value of the specific layer forming liquid B after mixing the liquids to be used together.
  • the molecular weight distribution shows a shape having two or more peaks such as two peaks and three peaks, the average value over the entire section is used as the weight average molecular weight value.
  • the specific layer B according to the present invention preferably has a low tackiness on the surface.
  • silicone rubber has tackiness (stickiness) on the surface of the cured product.
  • the tackiness is high, the products may be stacked and may not be handled individually during the manufacturing process, or may not be transported satisfactorily.
  • the specific layer B has a stress relaxation force and preferably follows external forces such as bending and deformation.
  • the preferred tensile stress range of the specific layer B is usually 0. IMPa or more, preferably 0.3 MPa or more, more preferably 0.4 MPa or more, and the upper limit is usually 50 MPa or less, preferably 30 MPa or less. Preferably it is 20 MPa or less. If the tensile stress is too small, the mechanical strength is insufficient and may be unsuitable for light guide plate applications. If it is too large, the material may be a hard material with insufficient stress relaxation force.
  • the tensile stress of the specific layer B is arbitrary.
  • the specific layer B is provided on a flexible substrate having a thickness of 500 m or less, it is particularly preferable that the specific layer B can relieve stress and that the tensile stress is 0. IMPa or more and 2 OMPa or less! /, .
  • the tensile stress can be measured based on JIS K6250.
  • the fifth to eighth light guide members of the present invention may have layers other than the specific layer B.
  • a layer other than the specific layer B a known layer can be arbitrarily applied.
  • only one layer may be provided, or two or more layers may be provided.
  • more of the layers of the fifth to eighth light guide members of the present invention have the characteristics as the specific layer B. It is more preferable that all the layers have the characteristics as the specific layer B described above.
  • each layer constituting the fifth to eighth light guide members of the present invention can be manufactured by any method.
  • a liquid material that is, a forming solution
  • the specific layer B is formed by, for example, applying a liquid material of the specific layer B (hereinafter referred to as “specific layer forming liquid B”) to a desired part to form a coating film. It can be made by curing with heat or light.
  • primer treatment when producing the specific layer B, it is preferable to appropriately perform primer treatment in order to ensure that the specific layer B has the above-mentioned preferable characteristics.
  • an adhesive layer having adhesiveness to both the base layer and the upper layer may be applied as an intermediate layer between the base layer and the upper layer. Applying such an adhesive intermediate layer on the underlayer is called primer treatment, and the coating solution is called a primer.
  • the primer itself works in the same way as the polar group at the interface.
  • the film thickness of the primer layer formed by the primer treatment is an arbitrary force as long as the effect of the present invention is not significantly impaired.
  • the specific layer B or another layer or member in contact with the specific layer B may be subjected to a surface treatment.
  • a surface treatment include, for example, formation of an adhesion improving layer using a primer-silane coupling agent, chemical surface treatment using a chemical such as acid or alkali, plasma irradiation, ion irradiation or electron beam irradiation. Used physical surface treatment, support And surface blasting by etching or fine particle coating.
  • Other surface treatments for improving adhesion include, for example, JP-A-5-25300, Nobuhiro Inagaki “Surface Chemistry” Vol. 18 No. 9, pp21-26, Kuroo Kurosaki “Surface Chemistry” ”Vo 1.19 No. 2, pp44-51 (1998), etc., may be known surface treatment methods.
  • ozone treatment can be performed.
  • the fifth and seventh light guide members of the present invention include a light source.
  • the sixth and eighth light guide members of the present invention may include a light source.
  • the fifth to eighth light guide members of the present invention transmit light emitted from the light source and emit the light as it is or after converting the wavelength.
  • the wavelength of the main wavelength of the light emission peak of this light source is 900 nm or less, preferably 700 nm or less, more preferably 500 ⁇ m or less. If the wavelength of the main wavelength of the light emission peak of the light source is too long, the light beam becomes a heat ray and may cause damage to the light guide member or may be absorbed by the constituent members of the light guide member to cause transmission loss.
  • the lower limit of the wavelength of the emission peak is not limited, but is usually 300 nm or more, preferably 350 nm or more, more preferably 400 nm or more. If the wavelength of the main wavelength of the light emission peak of the light source is too short, the light beam becomes high-energy ultraviolet light, which may reduce the transmittance of the light guide member.
  • the type of the light source is not limited as long as it emits light having the above-described emission peak, but a semiconductor light emitting element is usually used.
  • a semiconductor light emitting element for example, a light emitting diode (LED) or a laser diode (LD) can be given.
  • LED light emitting diode
  • LD laser diode
  • GaN-based LEDs and LDs using GaN-based compound semiconductors are preferred. This is because GaN-based LEDs and LDs are extremely low power and extremely low power when combined with phosphors described later, whose light output and external quantum efficiency are significantly higher than SiC LEDs that emit light in this region.
  • the power to obtain bright light emission for example, for a current load of 20 mA, GaN-based LEDs and LDs usually have a light emission intensity that is more than 100 times that of SiC.
  • Al GaN-based LEDs and LDs Al GaN-based LEDs and LDs, Al GaN-based LEDs and LD
  • GaN gallium arsphide
  • GaN-based LDs which are particularly preferred, multiple amounts of InGaN and GaN layers
  • the one with the well structure is particularly preferred because the emission intensity is very strong.
  • the value of X + Y is usually a value in the range of 0.8 to 1.2.
  • these light-emitting layers doped with Zn or Si or those without dopants are preferred for adjusting the light emission characteristics.
  • GaN-based LEDs have these light-emitting layers, p-layers, n-layers, electrodes, and substrates as basic components.
  • the light-emitting layers are n-type and p-type AlGaN layers, GaN layers, or InGaN layers. Etc.
  • Those having a heterostructure in the form of a neutral switch are preferred because the luminous efficiency is high, and those having a heterostructure in the quantum well structure are more preferred because the luminous efficiency is further high.
  • the fifth to eighth light guide members of the present invention may include only one light source or two or more light sources in any combination and ratio. Further, the fifth to eighth light guide members of the present invention may include another light source that does not have the main wavelength of the emission peak in the above wavelength range, in addition to the above light source. In addition, the light source is equipped with a combination of multiple light sources with different emission colors such as red, green, and blue!
  • the specific layer A and the specific layer B (hereinafter, when the specific layer A and the specific layer B are referred to without distinction, they may be referred to as “specific layer” as appropriate.
  • the specific layer forming liquid A and the specific layer forming liquid B When referring to them without distinction, they may be referred to as “specific layer forming liquid” as appropriate.) Any component can be contained without departing from the gist of the present invention. Therefore, depending on the application, the specific layer and the specific layer forming liquid may contain other components in addition to the above-mentioned hydrolysis polycondensate. For example, if necessary, the specific layer and the specific layer forming liquid may contain phosphors, inorganic particles, and the like.
  • light guide members may be used alone, or two or more may be used in any combination and ratio.
  • first to eighth light guide members of the present invention may be appropriately referred to as “light guide members”.
  • the light guide member of the present invention can contain, for example, a phosphor in a phosphor-containing layer (see [C 2-3-4]) described later.
  • the phosphors may be used alone or in combination of two or more in any combination and ratio. Also, the phosphor is contained in two or more layers among the layers constituting the light guide member of the present invention!
  • composition of the phosphor is typically represented by the crystal matrix Y O, Zn SiO, etc.
  • Preferred examples of the crystal matrix include (Zn, Cd) S, SrGa S, SrS, ZnS, etc.
  • Sulfides such as Y O S, (Y, Gd) Al O, YAIO, BaMgAl O, (Ba, S
  • borate such as gB 2 O 3, (Y, Gd) BO, Ca (PO 2) (F, CI), (Sr, Ca, Ba, Mg) (
  • Halophosphates such as PO) CI, phosphates such as SrPO, (La, Ce) PO, etc.
  • the above-mentioned crystal matrix and activator or coactivator are not particularly limited in element composition, and can be partially replaced with elements of the same family, and the obtained phosphor is visible from near ultraviolet. Any material that absorbs light in a region and emits visible light can be used.
  • phosphors that can be used in the present invention are not limited to these.
  • phosphors that differ only in part of the structure are appropriately omitted.
  • Y SiO: Ce 3+ “Y SiO: Tb 3+ ” and “Y SiO:
  • the peak wavelength is usually 570 nm or more, preferably 580 nm or more, Usually, it is 700 nm or less, preferably 680 nm or less.
  • red phosphors such as two are composed of fractured particles having a red fracture surface, and emit light in the red region (Mg, Ca, Sr, Ba) SiN: Eu represented by Eu. Mouth piu
  • Activated alkaline earth silicon nitride phosphor composed of growing particles with a nearly spherical shape as a regular crystal growth shape, and emits light in the red region (Y, La, Gd, Lu) OS: Eu
  • red phosphors for example, Eu-activated oxysulfur such as (La, Y) O S: Eu
  • (Ca, Sr) S Eu-activated sulfide phosphors such as Eu, etc.
  • YA10 Eu-activated aluminate such as Eu
  • Ce-activated aluminate phosphor such as Ce, (Ca, Sr, Ba) Si N: Eu, (Mg, Ca, Sr,
  • Ce-activated nitride phosphors such as Ce, (Sr, Ca, Ba, Mg) (PO)
  • Mn-activated halophosphate phosphors such as Eu, Mn, (Ba Mg) Si O: Eu, Mn, (B
  • MgO-0.5 MgF -GeO Mn-activated germanate phosphor such as Mn, Eu-activated ⁇ sizer Eu-activated oxynitride phosphors such as Ron, Eu, Bi-activated such as (Gd, Y, Lu, La) 2 O: Eu, Bi
  • Ce activated sulfide phosphor such as Ce, Ce, CaLa S: Ce activated sulfide phosphor such as Ce, (B
  • Ce-activated nitride phosphor (Ca, Sr, Ba, Mg) (PO) (F, CI, Br, OH): Eu, Mn, etc.
  • Ce-activated silicate phosphors such as (Mg, Zn) Si Ge O
  • red phosphor examples include: / 3 diketonate, ⁇ -diketone, aromatic carboxylic acid, or a red organic phosphor composed of a rare earth ion complex having an anion such as Bronsted acid as a ligand, a perylene pigment (For example, dibenzo ⁇ [f, f ']-4,4', 7,7'-tetraphenyl ⁇ diindeno [1,2,3-cd: l ', 2', 3'-lm] perylene) , Anthraquinone pigments, lake pigments, azo pigments, quinacridone pigments, anthracene pigments, isoindoline pigments, isoindolinone pigments, phthalocyanine pigments, triphenylmethane basic dyes, indanthrone pigments Indophenol pigments, cyanine pigments and dioxazine pigments can also be used.
  • a perylene pigment for example, dibenzo ⁇ [f
  • red phosphors those having a peak wavelength in the range of 580 nm or more, preferably 590 nm or more, and 620 nm or less, preferably 610 nm or less can be suitably used as an orange phosphor.
  • orange phosphors are (Sr, Ba) SiO 2: Eu, (
  • the peak wavelength is usually 490 nm or more, preferably 500 nm or more, Usually, it is 570 nm or less, preferably 550 nm or less.
  • a green phosphor for example, it is composed of fractured particles having a fracture surface, and emits light in the green region (Mg, Ca, Sr, Ba) Si ON: with a plutonium represented by Eu.
  • Active alkaline earth silicon oxynitride phosphor composed of fractured particles with fractured surface, and emits light in the green region (Ba, Ca, Sr, Mg) SiO: Eu mouth expressed by Eu
  • Examples include a palladium-activated alkaline earth silicate phosphor.
  • green phosphor for example, SrAlO: Eu, (Ba, Sr, Ca) Al
  • Eu-activated aluminate phosphor such as Eu, (Sr, Ba) Al Si O: Eu, (Ba, Mg) SiO
  • Activated silicate phosphor, Y SiO: Ce, Tb activated silicate phosphor such as Ce, Tb, Sr P O—
  • Sr B O Eu-activated boric acid phosphor such as Eu, Sr Si O 2 SrCl: Eu such as Eu
  • Tb-activated silicate phosphor such as Tb, (Sr, Ba, Ca) Ga S: E such as Eu, Tb, Sm
  • Ce-activated aluminate phosphor such as Ce, Ca Sc Si O: Ce
  • Ca (Sc, Mg, Na, Li) Si O Ce-activated silicate phosphor such as Ce, CaSc O: Ce, etc.
  • Eu-activated oxynitride phosphors such as sialon, BaMgAl 2 O: Eu, Mn, etc.
  • Activated aluminate phosphor such as SrAl 2 O 3: Eu, (La, Gd,
  • Tb-activated oxysulfide phosphors such as Tb
  • LaP ⁇ Ce
  • Tb-activated phosphoric acid such as Ce
  • Salt phosphors such as ZnS: Cu, Al, ZnS: Cu, Au, Al, (Y, Ga, Lu, Sc, La) BO: Ce, Tb T Na Gd B ⁇ : Ce, Tb, (Ba, Sr) (Ca, Mg, Zn) B ⁇ : K, C
  • Tb activated borate phosphors such as Tb, Ca Mg (SiO 2) CI: Eu, Mn such as Eu, Mn
  • green phosphors examples include pyridine-phthalimide condensed derivatives, benzoxazinone-based, quinazolinone-based, coumarin-based, quinophthalone-based, and naltalimide-based fluorescent materials. It is also possible to use an organic phosphor such as a terbium complex having a dye or hexyl salicylate as a ligand.
  • the peak wavelength is usually 420 nm or more, preferably 440 nm or more, Usually, it is 480 nm or less, preferably 470 nm or less.
  • a blue phosphor for example, a growing particle force having a substantially hexagonal shape as a regular crystal growth shape is configured, and BaMgAl 2 O 3: Eu that emits light in a blue region.
  • Pt-activated norlium magnesium aluminate-based phosphor which is composed of grown particles having a nearly spherical shape as a regular crystal growth shape, and emits light in the blue region (Ca, Sr, Ba) (PO)
  • CI Eu-pium-activated halophosphate calcium represented by Eu
  • Phosphors which are composed of growing particles having a regular cubic crystal growth shape and emit light in the blue region (Ca, Sr, Ba) B O CI: Eu
  • Pium-activated alkaline earth chloroborate phosphor composed of fractured particles with fractured surfaces, and emits light in the blue-green region (Sr, Ca, Ba) Al 2 O: Eu or (Sr, Ca, Ba) Al
  • blue phosphors include Sn-activated phosphate phosphors such as Sr P 2 O 3: Sn.
  • Salt-activated phosphor SrGa S: Ce
  • CaGa S Ce-activated thiogallate phosphor such as Ce
  • MgAlO Eu
  • BaMgAlO Eu-activated aluminate fluorescence such as Eu, Tb, Sm
  • Eu-activated halophosphate phosphors such as Mn and Sb, BaAl Si O: Eu, (Sr, Ba) MgSi 0:
  • Eu-activated silicate phosphor such as Eu
  • Eu-activated phosphate phosphor such as Sr P O: Eu
  • ZnS A
  • sulfide phosphor such as ZnS: Ag, Al, etc.
  • Y SiO Ce activated silicate phosphor such as Ce, CaW
  • nB 2 O Eu
  • 2SrO-0.84P O-0.16B O Eu
  • Mn-activated boric acid phosphates such as Eu Phosphors
  • Eu-activated halosilicate phosphors such as SrSiO-2SrCl: Eu
  • SrSiO-2SrCl Eu
  • blue phosphor for example, naphthalic acid imide-based, benzoxazole-based, styryl-based, coumarin-based, pyrazoline-based, triazole-based fluorescent dyes, organic phosphors such as thulium complexes, etc. may be used. Is possible.
  • yellow phosphor An example of the specific wavelength range of the fluorescence emitted by a phosphor emitting yellow fluorescence (hereinafter referred to as “yellow phosphor” as appropriate) is usually 530 nm or more, preferably 540 nm or more, and more preferably 550 nm.
  • the wavelength is usually 620 nm or less, preferably 600 mm or less, more preferably 580 nm or less. If the emission peak wavelength of the yellow phosphor is too short, the yellow component may be reduced and the color rendering may be inferior. If it is too long, the luminance of the light emitted from the light guide member may be reduced.
  • Examples of such yellow phosphors include various oxide-based, nitride-based, oxynitride-based, sulfide-based, and oxysulfide-based phosphors.
  • RE M O Ce (where R
  • M represents at least one element of Y, Tb, Gd, Lu, and Sm
  • M represents at least one element of Al, Ga, and Sc.
  • M 3 is a trivalent metal element
  • M 4 is garnet phosphor having a garnet structure represented by tetravalent metal element) and the like
  • M 5 represents at least one kind of element of Si and Ge.
  • Etc. oxynitride phosphors obtained by substituting part of oxygen of the constituent elements of the phosphors with nitrogen, AEAlSiN: Ce (where AE is Ba , Sr, Ca, Mg
  • the yellow phosphor for example, CaGa S: Eu (Ca, Sr) Ga S: Eu,
  • a phosphor activated with Eu such as an oxynitride phosphor having a SiAlON structure.
  • the light guide member of the present invention can contain phosphors other than those described above.
  • the layer constituting the light guide member of the present invention may be a fluorescent glass in which an ionic fluorescent material or an organic / inorganic fluorescent component is dissolved and dispersed uniformly and transparently.
  • the particle size of the phosphor used in the present invention is not particularly limited, but the median particle size (D) is usually 0.
  • the phosphor-containing layer described later can be used as a light source.
  • the transmitted light is sufficiently scattered.
  • the light transmitted from the light source is sufficiently absorbed by the phosphor particles, wavelength conversion is performed with high efficiency, and light emitted from the phosphor is irradiated in all directions.
  • primary light from a plurality of types of phosphors can be mixed to make white, and uniform white light and illuminance can be obtained.
  • the central particle size (D) of the phosphor is larger than the above range! /, The phosphor sufficiently fills the space of the light emitting part.
  • the light transmitted from the light source may not be sufficiently absorbed by the phosphor. If the median particle size (D) of the phosphor is smaller than the above range,
  • the illuminance may decrease.
  • the particle size distribution (QD) of the phosphor particles is preferably smaller in order to align the dispersed state of the particles in the phosphor-containing layer, but in order to reduce the particle size, the classification yield is lowered, leading to an increase in cost.
  • it is 0.03 or more, preferably 0.05 or more, and more preferably 0.07 or more. Further, it is usually 0.4 or less, preferably 0.3 or less, more preferably 0.2 or less.
  • the median particle size (D) and particle size distribution (QD) are weight-based particle sizes.
  • the weight-based particle size distribution curve can be obtained by measuring the particle size distribution by a laser diffraction or scattering method. Specifically, for example, it can be measured as follows.
  • the particle size value when the integrated value is 50% is expressed as the median particle size D. Also, the particle size values when the integrated value is 25% and 75% are D, D and
  • the shape of the phosphor particles is arbitrary as long as it does not affect the formation of the phosphor-containing layer.
  • a forming liquid for forming a phosphor-containing layer hereinafter, referred to as “phosphor-containing layer forming liquid” as appropriate.
  • a specific layer forming liquid containing a phosphor, etc. is the same as the phosphor composition. As long as it does not affect the fluidity, etc.).
  • the phosphor used in the present invention may be subjected to a surface treatment for the purpose of enhancing water resistance or preventing unnecessary aggregation of the phosphor in the phosphor-containing layer.
  • a surface treatment for the purpose of enhancing water resistance or preventing unnecessary aggregation of the phosphor in the phosphor-containing layer.
  • Examples of such surface treatment include surface treatments using organic materials, inorganic materials, glass materials and the like described in JP-A-2002-223008, and metal phosphates described in JP-A-2000-96045. And a known surface treatment such as a silica coating.
  • the following surface treatments (i) to (iii) are performed in order to coat the phosphor with the metal phosphate.
  • a water-soluble phosphate such as potassium phosphate or sodium phosphate
  • an alkaline earth metal such as calcium chloride, strontium sulfate, manganese chloride or zinc nitrate
  • a phosphate of at least one of the alkaline earth metals, Zn and Mn is formed in the suspension, and the generated metal phosphate is deposited on the phosphor surface.
  • preferable examples include silica coating, a method of neutralizing water glass to precipitate SiO, and surface treatment of hydrolyzed alkoxysilane.
  • the method of adding phosphor particles is not particularly limited! /.
  • the phosphor particles are mixed in advance with a reaction solution containing the raw material compound before hydrolysis (hereinafter referred to as “pre-hydrolysis solution”!).
  • pre-hydrolysis solution a reaction solution containing the raw material compound before hydrolysis
  • the phosphor surface is preliminarily provided with a crosslinkable group such as a bull group and a hydrosilyl group, or a hydrophobic group such as a methyl group.
  • a crosslinkable group such as a bull group and a hydrosilyl group
  • a hydrophobic group such as a methyl group.
  • the phosphor-containing layer is formed of a dehydrated or dealkoxy-condensation type silicone resin and the phosphor particles are likely to aggregate, the phosphor particles are mixed in advance in the pre-hydrolysis solution, When hydrolysis / polycondensation is performed in the presence of phosphor particles, the surface of the particles is partially silane-coupled to improve the dispersion state of the phosphor particles.
  • the specific layer A of the first to fourth light guide members of the present invention is in a liquid state before application (specific layer forming liquid A).
  • specific layer forming liquid A water is potentially present as a silanol body, and almost no free water is present. Therefore, even such a phosphor can be used without being hydrolyzed.
  • the specific layer forming solution after hydrolysis and polycondensation is used after dehydration / dealcoholation treatment, there is an advantage that it can be easily used together with such a phosphor.
  • the use of an addition condensation type silicone resin as the material of the layer containing the phosphor means that the silicone resin generates water during curing. This is preferable.
  • a dehydrated or dealcoholized silicone resin is used as the material for the phosphor-containing layer, the liquid state (formation solution) before coating is not good.
  • water since water is potentially present as a silanol body and almost no free water is present, such a phosphor can be used without being hydrolyzed.
  • the formation liquid after hydrolysis / polycondensation is used after dehydration / dealcoholation treatment, there is also an advantage that the combined use with such a phosphor becomes easy. Therefore, when the specific layer contains a phosphor, it is particularly preferable to form the specific layer with an addition condensation type, dehydration, or dealcohol type silicone resin.
  • the particle surface can be modified with an organic ligand to improve dispersibility.
  • Conventional addition-type silicone resins that have been used as light-guide members cannot be cured and mixed with such surface-treated particles as soon as they are inhibited by such organic ligands. It was. This is because the platinum-based curing catalyst used in the addition reaction type silicone resin has a strong interaction with these organic ligands, loses the hydrosilylation ability, and causes poor curing.
  • Such poisonous substances include organic compounds containing N, P, S, etc., ionic compounds of heavy metals such as Sn, Pb, Hg, Bi, As, acetylene groups, etc., organic compounds containing multiple bonds (flux) Amines, vinyl chloride, sulfur vulcanized rubber) and the like.
  • the specific layer of the light guide member of the present invention is based on a condensation-type curing mechanism that hardly causes inhibition of curing by these poisoning substances. For this reason, the specific layer is made of phosphor particles or inorganic particles whose surface has been modified with an organic ligand, and phosphor binders that have a high degree of freedom of mixing with fluorescent components such as complex phosphors. It has excellent characteristics as an introduced transparent material.
  • the phosphor content in the phosphor-containing layer of the present invention is arbitrary as long as the effects of the present invention are not significantly impaired, and the force that can be freely selected according to the application mode is usually 0.1% by weight or more, Preferably it is 1% by weight or more, more preferably 5% by weight or more, and usually 35% by weight or less, preferably 30% by weight or less, more preferably 28% by weight or less.
  • the light emission color transmitted from the light source is mixed with the light emission color of the phosphor to obtain white, a part of the light emission color transmitted through the light source power is transmitted. ,fluorescence The body content is low and becomes a region near the lower limit of the above range.
  • a high concentration phosphor is preferred, and the phosphor content is in a region near the upper limit of the above range. If the phosphor content is higher than this range, the coating performance may be deteriorated, or the utilization efficiency of the phosphor may be lowered due to optical interference, and the luminance may be lowered.
  • the phosphor content is less than this range, wavelength conversion by the phosphor becomes insufficient, and the target emission color may not be obtained.
  • the specific phosphor content varies depending on the target color, the light emission efficiency of the phosphor, the color mixture type, the specific gravity of the phosphor, the coating thickness, and the shape of the light guide member. Yes, this is not the case.
  • the specific layer forming liquid has a lower viscosity than conventional light guide member forming liquids such as epoxy resins and silicone resins.
  • the coating performance can be sufficiently maintained even if a high concentration phosphor or inorganic particles having good compatibility with the phosphor and inorganic particles are dispersed.
  • the specific layer forming liquid may contain a thixo material such as erodyl whose polymerization degree is adjusted as necessary.
  • a thixo material such as erodyl whose polymerization degree is adjusted as necessary.
  • the phosphor content in the phosphor-containing layer is such that if the phosphor composition can be specified, the phosphor-containing sample is pulverized and pre-fired to remove the carbon component, and then subjected to hydrofluoric acid treatment.
  • the components are removed as key hydrofluoric acid, the residue is dissolved in dilute sulfuric acid to make the main component metal element into an aqueous solution, and the main component metal element is quantified by known elemental analysis methods such as ICP, flame analysis, and fluorescent X-ray analysis.
  • the phosphor content can be obtained by calculation.
  • phosphor If the shape and particle size are uniform and the specific gravity is known, a simple method can be used in which the number of particles per unit area is obtained by image analysis of the cross-section of the coating and converted into the phosphor content.
  • the phosphor content in the phosphor-containing layer forming liquid may be set so that the phosphor content in the phosphor-containing layer falls within the above range. Therefore, the phosphor-containing layer forming liquid does not change in weight during the drying process! / In this case, the phosphor content in the phosphor-containing layer forming liquid is the phosphor content in the phosphor-containing layer. It will be similar to the rate.
  • the weight of the phosphor-containing layer forming liquid changes during the drying process, such as when the phosphor-containing layer forming liquid contains a solvent, the phosphor-containing layer forming liquid excluding the solvent or the like It suffices if the phosphor content rate is the same as the phosphor content rate in the phosphor-containing layer.
  • the layer constituting the light guide member of the present invention is intended to improve optical characteristics and workability, and to obtain any of the following effects ⁇ 1> to ⁇ 5>.
  • inorganic particles may be included.
  • the specific layer which mutually contacts among the layers which comprise the light guide member of this invention contains an inorganic particle.
  • at least one of the two or more specific layers provided in the light guide member may contain inorganic particles.
  • the inorganic particles may be contained in only one layer among the layers constituting the light guide member of the present invention, or may be contained in two or more layers.
  • a light scattering layer described later is mixed with inorganic particles as a light scattering material, and the light transmitted from the light source is scattered to widen the directivity angle of the light emitted from the light guide member to the outside. Further, in the phosphor-containing layer, the amount of light hitting the phosphor is increased to improve the wavelength conversion efficiency.
  • an appropriate amount of inorganic particles may be mixed in the specific layer forming liquid according to the purpose in the same manner as the phosphor powder.
  • the effect obtained varies depending on the kind and amount of inorganic particles to be mixed.
  • the inorganic particles are ultrafine silica with a particle size of about 10 nm (product name: AEROSIL # 200, manufactured by Nippon Aerosil Co., Ltd.), the thixotropic property of the specific layer forming liquid increases, so Is big.
  • the inorganic particles are crushed silica or spherical silica having a particle size of about several ⁇ m
  • ⁇ 2> and ⁇ 4> are significant because the increase in thixotropic properties is mainly due to the role of aggregate in a specific layer.
  • inorganic particles having a particle size of about 1 ⁇ m, which has a refractive index different from that of the compound (dried hydrolyzed polycondensate) used in the specific layer are used at the interface between the compound and the inorganic particles. Since light scattering increases, the effect of ⁇ 1> is great.
  • the refractive index of the compound (material) used in the specific layer is larger than that of the compound (material), and the median particle size is usually 1 nm or more, preferably 3 nm or more, and usually 1 Onm or less, preferably 5 nm or less.
  • the refractive index can be improved while maintaining the transparency of the specific layer, so the effect ⁇ 5> above is great!
  • the type of inorganic particles to be mixed may be selected according to the purpose. Moreover, the type may be a single type or a combination of multiple types. Moreover, in order to improve dispersibility, it may be surface-treated with a surface treatment agent such as a silane coupling agent.
  • a surface treatment agent such as a silane coupling agent.
  • inorganic particles used include inorganic oxide particles such as silica, barium titanate, titanium oxide, zirconium oxide, niobium oxide, aluminum oxide, cerium oxide, yttrium oxide, and diamond particles. Depending on the choice of other substances, it is not limited to these.
  • the form of the inorganic particles may be any form depending on the purpose, such as powder form or slurry form. However, if it is necessary to maintain transparency, other forms contained in the layer containing the inorganic particles may be used. It is preferable to make the refractive index the same as that of the material, or add it as a water-based / solvent-based transparent sol to the liquid for forming the layer.
  • the median particle size of these inorganic particles is not particularly limited, but is usually about 1/10 or less of the phosphor particles. Specifically, the following median particle size is used according to the purpose. For example, if inorganic particles are used as the light scattering material, the median particle size is usually 0.05 ⁇ m or more, preferably 0.1 ⁇ m or more, and usually 50 ⁇ m or less, preferably 20 or less. is there. For example, if inorganic particles are used as the aggregate, the median particle size is preferably 1 m to 10 m. For example, if inorganic particles are used as a thickener (thixotropic agent), the central particle is preferably 10 to! OOnm.
  • the median particle size is preferably from !! to 1 Onm.
  • at least one of the layers in contact with each other contains inorganic particles having a median particle diameter of 0.05 ⁇ 50 to 50 111, and the layer and / or others. It is preferable to contain inorganic particles having a median particle diameter of 1 to 1 Onm in at least one layer.
  • inorganic particles having a median particle diameter of! -10 nm have an advantage that various functions such as refractive index adjustment can be imparted without impairing the transmittance of the specific layer. Also
  • the inorganic particles having a median particle diameter of 0.05 to 50 111 can impart functions such as diffuse fluorescence as described above.
  • the first layer contains functional inorganic particles with a median particle size of 0.05 to 50 m
  • the second layer contains only inorganic particles with a median particle size of! -10 nm.
  • the 2nd layer with a specific refractive index and transparency plays the role of a light guide layer, and a 1st layer turns into a layer light-emitted by scattering and fluorescence.
  • both the first layer and the second layer can contain inorganic particles having a median particle diameter of 1 to 10 nm , and the first layer and the second layer can be formed by setting different contents for each layer.
  • the refractive index of this layer it is possible to make an optical design according to the light guide distance, film thickness, scattering efficiency, and the like.
  • the method for mixing the inorganic particles is not particularly limited.
  • a planetary agitation mixer or the like is usually used in the same manner as the phosphor. It is recommended to mix while degassing.
  • small particles such as Aerozinole! /
  • the content of the inorganic particles in each layer of the light guide member of the present invention can be freely selected depending on the force and its application form as long as the effects of the present invention are not significantly impaired.
  • the content when inorganic particles are used as the light scattering agent, the content is preferably 0.01 to 10% by weight.
  • the content is preferably from ! to 50% by weight.
  • the content when inorganic particles are used as a thickener (thixotropic agent), the content is preferably 0.;! To 20% by weight.
  • inorganic particles are used as the refractive index adjuster the content is preferably 10 to 80% by weight. If the amount of the inorganic particles is too small, the desired effect may not be obtained. If the amount is too large, various properties such as adhesion, transparency and hardness of the cured product may be adversely affected.
  • the specific layer forming liquid contains inorganic particles.
  • the specific layer forming liquid is a conventional conductive material such as an epoxy resin or a silicone resin. Compared to the optical member forming liquid, it has the advantage of being able to maintain sufficient coating performance even when dispersed at high concentration of inorganic particles that have good affinity with phosphors and inorganic particles. . It is also possible to increase the viscosity by adjusting the degree of polymerization if necessary, and by adding a thixo material such as aerosil, etc., and the viscosity adjustment range according to the target inorganic particle content is large.
  • a thixo material such as aerosil, etc.
  • the inorganic particle content in each layer of the light guide member can be measured in the same manner as the phosphor content described above.
  • the content of the inorganic particles in the forming liquid for forming each layer may be set so that the content of the inorganic particles in each layer falls within the above range. Therefore, the weight of the forming liquid does not change during the drying process!
  • the content of inorganic particles in the forming liquid is the same as the content of inorganic particles in each layer of the light guide member.
  • the forming liquid contains a solvent and the like. When the weight of the forming liquid changes in the drying process, such as when it has, the content of inorganic particles in the forming liquid excluding the solvent is the same as the content of inorganic particles in each layer of the light guide member It should just become.
  • the first and second light guide members of the present invention are characterized in that two or more layers having different refractive indexes are laminated.
  • third and fourth light guide members of the present invention are characterized in that two or more layers having different values are stacked.
  • the fifth and sixth light guide members of the present invention are characterized in that two or more layers having different refractive indexes are laminated. Therefore, the fifth light guide member of the present invention is a light guide member in which two or more layers having different refractive indexes are laminated, at least one of the layers being a specific layer, and having a light emission peak. A light source with a dominant wavelength of 500 nm or less is provided.
  • the sixth light guide member of the present invention is a light guide member in which two or more layers having different refractive indexes are laminated, and at least two of the layers in contact with each other are specific layers.
  • the seventh and eighth light guide members of the present invention are characterized in that two or more layers having different haze values are laminated. Accordingly, the seventh light guide member of the present invention is a light guide member in which two or more layers having different haze values are laminated, wherein at least one of the layers is a specific layer and has a main emission peak. A light source with a wavelength of 500 nm or less is provided.
  • the eighth light guide member of the present invention is a light guide member in which two or more layers having different haze values are laminated, and at least two of the layers in contact with each other are specific layers.
  • both layers are designated as specific layers.
  • the first, second, fifth and sixth light guide members of the present invention are characterized in that two or more layers having different refractive indexes are laminated.
  • the high refractive index layer transmits light by providing a difference in refractive index between adjacent layers.
  • the core layer, the low refractive index layer is the cladding layer that confines light, Form each one.
  • the refractive index of the high refractive index layer of the first, second, fifth and sixth light guide members of the present invention is usually
  • the refractive index of a general semiconductor light-emitting device is about 2.5, and is usually 2.5 or less. From the viewpoint of ease, it is preferably 2.0 or less. If the refractive index of the high refractive index layer is too small, the light extraction efficiency may not be improved. On the other hand, the light extraction efficiency is not improved even when the refractive index of the high refractive index layer is larger than the refractive index of the member constituting the light source.
  • the refractive index of the low refractive index layer of the first, second, fifth and sixth light guide members of the present invention is usually less than 1.45, preferably 1.43 or less, more preferably 1. 42 or less.
  • the lower limit is usually 1.4 or more, preferably 1.41 or more.
  • the refractive index difference between the high-refractive index layer and the low-refractive index layer is usually 0.03 to 0.2. By appropriately adjusting this, the transmission distance of light in the high-refractive index layer It is also possible to adjust the (guide distance). In other words, when the refractive index difference is increased, the low refractive index layer (cladding layer) efficiently confines the light of the high refractive index layer (core layer), and therefore the light transmission distance with less leakage light to the low refractive index layer. Can increase the separation force S. On the other hand, if the refractive index difference is set to be as small as 0.05 or less, for example, light leakage from the high refractive index layer to the low refractive index layer increases, and the light transmission distance becomes short.
  • the refractive index can be measured using a known method such as a Pulflich refractometer, an Abbe refractometer, a prism cover method, an interferometry, and a minimum declination method in addition to the immersion method (solid object).
  • the refractive index measurement wavelength in the present invention can be selected from sodium D line (589 nm), which is used for general purposes when using an instrument such as an Abbe refractometer.
  • the refractive index can be measured by various methods as described above, and the refractive index of the sample before and after curing hardly changes. Since samples after curing will be molded in various ways depending on the purpose, measurement using an Abbe refractometer using the uncured solution is the simplest and preferred!
  • the third, fourth, seventh and eighth light guide members of the present invention have two or more layers having different haze values. It is characterized by being laminated.
  • the haze value of the light scattering layer and / or the phosphor-containing layer is set. You can make it higher.
  • the haze value of the light scattering layer and / or the phosphor-containing layer of the third, fourth, seventh and eighth light guide members of the present invention is usually 50 or more, preferably 70 or more, more preferably 80. That's it. If the haze value of the light scattering layer and / or the phosphor-containing layer is too small, the light scattering effect, that is, the effect that light is emitted to the outside of the light guide member may not be improved. Therefore, it is preferable that the haze value of at least one of the specific layers in contact with each other falls within the range of the light scattering layer and / or the phosphor-containing layer.
  • the haze value is a numerical value of the so-called cloudiness (cloudiness value) of a transparent member, and is a value measured based on JIS-K-7136.
  • the light guide member of the present invention includes a low refractive index layer, a high refractive index layer, a light scattering layer, and a phosphor by adjusting the refractive index and / or the haze value of each layer that is configured.
  • each layer will be described. The specific installation method for each layer will be explained in the section [C-3] according to each embodiment!
  • a low refractive index layer is usually provided as a cladding layer for confining light.
  • a layer other than the specific layer may be a low refractive index layer, but the low refractive index layer is composed of a specific layer made of a compound having the characteristics described in the above-mentioned chapter [A] or [B]. It is preferable. Therefore, in the light guide member of the present invention, it is preferable that at least one of the specific layers in contact with each other is a low refractive index layer.
  • the refractive index of the low refractive index layer is as described above. Further, the low refractive index layer may be provided with only one layer or may be provided with two or more layers.
  • a high refractive index layer is usually provided as a core layer for transmitting light.
  • a layer other than the specific layer may be a high refractive index layer, but the high refractive index layer has the characteristics described in the above-mentioned chapter [A] or [B]. It is preferable that it is comprised by the specific layer which consists of a compound. Therefore, in the light guide member of the present invention, it is preferable that at least one of the specific layers in contact with each other is a high refractive index layer.
  • the high refractive index layer has a higher refractive index than the low refractive index layer, for example, a phenyl group is introduced into the compound, or as described in Chapter [C-12].
  • the refractive index of the high refractive index layer is as described above.
  • the high refractive index layer may be provided with only one layer or with two or more layers.
  • the low refractive index layer and the high refractive index layer are both constituted by specific layers. Therefore, in the light guide member of the present invention, the refractive index of at least one of the specific layers in contact with each other is within the range of the high refractive index layer, and the refractive index of at least one other layer is the low refractive index. More preferably, it falls within the range of the rate layer.
  • the light guide member of the present invention can be provided with a light scattering layer that radiates light transmitted from a light source to the outside.
  • the light scattering layer functions to widen the directivity angle of light emitted from the light guide member to the outside.
  • a layer other than the specific layer may be a light scattering layer, but the light scattering layer may be composed of a specific layer made of a compound having the characteristics described in the above-mentioned chapter [A] or [B]. preferable.
  • the light scattering layer has a median particle size of usually 0.05 ⁇ m or more, preferably 0.1 ⁇ m or more as a light scattering material. It is preferable to contain inorganic particles of 50 ⁇ m or less, preferably 20 or less.
  • the light scattering layer may be provided with only one layer, or may be provided with two or more layers.
  • guided light can be extracted using the surface roughness of the substrate. This is because, by providing a light scattering layer on the rough surface, the guided light is scattered on the rough surface, and the light becomes perpendicular to the extraction surface, so that the light emerges on the surface. It is what I did.
  • the rough surface can be formed on the substrate and / or on each layer. The rough surface may be formed on the upper surface (close to the light extraction surface! /, Surface), lower surface (far from the light extraction surface! /, Surface), or misaligned!
  • the roughness of the rough surface is not particularly limited as long as it has the property of scattering light, but the height difference is usually 0.2 Hm or more, preferably 0.5 ⁇ m or more, and usually 50 ⁇ m or less, preferably 30 ⁇ Less than m. .
  • the method of creating a rough surface on the substrate is not limited! /, But, for example, precision machining, blasting, powder coating, application of coating solution containing diffusing particles, particle pasting, chemical etching, optical Examples include irradiation, ink jet printing, exposure to a photosensitive curable (softening) resin, development, and heating / developing to a thermosensitive resin.
  • a method of roughening the surface of each layer to be laminated for example, chemical treatment using hydrofluoric acid or alkali, blast treatment, powder coating, application of a coating solution containing diffusing particles, particle pasting, light irradiation, inkjet There is printing.
  • the light guide member of the present invention can be provided with a phosphor-containing layer in order to convert the wavelength of light transmitted from the light source force into a desired wavelength.
  • the phosphor-containing layer refers to a layer containing a phosphor among the layers constituting the light guide member. At this time, a layer other than the specific layer becomes a phosphor-containing layer! /, But the phosphor-containing layer is made of a compound having the characteristics described in the above-mentioned chapter [A] or [B]. It is preferable that it is comprised by the specific layer. In this case, among the layers constituting the light guide member of the present invention, it is preferable that the specific layers in contact with each other contain a phosphor to constitute the phosphor-containing layer. However, in this case, at least one of the two or more specific layers provided in the light guide member may contain a phosphor.
  • the phosphor-containing layer is formed by containing the phosphor described in [C 1 1] in the layer.
  • the phosphor-containing layer contains inorganic particles having a median particle size of 0.;! To 10 m as a light scattering material. Also good.
  • the phosphor-containing layer may be provided with only one layer or two or more layers.
  • the shape and dimensions of the light guide member of this invention is determined according to the shape and size of the substrate of the optical waveguide or the light guide plate.
  • the forming film film forming the light guide member
  • the forming film is a force for laminating a plurality of films having different refractive indexes and haze values. The dimensions of each layer are arbitrarily set according to the application.
  • the specific layer can be formed in a thick film.
  • the layer constituting the light guide member is thickened, cracks or the like are generated due to internal stress or the like, and it is difficult to thicken the layer.
  • the thickness of each specific layer is usually 10 m or more, preferably 30 m or more, usually 500 m or less, preferably 300 mm or less. More preferably, it is 200 m or less.
  • the thickness of the film refers to the thickness of the maximum thickness portion of the film.
  • the total thickness of all layers excluding the light guide plate substrate is usually ⁇ ⁇ or more, preferably ⁇ ⁇ or more, usually 500 ⁇ m or less, preferably 300 ⁇ m or less, more preferably 200 ⁇ m. m or less.
  • the light guide member of the present invention a light guide plate using a semiconductor light-emitting device as a light source will be described as an example and described using an embodiment.
  • these embodiments are used only for convenience of explanation, and the optical waveguide, the light guide plate, and other examples to which the light guide member of the present invention is applied are limited to these embodiments.
  • the substrate may be provided or not as required, and the thickness is not particularly limited.
  • the specific layer has high flexibility in the present invention, the use of this specific layer makes it possible to produce a layer having an arbitrary film thickness without warping or deformation of the substrate even on a thin substrate such as a flexible printed circuit board. it can.
  • the light guide plate 8 of the first embodiment is disposed on the substrate 1 so as to cover the semiconductor light emitting element 2 made of LED chips and optionally cover the semiconductor light emitting element 2.
  • the semiconductor light emitting device 4 comprising the sealing material 3 is provided as a light source.
  • a low refractive index layer 5 is coated as a specific layer which is a part of the light guide plate 8.
  • the low refractive index layer 5 is provided with a cylindrical or mortar-shaped hole 5H so as not to cover the semiconductor light emitting device 4!
  • a high refractive index layer 6 is provided as a specific layer in contact with the low refractive index layer 5. Further, in the present embodiment, the high refractive index layer 6 is also formed around the semiconductor light emitting device 4 in the hole 5H, so that light emitted from the semiconductor light emitting device 4 is directly incident on the high refractive index layer 6. It has become. As a result, the high refractive index layer 6 assures the function of transmitting light emitted from the light source (semiconductor light emitting device 4 in FIG. 2) as the core portion of the optical waveguide.
  • a low refractive index layer 5 ' may be further provided as a specific layer in contact with the high refractive index layer 6. Even when the low refractive index layer 5 ′ is not provided, the air layer can serve as a cladding portion.
  • a light scattering layer and / or a phosphor-containing layer 7 can be appropriately provided on the contact surface (for example, the upper surface) of the high refractive index layer 6.
  • the light scattering layer ensures the function of emitting light emitted from the light source transmitted by the high refractive index layer 6 to the outside.
  • the phosphor-containing layer exhibits a wavelength conversion function of emitting light of a desired wavelength when excited by light from the light source transmitted by the high refractive index layer 6.
  • the light scattering layer and / or the phosphor-containing layer 7 is used.
  • the position to be formed is preferably set in consideration of design.
  • the light scattering layer and / or the phosphor-containing layer 7 is formed in a predetermined portion on the upper surface of the high refractive index layer 6, and the low refractive index layer is formed on the other portions on the upper surface of the high refractive index layer 6. Assume that 5 'is formed.
  • the semiconductor light-emitting element 2 is not particularly limited, but a specific example of a light-emitting diode (LED) or laser diode (LD) that emits light having a peak wavelength in the range of 350 nm to 500 nm is preferable. ) And the like. Of these, the above-described GaN-based LEDs and LDs are preferable.
  • the sealing material 3 exhibits functions such as a highly durable sealant, a light extraction film, and various function-added films of the semiconductor light emitting device 2.
  • the encapsulant 3 may be used alone, but can contain any additive as long as the effects of the present invention are not significantly impaired except for the phosphor and the phosphor component. Further, since the high refractive index layer 6 can also serve as a sealing material, the sealing material 3 may not be provided.
  • sealing material 3 it is preferable to use the same compound (material) as the high refractive index layer 6 of the light guide member of the present invention from the viewpoint of adhesion and the like. Further, as the sealing material 3, other materials can be used. Normally, a resin (hereinafter referred to as “sealing resin” as appropriate) is used as the sealing material 3. Examples of such a sealing resin usually include a thermoplastic resin, a thermosetting resin, a photocurable resin, and the like.
  • methacrylic resin such as polymethylmethacrylate
  • styrene resin such as polystyrene and styrene acrylonitrile copolymer
  • polycarbonate resin such as polymethylmethacrylate
  • polyester resin such as polystyrene and styrene acrylonitrile copolymer
  • phenoxy resin Cellulosic resins such as chinoresenolose, sennellose acetate, sennellose acetate petitate
  • epoxy resins such as phenol resins; silicone resins, etc.
  • inorganic materials such as metal alkoxides, ceramic precursor polymers, or solutions obtained by hydrolytic polymerization of a solution containing metal alkoxides by a sol-gel method or a combination thereof, inorganic materials such as siloxane bonds. Inorganic materials can be used.
  • the material of the sealing material 3 such as the sealing resin may be used alone or in combination of two or more in any combination and ratio.
  • the encapsulant 3 may contain a phosphor, whereby the wavelength of the light source can be converted into light having a desired wavelength and then transmitted through the high refractive index layer.
  • the amount of the phosphor used is not particularly limited, but is usually 0.01 parts by weight or more, preferably 0.1 parts by weight or more, more preferably 1 part by weight with respect to 100 parts by weight of the sealing material. In addition, it is usually 100 parts by weight or less, preferably 80 parts by weight or less, more preferably 60 parts by weight or less.
  • the sealing material 3 may contain components other than the phosphor and the inorganic particles.
  • a color correction dye an antioxidant, a processing stabilizer such as a phosphorus processing stabilizer, an oxidation and heat stabilizer, a light resistance stabilizer such as an ultraviolet absorber, and a silane coupling agent.
  • a processing stabilizer such as a phosphorus processing stabilizer, an oxidation and heat stabilizer, a light resistance stabilizer such as an ultraviolet absorber, and a silane coupling agent.
  • the semiconductor light-emitting device 4 may be installed on the substrate 1 before coating, or may be installed on the substrate 1 after coating by removing the masking after coating the coating portion.
  • a specific layer forming solution diluted with a solvent such as toluene or heptane is used. It may be formed by coating.
  • the light guide plate 8 of the present embodiment is configured as described above, the light from the light source transmitted by the high refractive index layer 6 passes through the light scattering layer and / or the phosphor-containing layer 7. Then, the light is emitted to the outside of the light guide member (light guide plate 8). Therefore, when the sealing material 3 does not contain a phosphor, and when the light guide member (light guide plate 8) does not contain the phosphor-containing layer 7, the light is emitted from the light source (semiconductor light emitting element 2 in FIG. 2). Radiated to the outside in the same luminescent color.
  • the phosphor-containing layer 7 exhibits a wavelength conversion function of emitting light of a desired wavelength when excited by light from the light source transmitted by the high refractive index layer 6 as described above. . Therefore, the phosphor-containing layer 7 emits light obtained by wavelength-converting light emitted from the semiconductor light emitting element 2. At this time, the phosphor-containing layer 7 only needs to contain at least a fluorescent substance that is excited by light from the light source and emits light of a desired wavelength. Examples of such phosphors include the various phosphors exemplified above.
  • the emission color of the phosphor-containing layer 7 not only the three primary colors of red (R), green (G) and blue (B), but also white such as a fluorescent lamp and yellow such as a light bulb are possible.
  • the phosphor-containing layer 7 has a wavelength conversion function for emitting light having a desired wavelength different from the excitation light.
  • the light transmitted by the high refractive index layer 6 is also emitted from a portion where the high refractive index layer 6 is exposed on the side surface.
  • the low refractive index layer 5 and the high refractive index layer 6 and the light scattering layer and / or the phosphor-containing layer 7 use a specific compound. Therefore, the light durability (light resistance) and heat durability (heat resistance) of the light guide member (light guide plate 8) can be improved. Due to the action of the polar group between 7 and the like, the adhesion is more improved than when the specific layer is used alone. Also, between the substrate 1 and the low refractive index layer 5, between the low refractive index layer 5 and the high refractive index layer 6, and / or the high refractive index layer.
  • the angle 9 formed between the side surface of the light guide member (light guide plate 8) and the laminated surface may be vertical, but the light extraction effect (particularly, light from the side surface portion in the present embodiment). From the viewpoint of improving the taking-out effect), it is usually 30 ° or more, preferably 35 ° or more, more preferably 40 ° or more, and usually 80 ° or less, preferably 70 ° or less, and more preferably 60 ° or less.
  • the angle formed between the side surface of the light guide member (light guide plate 8) and the laminated surface is a guide as viewed from a direction perpendicular to the laminate surface of the light guide member (light guide plate 8), as shown in FIG. The inner angle formed by the side surface of the optical member (light guide plate 8) and the laminated surface is shown.
  • the light guide member of the present invention When the light guide member of the present invention is applied to an optical waveguide, a light guide plate, or the like, it is preferable to appropriately modify it according to the location to which the present invention is applied. For example, a desired number of light sources can be appropriately provided at desired positions on the substrate surface. A desired number of light scattering layers and phosphor-containing layers can be appropriately provided at desired positions of the light guide member.
  • the light guide member of the present invention is not limited to the embodiments exemplified below, and can be implemented with arbitrary modifications without departing from the gist of the present invention.
  • the same reference numerals as those in the first embodiment are used for the same parts as those described in the first embodiment.
  • the entire uppermost layer is a light scattering layer and / or a phosphor-containing layer 7.
  • the light guide plate 8 according to the present embodiment is configured in the same manner as in the first embodiment except for the above-described points. Therefore, the light guide plate 8 of the present embodiment is also configured by laminating the low refractive index layer 5, the high refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7 which are specific layers in contact with each other.
  • the light guide plate 8 of the third embodiment does not have the low refractive index layer 5 ′ and the light scattering layer and / or the phosphor-containing layer 7 as the uppermost layer. That is, the entire top surface of the photorefractive index layer 6 is configured to be exposed to the gas phase. In this case, the gas transmission layer acts as a cladding layer on the upper surface, thereby ensuring the optical transmission effect.
  • the optical waveguide distance is controlled to achieve the desired effect. be able to.
  • the phosphor-containing layer 7 can be provided on a part of the low refractive index layer 5 (FIG. 4).
  • the light guide plate 8 according to the present embodiment is configured in the same manner as in the first embodiment except for the points described above. Therefore, the light guide plate 8 of the present embodiment also has a low refractive index layer 5, a high refractive index layer 6, and a light scattering layer and / or a fluorescent layer formed on a part of the low refractive index layer 5, which are specific layers in contact with each other. Since the body-containing layer 7 is laminated, as in the first embodiment, it is possible to freely control the film thickness such as thickening, and to suppress cracks and peeling. There are advantages such as being excellent in heat resistance and light resistance.
  • the light guide plate 8 of the fourth embodiment is formed into a light scattering layer 7 by mixing a very small amount of inorganic particles as a light scattering agent in a portion corresponding to the high refractive index layer 6 of FIG. ( Figure 5). In this case, light can be extracted from the entire surface of the light guide plate 8 as in the second embodiment. In addition, because of the two-layer structure, the total thickness of the light guide plate 8 can be reduced.
  • the light guide plate 8 according to the present embodiment has the above-mentioned configuration and the configuration other than that the light scattering layer and / or the phosphor-containing layer 7 is not provided in a part of the low refractive index layer 5.
  • the configuration is the same as that of the embodiment. Therefore, since the light guide plate 8 of the present embodiment is also configured by laminating the low refractive index layer 5 and the light scattering layer 7 which are specific layers in contact with each other, as in the third embodiment, the thick film It is possible to obtain advantages such as free control of film thickness such as crystallization, suppression of cracks and peeling, excellent heat resistance and light resistance, etc.
  • the light guide plate 8 of the fifth embodiment includes a high refractive index layer 6 that is an optical transmission unit.
  • a part (high refractive index portion 6a) penetrates through the low refractive index layers 5, 5 ′, the light scattering layer and / or the phosphor-containing layer 7.
  • the high refractive index portion 6a is a boundary portion that penetrates at least two specific layers in contact with each other.
  • the boundary portion is formed as the high refractive index portion 6a capable of transmitting light, the light transmission portion can be extended in a direction perpendicular to the substrate surface across each layer.
  • the high refractive index portion 6a functions as V, a so-called “boundary portion A”.
  • the boundary A is a high refractive index boundary formed of a material having a refractive index equivalent to that of the high refractive index layer 6, and transmits light emitted from the semiconductor light emitting device 4 to shine itself.
  • the high refractive index portion 6a may use a material different from the high refractive index layer 6 in the light guide member of the present invention as the boundary portion A.
  • any material can be used as long as it is a material that can transmit light from the light source.
  • an inorganic or organic material having the same refractive index as that of the high refractive index layer 6 can be used.
  • the boundary A is preferably an epoxy resin, a urethane resin, a polyimide resin, an acrylic resin, a phenol resin, or the like from the viewpoints of low moisture permeability, light blocking properties, and adhesion to the substrate 1.
  • the low refractive index layers 5, 5 ′, the light scattering layer and / or the phosphor-containing layer 7, epoxy resins and acrylic resins are particularly preferred.
  • Use of an epoxy resin as the boundary portion A is a particularly preferable combination because the high refractive index layer 6 as a specific layer is particularly excellent in adhesion to the epoxy resin, hardly changes in quality, and does not inhibit the effect.
  • the method for producing such a high refractive index portion 6a there is no limitation on the method for producing such a high refractive index portion 6a.
  • the high refractive index portion 6a is provided on the substrate 1, the low refractive index layers 5, 5 ′, the high refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7 are laminated before coating. Then, the high refractive index portion 6a is formed, and then the low refractive index layers 5 and 5 ′, the high refractive index layer 6 and the light scattering layer and / or the phosphor-containing layer 7 may be laminated.
  • the method used to form the high refractive index portion 6a is not limited, and for example, it can be formed by a dispenser, screen printing, a resist method, or the like.
  • the low refractive index layers 5, 5 ′, the high refractive index layer 6 and the light A scattering layer and / or phosphor-containing layer 7 is laminated, and then the masking is removed, and the installation portion is highly refracted.
  • the rate portion 6a may be formed.
  • the layer is laminated on the substrate 1, and then the high refractive index portion 6a and the high refractive index portion 6a are formed on the layer according to the method described above.
  • the low refractive index layers 5 and 5 ′, the high refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7 may be formed as necessary.
  • the light guide plate 8 according to the present embodiment is configured in the same manner as in the first embodiment except for the points described above. Therefore, the light guide plate 8 of the present embodiment also includes the low refractive index layers 5 and 5 ′, the high refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7 that are specific layers in contact with each other. Therefore, as in the first embodiment, it is possible to freely control the film thickness such as thickening, to suppress cracks and peeling, and to improve heat resistance and light resistance. Advantages such as superiority can be obtained.
  • the high refractive index portion 6a is formed of the same compound as that of the specific layer, the high refractive index portion 6a can also be freely controlled in film thickness such as thickening, cracks and Advantages such as suppression of peeling and excellent heat resistance and light resistance can be obtained.
  • the light guide plate 8 of the sixth embodiment includes a portion of the low refractive index layer 5 (low refractive index portion 5a) that is a light blocking portion, the high refractive index layer 6, It penetrates the light scattering layer and / or the phosphor-containing layer 7.
  • the low refractive index portion 5a functions as a boundary portion.
  • the boundary portion is formed as the low refractive index portion 5a capable of blocking light, the light blocking portion can be extended in the direction perpendicular to the substrate surface across each layer.
  • the low refractive index portion 5a functions as V, a so-called “boundary portion B”.
  • the boundary portion B is a low refractive index boundary portion formed of a low refractive index material, which blocks light emitted from the semiconductor light emitting device 4 and divides the light guide plate 8 into an optical area.
  • a high refractive index boundary portion made of a material having a higher refractive index than that of the high refractive index layer 6 can be used as the boundary portion B.
  • the low refractive index portion 5a may use a material different from the low refractive index layer 5 in the light guide member of the present invention as the boundary portion B.
  • the boundary B any material can be used as long as it is a material that can block light transmitted from the light source.
  • an inorganic or organic material having a refractive index lower than that of the high refractive index layer 6 can be used.
  • the boundary B is preferably an epoxy resin, a urethane resin, a polyimide resin, an acrylic resin, a sol-gel glass, or the like from the viewpoints of low moisture permeability, light blocking properties, and adhesion to the substrate 1. Further, from the viewpoint of adhesion to the high refractive index layer 6, low refractive index layer 5, 5 ′, light scattering layer and / or phosphor-containing layer 7 of the present invention, epoxy resin and acrylic resin are more preferable. Epoxy resins are particularly preferred.
  • the use of epoxy resin as the boundary B is a particularly preferred combination because the high refractive index layer 6 that is a specific layer is particularly excellent in adhesion to the epoxy resin, is difficult to be altered, and has no effect inhibition. It is.
  • the light guide plate 8 according to the present embodiment is configured in the same manner as in the first embodiment, except for the above points. Therefore, the light guide plate 8 of the present embodiment also includes the low refractive index layers 5 and 5 ′, the high refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7 that are specific layers in contact with each other. Therefore, as in the first embodiment, it is possible to freely control the film thickness such as thickening, to suppress cracks and peeling, and to improve heat resistance and light resistance. Advantages such as superiority can be obtained.
  • the low refractive index portion 5a is formed of the same compound as that of the specific layer, the low refractive index portion 5a can also be freely controlled in film thickness such as thickening, cracks and Advantages such as suppression of peeling and excellent heat resistance and light resistance can be obtained.
  • the light guide plate 8 of the seventh embodiment is obtained by installing a light scattering layer and / or a phosphor-containing layer 7 at a desired location in the high refractive index layer 6. is there.
  • a light emitting surface using scattering can be formed at a desired location on the light guide plate 8. If this is used, it is possible to prevent transmission of light from far away while extracting light from a desired position.
  • the method for producing such a light scattering layer and / or phosphor-containing layer 7 can be produced in the same manner as the high refractive index portion 6a described in the fifth embodiment.
  • the light scattering layer and / or the phosphor-containing layer 7 is provided inside the high refractive index layer 6, the light scattering layer and / or the phosphor-containing layer 7 is provided. Then, a high refractive index layer 6 is further laminated thereon.
  • the light guide plate 8 according to the present embodiment has the above-described points and the configuration other than that the light scattering layer and / or the phosphor-containing layer 7 is not provided in a part of the low refractive index layer 5.
  • the configuration is the same as in the third embodiment. Therefore, the low-refractive index layers 5 and 5 ′, which are specific layers in contact with each other, and the high-refractive index layer 6 as well as the light scattering layer and / or the phosphor-containing layer 7 are also laminated in the light guide plate 8 of the present embodiment. Therefore, as in the third embodiment, it is possible to freely control the film thickness such as thickening, to suppress cracks and peeling, and to have heat resistance and light resistance. It has become possible to obtain advantages such as excellence
  • the light guide plate 8 of the eighth embodiment has a high refractive index portion (boundary portion A) and / or a low refractive index portion (boundary portion B) 10 (in the description of this embodiment).
  • boundary portion 10 When referring to the high refractive index portion and the low refractive index portion without distinguishing each other, it is referred to as “boundary portion 10”) that penetrates each of the layers 5, 6, 5 ′.
  • a desired optical waveguide is constructed in the vertical and horizontal directions of the substrate surface by controlling the light blocking portion.
  • the boundary portion 10 can be produced in the same manner as the high refractive index portion 6a described in the fifth embodiment.
  • the light guide plate 8 according to the present embodiment has the above-described configuration, except that the light scattering layer and / or the phosphor-containing layer 7 is not provided on the upper surface of the high refractive index layer 6.
  • the configuration is the same as in the first embodiment. Therefore, the light guide plate 8 of the present embodiment is also configured by laminating the low refractive index layers 5 and 5 ′ and the high refractive index layer 6 which are specific layers in contact with each other. Similarly, it is possible to obtain advantages such as being able to freely control the film thickness such as thickening, suppressing cracks and peeling, and being excellent in heat resistance and light resistance. It has become.
  • the boundary portion 10 is formed of the same compound as that of the specific layer, the boundary portion 10 can also be freely controlled in film thickness such as thickening, and cracks and separation can be suppressed. Advantages such as being possible and being excellent in heat resistance and light resistance can be obtained.
  • the reflective layer 11 is laminated on the substrate 1, and the reflective layer 11 does not cover the portion of the semiconductor light emitting device 4.
  • a cylindrical or mortar-shaped hole 11H is provided. Thereby, the high refractive index layer 6 is transmitted. Since the light is efficiently reflected on the surface of the reflective layer 11, the light emitted from the semiconductor light emitting device 4 can be used effectively.
  • a light scattering layer and / or a phosphor-containing layer 7 can be provided.
  • the material constituting the reflective layer 11 is not limited.
  • a metal material such as silver or aluminum; barium sulfate, silica, titanium oxide, calcium carbonate, or the like can be used.
  • the film thickness is arbitrary as long as the effect of the present invention is not significantly impaired, but is usually ⁇ or more, preferably 10 m or more, and usually 100 m or less, preferably 50 m or less.
  • stacking method For example, it can laminate
  • the light guide plate 8 according to the present embodiment has the above-described points, and a configuration other than the force that does not provide the light scattering layer and / or the phosphor-containing layer 7 on the upper surface of the high refractive index layer 6. Is configured in the same manner as in the first embodiment. Accordingly, the light guide plate 8 of the present embodiment is also configured by laminating the high refractive index layer 6 and the low refractive index layer 5 ′, which are specific layers that are in contact with each other, and is the same as in the first embodiment. In addition, it is possible to obtain advantages such as being able to freely control the film thickness such as thickening, being able to suppress cracks and peeling, and being excellent in heat resistance and light resistance. Yes.
  • a cylindrical or mortar-shaped hole 1H is formed in the substrate 1, and the semiconductor light emitting device 4 is installed at the bottom of the hole 1H. It is composed.
  • the thickness of the light source itself can be accommodated in the substrate 1.
  • the thickness of the low refractive index layer 5, the high refractive index layer 6, the light scattering layer and / or the phosphor-containing layer 7 can be reduced, and the height of the semiconductor light emitting device 4 can be adjusted. It becomes possible to increase the degree of freedom of design.
  • the light guide plate 8 has the above-described points, and the configuration other than the provision of the light scattering layer and / or the phosphor-containing layer 7 in a part of the low refractive index layer 5,
  • the configuration is the same as in the first embodiment. Therefore, the low-refractive index layers 5 and 5 ′, the high-refractive index layer 6, and the light scattering layer and / or the phosphor-containing layer 7, which are specific layers in contact with each other, are also laminated on the light guide plate 8 of the present embodiment.
  • the thick film It is possible to obtain advantages such as free control of the film thickness such as crystallization, suppression of cracks and peeling, and excellent heat resistance and light resistance.
  • the specific layers such as the low refractive index layers 5, 5 ′, the light refractive index layer 6, the light scattering layer and / or the phosphor-containing layer 7 are laminated.
  • Some layers constituting the light guide plate 8 may not be provided, and other layers may be further stacked.
  • the specific layer is excellent in translucency and adhesiveness, it is preferable to provide a moisture-proof film formed of polyethylene terephthalate (PET) or the like on the outermost layer of the light guide plate 8 described above.
  • PET polyethylene terephthalate
  • the boundary portions such as the low refractive index portion 5a, the high refractive index portion 6a, and the boundary portion 10 may penetrate at least two of the specific layers 5, 5 ', 6, and 7 described above. Therefore, it is possible to penetrate three or more layers. Further, it may be formed of a material that does not transmit light just by forming it from a material that can transmit light. Furthermore, the boundary part may contain other components such as inorganic particles, phosphors, and coloring materials.
  • the color material can be used by appropriately selecting the material and color.
  • the boundary is white
  • the white boundary reflects the light in each region, and the light to the adjacent region It has the effect of preventing leakage and color mixing.
  • the white boundary is made very thin or thin, the light shielding effect may be insufficient.
  • the use of the black border can surely prevent the color mixing of light to the adjacent area that causes a loss of light guide amount due to light absorption.
  • an inorganic and / or organic material can be used as the color material.
  • the inorganic particles alumina fine powder, silicon oxide, aluminum oxide, titanium oxide, Metal oxides such as zinc oxide and magnesium oxide; metal salts such as calcium carbonate, barium carbonate, magnesium carbonate, barium sulfate, aluminum hydroxide, calcium hydroxide, magnesium hydroxide; boron nitride, alumina white, co Examples include loyal silica, aluminum silicate, zirconium silicate, aluminum borate, clay, talc, kaolin, mica, and synthetic mica.
  • the organic fine particles include, but are not limited to, forces that can include resin particles such as fluorine resin particles, guanamine resin particles, melamine resin particles, acrylic resin particles, and silicon resin particles.
  • the boundary portion contains a color material to make it black
  • inorganic and / or organic materials can be used.
  • the inorganic particles titanium black, carbon black, iron oxide black, bismuth sulfate, etc. Is mentioned.
  • the organic fine particles are not limited to any force that can include, for example, aniline black, cyanine black, and perylene black.
  • coloring material only one type of coloring material may be used, or two or more types may be used in any combination and ratio.
  • the light guide member manufacturing method of the present invention includes a light guide layer obtained by curing a fluid curable material on a substrate.
  • a step of providing a weir for partitioning the light guide layer on the substrate hereinafter referred to as “weir formation process” as appropriate
  • a step of applying a curable material on the substrate hereinafter referred to as “curable material as appropriate”.
  • curable material curing process a process of curing the curable material
  • a substrate is prepared, and a weir is provided on the substrate.
  • substrate is a part which can become a support body of the light guide member of this invention, and a light guide layer and a weir are arrange
  • the size and shape of the substrate can be set arbitrarily according to the purpose of the light guide member to be manufactured.
  • the substrate may include an arbitrary member as necessary.
  • the substrate is a light emitting diode (also called “: LED”) and a semiconductor laser diode.
  • a light emitting source such as a semiconductor light emitting device such as a semiconductor laser diode (also referred to as “LD”) may be provided.
  • the position at which the light emitting light source is disposed can be arbitrarily set according to the purpose of the light guide member.
  • one or more desired layers may be laminated on the substrate in advance.
  • the weir and the light guide layer which will be described later, are provided on the substrate via these layers.
  • the material for forming the substrate is optional as long as the effects of the present invention are not significantly impaired.
  • a curable material for forming a weir or a light guide layer ceramic, metal, glass, etc.
  • Resins are preferred.
  • those containing a polar group and those containing a filler for improving adhesiveness such as ceramic, metal and glass are preferable.
  • a substrate having wiring may be used.
  • a printed wiring board on which glass fiber reinforced epoxy resin is laminated is suitable.
  • the substrate may be formed of only one kind of material. Two or more kinds of materials may be used in any combination and kind.
  • a weir is provided on the substrate.
  • the weir is formed of a material that can transmit or block light from the light source, and is a portion that functions as a boundary portion that partitions the light guide member into predetermined regions.
  • the light source light is transmitted to the area including the weir. That is, light is transmitted to the inside of the weir.
  • the light source light is transmitted only to the area that does not include the weir! That is, no light is transmitted inside the weir.
  • a light guide layer which will be described later, is formed so as to be blocked by this weir. Even when the weir does not completely block the light guide layer (that is, when the light guide layer is formed so as to cross over the weir), the portion where the weir is formed is a part of the weir. Only the light guide layer is formed thin, and as a result, the weir functions as a boundary part that partitions the light guide layer partially. Therefore, the weir partitions the light guide layer, so to speak, the size, shape, position, etc. of the light guide layer region are set according to the size, shape, position, etc. of the drawing of the weir. Design of Will be determined.
  • the planar shape of each area of the partitioned light guide layer is the size, shape, It will be set according to the layout.
  • the weir when the weir is formed of a material capable of transmitting light, the light transmitted from the light source through the light guide layer can be emitted through the weir.
  • the shape and pattern formed by the light emitted by the member can be set according to the size, shape, position, etc. of the weir.
  • the weir cannot transmit light! / Or is formed of a material! /
  • the light transmitted from the light source through the light guide layer is prevented from being emitted from the weir. It is possible to prevent transmission from the weir to the end, or to reduce the intensity of the light transmitted from the weir to the end, thereby reducing the shape or pattern formed by the light emitted by the light guide member. It can be set according to the dimensions, shape, position, etc. of the weir.
  • the weir has a function of converting the wavelength of light (that is, a wavelength conversion function)
  • a wavelength conversion function when the weir has a function of converting the wavelength of light (that is, a wavelength conversion function), light transmitted from the light source through the light guide layer is transmitted through the weir to a desired wavelength. After being converted into light, the light can be emitted, so that the color formed by the light emitted from the light guide member can be set according to the size, shape, position, etc. of the weir.
  • the weir has a function of diffusing light
  • light transmitted from the light source through the light guide layer can be diffused with respect to light emitted from the weir.
  • the shape or pattern formed by the light emitted from the light guide member can be set according to the size, shape, position, etc. of the weir.
  • any material of the weir can be used as long as the effects of the present invention are not significantly impaired.
  • epoxy resin, urethane resin, polyimide resin, acrylic resin, silicone resin, and the like are preferable from the viewpoint of low moisture permeability, light transmission or blocking characteristics, and adhesion to the substrate. Further, from the viewpoint of adhesion to the substrate and the light guide layer (curable material), epoxy resin, acrylic resin, and silicone resin are particularly preferable. Only one type of weir material may be used, or two or more types may be used in any combination and ratio. [0362] Further, the material of the weir is preferably a material (curable material) that can be cured by applying a liquid material.
  • the curable material is preferably a thermosetting resin, a photocurable resin, or the like.
  • thermosetting resins those that cure at the lowest possible temperature are preferred, and the influence of alteration on the substrate and light source is small.
  • Some curable materials have a viscosity that temporarily decreases during curing. From the viewpoint of preventing the strength and the shape retention characteristics from deteriorating, it is preferable to suppress the above-described decrease in viscosity. In order to realize this, it is effective to improve the properties of the curable material and utilize the above-mentioned inorganic particles.
  • other components may be further mixed with the above-described resin or the like as long as the effects of the present invention are not significantly impaired.
  • Other components may be used alone, or two or more may be used in any combination and ratio.
  • examples of other components include phosphors and inorganic particles. These phosphors and inorganic particles are the same as those described in the first to eighth light guide members of the present invention.
  • the weir is formed as a convex member extending on the substrate surface.
  • the weir is preferably formed in a shape having no ridgeline.
  • the ridge line means a corner continuously formed in the longitudinal direction on the surface of the weir. Therefore, the shape having no ridge line refers to a shape in which the cross section has no corners when the weir is cut along a plane intersecting the longitudinal direction. Therefore, for example, the weir is preferably formed as a member having a substantially semicircular cross-section (le, loose, force, dimpled) whose surface is formed only by a curved surface (Fig. 13 (b) See).
  • the surface of the weir is formed only with a smooth convex curved surface, the light extraction effect in the weir is superior to the case where it is formed with a polygonal cross section. This is because the surface of the weir is formed with a smooth surface, so that the transmitted light hits the weir and is reflected from the top of the weir. This is because it is possible to extract smooth light that continues to the bonding surface with a plate or the like.
  • the dimensions of the weir can be arbitrarily set according to the design of the light guide member.
  • the height of the weir (see height H in Fig. 12 (a)) is usually l ⁇ m or more, especially 5 m or more, especially 10 m or more, usually 5 mm or less, especially 2 mm or less. In particular, lmm or less is preferable. If the weir is too low, the light splitting function of the guided light may be lost, and if it is too high, the mechanical strength may be reduced and impractical.
  • the width of the weir is more than normal, especially 5 111 or more, especially 10 m or more, usually 20 mm or less, especially 10 mm or less, especially 5 mm or less is preferable. If the width of the weir is too narrow, the mechanical strength may be insufficient, and if it is too wide, it may be wasted.
  • the material of the weir is placed at a desired site on the substrate, and the desired shape is drawn with the material to form the weir.
  • the drawing method is not limited.
  • a drawing method using an inkjet, a dispenser, etc . a printing method such as intaglio printing, relief printing, lithographic printing, stencil printing (screen printing, etc.); a resist method, etc. should be used. I can do it. Of these, drawing with a dispenser, screen printing, and resist method are preferred.
  • a dispenser is a device that quantitatively measures a liquid material and discharges the liquid material quantitatively.
  • This device usually produces highly precise controlled air pressure, time, etc., which pushes the liquid material injected into a syringe or other container into various sizes and shapes of nozzle tips.
  • the liquid material discharged from the tip of the nozzle is dropped onto the object and drawn.
  • This drawing can be performed manually or automatically.
  • an automatic dispensing stage a device that can directly draw an electronic drawing by storing two-dimensional movement or controlling it by a computer. It is preferable.
  • a sufficient defoaming operation (defoaming operation) Preferably). If bubbles are mixed in the liquid material, the discharge from the nozzles may become intermittent during drawing, which may lead to a reduction in drawing accuracy. It is also desirable to remove bubbles of about 100 m or less that are difficult to see with the naked eye.
  • a liquid material can be centrifuged under a vacuum (rotation, revolution type), or foam can be removed by applying an ultrasonic wave.
  • bubbles may be mixed in when the nozzle is connected to the syringe, so discharge from the nozzle sufficiently before drawing! /, And it is also preferable to stabilize the discharge! /.
  • the height of the weir is increased as the viscosity of the liquid material is higher, the thixotropy of the liquid material is higher, the nozzle diameter is larger, the drawing speed is slower, and the lowering of the viscosity during curing is smaller. That power S.
  • the width of the weir can be increased as the viscosity of the liquid material is lower, the thixotropy is lower, the nozzle diameter is larger, the speed is lower, and the viscosity decrease is larger. Further, it can be made wider by performing multiple drawing adjacent in the horizontal direction.
  • a dispenser having a plurality of adjacent nozzles it is possible to perform multiple drawing adjacent in the horizontal direction by one drawing.
  • Screen printing is a kind of printing technique called stencil printing, and is a printing method in which a large number of fine holes are provided in a plate and a liquid material that has passed through the holes is transferred by pressure. Specifically, a screen composed of a mesh and a mask is stacked on the object to be printed, and the screen is pressed against the stage while supplying the liquid material from above. As a result, the liquid material is discharged from the mesh corresponding to the opening of the mask, and the same image as the mask opening is formed.
  • the dimensions of the weir can be controlled by the operating conditions of screen printing. For example, the height of the weir can be increased as the mesh screen is thicker and the aperture ratio is larger. Further, it is possible to make it higher by repeatedly printing.
  • the width of the weir usually follows the mask dimensions.
  • the resist method is a method in which a resist material is used as a weir material, the resist material is applied to a substrate, and a desired image is formed by development.
  • a resist material Either a positive type or a negative type can be used.
  • the positive resist material for example, a photosensitive positive resin or a resin composition can be used.
  • the negative resist material for example, a photopolymerizable and / or heat polymerizable resin or a resin composition can be used.
  • a conventionally known method such as a spinner method, a wire bar method, a flow coating method, a slit 'and' spin method, a die coating method, a roll coating method, a spray coating method, etc. Can be done.
  • a force S to form a desired image after the resist application, through an exposure process, a development process, a heat treatment process, and the like.
  • a weir with a dispenser.
  • the process is not complicated, so it is easy to design a variety of designs according to the order, and because the weir has a shape that does not have a ridgeline, the surface can be formed only with a smooth convex curved surface. This is because the light extraction effect at the portion is also excellent.
  • the above method can be carried out by combining two or more methods.
  • a curable material coating process is performed in which a curable material is coated on the substrate.
  • the curable material is a fluid-like material that is cured by performing some kind of curing treatment.
  • the fluid state means, for example, a liquid state or a gel state.
  • the curable material ensures the role of the light guide that transmits light from the light source to a predetermined position.
  • the curable material it is also possible to use! /, Deviation of inorganic material and organic material and a mixture of both.
  • Examples of inorganic materials include metal alkoxides, ceramic precursor polymers, or Examples thereof include a solution obtained by hydrolytic polymerization of a solution containing a metal alkoxide by a sol-gel method, or an inorganic material (for example, an inorganic material having a siloxane bond) obtained by solidifying a combination thereof.
  • examples of the organic material include a thermosetting resin and a photocurable resin.
  • specific examples include methacrylic resins such as polymethylmethacrylate; styrene resins such as polystyrene and styrene acrylonitrile copolymers; polycarbonate resins; polyester resins; phenoxy resins; butyral resins; Cenorelose-based lunar essence such as cenololose acetate and cenololose acetate butyrate; epoxy resin; phenol resin; silicone resin and the like.
  • a silicon-containing compound is a compound having a silicon atom in its molecule, inorganic materials such as organic materials (silicon-based materials) such as les, le, polyorganosiloxane, silicon oxide, silicon nitride, and silicon oxynitride. And glass materials such as borosilicate, phosphosilicate, and alkali silicate.
  • silicone-based materials are preferable from the viewpoints of transparency, adhesion, ease of handling, mechanical and thermal adaptability relaxation characteristics, and the like.
  • the specific layer forming liquid described in the first to eighth light guide members is more preferable.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente invention concerne un élément de guidage optique qui excelle en termes de résistance à la chaleur, stabilité à la lumière, propriété de formation de film, adhérence à un substrat et adhérence à un plan de stratification, et qui, même lorsqu'il est utilisé pendant une période prolongée, ne présente pas de fissuration, décollement ou coloration. L'élément de guidage optique est constitué d'un stratifié de deux ou plusieurs couches différentes les unes des autres en termes d'indice de réfraction, dans lequel au moins deux couches en contact l'une avec l'autre parmi les couches satisfont les conditions requises suivantes qui nécessitent que : (1) dans le spectre de résonance magnétique nucléaire de Si solide, la position et la valeur de demi-largeur d'un sommet d'amplitude maximum soit comme spécifié ; (2) la teneur en silicium soit de 10 % en poids ou plus ; (3) la teneur en silanol soit comprise entre 0,01 et 10 % en poids ; et (4) la valeur de dureté (Shore A) mesurée par un duromètre de type A soit comprise entre 5 et 90.
PCT/JP2007/072665 2006-11-22 2007-11-22 Élément de guidage optique, procédé de production de celui-ci, guide d'ondes optique et plaque de guidage de lumière WO2008062870A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2006-315765 2006-11-22
JP2006315765 2006-11-22
JP2007-093687 2007-03-30
JP2007-093688 2007-03-30
JP2007093688 2007-03-30
JP2007093686 2007-03-30
JP2007-093686 2007-03-30
JP2007093687 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008062870A1 true WO2008062870A1 (fr) 2008-05-29

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Country Status (1)

Country Link
WO (1) WO2008062870A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013105946A (ja) * 2011-11-15 2013-05-30 Toyo Ink Sc Holdings Co Ltd 発光装置
JP2013105947A (ja) * 2011-11-15 2013-05-30 Toyo Ink Sc Holdings Co Ltd 発光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004091579A (ja) * 2002-08-30 2004-03-25 Kyocera Corp シロキサンポリマおよびそれを含有するシロキサンポリマ皮膜形成用塗液組成物およびそれを用いた光導波路
JP2005227701A (ja) * 2004-02-16 2005-08-25 Dow Corning Corp 光伝送部材用硬化性オルガノポリシロキサン組成物、オルガノポリシロキサン硬化物からなる可撓性光伝送部材、および可撓性光伝送部材の製造方法
WO2006090804A1 (fr) * 2005-02-23 2006-08-31 Mitsubishi Chemical Corporation Element de composant electroluminescent a semiconducteur, son procede de fabrication et composant electroluminescent l'utilisant
JP2006519896A (ja) * 2003-02-19 2006-08-31 ニューシル・テクノロジー・リミテッド・ライアビリティ・カンパニー 光学的透明性及び高温耐性を有する高屈折率のポリシロキサン
JP2007242246A (ja) * 2006-03-03 2007-09-20 Mitsubishi Chemicals Corp 照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004091579A (ja) * 2002-08-30 2004-03-25 Kyocera Corp シロキサンポリマおよびそれを含有するシロキサンポリマ皮膜形成用塗液組成物およびそれを用いた光導波路
JP2006519896A (ja) * 2003-02-19 2006-08-31 ニューシル・テクノロジー・リミテッド・ライアビリティ・カンパニー 光学的透明性及び高温耐性を有する高屈折率のポリシロキサン
JP2005227701A (ja) * 2004-02-16 2005-08-25 Dow Corning Corp 光伝送部材用硬化性オルガノポリシロキサン組成物、オルガノポリシロキサン硬化物からなる可撓性光伝送部材、および可撓性光伝送部材の製造方法
WO2006090804A1 (fr) * 2005-02-23 2006-08-31 Mitsubishi Chemical Corporation Element de composant electroluminescent a semiconducteur, son procede de fabrication et composant electroluminescent l'utilisant
JP2007242246A (ja) * 2006-03-03 2007-09-20 Mitsubishi Chemicals Corp 照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013105946A (ja) * 2011-11-15 2013-05-30 Toyo Ink Sc Holdings Co Ltd 発光装置
JP2013105947A (ja) * 2011-11-15 2013-05-30 Toyo Ink Sc Holdings Co Ltd 発光装置

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